Datasheet TDA8376A-N2, TDA8376-N1 Datasheet (Philips)

Page 1
DATA SH EET
Objective specification File under Integrated Circuits, IC02
1996 Jan 26
INTEGRATED CIRCUITS
TDA8376; TDA8376A
I
C-bus controlled PAL/NTSC TV
processors
Page 2
1996 Jan 26 2
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
CONTENTS
1 FEATURES 2 GENERAL DESCRIPTION 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING 7 FUNCTIONAL DESCRIPTION
7.1 Video switches
7.2 Integrated video filters, peaking and black stretcher
7.3 Synchronization circuit
7.4 Colour decoder
7.5 RGB output circuit and black-current stabilization
8I
2
C-BUS SPECIFICATION
8.1 Start-up procedure
8.2 Inputs
8.2.1 Input control bits
8.2.2 Output control bits
9 LIMITING VALUES 10 THERMAL CHARACTERISTICS 11 QUALITY SPECIFICATION
11.1 Latch-up
12 CHARACTERISTICS 13 TEST AND APPLICATION INFORMATION
13.1 East-West output stage
13.2 Adjustment of geometry control parameters
14 PACKAGE OUTLINES 15 SOLDERING
15.1 Introduction
15.2 SDIP
15.2.1 Soldering by dipping or by wave
15.2.2 Repairing soldered joints
15.3 QFP
15.3.1 Reflow soldering
15.3.2 Wave soldering
15.3.3 Repairing soldered joints
16 DEFINITIONS 17 LIFE SUPPORT APPLICATIONS 18 PURCHASE OF PHILIPS I2C COMPONENTS
Page 3
1996 Jan 26 3
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
1 FEATURES
Source selection with 2 CVBS inputs and a Y/C (or extra
CVBS) input
Output signals of the video switch circuit for the teletext
decoder and a Picture-In-Picture (PIP) processor
Video identification circuit which is independent of the
synchronization for stable On Screen Display (OSD) under ‘no-signal’ conditions
Integrated chrominance trap with pre-shoot
compensation and bandpass filters (automatically calibrated)
Integrated luminance delay line
Asymmetrical peaking in the luminance channel with a
(defeatable) noise coring function
Black stretcher circuit in the luminance channel
PAL/NTSC colour decoder with automatic search
system
Easy interfacing with the TDA8395 (SECAM decoder)
for multistandard applications
RGB control circuit with black-current stabilization and
white point adjustment; to obtain a good grey scale tracking the black-current ratio of the 3 guns depends on the white point adjustment
Two linear RGB inputs and fast blanking
Horizontal synchronization with two control loops and
alignment-free horizontal oscillator
Vertical count-down circuit
Geometry correction by modulation of the vertical and
E-W drive
Vertical and horizontal zoom possibility for 16 : 9
applications (TDA8376A only)
I
2
C-bus control of various functions
Low dissipation (700 mW)
Small amount of peripheral components compared with
competition ICs
Y, U and V inputs and outputs.
2 GENERAL DESCRIPTION
The TDA8376 and TDA8376A are alignment-free I
2
C-bus controlled video processors which contain a PAL/NTSC colour decoder, luminance processor, sync processor, RGB-control and deflection processor. The circuits have been designed for use with the baseband chrominance delay line TDA4665 and for DC-coupled vertical and East-West (E-W) output stages. Both ICs are pin compatible. The TDA8376A has a flexible horizontal and vertical zoom possibility for 16 : 9 applications.
The supply voltage for the ICs is 8 V. The ICs are available in an SDIP package with 52 pins and in a QFP package with 64 pins (see Chapter 4).
The pin numbers indicated in this document are referenced to the SDIP52; SOT247-1 package; unless otherwise indicated.
Page 4
1996 Jan 26 4
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Supply
V
P
supply voltage 8.0 V
I
P
supply current 75 mA
Input voltages
V
9,13(p-p)
CVBS input voltage (peak-to-peak value) 1.0 V
V
27(p-p)
S-VHS luminance input voltage (peak-to-peak value) 1.0 V
V
6(p-p)
S-VHS chrominance input voltage (burst amplitude) (peak-to-peak value)
0.3 V
V
i(p-p)
RGB input voltage (peak-to-peak value) 0.7 V
Output voltages
V
38(p-p)
TXT output voltage (peak-to-peak value) 1.0 V
V
11(p-p)
PIP output voltage (peak-to-peak value) 1.0 V
V
30(p-p)
(RY) output voltage (peak-to-peak value) 525 mV
V
29(p-p)
(BY) output voltage (peak-to-peak value) 675 mV
V
19,20,21(p-p)
RGB output signal voltage amplitudes (peak-to-peak value) 2.0 V
Output currents
I
40
horizontal output current 10 −−mA
I
47,48
vertical output current 1 −−mA
I
46
E-W drive output current 0.5 −−mA
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA8376 SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 TDA8376AH QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);
body 14 × 20 × 2.8 mm
SOT319-2
Page 5
1996 Jan 26 5
Philips Semiconductors Objective specification
I
2
C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
5 BLOCK DIAGRAM
d
book, full pagewidth
MGE078
CVBS
SWITCH
S-VHS SWITCH
BAND PASSTRAP
CONTROL DACs
16 x 6 bits
2 x 4 bits
PAL/NTSC DECODER
FILTER
TUNING
VERTICAL
SYNC
SEPARATOR
VIDEO
IDENTIFICATION
BLACK
STRETCHER
SYNC
SEPARATOR
AND 1st LOOP
VCO
AND
CONTROL
I
2
C-BUS
TRANSCEIVER
35 34 33
4.4
MHz
3.6
MHz
6 7 11 38 12 36
2nd LOOP AND
HORIZONTAL
OUTPUT
HORIZONTAL/
VERTICAL
DIVIDER
DELAY,
PEAKING AND
CORING
G-Y MATRIX
AND
SAT CONTROL
TDA4665
EW
GEOMETRY
VERTICAL
GEOMETRY
BLACK
CURRENT
STABILIZER
RGB MATRIX
AND
OUTPUT
RGB INPUT
AND
SWITCH
46
BRI CONTR
WHITE
POINT
21 20 19
30 29 32 31 28 27 23 24 25 26
LUMOUT
LUMIN
RI1 GI1 BI1
RGBIN1
CHROMA
CVBS/Y
PIPO
CVBS/TXT
CVBS
EXT
DEC
FT
DET
XTAL2 XTAL1
DEC
DIG
DEC
BG
GND2
GND1
GND3
PH1LF
CVBS
INT
913
SW
SCL
V
P1
(+8 V)
V
P2
(+8 V)
SDA
34 44
454210
51837 43 41 39 40
HOUT
SCO
FBI
PH2LF
ref
ref
HUE
SW
SAT
RO GO BO
22
BCLIN
18
BLKIN
51
2
50
48
47
49
EWD
EHTO VDR
(p)
VSC
C
BLK
VDR
(n)
SEC
ref
14 15 16 17
RGBIN2 RI2 GI2 BI2
RYO BYO BYIRYI
TDA8376(A)
I
ref
Fig.1 Block diagram (SDIP52; SOT247-1).
Page 6
1996 Jan 26 6
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
6 PINNING
SYMBOL
PIN
DESCRIPTION
SDIP52 QFP64
DEC
DIG
1 11 decoupling digital supply
C
BLK
2 12 black peak hold capacitor
SCL 3 13 I
2
C-bus serial clock input
SDA 4 14 I
2
C-bus serial data input/output
DEC
BG
5 16 band gap decoupling CHROMA 6 17 chrominance input (S-VHS) CVBS/Y 7 18 external CVBS/Y input V
P1
8 20 main supply voltage (+8 V) CVBS
INT
9 22 internal CVBS input GND1 10 23 ground 1 PIPO 11 25 picture-in-picture output DEC
FT
12 26 decoupling filter tuning
CVBS
EXT
13 27 external CVBS input RGBIN2 14 28 RGB insertion input 2 RI2 15 29 red input 2 GI2 16 30 green input 2 BI2 17 31 blue input 2 BLKIN 18 32 black-current input BO 19 34 blue output GO 20 35 green output RO 21 36 red output BCLIN 22 37 beam current limiter input RI1 23 38 red input 1 GI1 24 39 green input 1 BI1 25 40 blue input 1 RGBIN1 26 41 RGB insertion input 1 LUMIN 27 42 luminance input LUMOUT 28 43 luminance output BYO 29 44 (BY) signal output RYO 30 45 (RY) signal output BYI 31 46 (BY) signal input RYI 32 47 (RY) signal input XTAL1 33 49 3.58 MHz crystal connection XTAL2 34 51 4.43/3.58 MHz crystal connection DET 35 53 loop filter phase detector SEC
ref
36 54 SECAM reference output V
P2
37 55 horizontal oscillator supply voltage (+8 V) CVBS/TXT 38 56 CVBS/TXT output
Page 7
1996 Jan 26 7
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
SCO 39 57 sandcastle output HOUT 40 58 horizontal output FBI 41 59 flyback input GND2 42 24 ground 2 PH2LF 43 62 phase-2 filter PH1LF 44 63 phase-1 filter GND3 45 60 ground 3 EWD 46 1 east-west drive output VDR
(p)
47 3 vertical drive 1 positive output VDR
(n)
48 4 vertical drive 2 negative output EHTO 49 5 EHT/overvoltage protection input VSC 50 7 vertical sawtooth capacitor I
ref
51 8 reference current input n.c. 52 2 not connected n.c. 6 not connected n.c. 9 not connected n.c. 10 not connected n.c. 15 not connected n.c. 19 not connected n.c. 33 not connected n.c. 48 not connected n.c. 50 not connected n.c. 52 not connected V
P3
21 supply voltage 3 (+8 V) GND4 61 ground 4 GND5 64 ground 5
SYMBOL
PIN
DESCRIPTION
SDIP52 QFP64
Page 8
1996 Jan 26 8
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Fig.2 Pin configuration (SDIP52).
handbook, halfpage
TDA8376(A)
MGE076
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27
DEC
DIG
C
BLK SCL
SDA
DEC
BG
CHROMA
CVBS/Y
V
P1
CVBS
INT
GND1
PIPO
DEC
FT
CVBS
EXT
RGBIN2
RI2 GI2 BI2
BLKIN
BO GO RO
BCLIN
RI1 GI1 BI1
RGBIN1
n.c. I
ref
VSC EHTO VDR
(n)
VDR
(p)
EWD GND3 PH1LF PH2LF GND2 FBI HOUT SCO CVBS/TXT V
P2
SEC
ref
DET XTAL2 XTAL1 RYI BYI RYO BYO LUMOUT LUMIN
Page 9
1996 Jan 26 9
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Fig.3 Pin configuration (QFP64).
handbook, full pagewidth
TDA8376(A)
MGE077
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19
EWD
n.c.
VDR
(p)
VDR
(n)
EHTO
n.c.
VSC
I
ref
n.c. n.c.
DEC
DIG
C
BLK SCL
SDA
n.c.
DEC
BG
CHROMA
CVBS/Y
n.c.
XTAL2 n.c. XTAL1 n.c. RYI BYI RYO BYO LUMOUT LUMIN RGBIN1 BI1 GI1 RI1 BCLIN RO GO BO n.c.
51
50 49 48 47 46 45 44 43 42
41 40 39 38 37 36 35 34 33
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
GND5
PH1LF
PH2LF
GND4
GND3
FBI
HOUT
SCO
CVBS/TXT
V
P2
SEC
ref
DET
n.c.
V
P1
V
P3
CVBS
INT
GND1
GND2
PIPO
DEC
FT
CVBS
EXT
RGBIN2
RI2
GI2
BI2
BLKIN
Page 10
1996 Jan 26 10
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
7 FUNCTIONAL DESCRIPTION
7.1 Video switches
The circuit has two CVBS inputs and a Super-Video Home System (S-VHS) input. The input can be chosen by the I
2
C-bus. The input selector also has a position in which
CVBS
EXT
is processed, unless there is a signal on the S-VHS input. When the input selector is in this position it switches to the S-VHS input if the S-VHS detector detects sync pulses on the S-VHS luminance input. The S-VHS detector output can be read by the I2C-bus. When the S-VHS option is not used the luminance input can be used as a second input for external CVBS signals. The choice is made via the CVS bit (see Table 1).
The video switch circuit has two outputs which can be programmed in a different way. The input signal for the decoder is also available on the TXT output. Therefore this signal can be used to drive the teletext decoder and the SECAM add-on decoder. The signal on the PIP output can be chosen independent of the TXT output. If S-VHS is selected for one of the outputs the luminance and chrominance signals are added so that a CVBS signal is obtained again.
The circuit contains a video identification circuit which checks whether a video signal is available at the selected video input. This circuit is independent of the synchronization circuit. The information of this identification circuit can also be used to switch the phase-1 (ϕ1) loop to a low gain when no signal is received so that a stable OSD display is obtained. The video identification circuit can be switched on and off via the I2C-bus.
7.2 Integrated video filters, peaking and black
stretcher
The circuit contains a chrominance bandpass and trap circuit. The chrominance trap filter in the luminance path is designed for a symmetrical step response behaviour. The filters are realized by gyrator circuits and they are automatically tuned by comparing the tuning frequency with the crystal frequency of the decoder. The luminance delay line and the delay for the peaking circuit are also realized by gyrator circuits. During SECAM reception the centre frequency of the chrominance trap is set to a value of approximately 4.2 MHz to obtain a better suppression of the SECAM carrier frequencies.
The peaking function is achieved by two luminance delay cells each with a delay of 165 ns. The resulting peaking frequency is 3 MHz. The peaking is asymmetrical so that the overshoots in the direction of ‘black’ are approximately two times higher than those in the direction of ‘white’.
This provides a better picture impression than a symmetrical peaking. The circuit contains a coring circuit to prevent the noise content of the video signal being amplified by the peaking circuit. This coring circuit can be switched-off when required.
It is possible to connect a Colour Transient Improvement (CTI) or Picture Signal Improvement (PSI) IC to the TDA8376. The luminance signal which has passed the filter and delay line circuit is available externally. The output signal of the transient improvement circuit must be applied to the luminance input circuit. When the CTI function is not required the two pins must be AC-coupled.
The luminance signal below 50 IRE can be stretched in accordance with the difference between the peak black level and the blanking level of the back-porch of the video signal. The black level stretcher can be switched-off by connecting pin 2 to the positive supply line.
7.3 Synchronization circuit
The sync separator is preceded by a controlled amplifier which adjusts the sync pulse amplitude to a fixed level. These pulses are fed to the slicing stage which is operating at 50% of the amplitude.
The separated sync pulses are fed to the first phase detector and to the coincidence detector. This coincidence detector is only used to detect whether the line oscillator is synchronized and not for transmitter identification. The first Phase-Locked Loop (PLL) has a very high-statical steepness so that the phase of the picture is independent of the line frequency. To prevent the horizontal synchronization being disturbed by anti-copy signals such as Macrovision the phase detector is gated during the vertical retrace period so that pulses during scan have no effect on the output voltage. The position of this pulse is asymmetrical and the width is approximately 22 µs.
The horizontal output signal is generated by an oscillator which operates at twice the line frequency. Its frequency is divided-by-two to lock the first control loop to the incoming signal. The time-constant of the loop can be forced by the I
2
C-bus (fast or slow). If required the IC can select the time-constant depending on the noise content of the incoming video signal. The free-running frequency of the oscillator is determined by a digital control circuit which is locked to the reference signal of the colour decoder. When the IC is switched on the horizontal output signal is suppressed and the oscillator is calibrated as soon as all subaddress bytes have been sent. When the frequency of the oscillator is correct the horizontal drive signal is switched on.
Page 11
1996 Jan 26 11
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
To obtain a smooth switching-on and switching-off behaviour of the horizontal output stage the horizontal output frequency is doubled during switch-on and switch-off (slow start/stop). During that time the duty factor of the output pulse has such a value that maximum safety is obtained for the output stage
To protect the horizontal output transistor the horizontal drive is switched off when a power-on reset is detected. The drive signal is switched on again when the normal switch-on procedure is followed, i.e. all sub-address bytes must be sent and, after calibration, the horizontal drive signal will be released again via the slow start procedure.
When the coincidence detector indicates an out-of-lock situation the calibration procedure is repeated.
The circuit has a second control loop to generate the drive pulses for the horizontal driver stage. To prevent the horizontal output transistor being switched on during flyback the horizontal drive output is gated with the flyback pulse.
The vertical sawtooth generator drives the vertical output and E-W correction drive circuits. The geometry processing circuits provide control of horizontal shift, E-W width, E-W parabola/width ratio, E-W corner/parabola ratio, trapezium correction, vertical shift, vertical slope, vertical amplitude, and the S-correction. All these controls can be set via the I2C-bus. The geometry processor has a differential current output for the vertical drive signal and a single-ended output for the E-W drive. Both the vertical drive and the E-W drive outputs can be modulated for EHT compensation. The EHT compensation pin is also used for overvoltage protection.
The TDA8376A geometry processor also offers the possibility for a flexible vertical and horizontal zoom mode for 16 : 9 applications. Because of this feature an additional control can be added on the remote control so that the viewer can adjust the picture.
In addition the de-interlace of the vertical output can be set via the I2C-bus.
To avoid damage of the picture tube when the vertical deflection fails, the guard output current of the TDA8350 can be supplied to the sandcastle output. When a failure is detected the RGB-outputs are blanked and a bit is set (NDF) in the status byte of the I2C-bus. When no vertical deflection output stage is connected this guard circuit will also blank the output signals. This can be overruled by the EVG bit of subaddress 0A (see Table 1).
7.4 Colour decoder
The colour decoder contains an alignment-free crystal oscillator, a killer circuit and the colour difference demodulators. The 90° phase shift for the reference signal is made internally. The demodulation angle and gain ratio for the colour difference signals for PAL and NTSC are adapted to the standard.
The colour decoder is very flexible. Together with the SECAM decoder TDA8395 an automatic multistandard decoder can be designed. In the automatic mode the SECAM identification is accepted only when the vertical frequency is 50 Hz. In the forced mode the system can also identify signals with a vertical frequency of 60 Hz.
Which standard the IC can decode depends on the external crystals. If a 4.4 MHz and a 3.5 MHz crystal are used PAL 4.4, NTSC 4.4, NTSC 3.5 and PAL 3.5 can be decoded. If two 3.5 MHz crystals are used PAL N and M can be decoded. If one crystal is connected only PAL/NTSC 4.4 or PAL/NTSC 3.5 can be decoded. The crystal frequency of the decoder is used to tune the line oscillator. Therefore the value of the crystal frequency must be given to the IC via the I
2
C-bus. For a reliable calibration of the horizontal oscillator it is very important that the crystal indication bits (XA and XB) are not corrupted (see Table 6). For this reason the crystal bits (SXA and SXB) can be read in the output bytes so that the software can check the I2C-bus transmissions (see Table 38).
7.5 RGB output circuit and black-current
stabilization
The colour-difference signals are matrixed with the luminance signal to obtain the RGB-signals. For the RGB-inputs linear amplifiers have been chosen so that the circuit is suited for signals coming from the SCART connector. The RGB2 inputs (pins 14 to 17) have priority over the RGB1 inputs (pins 23 to 26). Both fast blanking inputs can be blocked by I2C-bus controls. The contrast and brightness controls operate on internal and external signals.
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1996 Jan 26 12
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
The output signal has an amplitude of approximately 2 V black-to-white at nominal input signals and nominal settings of the controls.
The black current stabilization is realized by feedback from the video output amplifiers to the RGB control circuit. The ‘black current’ of the 3 guns of the picture tube is internally measured and stabilized. The black level control is active during 4 lines at the end of the vertical blanking. During the first line the leakage current is measured and the following 3 lines the 3 guns are adjusted to the required level. The maximum acceptable leakage current is ±100 µA.
The nominal value of the ‘black current’ is 10 µA. The ratio of the currents for the various guns automatically tracks with the white point adjustment so that the background colour is the same as the adjusted white point.
The input impedance of the ‘black-current’ measuring pin is 15 k. Therefore the beam current during scan will cause the input voltage to exceed the supply voltage. The internal protection will start conducting so that the excessive current is bypassed.
When the TV receiver is switched on the black current stabilization circuit is not active, the RGB outputs are blanked and beam current limiting input pin is short-circuited. Only during the measuring lines will the outputs supply a voltage of 5 V to the video output stage so that it can be detected if the picture tube is warming up. These pulses are switched on after a waiting time of approximately 0.5 s. This ensures that the vertical deflection is activated so that the measuring pulses are not visible on the screen. As soon as the current supplied to the measuring input exceeds a value of 190 µA the stabilization circuit is activated. After a waiting time of approximately 0.8 s the blanking and the beam current limiting input pin are released. The remaining switch-on behaviour of the picture is determined by the external time constant of the beam current limiting network.
8I
2
C-BUS SPECIFICATION
Valid subaddresses: 00 to 13 (TDA8376) or 00 to 16 (TDA8376A); subaddress FE is reserved for test purposes. Auto-increment mode is available for subaddresses.
8.1 Start-up procedure
Read the status bytes until POR = 0 and send all subaddress bytes. The horizontal output signal is switched on when the oscillator is calibrated.
Each time before the data in the IC is refreshed, the status bytes must be read. If POR = 1, the procedure previously mentioned must be carried out to restart the IC.
When this procedure is not followed the horizontal frequency may be incorrect after power-up or after a power dip.
handbook, halfpage
MLA743
A6 A5 A4 A3 A2 A1 A0
10001011/0
R/W
Fig.4 Slave address (8A).
Page 13
1996 Jan 26 13
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
8.2 Inputs Table 1 Input status bits
Note
1. The bits EXP and CL in subaddress 0C are only valid for the TDA8376. For the TDA8376A these two bits must be set to logic 0.
Table 2 Output status bits
Note
1. X = don’t care.
FUNCTION
SUBADDRESS
(HEX)
DATA BYTE
D7 D6 D5 D4 D3 D2 D1 D0
Source select 00 INA INB INC IND FOA FOB XA XB Decoder mode 01 FORF FORS DL STB POC CM2 CM1 CM0 Hue 02 0 0 A5 A4 A3 A2 A1 A0 Horizontal shift (HS) 03 0 0 A5 A4 A3 A2 A1 A0 E-W width (E-W) 04 0 0 A5 A4 A3 A2 A1 A0 E-W parabola/width (PW) 05 0 0 A5 A4 A3 A2 A1 A0 E-W corner parabola (CP) 06 0 0 A5 A4 A3 A2 A1 A0 E-W trapezium (TC) 07 0 0 A5 A4 A3 A2 A1 A0 Vertical slope (VS) 08 NCIN 0 A5 A4 A3 A2 A1 A0 Vertical amplitude (VA) 09 VID LBM A5 A4 A3 A2 A1 A0 S-correction (SC) 0A HCO EVG A5 A4 A3 A2 A1 A0 Vertical shift (VSH) 0B SBL PRD A5 A4 A3 A2 A1 A0 White point R 0C EXP
(1)
CL
(1)
A5 A4 A3 A2 A1 A0 White point G 0D 0 CVS A5 A4 A3 A2 A1 A0 White point B 0E MAT 0 A5 A4 A3 A2 A1 A0 Peaking 0F YD3 YD2 YD1 YD0 A3 A2 A1 A0 Brightness 10 RBL COR A5 A4 A3 A2 A1 A0 Saturation 11 IE1 IE2 A5 A4 A3 A2 A1 A0 Contrast 12 0 0 A5 A4 A3 A2 A1 A0 Spare 13 0 0 000000 Spare 14 0 0 000000 Spare 15 0 0 000000 Vertical zoom (VX, 76A) 16 0 0 A5 A4 A3 A2 A1 A0
FUNCTION
SUBADDRESS
(HEX)
DATA BYTE
D7 D6 D5 D4 D3 D2 D1 D0
Output status bytes 00 POR FSI STS SL XPR CD2 CD1 CD0
01 NDF IN1 IN2 IFI AFA X
(1)
SXA SXB
Page 14
1996 Jan 26 14
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
8.2.1 INPUT CONTROL BITS
Table 3 Source select 1
Table 4 Source select 2
Table 5 Phase 1 (ϕ1) time constant
Note
1. X = don’t care.
Table 6 Crystal indication XA and XB
INA INB DECODER AND TXT
0 0 CVBS
INT
0 1 CVBS
EXT
1 0 S-VHS 1 1 S-VHS (CVBS
EXT
)
INC IND PIP
0 0 CVBS
INT
0 1 CVBS
EXT
1 0 S-VHS 1 1 S-VHS (CVBS
EXT
)
FOA FOB MODE
0 0 normal 0 1 slow 1X
(1)
fast
XA XB CRYSTAL
0 0 two 3.6 MHz 0 1 one 3.6 MHz (pin 33) 1 0 one 4.4 MHz (pin 34) 1 1 3.6 MHz (pin 33) and
4.4 MHz (pin 34)
Table 7 Forced field frequency
Note
1. When the forced mode is selected the divider will only switch to that position when the horizontal oscillator is not synchronized.
Table 8 Interlace
Table 9 Standby
Table 10 Synchronization mode
Table 11 Colour decoder mode
FORF FORS FIELD FREQUENCY
0 0 auto (60 Hz when line not
synchronized) 0 1 60 Hz; note 1 1 0 50 Hz; note 1 1 1 auto
(50 Hz when line not synchronized)
DL STATUS
0 interlace 1 de-interlace
STB MODE
0 standby 1 normal
POC MODE
0 active 1 not active
CM2 CM1 CM0 DECODER MODE
0 0 0 not forced, own intelligence 0 0 1 forced NTSC 3.6 MHz 0 1 0 forced PAL 4.4 MHz 0 1 1 forced SECAM 1 0 0 forced NTSC 4.4 MHz 1 0 1 forced PAL 3.6 MHz (pin 33) 1 1 0 forced PAL 3.6 MHz (pin 34) 1 1 1 no function
Page 15
1996 Jan 26 15
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Table 12 Vertical divider mode
Table 13 Video identification mode
Table 14 Long blanking mode
Table 15 EHT tracking mode
Table 16 Enable vertical guard (RGB blanking)
Table 17 Service blanking
Table 18 Overvoltage input mode
Table 19 Vertical deflection mode (TDA8376 only)
NCIN VERTICAL DIVIDER MODE
0 normal operation 1 switched to search window
VID VIDEO IDENTIFICATION MODE
0 ϕ
1
loop switched on and off
1 not active
LBM BLANKING MODE
0 adapted to standard (50 or 60 Hz) 1 fixed in accordance with 50 Hz standard
HCO TRACKING MODE
0 EHT tracking only on vertical 1 EHT tracking on vertical and E-W
EVG VERTICAL GUARD MODE
0 not active 1 active
SBL SERVICE BLANKING MODE
0off 1on
PRD OVERVOLTAGE MODE
0 detection mode 1 protection mode
EXP CL VERTICAL DEFLECTION MODE
0 0 normal 0 1 compress 1 0 expand 1 1 expand and lift
Table 20 Condition Y/C input
Table 21 PAL/NTSC matrix
Table 22 Y-delay adjustment; note 1
Note
1. For an equal delay of the luminance and chrominance signal the delay must be set at a value of 160 ns. This is only valid for a CVBS signal without group delay distortions.
Table 23 RGB blanking
Table 24 Noise coring (peaking)
Table 25 Enable fast blanking RGB1
Table 26 Enable fast blanking RGB2
CVS Y-INPUT MODE
0 switched to Y/C mode 1 switched to CVBS mode
MAT MATRIX
0 adapted to standard 1PAL
YD0 to YD3 Y-DELAY
YD3 YD3 × 160 ns + YD2 YD2 × 80 ns + YD1 YD1 × 40 ns + YD0 YD0 × 40 ns
RBL RGB BLANKING
0 not active 1 active
COR NOISE CORING
0off 1on
IE1 FAST BLANKING
0 not active 1 active
IE2 FAST BLANKING
0 not active 1 active
Page 16
1996 Jan 26 16
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
8.2.2 OUTPUT CONTROL BITS
Table 27 Power-on reset
Table 28 Field frequency indication
Table 29 S-VHS status
Table 30 Phase 1 (ϕ
1
) lock indication
Table 31 X-ray protection
Table 32 Colour decoder mode
POR MODE
0 normal 1 power-down
FSI FREQUENCY
050Hz 160Hz
STS S-VHS INPUT
0 no signal 1 signal
SL INDICATION
0 not locked 1 locked
XPR OVERVOLTAGE
0 no overvoltage detected 1 overvoltage detected
CD2 CD1 CD0 STANDARD
0 0 0 no colour standard identified 0 0 1 NTSC 3.6 MHz 0 1 0 PAL 4.4 MHz 0 1 1 SECAM 1 0 0 NTSC 4.4 MHz 1 0 1 PAL 3.6 MHz (pin 33) 1 1 0 PAL 3.6 MHz (pin 34) 1 1 1 spare
Table 33 Output vertical guard
Table 34 Indication RGB1 insertion
Table 35 Indication RGB2 insertion
Table 36 Output video identification
Table 37 IC version indication
Table 38 Crystal indication SXA and SXB
NDF VERTICAL OUTPUT STAGE
0OK 1 failure
IN1 RGB INSERTION
0 no (pin 26 LOW) 1 yes (pin 26 HIGH)
IN2 RGB INSERTION
0 no (pin 14 LOW) 1 yes (pin 14 HIGH)
IFI VIDEO SIGNAL
0 no video signal identified 1 video signal identified
AFA IC
0 TDA8376 1 TDA8376A
SXA SXB CRYSTAL
0 0 two 3.6 MHz 0 1 one 3.6 MHz 1 0 one 4.4 MHz 1 1 3.6 and 4.4 MHz
Page 17
1996 Jan 26 17
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. All pins are protected against ESD by means of internal clamping diodes.
2. Human Body Model (HBM): R = 1.5 k; C = 100 pF.
3. Machine Model (MM): R = 0 ; C = 200 pF.
10 THERMAL CHARACTERISTICS
11 QUALITY SPECIFICATION
In accordance with
“SNW-FQ-611E”
. The number of the quality specification can be found in the
“Quality Reference
Handbook”
. The handbook can be ordered using the code 9398 510 63011.
11.1 Latch-up
At T
amb
=70°C all pins meet the following specification.
I
trigger
100 mA or 1.5V
DD(max)
I
trigger
≤−100 mA or ≤−0.5V
DD(max)
.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
supply voltage 9.0 V
T
stg
storage temperature 25 +150 °C
T
amb
operating ambient temperature 0 70 °C
T
sol
soldering temperature for 5 s 260 °C
T
j
operating junction temperature 150 °C
V
es
electrostatic handling all pins; notes 1 and 2 2000 +2000 V
all pins; notes 1 and 3 200 +200 V
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air
SDIP52 40 K/W QFP64 50 K/W
Page 18
1996 Jan 26 18
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
12 CHARACTERISTICS
V
P
=8V; T
amb
=25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
M
AIN SUPPLY (PIN 8)
V
P1
supply voltage 7.2 8.0 8.8 V
I
P1
supply current 75 mA
P
tot
total power dissipation 650 W HORIZONTAL OSCILLATOR SUPPLY (PIN 37) V
P2
supply voltage 7.2 8.0 8.8 V I
P2
supply current 6 mA
CVBS and S-VHS input switch
I
NTERNAL AND EXTERNAL CVBS INPUTS (PINS 9 AND 13)
V
9(p-p)
CVBS input voltage
(peak-to-peak value)
note 1 1.0 1.4 V
I
9
CVBS input current 4 −µA SS
CVBS
suppression of non-selected CVBS
input signal
notes 2 and 3 50 −−dB
S-VHS INPUT (PINS 6 AND 7) V
7(p-p)
luminance input voltage
(peak-to-peak value)
1.0 1.4 V
I
7(p-p)
luminance input current 4 −µA V
6(p-p)
chrominance input voltage
(burst amplitude)
(peak-to-peak value)
note 4 0.3 0.45 V
Z
i
chrominance input impedance 50 k TXT AND PIP OUTPUT SIGNALS (PINS 38 AND 11) V
o(p-p)
output signal voltage amplitude
(peak-to-peak value)
1.0 V
Z
o
output impedance −− 250 V
TS
top sync voltage level tbf V
Page 19
1996 Jan 26 19
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
RGB inputs, colour difference inputs, luminance inputs and outputs
RGB INPUTS (PINS 15 TO 17 AND 23 TO 25); note 5 V
i(p-p)
input signal voltage amplitude for an output signal of 2 V (black-to-white) at nominal controls (peak-to-peak value)
note 6 0.7 0.8 V
V
i(p-p)
input signal voltage amplitude before clipping occurs (peak-to-peak value)
note 2 1.0 −−V
V
o
difference between black level of internal and external signals at the outputs
−− 20 mV
I
i
input currents no clamping; note 7 0.1 −µA
t
d
delay difference for the three channels
note 2 020ns
FAST BLANKING (PINS 14 AND 26) V
i
input voltage no data insertion −− 0.4 V
data insertion 0.9 −−V
V
14,26(max)
maximum input pulse data insertion −− 3.0 V
t
d
delay time from RGB input to RGB output
data insertion; note 5 100 ns
t
d
delay difference between data insertion to RGB output and RGB input to RGB output
data insertion; note 5 50 ns
I
14,26
input current −− 0.2 mA
SS
int
suppression of internal RGB signals notes 1 and 2; data
insertion; fi= 0 to 5 MHz
55 −−dB
SS
ext
suppression of external RGB signals notes 1 and 2; no data
insertion; fi= 0 to 5 MHz
55 −−dB
V
14
input voltage to insert black level at the RGB outputs to facilitate OSD signals being applied to the outputs
4 −−V
COLOUR DIFFERENCE INPUT SIGNALS (PINS 31 AND 32) V
32(p-p)
input signal amplitude (RY) (peak-to-peak value)
note 7 1.05 V
V
31(p-p)
input signal amplitude (BY) (peak-to-peak value)
note 7 1.35 V
I
31,32
input current for both inputs note 7 0.1 1.0 µA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 20
1996 Jan 26 20
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
LUMINANCE INPUTS AND OUTPUTS (PINS 27 AND 28) V
28(p-p)
output signal voltage amplitude
(peak-to-peak value)
top sync to white 0.45 0.63 V
V
TS
top sync voltage level 2.5 V Z
o
output impedance 250 −Ω V
27(p-p)
input signal voltage amplitude
(peak-to-peak value)
0.45 V
I
clamp
clamping current during burst key
pulse
200 −µA
I
i
input current no clamping −− 0.5 µA
Chrominance filters
C
HROMINANCE TRAP CIRCUIT
f
trap
trap frequency f
osc
MHz
during SECAM reception 4.2 MHz QF trap quality factor note 8 2 SR colour subcarrier rejection 20 −−dB
C
HROMINANCE BAND-PASS CIRCUIT
f
c
centre frequency f
osc
MHz
QBP band-pass quality factor 3
Delay line, peaking circuit and black stretcher
Y
DELAY LINE
t
d
delay time note 2 480 ns
t
d1
tuning range delay time 8 steps 160 +160 ns
B bandwidth of internal delay line note 2 5 −−MHz P
EAKING CONTROL; note 9
f
c(p)
peaking centre frequency 3 MHz
t
W
width of preshoot or overshoot at 50% of pulse; note 2 160 ns
OS overshoot positive 20 %
negative 36 %
peaking control curve 16 steps see Fig.5
G
W
wave gain 1.8
CORING STAGE S coring range 15 IRE BLACK LEVEL STRETCHER (PIN 2); note 10 BLS
max
maximum black level shift 15 21 27 IRE
LSH level shift 100% of peak-white 1 0 +1 IRE
50% of peak-white 1 +3 IRE
15% of peak-white 6 8 10 IRE
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
negative half wave gain
positive half wave gain
--------------------------------------------------------------
Page 21
1996 Jan 26 21
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Horizontal synchronization circuits
SYNC VIDEO INPUTS(PINS 7, 9 AND 13) V
7,9,13
sync pulse voltage amplitude note 7 50 300 mV
SL
HS
slicing level for horizontal sync note 11 50 %
SL
VS
slicing level for vertical sync 30 % HORIZONTAL OSCILLATOR f
fr
free running frequency 15625 Hz f
fr
spread of free running frequency −− ±2% f/V
P
frequency variation with respect to
the supply voltage
VP=8V±10%; note 2 0.2 0.5 %
f
(max)
maximum frequency variation with
temperature
T
amb
= 0 to 70 °C; note 2 −− 80 Hz
FIRST CONTROL LOOP (FILTER CONNECTED TO PIN 44); note 12 f
HR
frequency holding range PLL −±0.9 ±1.2 kHz f
CR
frequency catching range PLL note 2 ±0.6 ±0.9 kHz S/N signal-to-noise ratio of the video
input signal at which the time
constant is switched
20 dB
HYS hysteresis at the switching point 1 dB S
ECOND CONTROL LOOP (CAPACITOR CONNECTED TO PIN 43)
∆ϕ
i
/∆ϕ
o
control sensitivity 150 −µs/µs t
cr
control range from start of horizontal
output to flyback at nominal shift
position
11 12 −µs
t
shift
horizontal shift range 63 steps ±2 −−µs
ϕ
dync
control sensitivity for dynamic
compensation
5.3 −µs/V
V
43
voltage to switch on the ‘flash’
protection
note 13 6 −−V
I
43
input current during protection −− 1mA HORIZONTAL OUTPUT (PIN 40); note 14 V
OL
LOW level output voltage IOL=10mA −− 0.3 V I
O(max)
maximum allowed output current 10 −−mA V
O(max)
maximum allowed output voltage −− V
P
V
δ duty factor note 2 50 %
note 2; V
HOUT
= high;
during switch-on/switch-off
75 %
f
switch
frequency during switch-on and
switch-off
2f
HOUT
Hz
t
switch(on)
switch-on time 50 ms t
switch(off)
switch-off time RGB drive maximum 100 ms
RGB drive minimum 50 ms
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 22
1996 Jan 26 22
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
FLYBACK PULSE INPUT (PIN 41) V
HSW
switching voltage level for horizontal
blanking
0.4 V
V
ϕ2(SW)
switching level for phase-2 loop 4.0 V V
41(max)
maximum input voltage note 7 8.0 V Z
i
input impedance note 7 10 M SANDCASTLE PULSE OUTPUT (PIN 39) V
39
output voltage during burst key 4.8 5.3 5.8 V
during blanking 1.8 2.0 2.2 V
t
W
pulse width burst key pulse 3.3 3.5 3.7 µs
vertical blanking (50 Hz) 25 lines vertical blanking (60 Hz) 21 lines
V
clamp
clamping voltage level for vertical
guard detection
2.7 V
I
39(min)
minimum input current to activate
guard detection
−− 0.5 mA
I
39(max)
maximum allowable input current 2.5 −−mA t
d
delay of start of burst key to start of
sync
5.4 −µs
Vertical synchronization and geometry correction
V
ERTICAL OSCILLATOR; note 15
f
fr
free running frequency 50/60 Hz f
lock
locking frequency range 45 64.5 Hz
divider value not locked 625/525 lines LR locking range 488 722 lines/
frame VERTICAL RAMP GENERATOR (PIN 50) V
50(p-p)
sawtooth voltage amplitude (peak-to-peak value)
VS = 1FH; C = 100 nF; R = 39 k
3.5 V
I
dis
discharge current 1 mA
I
charge
charge current set by external resistor
note 16 19 −µA
VS vertical slope control range 63 steps 20 +20 % I
50
charge current increase f = 60 Hz 20 %
V
LOW level voltage of ramp 2.07 V VERTICAL DRIVE OUTPUTS (PINS 47 AND 48) I
diff(p-p)
differential output current
(peak-to-peak value)
VA = 1FH 0.95 mA
I
CM
common mode output current 400 −µA V
o
output voltage 0 4.0 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 23
1996 Jan 26 23
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
EHT TRACKING/OVERVOLTAGE PROTECTION (PIN 49); note 13 V
49
input voltage 1.2 2.8 V SMR scan modulation range 5 +5 %
ϕ
vert
vertical sensitivity 6.3 %/V
ϕ
EW
E-W sensitivity when switched-on −−6.3 %/V I
eq
E-W equivalent output current +100 −−100 µA V
49
overvoltage detection level 3.9 V DE-INTERLACE
first field delay 0.5H E-W WIDTH; note 17 CR control range 63 steps
TDA8376 100 80 % TDA8376A 100 65 %
I
eq
equivalent output current
TDA8376 0 400 µA TDA8376A 0 700 µA
V
o
E-W output voltage range 1.0 8.0 V I
o
E-W output current range
TDA8376 0 900 µA TDA8376A 0 1200 µA
E-W
PARABOLA/WIDTH
CR control range 63 steps 0 22 % I
eq
equivalent output current E-W = 3FH; CP = 00H 0 440 µA E-W CORNER/PARABOLA CR control range 63 steps 43 0%
I
eq
equivalent output current PW = 3FH; E-W = 3FH 190 0 µA E-W TRAPEZIUM CR control range 63 steps 5 +5 %
I
eq
equivalent output current 100 +100 µA VERTICAL AMPLITUDE CR control range 63 steps 80 120 %
I
eqdiff(p-p)
equivalent differential vertical drive
output current (peak-to-peak value)
SC = 00H 760 1140 µA
VERTICAL SHIFT CR control range 63 steps 5 +5 %
I
eqdiff(p-p)
equivalent differential vertical drive
output current (peak-to-peak value)
50 +50 µA
S-CORRECTION CR control range 63 steps 0 30 %
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 24
1996 Jan 26 24
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
VERTICAL EXPANSION (ZOOM) MODE (TDA8376A ONLY); note 18
Output current variation compared with nominal scan:
VEF vertical expansion factor 0.75 1.38 %
output current limiting and RGB
blanking
1.06 %
Colour demodulation part
C
HROMINANCE AMPLIFIER
ACC
cr
ACC control range note 19 26 −−dB V variation in amplitude of the output
signals over the ACC range
−− 2dB
THR
on
threshold colour killer ON 23 26 29 dB HYS
off
hysteresis colour killer OFF strong signal conditions;
S/N 40 dB; note 2
+3 dB
noisy input signals; note 2 +1 dB
R
EFERENCE PART
Phase-locked loop;
note 20
f
CR
frequency catching range ±360 ±600 Hz ∆ϕ phase shift for a ±400 Hz deviation
of the oscillator frequency
note 2 −− 2 deg
Oscillator
TC
osc
temperature coefficient of the
oscillator frequency
note 2 −− tbf Hz/K
f
osc
oscillator frequency deviation with
respect to the supply
note 2; VP=8V±10% −− tbf Hz
R
i(min)
minimum negative input resistance −− 1k C
L(max)
maximum load capacitance −− 15 pF HUE CONTROL HUE
cr
hue control range 63 steps; see Fig.6 ±35 ±40 deg HUE hue variation for ±10% V
P
note 2 0 deg
HUE/T hue variation with temperature T
amb
= 0 to 70 °C; note 2 0 deg
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 25
1996 Jan 26 25
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
DEMODULATORS (PINS 29 AND 30) V
30(p-p)
(RY) output voltage amplitude
(peak-to-peak value)
note 21 0.525 V
V
29(p-p)
(BY) output voltage amplitude
(peak-to-peak value)
note 21 0.675 V
G gain ratio between both
demodulators G(BY) and G(RY)
1.60 1.78 1.96
V spread of voltage amplitude ratio
PAL/NTSC
note 2 1 +1 dB
Z
o
output impedance (RY)/(BY)
output
note 2 500 −Ω
B bandwidth of demodulators 3 dB; notes 7 and 21 650 kHz V
29,30(p-p)
residual carrier output
(peak-to-peak value)
f=f
osc
; (RY) output −− 5mV
f=f
osc
; (BY) output −− 5mV
f=2f
osc
; (RY) output −− 5mV
f=2f
osc
; (BY) output −− 5mV
V
30(p-p)
H/2 ripple at (RY) output
(peak-to-peak value)
−− 25 mV
V
o
/T variation of output voltage amplitude
with temperature
note 2 0.1 %/K
V
o
/V
P
variation of output voltage amplitude
with supply voltage
note 2 −− ±0.1 dB
ϕ
e
phase error in the demodulated
signals
−− ±5 deg
COLOUR DIFFERENCE MATRICES IN CONTROL CIRCUIT
PAL or (SECAM mode with TDA8395);−(R−Y) and−(B−Y) not affected
(GY)/(RY) ratio of demodulated signals −−0.51
±10%
(GY)/(BY) ratio of demodulated signals −−0.19
±25%
NTSC mode; the colour-difference matrix results in the following signals (nominal hue setting)
(BY) (BY) signal (BY)
(RY) (RY) signal 1.39(RY) 0.07(BY)
(GY) (GY) signal 0.46(RY) 0.15(BY)
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 26
1996 Jan 26 26
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
REFERENCE SIGNAL OUTPUT FOR TDA8395 (PIN 36); note 22 f
ref
reference frequency 4.43 MHz V
36(p-p)
output voltage amplitude
(peak-to-peak value)
0.2 0.25 0.3 V
V
o
output voltage level PAL/NTSC identified 1.5 V
no PAL/NTSC identified; SECAM (by TDA8395) identified
5.0 V
I
36
required current to stop PAL/NTSC
identification circuit during SECAM
150 −−µA
Control part
S
ATURATION CONTROL; note 6
SAT
CR
saturation control range 63 steps; see Fig.7 52 −−dB CONTRAST CONTROL; note 6 CON
CR
contrast control range 63 steps 20 dB
tracking between the three channels
over a control range of 10 dB
see Fig.8 −− 0.5 dB
B
RIGHTNESS CONTROL
BRI
CR
brightness control range 63 steps; see Fig.9 −±0.7 V RGB OUTPUT SIGNALS (PINS 19, 20 AND 21) V
19,20,21(p-p)
output voltage amplitude
(peak-to-peak value)
at nominal luminance input signal, nominal contrast and white-point adjustment; note 6
tbf 2.0 tbf V
at maximum white point setting
3.0 V
V
BWmax(p-p)
maximum voltage amplitude
(black-to-white)
note 23 2.6 V at maximum white point
setting
3.6 V
V
RED(p-p)
output voltage amplitude for the ‘red’
channel (peak-to-peak value)
at nominal settings for contrast and saturation control and no luminance signal to the input (RY, PAL)
tbf 2.1 tbf V
V
blank
blanking level at the RGB outputs 0.7 0.8 0.9 V I
bias
internal bias current of NPN emitter
follower output transistor
1.5 mA
I
o
available output current 5 mA Z
o
output impedance 150 −Ω CR
bl
control range of the black-current
stabilization
nominal brightness and white-point adjustment (with respect to the measuring pulse); V
blk
= 2.5 V
−− ±1V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 27
1996 Jan 26 27
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
V
bl
black level shift with picture content note 2 −− 20 mV V
o
output voltage of the 4-L pulse after
switch-on
4.2 V
bl/T variation of black level with
temperature
note 2 1.0 mV/K
bl relative variation in black level
between the three channels during
variations of
note 2
supply voltage (±10%) nominal controls −− tbf mV saturation (50 dB) nominal contrast −− tbf mV contrast (20 dB) nominal saturation −− tbf mV brightness (±0.5 V) nominal controls −− tbf mV temperature (range 40 °C) −− tbf mV
S/N signal-to-noise ratio of the output
signals
RGB input; note 24 60 −−dB CVBS input; note 24 50 −−dB
V
res(p-p)
residual voltage at the RGB outputs
(peak-to-peak value)
at f
osc
−− 15 mV
at 2f
osc
plus higher
harmonics in RGB outputs
−− 15 mV
B bandwidth of output signals RGB input; at 3dB 8 −−MHz
CVBS input; at 3 dB; f
osc
= 3.58 MHz
2.8 MHz
CVBS input; at 3 dB; f
osc
= 4.43 MHz
3.5 MHz
S-VHS input; at 3dB 5 −−MHz
W
HITE-POINT ADJUSTMENT
I2C-bus setting for nominal gain HEX code 20H G
inc(max)
maximum increase of the gain HEX code 3FH 40 50 60 % G
dec(max)
maximum decrease of the gain HEX code 00H 40 50 60 % BLACK-CURRENT STABILIZATION (PIN 18); note 25 I
bias
bias current for the picture tube
cathode
nominal white point setting 10 −µA
I
leak
acceptable leakage current 100 −µA I
scan(max)
maximum current during scan 0.3 mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 28
1996 Jan 26 28
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Notes
1. Signal with negative-going sync. Amplitude includes sync pulse amplitude.
2. This parameter is not tested during production but is guaranteed by the design and qualified by means of matrix batches which are made in the pilot production period.
3. This parameter is measured at nominal settings of the various controls.
4. Indicated is a signal for a colour bar with 75% saturation (chrominance : burst ratio = 2.2 : 1).
5. The RGB1 inputs (pins 14 to 17) have priority over the RGB2 inputs (pins 23 to 25).
6. Nominal contrast is specified with the DAC in position 20H. Nominal saturation as maximum 10 dB. In the nominal brightness setting the black level at the outputs is identical to the level of the black-current measuring pulses.
7. This parameter is not tested during production and is just given as application information for the designer of the television receiver.
8. The 3 dB bandwidth of the circuit can be calculated by means of the following equation:
9. Valid for a signal amplitude on the Y-input of 0.7 V black-to-white (100 IRE) with a rise time (10% to 90%) of 70 ns and the video switch in the Y/C mode. During production the peaking function is not tested by measuring the overshoots but by measuring the frequency response of the Y output.
10. For video signals with a black level which deviates from the back-porch blanking level the signal is ‘stretched’ to the blanking level. The amount of correction depends on the IRE value of the signal (see Fig.10). The black level is detected by the capacitor connected to pin 2. The black level stretcher can be made inoperative by connecting pin 2 to the positive supply line. The values given are valid only when the luminance input signal (pins 7, 9 and 13) has a value of 1 V (p-p).
11. The slicing level is independent of sync pulse amplitude. The given percentage is the distance between the slicing level and the black level (back porch).
B
EAM CURRENT LIMITING (PIN 22); note 23
V
CR
contrast reduction starting voltage 3.5 V
V
diffCR
voltage difference for full contrast reduction
2.0 V
V
BR
brightness reduction starting voltage 2.5 V
V
diffBR
voltage difference for full brightness reduction
1.0 V
V
bias
internal bias voltage 4.5 V
I
ch(int)
internal charge current 25 −µA
I
disch
discharge current due to ‘peak-white limiting’
200 −µA
SYMBOL PARAMETER CONDITIONS MIN. TYP . MAX. UNIT
f
3dB
f
osc
1
1
2Q
--------


=
Page 29
1996 Jan 26 29
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
12. To obtain a good performance for both weak signal and VCR playback the time constant of the first control loop is switched depending on the input signal condition and the condition of the I2C-bus. Therefore the circuit contains a noise detector and the time constant is switched to ‘slow’ when too much noise is present in the signal. In the ‘fast’ mode during the vertical retrace time the phase detector current is increased 50% so that phase errors due to head-switching of the VCR are corrected as soon as possible. Switching between the two modes can be automatically or overruled by the I2C-bus.
The circuit contains a video identification circuit which is independent of first loop. This identification circuit can be used to close or open the first control loop when a video signal is present or not present on the input. This enables a stable On Screen Display (OSD) when just noise is present at the input. The coupling of the video identification circuit with the first loop can be defeated via the I2C-bus.
To prevent that the horizontal synchronization being disturbed by anti-copy guard signals like Macrovision the phase detector is gated during the vertical retrace period so that pulses during scan have no effect on the output voltage. The width of the gate pulse is approximately 22 µs, the phase position around the sync pulse is asymmetrical. During weak signal conditions (noise detector active) the gating is active during the complete scan period and the width of the gate pulse is reduced to 5.7 µs so that the effect of the noise is reduced to a minimum.
The output current of the phase detector in the various conditions are shown in Table 39.
13. The ICs have two protection inputs. The protection on pin 43 is intended to be used as ‘flash’ protection. When this protection is activated the horizontal drive pulse is switched-off immediately and then switched on again via the slow start procedure. The protection on pin 49 is intended for overvoltage (X-ray) protection. When this protection is activated the horizontal drive can be switched-off (via the slow stop procedure). It is also possible to continue the horizontal drive and to set the protection bit (XPR) in the output bytes of the I2C-bus. The choice between the two modes of operation is made via the PRD bit.
14. During switch-on the horizontal output starts with the double frequency and with a duty factor of 75% (V
HOUT
= high). After approximately 50 ms the frequency is changed to the normal value. Because of the high frequency the peak currents in the horizontal output transistor are limited. Also during switch-off the frequency is switched to the double value and the RGB drive is set to maximum so that the EHT capacitor is discharged. After approximately 100 ms the RGB drive is set to minimum and 50 ms later the horizontal drive is switched-off.
15. The timing pulses for the vertical ramp generator are obtained from the horizontal oscillator via a divider circuit. This divider circuit has 3 modes of operation:
a) Search mode ‘large window’. This mode is switched on when the circuit is not synchronized or when a non-standard signal (number of lines per
frame in the 50 Hz mode is between 311 and 314 and in the 60 Hz mode between 261 and 264). In the search mode the divider can be triggered between line 244 and line 361 (approximately 45 to 64.5 Hz).
b) Standard mode ‘narrow window’. This mode is switched on when more than 15 successive vertical sync pulses are detected in the narrow window.
When the circuit is in the standard mode and a vertical sync pulse is missing the retrace of the vertical ramp generator is started at the end of the window. Consequently, the disturbance of the picture is very small. The circuit will switch back to the search window when, for 6 successive vertical periods, no sync pulses are found within the window.
c) Standard TV-norm (divider ratio 525 (60 Hz) or 625 (50 Hz). When the system is switched to the narrow window it is checked whether the incoming vertical sync pulses are in
accordance with the TV-norm. When 15 standard TV-norm pulses are counted the divider system is switched to the standard divider ratio mode. In this mode the divider is always reset at the standard value even if the vertical sync pulse is missing.
When 3 vertical sync pulses are missed the system switches back to the narrow window and when also in this window no sync pulses are found (condition 3 missing pulses) the system switches over to the search window.
The vertical divider requires some waiting time during channel-switching of the tuner. When a fast reaction of the divider is required during channel-switching the system can be forced to the search window by means of the NCIN bit in subaddress 08.
Page 30
1996 Jan 26 30
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
16. Conditions: frequency is 50 Hz; normal mode; VS = 1FH.
17. The E-W output current range of the TDA8376A is higher than that of the TDA8376 because of the horizontal zoom function of the TDA8376A. The output range percentages mentioned for E-W control parameters are based on the assumption that 400 µA variation in E-W output current is equivalent to 20% variation in picture width.
18. The TDA8376A has a zoom adjustment possibility for the vertical and horizontal deflection. For this reason an extra DAC has been added in the vertical amplitude control which controls the vertical scan amplitude between 75 to 138% of the nominal scan. At an amplitude of 106% of the nominal scan the output current is limited and the blanking of he RGB outputs is activated. This is illustrated in Fig.21. In addition to the variation of the vertical amplitude the vertical slope control range is also increased. This allows variation of the position of the bottom part of the picture independent of the upper part. The nominal scan height must be adjusted at a position of 19H of the vertical ‘zoom’ DAC.
19. At a chrominance input voltage of 660 mV (p-p) [colour bar with 75% saturation i.e. burst signal amplitude 300 mV (p-p)] the dynamic range of the ACC is +6 and 20 dB.
20. All frequency variations are referenced to a 3.58 or 4.43 MHz carrier frequency. All oscillator specifications are measured with the Philips crystal series 9922 520 with a series capacitance of 18 pF. The oscillator circuit is rather insensitive to the spurious responses of the crystal. Provided the resonance resistance of the third overtone is higher than that of the fundamental frequency the oscillator will operate at the correct frequency. The typical crystal parameters for the crystals are:
a) load resonance frequency f
0
(CL= 20 pF) = 4.433619 or 3.579545 MHz
b) motional capacitance C
M
= 20.6 fF (4.43 MHz crystal) or 14.7 fF (3.58 MHz crystal)
c) parallel capacitance C
0
= 5 pF for both crystals.
The minimum detuning range can only be specified if both the IC and the crystal tolerances are known and the figures given in are therefore valid for the specified crystal series. In this, tolerances of the crystal with respect to nominal frequency, motional capacitance and ageing have been taken into account and have been counted for by gaussic addition. Whenever different typical crystal parameters are used the following equation might be helpful for calculating the impact on the detuning capabilities:
Detuning range:
The resulting detuning range should be corrected for temperature shift and supply deviation of both the IC and the crystal. The actual series capacitance in the application should be C
L
= 18 pF to account for parasitic capacitances on and off chip. For 3-normal applications with two crystals connected to one pin the maximum parasitic capacitance of the crystal pin should not exceed 15 pF.
21. The (RY) and (BY) signals are demodulated with a phase difference of the reference carrier of 90° and a gain ratio . The matrixing to the required signals is achieved in the control part.
22. The subcarrier output signal can be supplied to the TDA8395 but it can also be used as drive signal for external comb filters. For this reason the signal is continuously available at the output. Only when SECAM has been identified the subcarrier signal is available only during the vertical retrace time. This is to avoid cross-talk between the SECAM input signal and the subcarrier signal. An external DC load on this pin is not allowed because this current will disturb the reliability of the communication between the TDA8376/TDA8376A and the TDA8395.
23. At nominal setting of the gain control. When this amplitude is exceeded the peak-white limiting circuit will reduce the contrast. The control voltage is generated via the external capacitor connected to the beam-current limiting input.
24. Signal-to-noise ratio (S/N) is specified as peak-to-peak signal with respect to RMS noise (bandwidth 5 MHz).
25. This is a current input. The indicated value of the nominal bias current is obtained at the nominal setting of the gain (white point) control. The actual value of the bias current depends on the gain control setting of each channel. As a result the ‘black-current’ of each gun is adapted to the white point setting so that the background colour will follow the white point adjustment.
C
M
1
C
0
C
L
------ -
+



2
--------------------------
BY()– RY()
------------------------
1.78=
Page 31
1996 Jan 26 31
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Table 39 Output current of the phase detector in the various conditions
Note
1. Only during vertical retrace, pulse width 22 µs. In other conditions the pulse width is 5.7 µs and the gating is continuous.
I2C-BUS COMMANDS IC CONDITIONS ϕ-1 CURRENT/MODE
VID POC FOA FOB IDENT COIN NOISE SCAN V-RETR GATING MODE
0 0 0 yes yes yes 30 30 yes
(1)
auto
0 0 0 yes no no 180 270 no auto
0 0 1 yes yes yes 30 30 yes slow
0 0 1 yes yes no 180 270 yes fast
01−yes −−180 270 no fast 00−−no −−6 6 no OSD
1 −−−−−−−−off
MLA738 - 1
50
30
10
10
30
50
(%)
048C10
F
DAC (HEX)
Fig.5 Peaking control curve.
Overshoot in direction ‘black’.
MLA739 - 1
50
30
10
10
30
50
(deg)
010203040
DAC (HEX)
Fig.6 Hue control curve.
Page 32
1996 Jan 26 32
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
MLA740 - 1
25
0
(%)
010203040
DAC (HEX)
50
75
Fig.7 Saturation control curve. Fig.8 Contrast control curve.
MLA741 - 1
90
50
10
(%)
010203040
DAC (HEX)
20
30
40
60
70
80
MLA742 - 1
0.7
0.35
0
0.35
0.7 0
(V)
010203040
DAC (HEX)
Fig.9 Brightness control curve.
Relative variation with respect to the measuring pulse.
Fig.10 I/O relationship of the black level stretcher.
(1) Maximum black level shift. (2) Level shift at 15% of peak white.
handbook, halfpage
A
A
B
output
(IRE)
60
20
20
80
40
0
input (IRE)
200 100
MGE079
40 60 80
(1)
(2)
B
Page 33
1996 Jan 26 33
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
13 TEST AND APPLICATION INFORMATION
Fig.11 Application diagram.
handbook, full pagewidth
MGE080
SDA
XTAL2
34 33 38
4 3 15 16 17 14 23 24 25 26
36 30 29 32 31 39
21 20 19 18 22 46 47 48 40 41
XTAL1
SCL RI2 GI2 BI2 RGBIN2 RI1 GI1 BI1
RO GO BO BLKIN BCLIN EWD VDR
(p)
SEC
ref
VDR
(n)
HOUT
BYO
3.6 MHz
4.4 MHz
RYO RYICVBS/
TXT
BYI SCO
FBI
to text decoder
RGBIN1
CVBS
INT
CVBS
EXT
CVBS/Y
CHROMA
PIPO
9
13
7
6
11
TDA8395
TDA8376(A)
TDA4665
13.1 East-West output stage
In order to obtain correct tracking of the vertical and horizontal EHT-correction, the E-W output stage should be dimensioned as illustrated in Fig.12.
Resistor REW determines the gain of the E-W output stage. Resistor Rc determines the reference current for both the vertical sawtooth generator and the geometry processor.
The preferred value of R
c
is 39 kwhich results in a
reference current of 100 µA (V
ref
= 3.9 V
The value of R
EW
must be:
Example: With V
ref
= 3.9 V Rc=39kΩand V
scan
= 120 V
then REW= 68 kΩ.
R
EW
R
c
V
scan
18 V
ref
×
---------------------- -
×=
Page 34
1996 Jan 26 34
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Fig.12 East-West output stage.
handbook, full pagewidth
MGE081
TDA8376(A)
HORIZONTAL DEFLECTION
STAGE
DIODE
MODULATOR
EW OUTPUT
STAGE
EWD
100 nF
(5%)
39 k
(2%)
46
5051
R
c
C
saw
R
EW
V
DD
V
scan
V
EW
I
ref
V
ref
Fig.13 Control range of vertical amplitude.
VA = 0, 31H and 63H; VSH = 31H; SC = 0.
handbook, halfpage
0
200
600
400
0
t
MGE082
1/2 t
I
vert
(µA)
time
Fig.14 Control range of vertical slope.
VS = 0, 31H and 63H; VA = 31H; VHS = 31H; SC = 0.
handbook, halfpage
0t
300
700
100
500
MGE083
1/2 t
time
I
vert
(µA)
Page 35
1996 Jan 26 35
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Fig.15 Control range of vertical shift.
VSH = 0, 31H and 63H; VA = 31H; SC = 0.
handbook, halfpage
0
200
600
400
0
t
MGE084
1/2 t
time
I
vert
(µA)
Fig.16 Control range of S-correction.
SC = 0, 31H and 63H; VA = 31H; VHS = 31H. Picture height does not change with setting of S-correction for
nominal vertical amplitude (VA = 31H).
handbook, halfpage
0
-200
-600
-400
0
t
MGE085
1/2 t
time
I
vert
(µA)
Fig.17 Control range of E-W width.
EW = 0, 31H and 63H; PW = 31H; CP = 31H.
handbook, halfpage
0
1200
0
1000
t
MGE086
1/2 t
time
I
EW
(µA)
Fig.18 Control range of E-W parabola/width ratio.
PW = 0, 31H and 63H; EW = 31H; CP = 31H.
handbook, halfpage
0
t
time
MGE087
1/2 t
I
EW
(µA)
Page 36
1996 Jan 26 36
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
Fig.19 Control range of E-W corner/parabola ratio.
CP = 0, 31H and 63H; EW = 31H; PW = 63H.
handbook, halfpage
0
t
time
MGE088
1/2 t
I
EW
(µA)
Fig.20 Control range of E-W trapezium correction.
TC = 0, 31H and 63H; EW = 31H; PW = 31H.
handbook, halfpage
0
t
time
MGE089
1/2 t
I
EW
(µA)
Fig.21 Sawtooth waveform and blanking pulse.
TDA8376A only.
handbook, full pagewidth
60
70
50 40 30
138%
75%
20 10
0
10
20
30
40
50
60
BOTTOM PICTURE
TOP
PICTURE
vertical
position
(%)
100%
1/2 t
time
blanking for expansion 138%
t
MGE090
Page 37
1996 Jan 26 37
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
13.2 Adjustment of geometry control parameters
The deflection processor of the TDA8376/TDA8376A offers nine control parameters for picture alignment:
Vertical picture alignment – S-correction – vertical amplitude – vertical slope – vertical shift
Horizontal picture alignment – horizontal shift – E-W width – E-W parabola/width – E-W corner/parabola – E-W trapezium correction.
It is important to notice that the TDA8376/ TDA8376A is designed for use with a DC-coupled vertical deflection stage. This is the reason why a vertical linearity alignment is not necessary (and therefore not available).
For a particular combination of picture tube type, vertical output stage and E-W output stage it is determined which are the required values for the settings of S-correction, E-W parabola/width ratio and E-W corner/parabola ratio. These parameters can be preset via the I
2
C-bus, and do not need any additional adjustment. The remainder of the parameters are preset with the mid-value of their control range (i.e. 1FH), or with the values obtained by previous TV-set adjustments.
The vertical shift control is intended for compensation of off-sets in the external vertical output stage or in the picture tube. It can be shown that without compensation these off-sets will result in a certain linearity error, especially with picture tubes that need large S-correction. The total linearity error is in first order approximation proportional to the value of the off-set, and to the square of the S-correction required. The necessity to use the vertical shift alignment depends on the expected off-sets in vertical output stage and picture tube, on the required value of the S-correction, and on the demands upon vertical linearity.
For adjustment of the vertical shift and vertical slope independent of each other, a special service blanking mode can be entered by setting the SB-bit HIGH. In this mode the RGB-outputs are blanked during the second half of the picture. There are two different methods for alignment of the picture in vertical direction. Both methods make use of the service blanking mode.
The first method is recommended for picture tubes that have a marking for the middle of the screen. With the vertical shift control the last line of the visible picture is positioned exactly in the middle of the screen. After this adjustment the vertical shift should not be changed. The top of the picture is placed by adjustment of the vertical amplitude, and the bottom by adjustment of the vertical slope.
The second method is recommended for picture tubes that have no marking for the middle of the screen. For this method a video signal is required in which the middle of the picture is indicated (e.g. the white line in the circle test pattern). With the vertical slope control the beginning of the blanking is positioned exactly on the middle of the picture. Then the top and bottom of the picture are placed symmetrical with respect to the middle of the screen by adjustment of the vertical amplitude and vertical shift. After this adjustment the vertical shift has the correct setting and should not be changed.
If the vertical shift alignment is not required VSH should be set to its mid-value (i.e. VSH = 1FH). Then the top of the picture is placed by adjustment of the vertical amplitude and the bottom by adjustment of the vertical slope. After the vertical picture alignment the picture is positioned in the horizontal direction by adjustment of the E-W width and the horizontal shift. Finally (if necessary) the left and right-hand sides of the picture are aligned in parallel by adjusting the E-W trapezium control.
To obtain the full range of the vertical zoom function of the TDA8376A the adjustment of the vertical geometry should be carried out at a nominal setting of the zoom DAC at position 19H.
Page 38
1996 Jan 26 38
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
14 PACKAGE OUTLINES
UNIT b
1
cEe M
H
L
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT247-1
90-01-22 95-03-11
b
max.
w
M
E
e
1
1.3
0.8
0.53
0.40
0.32
0.23
47.9
47.1
14.0
13.7
3.2
2.8
0.181.778 15.24
15.80
15.24
17.15
15.90
1.73
5.08 0.51 4.0
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
D
A
2
Z
52
1
27
26
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D
(1)
Z
e
A
max.
12
A
min.
A
max.
SDIP52: plastic shrink dual in-line package; 52 leads (600 mil)
SOT247-1
Page 39
1996 Jan 26 39
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
UNIT A1A2A3b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
0.25
0.05
2.90
2.65
0.25
0.50
0.35
0.25
0.14
14.1
13.9
1
18.2
17.6
1.2
0.8
7 0
o o
0.2 0.10.21.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT319-2
95-02-04 97-08-01
D
(1) (1)(1)
20.1
19.9
H
D
24.2
23.6
E
Z
1.2
0.8
D
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
19
y
c
E
H
A
2
D
Z
D
A
Z
E
e
v M
A
1
64
52
51 33
32
20
X
pin 1 index
b
p
D
H
b
p
v M
B
w M
w M
0 5 10 mm
scale
QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT319-2
A
max.
3.20
Page 40
1996 Jan 26 40
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
15 SOLDERING
15.1 Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
15.2 SDIP
15.2.1 SOLDERING BY DIPPING OR BY WA VE The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
15.2.2 R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
15.3 QFP
15.3.1 REFLOW SOLDERING Reflow soldering techniques are suitable for all QFP
packages. The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our
“Quality
Reference Handbook”
(order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary from 50 to 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheat for 45 minutes at 45 °C.
15.3.2 WAVE SOLDERING Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves downstream and at the side corners.
Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
15.3.3 R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Page 41
1996 Jan 26 41
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
16 DEFINITIONS
17 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
18 PURCHASE OF PHILIPS I
2
C COMPONENTS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I
2
C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
Page 42
1996 Jan 26 42
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
NOTES
Page 43
1996 Jan 26 43
Philips Semiconductors Objective specification
I2C-bus controlled PAL/NTSC TV processors
TDA8376; TDA8376A
NOTES
Page 44
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Tel. (31)40-2783749, Fax. (31)40-2788399
Brazil: Rua do Rocio 220 - 5
th
floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: Av. Santa Maria 0760, SANTIAGO,
Tel. (02)773 816, Fax. (02)777 6730
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852)2319 7888, Fax. (852)2319 7700
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549
Denmark: Prags Boulevard 80, PB 1919, DK-2300
COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (358)0-615 800, Fax. (358)0-61580 920
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 51 40, 20035 HAMBURG,
Tel. (040)23 53 60, Fax. (040)23 53 63 00
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
India: Philips INDIA Ltd, Shivsagar Estate, A Block,
Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)7640 000, Fax. (01)7640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l.,
Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5130, Fax. (03)3740 5077
Korea: Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040)2783749, Fax. (040)2788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel.380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825
SCDS47 © Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1100/01/pp44 Date of release: 1996 Jan 26 Document order number: 9397 750 00592
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