Datasheet TDA8042M Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8042M

Quadrature demodulator

Product specification
File under Integrated Circuits, IC02

1997 Apr 11

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

FEATURES

• 5 V supply voltage

• Internal voltage reference

• 350 to 650 MHz input frequency range

• On-chip 0° and 90° phase shifter

• Symbol rate up to 45 Msymbols/s

• High input sensitivity

• Built-in voltage stabilizer

• AGC amplifier with 21 dB control range

• AGC detector.

APPLICATION

• Binary Phase-Shift Keying (BPSK) and Quadrature
Phase-Shift Keying (QPSK) demodulation.

GENERAL DESCRIPTION

The TDA8042M is a monolitic bipolar IC dedicated for
BPSK and QPSK demodulation. It is designed to be used
together with the TDA8043 as part of a complete
BPSK/QPSK satellite demodulator and decoder.
The bandwidth of the TDA8042M allows symbol rates up
to 45 Msymbols/s. It includes two matched mixers, an IF
gain controlled amplifier, a symmetrical oscillator, a 0°/90°
phase shifter, two low-pass filters and two matched
baseband amplifiers.

The high input sensitivity makes interfacing with various
sources easy. The input sensitivity can be adjusted by
means of an internal AGC amplifier.

The oscillator operates at half the IF frequency. The local
oscillator signal driving the mixers is made by doubling the
oscillator frequency by an internal frequency multiplier.
The oscillator frequency can be set by the appropriate
external LC tank circuit. The internal wideband phase
shifter provides two oscillator signals which are
90 degrees out of phase to drive the mixers.

An AGC detector at the I and Q outputs makes it possible
to keep the I and Q signals at a constant level to drive the
analog-to-digital converters of the TDA8043.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

V

i(RF)

f

i(RF)

V

olQ(p-p)

∆E
∆E
∆G

Φ(I-Q)

G(I-Q)

tilt

supply voltage 4.75 5.0 5.25 V
supply current VCC= 5.0 V 54 67.5 81 mA
operating input level − 57 − dBµV
RF input signal frequency 350 − 650 MHz
I and Q output voltage (peak-to-peak value) − 0.8 − V
phase matching error between I and Q channels − 0.7 2 deg
gain matching error between I and Q channels − 0.15 0.8 dB
gain tilt error between I and Q channels − 0.3 0.5 dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8042M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

1997 Apr 11 2

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

BLOCK DIAGRAM

handbook, full pagewidth

IDET

1

DET

20

VTH

IFA

IFB

2

3

4

5

6

7

8

×

0°

90°

×

9

10

I

× 2

Q

VOLTAGE

REFERENCE

VCO

32

GND1

VAGC

IOUT

GND2

V

CC2

QOUT FDIV(B)

GND1

19

GND1

18

V

CC1

17

OSCDIS

16

OSCA

15

OSCB

14

GND1

13

FDIV(A)

12

11

V

CC1

TDA8042M

MBH968

Fig.1 Block diagram.

1997 Apr 11 3

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

PINNING

SYMBOL PIN DESCRIPTION

IDET 1 AGC detector output signal
GND1 2 ground
VAGC 3 gain control input voltage
IOUT 4 I channel amplifier output
GND2 5 ground
IFA 6 IF input A
IFB 7 IF input B
V

CC2

8 supply voltage 2
QOUT 9 Q channel amplifier output
GND1 10 ground
V

CC1

11 supply voltage 1
FDIV(B) 12 prescaler output B
FDIV(A) 13 prescaler output A
GND1 14 ground
OSCB 15 oscillator tank circuit B
OSCA 16 oscillator tank circuit A
OSCDIS 17 oscillator disable input
V

CC1

18 supply voltage 1
GND1 19 ground
VTH 20 AGC threshold voltage input

handbook, halfpage

IDET VTH

1

GND1 GND1

2
3

VAGC V

IOUT OSCDIS

4
5

GND2 OSCA

IFA OSCB
IFB GND1

V

CC2

QOUT FDIV(B)

GND1 V

TDA8042M

6
7
8
9

10

MBH967

20
19
18
17
16
15
14
13
12
11

CC1

FDIV(A)

CC1

Fig.2 Pin configuration.

1997 Apr 11 4

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

V

i

P

tot

T

stg

T

j

T

amb

Note

1. The operating ambient temperature can be extended up to +85 °C providing the supply voltage remains lower or
equal to 5.2 V in order to maintain the junction temperature below 150 °C.

QUALITY SPECIFICATION

supply voltage −0.3 +6.0 V
input voltage on all pins −0.3 V

CC

V
total power dissipation − 470 mW
IC storage temperature −55 +150 °C
junction temperature − +150 °C
operating ambient temperature 0 +70

(1)

°C

All pins withstand the ESD test in accordance with

“UZW-BO/FQ-B302 (machine model)”

. These numbers can be found in the

“UZW-BO/FQ-A302 (human body model)”

“Quality reference Handbook”

and with

. The handbook

can be ordered using the code 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 120 K/W

1997 Apr 11 5

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

CHARACTERISTICS

V

=5V; T

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CC1

V

CC2

I

CC1

I

CC2

AGC

G

CR

G

VAGC

R

iVAGC

V

th

R

iVTH

 maximum AGC detector output current

I

det

=25°C; R

amb

=1kΩ; measured in application circuit of Fig.4; unless otherwise specified.

L(IQ)

supply voltage 4.75 5.0 5.25 V
supply voltage 4.75 5.0 5.25 V
supply current V
supply current V

CC1=VCC2
CC1=VCC2

=5.0V415161mA
= 5.0 V 13 16.5 20 mA

gain control range 21 29 − dB
voltage gain control at pin 3 note 1

input level = V
input level = V

i(RF)min
i(RF)max

0.5 − 2V

3.5 − 4.5 V
input resistance at pin 3 − 20 − kΩ
AGC threshold voltage note 2

= 1.6 V (peak-to-peak value) − 3.6 − V

V

o

= 0.8 V (peak-to-peak value) − 2.4 − V

V

o

= 0.4 V (peak-to-peak value) − 1.8 − V

V

o

VTH input resistance − 10 − kΩ

note 3 − 1 − mA

(absolute value)

QPSK demodulator

f

i(RF)

R

i(RF)

X

i(RF)

V

i(RF)

∆E

Φ(I-Q)

RF input signal frequency 350 − 650 MHz
RF input impedance (resistive part) f
RF input impedance (reactive part) f

i(RF)
i(RF)

operating RF input level note 1 57 − 78 dBµV
phase matching error between I and Q

note 4 − 0.7 2 deg

channels

∆E
∆G

G(I-Q)

tilt

gain matching error between I and Q channels note 5 − 0.15 0.8 dB
gain tilt error between I and Q channels note 6 − 0.3 0.5 dB

F DSB noise figure source

impedance = 50 Ω;
note 7

d

3(IQ)

third-order intermodulation distortion in I and

note 8 − 50 − dB

Q channels

= 480 MHz − 50 −Ω
= 480 MHz − 19 −Ω

− 13 17 dB

1997 Apr 11 6

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Oscillator

f

osc

∆f

osc

N

osc

V

osc(dis)

Prescaler

V

OH

V

OL

δ output duty cycle 40 50 60 %
DIV

spu(IQ)

I and Q internal filters

B

−1

B

−30

I and Q output amplifiers

V

O(IQ)(DC)

V

o(IQ)(p-p)

V

clip(p-p)

R

L(IQ)

R

o(IQ)

α

ct(I-Q)

Notes

1. The voltage gain control range (G
800 mV (peak-to-peak value) at I and Q outputs.
The lowest control voltage corresponds to the highest sensitivity and gain.

2. Vth is the level of voltage to be applied at pin 20 to get a current I
amplitude of the signal at I and Q outputs.
The AGC threshold voltage can be set by a resistive voltage divider connected at pin 20. Without the external
resistors Vthis set at a value close to 2.35 V.

3. The current I
Vth.

4. The phase error is defined as the phase quadrature imbalance between I and Q channels.

5. The gain error is defined as the phase quadrature imbalance between I and Q channels.

6. The tilt is defined as the difference between the maximum and the minimum channel gain measured in a frequency
band of ±30 MHz around f

oscillator frequency note 9 175 − 325 MHz
frequency drift note 10 −−500 kHz

= ±5% −−100 kHz

∆V

CC

oscillator phase noise measured10 kHz

from f

; note 11

osc

−−91 dBc/Hz

oscillator disable voltage at pin 17

oscillator disabled −−1.0 V
oscillator enabled 4.0 −−V

HIGH level output voltage note 12 4.0 −−V
LOW level output voltage note 12 −−3.35 V

output spurious voltage at I and Q outputs note 13 −−50 − dB

bandwidth for 1 dB attenuation 30 −−MHz
bandwidth for 30 dB attenuation − 450 − MHz

I and Q channels DC output voltage − 2.45 − V
I and Q channels output voltage

note 14 − 0.8 − V

(peak-to-peak value)
I and Q output clipping level

1.8 V

(peak-to-peak value)
I and Q channels output load resistance note 15 500 −−Ω
I and Q channels output resistance − 67 −Ω
crosstalk between I and Q channels 30 −−dB

) is defined as the DC voltage to be applied on pin 3 to get a signal level of

VAGC

of 0.5 mA at pin 1. This voltage depends on the

det

increases when the output level (at pins 4 and 9) increases above the value set by the adjustment of

det

. The specified tilt is the maximum tilt value found in one of the I and Q channels.

i(RF)

1997 Apr 11 7

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

7. The specified noise figure is the maximum value obtained from I and Q channels noise measurement. The figure
holds for the maximum gain (G

8. The specified intermodulation distortion is the minimum value obtained from intermodulation measurements in I and
Q channels. The specified value is the minimum distance between wanted signal and intermodulation products
measured at the output for a wanted output level of 0.8 V (peak-to-peak value).

9. The oscillator is tuned with an appropriate tank circuit designed for each frequency limit.

10. The drift of the oscillator frequency with temperature is defined for ∆T
circuit (see Fig.4) with a temperature compensated tank circuit. The temperature compensation used for this
measurement is realized using the application which is depicted in Fig.3.

11. The phase noise is measured at the oscillator frequency (= 240 MHz). Due to the internal frequency doubler the
phase noise at the input of the mixers will be 6 dB worse.

12. Measured with a high impedance load (RL>5kΩ) connected at pins 12 and 13.

13. The prescaler output spurious voltage at I and Q outputs are measured with respect to an output level of 800 mV
(peak-to-peak value).

14. Measured with an input signal f

15. The load should be AC-coupled.

= 0.5 V).

VAGC

+ 500 kHz (i.e. 480.5 MHz).

i(RF)

=25°C. It is measured in the application

amb

handbook, full pagewidth

to pin 15

TOKO ref.:

100 082 93278

to pin 16

8.2 pF
NP0

2.2 pF
NP0

Fig.3 Temperature compensation circuit.

6 pF
N470

1 pF
N470

MBH969

1997 Apr 11 8

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

APPLICATION INFORMATION

handbook, full pagewidth

NOT ON THE TESTBOARD

50 Ω

RF

5 V

1 kΩ

H-183-4

test point

ANZAC

5 V

100 nF

100 nF

100

nF

100

nF

100

nF

1 kΩ

1 kΩ

5 kΩ

10 nF

10 nF

5 V

GND1

VAGC

GND2

V

QOUT

GND1

IDET

IOUT

IFA

IFB

CC2

1

2

3

4

5

6

7

8

9

TDA8042M

20

19

18

17

16

15

14

13

12

1110

MBH970

VTH

100

nF

GND1

V

CC1

OSCDIS

OSCA

18 pF

OSCB

GND1

FDIV(A)

FDIV(B)

V

CC1

10 nF

10 nF

1 kΩ

100

nF

100

nF

470 Ω

470 Ω

100

nF

+

5 V

TOKO ref.:
100 082 93278

5 V

5 V
maximum

to

prescaler

Fig.4 Application diagram.

1997 Apr 11 9

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

PACKAGE OUTLINE

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

D

c

y

Z

20

pin 1 index

11

A

2

A

1

110

w M

b

e

p

E

H

E

detail X

SOT266-1

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

mm

OUTLINE

VERSION

SOT266-1

A

max.

1.5

0.1501.4

1.2

b

3

p

0.32

0.20

0.20

0.13

0.25

IEC JEDEC EIAJ

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

(1)E(1)

cD

6.6

6.4

REFERENCES

4.5

0.65 1.0 0.2

4.3

1997 Apr 11 10

eHELLpQZywv θ

6.6

6.2

0.75

0.45

0.65

0.45

PROJECTION

0.13 0.1

EUROPEAN

(1)

0.48

0.18

ISSUE DATE

90-04-05
95-02-25

o

10

o

0

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SSOP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering isnot recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

(order code 9398 652 90011).

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Apr 11 11

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Apr 11 12

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

NOTES

1997 Apr 11 13

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

NOTES

1997 Apr 11 14

Philips Semiconductors Product specification

Quadrature demodulator TDA8042M

NOTES

1997 Apr 11 15

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© Philips Electronics N.V. 1997 SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547047/1200/01/pp16 Date of release: 1997 Apr 11 Document order number: 9397 750 00909