Datasheet TDA8012M-C2, TDA8012M-C1-S1 Datasheet (Philips)

Page 1
DATA SH EET
Product specification Supersedes data of 1995 Feb 02 File under Integrated Circuits, IC02
1996 Mar 26
INTEGRATED CIRCUITS
TDA8012M
Page 2
1996 Mar 26 2
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
FEATURES
High input sensitivity
Fully balanced two-pin Voltage Controlled Oscillator
(VCO)
Low input impedance (50 Ω)
Low impedance video baseband output
Internal voltage stabilizer
Keyed AFC or peak-to-peak AFC
Carrier detector
AGC output
Suitable for High Definition TV (HDTV).
APPLICATIONS
Direct Broadcast Satellite (DBS) receivers.
GENERAL DESCRIPTION
The TDA8012M is a sensitive PLL FM demodulator which is used for the second IF in satellite receivers. It provides Automatic Gain Control (AGC) and Automatic Frequency Control (AFC) outputs that can be used to optimize the level and frequency of the input signal. During the searching procedure, the AFC output provides a signal which is used for carrier detection.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT
V
CC
supply voltage 4.5 5.0 5.5 V
I
CC
supply current VCC=5V; T
amb
=25°C506070mA
V
i
input signal voltage level 53 57 61 dBµV
V
o(p-p)
video output signal voltage amplitude (peak-to-peak value)
fo= 25 MHz (p-p) 1 V
f
i
operating input frequency 480 MHz
TYPE
NUMBER
PACKAGES
NAME DESCRIPTION VERSION
TDA8012M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
Page 3
1996 Mar 26 3
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MBE251
3
4
STABILIZER
VCO
VIDEO BUFFER
TDA8012M
1
2
5
6
7 8
9
10
CDF1 CDF2
PD(pos)
PD(neg)
IFI1 IFI2
GND
CC
V
AGCO
th
AGC
VIDEO
LF1
LF2
OSCGND
VCO1
VCO2
NF
KEY
AFC
CDO
AFC
os
20
19 18
17
16
15 14
13
12
11
CARRIER
DETECTOR
AFC
AGC
Page 4
1996 Mar 26 4
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
PINNING
SYMBOL PIN DESCRIPTION
CDF1 1 carrier detector filter 1 input CDF2 2 carrier detector filter 2 input PD(pos) 3 positive peak detector output PD(neg) 4 negative peak detector output IFI1 5 IF input 1 IFI2 6 IF input 2 GND 7 ground V
CC
8 supply voltage AGCO 9 AGC output AGC
th
10 AGC threshold voltage input VIDEO 11 baseband signal output LF1 12 loop filter 1 input LF2 13 loop filter 2 input OSCGND 14 oscillator ground VCO1 15 oscillator tank circuit 1 input VCO2 16 oscillator tank circuit 2 input NF 17 noise filter input KEY 18 key pulse input AFC
CDO
19 AFC and carrier detector output AFC
os
20 AFC offset input
Fig.2 Pin configuration.
book, halfpage
TDA8012M
MBE250
1 2 3 4 5 6 7 8 9
10
20 19 18 17 16 15 14 13 12 11
CDF1
CDF2 PD(pos) PD(neg)
IFI1
IFI2
GND
V
AGCO
AGC
CC
th
VIDEO
LF1
LF2
OSCGND
VCO1
VCO2
NF
KEY
AFC
AFC
CDO
os
FUNCTIONAL DESCRIPTION
The TDA8012M is a low power PLL FM demodulator designed for use in satellite TV reception systems.
The demodulator is based on a Phase-Locked Loop (PLL) structure including a fully balanced two-pin VCO. A high gain IF amplifier ensures a high input sensitivity. The video output voltage is supplied via a highly linear video buffer which has a low output impedance. The centre frequency of the VCO and the loop characteristics can be set using external components.
The circuit provides an AGC signal which is used to drive a gain-controlled IF amplifier (TDA8011T or TDA8010M) to ensure a stable PLL demodulation characteristic.
An analog AFC voltage is also made available. This signal can be suitably applied to the input of the ADC port of the PLL frequency synthesizer (TSA5055). The AFC function may be keyed to address D2MAC and MUSE systems.
The TDA8012M includes a Carrier Detector (CD) which is used for channel detection during search procedures.
Page 5
1996 Mar 26 5
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe it is desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
CHARACTERISTICS
V
CC
=5V; fi= 480 MHz; Vi=57dBµV; T
amb
=25°C; measured in application circuit of Fig.4;
unless otherwise specified.
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
supply voltage 0.3 6.0 V
V
i(max)
maximum input voltage on all pins 0.3 V
CC
V
I
source(max)
maximum output source current 10 mA
t
sc
maximum short-circuit time on all outputs 10 s
Z
L
AC load impedance at video output 600 −Ω
T
stg
storage temperature 55 +150 °C
T
j
junction temperature +150 °C
T
amb
operating ambient temperature 10 +80 °C
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 120 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
CC
supply voltage 4.75 5.0 5.25 V
I
CC
supply current note 1 50 60 70 mA
Voltage controlled oscillator
K
VCO
voltage controlled oscillator constant VCC= 4.75 to 5.25 V;
T
amb
= 10 το +80 °C
22.5 25 27.5 MHz/V
δf
o
/δT voltage controlled oscillator drift note 2 −−70 × 10−6−°C
1
f
o
voltage controlled oscillator shift VCC= 4.75 to 5.25 V −− ±750 kHz
Frequency demodulator
V
i
input signal voltage level note 3 53 57 61 dBµV
Z
i
input impedance real part; note 4 50 −Ω
parallel inductive part; note 4
130 nH
K
PD
phase detector constant Vi=57dBµV 0.37 V/rad
G
v
phase-lock loop gain drift; note 5 2 dB
shift; note 5 2 dB
Page 6
1996 Mar 26 6
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
Z
o(diff)
differential output impedance of the phase detector
1.6 2 2.4 k
CR
PLL
phase-lock loop capture range note 6 −±17 MHz
G
diff
differential gain note 7 −±2 %
Φ
diff
differential phase note 7 −±2 deg
IM3 third-order intermodulation distortion note 8 50 −−dB
Video output
V
o(p-p)
baseband output signal amplitude (peak-to-peak value)
fo= 25 MHz 0.9 1.0 1.1 V
V
O(DC)
DC voltage level of video output 2.1 2.35 2.6 V
Z
o
output impedance 10 50 Automatic gain control (note 9) AGC
th
AGC threshold as a function of the
voltage applied to pin 10
I
AGC
= 0.5 mA; 0.1V
CC
−− 53 dBµV
I
AGC
= 0.5 mA; 0.9V
CC
61 −−dBµV
LD level detector shift;
V
CC
= 4.75 to 5.25 V
1 dB
drift; T
amb
= 10 to +80 °C
1 dB
AGC steepness I
AGC
= 0.5 mA; note 10 8 mA/dB
V
sat(AGC)
low level AGC output saturation
voltage
I
AGC
=1mA 200 500 mV
Keying pulse
t
key
input keyed pulse time period 64 −µs t
W(key)
keyed pulse width 8 −−µs V
IL
LOW level input keyed pulse voltage key on −− 0.8 V V
IH
HIGH level input keyed pulse voltage key off 2.7 −−V Z
i
input impedance 1 −−k AFC and carrier detector output (note 11) δV
AFC/δf
AFC steepness 4.9 5.5 6.1 V/MHz AFC
shift
shift of AFC voltage in relation to
VCO shift with unmodulated
480 MHz input signal
VCC= ±5% −±180 ±500 kHz
AFC
drift
drift of AFC voltage in relation to the
VCO
T
amb
=80°C; note 12 −−400 kHz
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 7
1996 Mar 26 7
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
Notes
1. The DC supply current is defined for VCC=5V.
2. This typical value of 70 ppm/°C or 70 × 10−6°C−1 can be found in the reference measuring set-up shown in Fig.3. The temperature drift may be adjusted by the temperature coefficient of the external capacitor in the tank circuit.
3. The circuit is designed for an input level of 57 dBµV. The maximum allowable input level is 61 dBµV. However, for levels other than 57 dBµV the optimum loop filter values will be different from those given for the 57 dBµV input level in the reference measuring set-up.
4. The input impedance is reduced to a resistor with a parallel reactance. The values are given at 480 MHz. In order to reduce the radiation from the oscillator to the RF input, it is recommended to use a symmetrical drive.
5. The PLL loop gain shift and drift are given without loop filter shift and drift (non-temperature compensated external components).
6. The capture range or lock-in range is defined as the PLL normal operating range. This value depends strongly on the loop filter characteristics.
7. Measurements with test signals in accordance with CCIR recommendation 473-3. FM modulated signal with DBS parameters:
a) 625 lines PAL TV system b) 25 MHz/V modulator sensitivity c) 1 V (p-p) video signal d) No SAW filter is used.
8. No SAW filter is used at the input: a) 16 MHz/V modulator sensitivity b) 4.43 MHz sine wave colour signal [660 mV (p-p)] c) 3.25 MHz sine wave luminance signal [700 mV (p-p)] d) Two Wegner sound sub-carriers at 7.02 and 7.2 MHz (100 mV) e) Intermodulation distance is defined as the distance between the luminance signal and the intermodulation
products.
9. The characteristics of the AGC function are measured in the application circuit of Fig.4. The circuit illustrated in Fig.4 has been designed to set the maximum AGC current of 1 mA. The output of the AGC function is capable of handling up to 5 mA. The maximum AGC current can be increased to 5 mA by decreasing the value of the resistor connected between pins 8 and 9.
10. In the application circuit (see Fig.4) the voltage at the AGC output decreases when the IF input level increases above the adjusted AGC threshold.
11. The outputs from the AFC and carrier detector are combined at pin 19 (see Fig.3). During search tuning, when the input frequency is outside the capture range, the combined output (carrier detector function) is at a LOW level (any voltage below 0.6VCC). When the PLL becomes locked, the voltage at pin 19 rises to a HIGH level (V19= 0.8VCCto VCC). When the input channel is close to the centre frequency, V19 falls to the LOW level. As shown in Fig.3, the voltage at pin 19 is now a function of the centre frequency (AFC function). This information may be read by a microcontroller via the ADC of the satellite frequency synthesizer (TSA5055) and the I2C-bus.
12. The drift of the AFC voltage is measured in accordance with the following method: a) At room temperature (T
amb
=25°C) the TDA8012M is driven by a 480 MHz unmodulated signal. The voltage at
pin 20 must be adjusted to obtain a 1.5 V output at the AFC output (pin 19).
b) At T
amb
=80°C, due to its temperature drift, the AFC output voltage differs from 1.5 V. The input frequency must, therefore, be adjusted to obtain 1.5 V at the AFC output. The drift of the AFC voltage will then be equal to the difference between the new input frequency and 480 MHz.
Page 8
1996 Mar 26 8
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
Fig.3 AFC and carrier detector output.
MBE253
0
0.15
0.3
0.45
0.6
0.8
1
AFC DATA
frequency
V19/V
CC
carrier detect on
f
o
500 kHz
Page 9
1996 Mar 26 9
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
APPLICATION INFORMATION
Fig.4 Application circuit.
book, full pagewidth
MBE252
3
4
STABILIZER
VCO
VIDEO BUFFER
TDA8012M
1
2
5
6
7 8
9
10
CC
V
AGCO
VIDEO
KEY
AFC
CDO
20
19 18
17
16
15
14
13
12
11
CARRIER
DETECTOR
AFC
AGC
82 k
2.7 M
22 µF
1 µF
10 M
330 nF
10 M
330 nF
IF input
10 nF
10 nF
4.7 k
47 k
2
k
1.3 k
10 pF
1.2 pF30 nH
180 pF
10
k
1 µF
2.2 k
36 k
13 k
CC
V
Page 10
1996 Mar 26 10
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
PACKAGE OUTLINE
UNIT A1A2A
3
b
p
cD
(1)E(1)
(1)
eHELLpQZywv θ
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
0.1501.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
0.65 1.0 0.2
6.6
6.2
0.65
0.45
0.48
0.18
10
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1
90-04-05 95-02-25
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
X
(A )
3
A
y
0.25
110
20
11
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
A
max.
1.5
Page 11
1996 Mar 26 11
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SSOP packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate solder thieves at the downstream end.
Even with these conditions, only consider wave soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Page 12
1996 Mar 26 12
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 13
1996 Mar 26 13
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
NOTES
Page 14
1996 Mar 26 14
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
NOTES
Page 15
1996 Mar 26 15
Philips Semiconductors Product specification
Low power PLL FM demodulator for satellite TV receivers
TDA8012M
NOTES
Page 16
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537021/1100/02/pp16 Date of release: 1996 Mar 26 Document order number: 9397 750 00766
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