Datasheet TDA8008 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8008

Dual multiprotocol smart card
coupler

Objective specification
File under Integrated Circuits, IC02

1999 Dec 14

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

FEATURES

• 8xC51 core with 16 kbytes or EPROM (TDA8008),
256 bytes RAM, 512 bytesAUXRAM, Timer 0, 1, 2 and
enhanced UART

• Specific ISO 7816 UART, accessible with MOVX
instructions for automatic convention processing,
variable baud rate through frequency or division ratio
programming, error management at character level for
T = 0 protocol, extra guard time register

• Dual VCC generation (5 V ±5% or 3 V ±5%), maximum
current of 60 mA with controlled rise and fall times

• Dual cards clock generation (up to 10 MHz) with two
times synchronous frequency doubling

• Cards clock STOP HIGH or LOW or 1.25 MHz (from an
integrated oscillator) for cards power reduction mode

• Automatic activation and deactivation sequences
through an independent sequencer

• Supports the asynchronous protocols T = 0 and T = 1 in
accordance with ISO 7816 and EMV

• Versatile 24-bit time-out counter for Answer To Reset
(ATR) and waiting times processing

• 22 ETU counter for block guard time

• Supports synchronous cards

• Current limitations on cards contacts

• Special circuitry for killing spikes during power-on or off

• Supply supervisor for Power-on reset

• Step-up converter (supply voltage from 2.7 to 5.5 V at

16 MHz), doubler, tripler or follower according to V
and V

DD

CC

• Speed up to 25 MHz at VDD=5V

• Additional I/O pin allowing the use of the ISO 7816

UART for an external card interface (pin IOAUX)

• Additional interrupt pin allowing detection of level
toggling on an external signal (pin INTAUX)

• Fast and efficient swapping between the 3 cards due to
separate buffering of parameters for each card

• Chip select input allowing use of several devices in
parallel and memory space paging

• Enhanced ESD protections on card contacts (6 kV min.)

• Software library for easy integration within the

application

• Development tool with a TDA8007B and a regular
emulator.

APPLICATIONS

• Multiple smart card readers for multiprotocol
applications (EMV banking, digital pay TV, access
control, etc.).

GENERAL DESCRIPTION

TheTDA8008 is a complete, one-chip,low cost dual smart
card coupler.

Itcanbeusedas the kernel of a multiple card reader. It can
handle all ISO 7816, EMV and GSM11-11 requirements.
The integrated ISO 7816 UART and the time-out counters
allow easy use even at high baud rates with no real time
constraints. Due to its chip select and external I/O and
interrupt features, it simplifies the realization of any
number of cards reader. It gives the cards and the set a
very high level of security, due to its special hardware
against ESD, short-circuiting, power failure and
overheating. Its integrated step-up converter allows
operation within a supply voltage range of 2.7 to 5.5 V at
16 MHz.

The OTP version of the TDA8008 allows fast and reliable
software development and fast product introduction.

A software library has been developed, that can handle all
actions required for T = 0, T = 1 and synchronous
protocols.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA8008HL LQFP80 plastic low profile quad flat package; 80 leads; body 12 × 12 × 1.4 mm SOT315-1

1999 Dec 14 2

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

I

DD(pd)

I

DD(sm)

I

DD(om)

V

CC

I

CC

I

CC1+ICC2

SR slew rate on V
t

de

t

act

f

XTAL

f

op

T

amb

supply voltage V

DDD=VDDA=VDDP

supply current in Power-down mode VDD= 3.3 V; cards inactive;

2.7 − 5.5 V

−−tbf µA
8xC51 controller in power-down
mode; note 1

supply current in sleep mode VDD= 3.3 V; cards active at

−−tbf mA
VCC= 5V;clockstopped; 8xC51
controller in Idle mode; note 1

supply current in operating mode VDD= 3.3 V; f

V

CC1=VCC2

I

CC1+ICC2

= 80 mA; note 1

XTAL1

=5V;

= 20 MHz

−−tbf mA

card output supply voltage including static loads (5 V card) 4.75 5.0 5.25 V

with 40 nAs dynamic loads on

4.6 5.0 5.4 V
200 nF capacitor (5 V card)

including static loads (3 V card) 2.80 3.0 3.20 V
with 40 nAs dynamic loads on

2.75 3.0 3.25 V
200 nF capacitor (3 V card)

card output supply current operating −−65 mA

overload detection − 80 − mA

sum of both cards currents −−80 mA

(rise and fall) CL= 300 nF (max.) 0.10 0.16 0.22 V/µs

CC

deactivation cycle duration −−100 µs
activation cycle duration −−225 µs
crystal frequency 3.5 − 25 MHz
operating frequency external frequency applied to

0 − 25 MHz

pin XTAL1

ambient temperature −25 − +85 °C

Note

in all configurations includes the current at pins V

1. I

DD

DDD

1999 Dec 14 3

, V

DDA

and V

DDP

.

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

BLOCK DIAGRAM

handbook, full pagewidth

SBP

SAP

25 16

200 nF

SAM

17

23

V

DDP

GNDP

RESET

RSTOUT

DDD

V

3

39

51

GNDD

52

200 nF

CDELAY

6

SUPPLY

SUPERVISOR

SBM

24

18

STEP-UP

CONVERTER

EA/VPP

PSEN

ALE/PROG

P10 to P17

P30 to P37

P20 to P27

P00 to P07

P36/WR

P37/RD

INTAUX
IOAUX

CS

65

63

64

75 to 80,
1, 2

41 to 48

53 to 62

67 to 74

47

48

35
37
38

8xC51 CONTROLLER

16 KBYTES ROM or OTP

256 BYTES RAM

TIMER 0, 1 and 2

8

8

ENHANCED UART

512 BYTES AUXRAM

BY MOVX

TDA8008

ALE

TIME-OUT

COUNTER

ISO 7816

UART

CLOCK

CIRCUITRY

INTERFACE CONTROL

ANALOG
DRIVERS

AND

SEQUENCER

XTAL
OSCILLATOR

INTERNAL
OSCILLATOR

19 to 22, 40,
58, 59, 66

n.c.

26

4

34
33
32
31
30

29
28

27
15

14
13

12
11

10

9
8

5

50

49

36

7

FCE568

200 nF

V

I/01

C81

PRES1

C41

RST1

V
CLK1

GNDC1

GNDC2
CLK2

V

RST2

C42
C82
I/02

PRES2

GNDA

XTAL1

XTAL2

TEST
INHIB

VUP

DDA

CC1

CC2

Fig.1 Block diagram.

1999 Dec 14 4

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

PINNING

SYMBOL PIN DESCRIPTION

P16 1 8xC51 general purpose I/O port
P17 2 8xC51 general purpose I/O port
RESET 3 reset input: a HIGH on this pin for 2 machine cycles while the oscillator is running, resets the

device. An internal diffused resistor connected to GNDD permits a Power-on reset using an
external capacitor connected to V

V

DDA

4 analog supply voltage
GNDA 5 analog ground
CDELAY 6 pin for an external delay capacitor
INHIB 7 test pin (must be left open-circuit in the application)
PRES2 8 card 2 presence contact input (active HIGH or LOW by mask option)
IO2 9 data line to/from card 2 (ISO C7 contact)
C82 10 auxiliary I/O for ISOC8 contact for card 2 (i.e. synchronous cards)
C42 11 auxiliary I/O for ISOC4 contact for card 2 (i.e. synchronous cards)
RST2 12 card 2 reset output (ISO C2 contact)
V

CC2

13 card2 output supply voltage (ISO C1 contact)
CLK2 14 clock output of card 2 (ISO C3 contact)
GNDC2 15 ground for card 2
SAM 16 contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP

and SAM)
GNDP 17 ground for the step-up converter
SBM 18 contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP

and SBM)
n.c. 19 not connected
n.c. 20 not connected
n.c. 21 not connected
n.c. 22 not connected
V

DDP

23 supply voltage for the step-up converter

SBP 24 contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP

and SBM)
SAP 25 contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP

and SAM)
VUP 26 output of the step-up converter
GNDC1 27 ground for card 1
CLK1 28 clock output of card 1 (ISO C3 contact)
V

CC1

29 card 1 output supply voltage (ISO C1 contact)
RST1 30 card 1 reset output (ISO C2 contact)
C41 31 auxiliary I/O for ISO C4 contact for card 1 (i.e. synchronous cards)
PRES1 32 card 1 presence contact input (active HIGH or LOW by mask option)
C81 33 auxiliary I/O for ISO C8 contact for card 1 (i.e. synchronous cards)
IO1 34 data line to and from card 1 (ISO C7 contact)
INTAUX 35 auxiliary interrupt input

DDD

.

1999 Dec 14 5

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

SYMBOL PIN DESCRIPTION

TEST 36 test pin (must be left open-circuit in the application)
IOAUX 37 input or output for an I/O line issued on an auxiliary smart card interface
CS 38 chip select input (active LOW)
RSTOUT 39 open-drain output for resetting external chips
n.c. 40 not connected
P30/RXD 41 8xC51 general purpose I/O port/serial input port
P31/TXD 42 8xC51 general purpose I/O port/serial output port
P32/

INT0 43 8xC51 general purpose I/O port/external interrupt 0

P33/

INT1 44 8xC51 general purpose I/O port/external interrupt 1
P34/T0 45 8xC51 general purpose I/O port/Timer 0 external input
P35/T1 46 8xC51 general purpose I/O port/Timer 1 external input

WR 47 8xC51 general purpose I/O port/external data memory write strobe

P36/
P37/

RD 48 8xC51 general purpose I/O port/external data memory read strobe
XTAL2 49 connection pin for an external crystal (output from the inverting oscillator amplifier)
XTAL1 50 connection pin for an external crystal, or input for an external clock signal (input to the

inverting oscillator amplifier and input to the internal clock generator circuits)

V

DDD

GNDD 52 digital ground
P20/A8 53 8xC51 general purpose I/O port/address 8
P21/A9 54 8xC51 general purpose I/O port/address 9
P22/A10 55 8xC51 general purpose I/O port/address 10
P23/A11 56 8xC51 general purpose I/O port/address 11
P24/A12 57 8xC51 general purpose I/O port/address 12
n.c. 58 not connected
n.c. 59 not connected
P25/A13 60 8xC51 general purpose I/O port/address 13
P26/A14 61 8xC51 general purpose I/O port/address 14
P27/A15 62 8xC51 general purpose I/O port/address 15
PSEN 63 Program store enable output: this is the read strobe to the external program memory. When

PROG 64 Address latch enable/program pulse: this is the output pulse for latching the low byte of the

ALE/

51 digital supply voltage

executing code from the external program memory, PSEN is activated twice each machine
cycle, except that two PSEN activations are skipped during each access to external data
memory.PSEN is not activated during fetches from internal program memory.

address during an access to external memory.In normal operation, ALE pulses are emitted at
a constant rate of1⁄6of the oscillator frequency and can be used for external timing or
clocking. It should be noted that one ALE pulse is skipped during each access to external data
memory. This pin is also the program pulse input (PROG) during EPROM programming. ALE
can be disabled by setting bit SFR Auxiliary 0. With this bit set, ALE will be active only during
a MOVX instruction.

1999 Dec 14 6

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

SYMBOL PIN DESCRIPTION

EA/VPP 65 External access enable/programming supply voltage: EA must be externally held LOW to

enable the device to fetch code from external program memory locations starting with 0000H.
If EA is held HIGH, the deviceexecutesfrom the internal program memory unless the program
counter contains an address greater than 3FFFH (16 kbytes boundary). This pin also receives
the 12.75 V programming supply voltage (VPP) during EPROM programming. If security bit 1

is programmed, EA will be internally latched on reset.
n.c. 66 not connected
P07/AD7 67 8xC51 general purpose I/O port/address/data 7
P06/AD6 68 8xC51 general purpose I/O port/address/data 6
P05/AD5 69 8xC51 general purpose I/O port/address/data 5
P04/AD4 70 8xC51 general purpose I/O port/address/data 4
P03/AD3 71 8xC51 general purpose I/O port/address/data 3
P02/AD2 72 8xC51 general purpose I/O port/address/data 2
P01/AD1 73 8xC51 general purpose I/O port/address/data 1
P00/AD0 74 8xC51 general purpose I/O port/address/data 0
P10/T2 75 8xC51 general purpose I/O port/timer, counter 2 external count input and clock output
P11/T2EX 76 8xC51 general purpose I/O port/timer, counter2 reload, capture and direction control
P12 77 8xC51 general purpose I/O port
P13 78 8xC51 general purpose I/O port
P14 79 8xC51 general purpose I/O port
P15 80 8xC51 general purpose I/O port

1999 Dec 14 7

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

handbook, full pagewidth

P26/A14
P27/A15

PSEN

ALE/PROG

EA/VPP

n.c.
P07/AD7
P06/AD6
P05/AD5
P04/AD4

P03/AD3
P02/AD2
P01/AD1
P00/AD0

P10/T2

P11/T2EX

P12
P13
P14
P15

P25/A13

n.c.

60

59

61

62
63
64
65
66
67
68
69
70

71

72

73
74

75
76

77
78

79
80

1

2

P16

P17

n.c.

58

3

RESET

P24/A12

P23/A11

57

56

4

5

DDA

V

GNDA

P22/A10

P21/A9

55

54

6

7

INHIB

CDELAY

P20/A8
53

8

PRES2

DDD

GNDD

V

XTAL1

52

51

50

TDA8008HL

9

10

11

IO2

C82

C42

XTAL2
49

12

RST2

P37/RD
48

13

CC2

V

P35/T1

P36/WR
47

46

14

15

CLK2

GNDC2

P34/T0
45

16

SAM

P33/INT1

P32/INT0

44

43

17

18

SBM

GNDP

P31/TXD

P30/RXD

42

41

19

20

n.c.

n.c.

40
39
38
37
36

35
34
33
32
31
30
29
28
27
26
25
24
23
22
21

FCE569

n.c.
RSTOUT
CS
IOAUX
TEST

INTAUX

IO1

C81

PRES1

C41
RST1

V

CC1

CLK1

GNDC1

VUP

SAP

SBP

V

DDP

n.c.
n.c.

Fig.2 Pin configuration.

1999 Dec 14 8

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

PACKAGE OUTLINE

LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm

c

y

X

A

60 41

61

Z

40

E

SOT315-1

e

w M

b

p

e

pin 1 index

b

p

D

H

D

w M

21

20

Z

D

v M

B

v M

B

80

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

mm

A

A1A2A3b

max.

0.16

1.6

0.04

1.5

1.3

0.25

cE

p

0.27

0.18

0.13

0.12

(1)

(1) (1)(1)

D

12.1

11.9

eH

H

12.1

11.9

0.5

14.15

13.85

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

E

A

D

H

E

E

14.15

13.85

A

2

A

LL

p

0.75

0.30

(A )

A

1

3

θ

L

p

L

detail X

Zywv θ

Z

E

D

1.45

0.15 0.10.21.0

1.05

1.45

1.05

o

7

o

0

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT315-1

1999 Dec 14 9

EUROPEAN

PROJECTION

ISSUE DATE

95-12-19
97-07-15

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Dec 14 10

Philips Semiconductors Objective specification

Dual multiprotocol smart card coupler TDA8008

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, LFBGA, SQFP, TFBGA not suitable suitable

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Dec 14 11

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Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

68

Printed in The Netherlands 545004/01/pp12 Date of release: 1999 Dec 14 Document order number: 9397 750 06532