Datasheet TDA8007B Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8007B

Multiprotocol smart card interface

Objective specification
File under Integrated Circuits, IC02

1999 Nov 11

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

FEATURES

• 8-bit parallel interface for control and communication,
compatible with multiplexed or non-multiplexed
memory access

• Specific ISO UART with parallel access on I/O for
automatic convention processing, variable baud rate
through frequency or division ratio programming, error
management at character level for T = 0, extra guard
time register

• 1 to 8 characters FIFO in reception mode

• Parity error counter in reception mode

• Dual VCC generation (5 V ±5% or 3 V ±5%,

65 mA (max.) with controlled rise and fall times)

• Dual smart card clock generation (up to 10 MHz), with
two times synchronous frequency doubling

• Cards clock STOP HIGH, clock STOP LOW or

1.25 MHz (from internal oscillator) for cards
power-down mode

• Automatic activation and deactivation sequence
through an independent sequencer

• Supports asynchronous protocols T = 0 and T = 1, in
accordance with ISO 7816 and EMV

• Versatile 24-bit timeout counter for ATR (Answer To
Reset) and waiting times processing

• 22 ETU counter for Block Guard Time

• Supports synchronous cards

• Short-circuit current limitations

• Special circuit for killing spikes during power-on/-off

• Supply supervisor for power-on/-off reset

• Step-up converter (supply voltage from 2.5 to 6 V),

doubler, tripler or follower according to VCC and V

• Additional I/O pin, allowing use of the ISO UART for
another analog interface (I/OAUX)

• Additional interrupt pin, allowing detection of level
toggling on an external signal (INTAUX)

DD

• Fastandefficientswappingbetweencard 1,card 2and
athird card whose I/O is tiedto IOAUX, due to separate
buffering of parameters for each card

• Chip select input, allowing use of several devices in
parallel and memory space paging

• Enhanced ESD protections on card side (6 kV min.)

• Software library for easy integration within the

application

• Power-down mode, reducing current consumption
during periods of non-activity.

APPLICATIONS

• Multiple smart card readers for multiprotocol
applications (EMV banking, Digital pay TV, Access
control etc.).

GENERAL DESCRIPTION

The TDA8007B is a low cost card interface for dual smart
card readers. Controlled through a parallel bus, it takes
care of all ISO 7816, EMV and GSM11-11 requirements.
Itmay be interfaced to the P0/P2ports of an 80C51 family
microcontroller, and be addressed as a memory through
MOVX instructions. It may also be addressed on a
non-multiplexed 8-bit data bus, by means of register
addresses AD0, AD1, AD2 and AD3. The integrated ISO
UART and the timeout counters allow easy use, even at
high baud rates with no real time constraints. Due to its
chip select and external I/O and INT features, it greatly
simplifies the realization of any number of types of card
readers. It gives the cards and the mode a very high level
ofsecurity,due to its special hardware against ESD, short
circuits, power failure, etc. Its integrated step-up
converter allows operation within a supply voltage range
of 2.5 to 6 V.

A software library has been developed, taking care of all
actions required for T = 0, T = 1 and synchronous
protocols, see Application Reports.

1999 Nov 11 2

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

I

DD(pd)

I

DD(sm)

I

DD(om)

V

CC

I

CC

I

CC1+ICC2

SR slew rate on V
T

deact

T

act

f

xtal

f

op

T

amb

supply voltage 2.5 − 6V
supply current in inactive mode

(power-down)

VDD= 3.3 V; cards inactive;
XTAL oscillator stopped

= 3.3 V; cards active at

V

DD

−−350 µA

−−3mA

VCC= 5 V; CLK stopped;
XTAL oscillator stopped

supply current in sleep mode cards powered at 5 V but clock

−−5mA

stopped

supply current in operating mode VDD= 3.3 V; XTAL = 20 MHz

V

CC1=VCC2

I

CC1=ICC2

=5V;

=80mA

−−300 mA

card supply voltage including static loads (5 V card) 4.75 5.0 5.25 V

with 40 nAs dynamic loads on

4.6 5.4 V

200 nF capacitor (5 V card)
including static loads (3 V card) 2.80 3.20 V
with 40 nAs dynamic loads on

2.75 3.25 V

200 nF capacitor (3 V card)

card supply current operating −−65 mA

overload detection − 80 − mA

sum of both cards’ currents −−80 mA

(rise and fall) maximum load capacitor 300 nF 0.10 0.16 0.22 V/µs

CC

deactivation cycle time −−100 µs
activation cycle time −−225 µs
crystal frequency 4 − 25 MHz
operating frequency external frequency applied on

0 − 25 MHz

pin XTAL1

ambient temperature −25 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8007BHL LQFP48 plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4mm SOT313-2

1999 Nov 11 3

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

BLOCK DIAGRAM

handbook, full pagewidth

RSTOUT

DELAY

22 nF

INT
ALE
AD0
AD1
AD2
AD3

RD

WR

D0
D1
D2
D3
D4
D5
D6
D7

CS

I/OAUX

INTAUX

V

DD

100 nF

1
48

40
39
45
44
43
42
36
37
28
29
30
31
32
33
34
35
38
2
41

SUPPLY

AND

SUPERVISOR

ISO7816

UART

TIMEOUT

COUNTER

INTERFACE CONTROL

CLOCK

CIRCUIT

GND

V

DDA

220 nF

SAP SAM

STEP-UP

CONVERTER

ANALOG

DRIVERS

SEQUENCERS

AND

220 nF

SBP SBM

AGND
2524222621231927

20

6
4
8

10

9
3
5

7
14
12
16
18
17
11
13
15

V

UP

220 nF

C41
C81
CLK1
RST1
V

CC1

I/O1
PRES1
GNDC1
C42
C82
CLK2
RST2
V

CC2

I/O2
PRES2
GNDC2

TDA8007B

XTAL1 XTAL2

Fig.1 Block diagram.

1999 Nov 11 4

INT OSC

XTAL OSC

47 46

FCE534

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

PINNING

SYMBOL PIN DESCRIPTION

RSTOUT 1 open-drain output for resetting external ICs
I/OAUX 2 input or output for an I/O line to an auxiliary smart card interface
I/O1 3 data line to/from card 1 (ISO C7 contact)
C81 4 auxiliary I/O for ISO C8 contact (synchronous cards for instance) for card 1
PRES1 5 card 1 presence contact input (active HIGH or LOW by mask option)
C41 6 auxiliary I/O for ISO C4 contact (synchronous cards for instance) for card 1
GNDC1 7 ground for card 1
CLK1 8 clock output to card 1 (ISO C3 contact)
V

CC1

RST1 10 card 1 reset output (ISO C2 contact)
I/O2 11 data line to/from card 2 (ISO C7 contact)
C82 12 auxiliary I/O for ISO C8 contact (synchronous cards for instance) for card 2
PRES2 13 card 2 presence contact input (active HIGH or LOW by mask option)
C42 14 auxiliary I/O for ISO C4 contact (synchronous cards for instance) for card 2
GNDC2 15 ground for card 2
CLK2 16 clock output to card 2 (ISO C3 contact)
V

CC2

RST2 18 card 2 reset output (ISO C2 contact)
GND 19 ground
V

UP

SAP

SBP

V

DDA

SBM

AGND 25 ground connection for the step-up converter
SAM

V

DD

D0 28 data 0 or address 0
D1 29 data 1 input/output or address 1 input
D2 30 data 2 input/output or address 2 input
D3 31 data 3 input/output or address 3 input
D4 32 data 4 input/output or address 4 input
D5 33 data 5 input/output or address 5 input
D6 34 data 6 input/output or address 6 input
D7 35 data 7 input/output or address 7 input
RD 36 read selection signal input (read or write in non-multiplexed configuration) (active LOW)

9 card 1 supply output voltage (ISO C1 contact)

17 card 2 supply output voltage (ISO C1 contact)

20 output voltage of the step-up converter

contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP and

21

SAM)
contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP and

22

SBM)

23 analog positive supply voltage for the step-up converter

contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP and

24

SBM)

contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP and

26

SAM)

27 positive supply voltage

1999 Nov 11 5

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

SYMBOL PIN DESCRIPTION

WR 37 write selection signal input (enable in the event of non-multiplexed configuration) (active LOW)
CS 38 chip select input (active HIGH or LOW)
ALE

INT 40 interrupt output (active LOW)
INTAUX 41 auxiliary interrupt input
AD3 42 register selection address 3 input
AD2 43 register selection address 2 input
AD1 44 register selection address 1 input
AD0 45 register selection address 0 input
XTAL2 46 connection pin for an external crystal
XTAL1 47 connection pin for an external crystal, or input for an external clock signal
DELAY 48 connection pin for an external delay capacitor

address latch enable in the event of multiplexed configuration (connect to V

39

configuration)

in non-multiplexed

DD

RSTOUT

I/OAUX

I/O1
C81

PRES1

C41

GNDC1

CLK1

V

CC1

RST1

I/O2
C82

DELAY

XTAL1

XTAL2

AD0

AD1

AD2

AD3

INTAUX

INT

ALE

CS

WR

48

47

46

45

44

43

42

41

40

39

38

37

1
2
3
4
5
6
7
8

9
10
11
12

13

14

15

C42

PRES2

GNDC2

16

CLK2

TDA8007B

17

18

CC2

RST2

V

19

GND

20

21

22

23

UP

SAP

V

SBP

DDA

V

24

SBM

36
35
34
33
32
31
30
29
28
27
26
25

FCE535

RD
D7
D6
D5
D4
D3
D2
D1
D0
V

DD

SAM
AGND

Fig.2 Pin configuration.

1999 Nov 11 6

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

PACKAGE OUTLINE

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

c

y

X

SOT313-2

36

37

pin 1 index

48

1

e

w M

b

p

D

H

D

DIMENSIONS (mm are the original dimensions)

mm

A

A1A2A3b

max.

0.20

1.60

0.05

1.45

1.35

0.25

cE

p

0.27

0.18

0.17

0.12

UNIT

25

Z

24

E

e

A

H

E

E

A

2

A

A

1

w M

b

p

13

12

Z

D

v M

A

detail X

B

v M

B

0 2.5 5 mm

scale

(1)

(1) (1)(1)

D

7.1

6.9

eH

H

D

7.1

6.9

0.5

9.15

8.85

E

9.15

8.85

LL

p

0.75

0.45

0.12 0.10.21.0

Z

0.95

0.55

L

L

D

(A )

3

p

Zywv θ

E

0.95

0.55

o

7

o

0

θ

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT313-2

1999 Nov 11 7

EUROPEAN

PROJECTION

ISSUE DATE

94-12-19
97-08-01

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Nov 11 8

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, LFBGA, SQFP, TFBGA not suitable suitable

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Nov 11 9

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

NOTES

1999 Nov 11 10

Philips Semiconductors Objective specification

Multiprotocol smart card interface TDA8007B

NOTES

1999 Nov 11 11

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips DevelopmentCorporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS,Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

68

Printed in The Netherlands 545004/01/pp12 Date of release: 1999 Nov 11 Document order number: 9397 750 06348