Datasheet TDA8005H Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8005

Low-power smart card coupler

Product specification
Supersedes data of 1995 Apr 13
File under Integrated Circuits, IC17

1996 Sep 25

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

FEATURES

• VCC generation (5 V ±5%, 20 mA maximum with
controlled rise and fall times)

• Clock generation (up to 8 MHz), with two times
synchronous frequency doubling

• Clock STOP HIGH, clock STOP LOW or 1.25 MHz (from
internal oscillator) for cards power-down mode

• Specific UART on I/O for automatic direct/inverse
convention settings and error management at
character level

• Automatic activation and deactivation sequences
through an independent sequencer

• Supports the protocol T = 0 in accordance with
ISO 7816, GSM11.11 requirements (Global System for
Mobile communication); and EMV banking specification
approved for Final GSM11.11 Test Approval (FTA)

• Several analog options are available for different
applications (doubler or tripler DC/DC converter, card
presence, active HIGH or LOW, threshold voltage
supervisor, etc.

• Overloads and take-off protections

• Current limitations in the event of short-circuit

• Special circuitry for killing spikes during power-on or off

• Supply supervisor

• Step-up converter (supply voltage from 2.5 to 6 V)

• Power-down and sleep mode for low-power

consumption

• Enhanced ESD protections on card side
(6 kV minimum)

• Control and communication through a standard RS232
full duplex interface

• Optional additional I/O ports for:
– keyboard
– LEDs
– display
– etc.

• 80CL51 microcontroller core with 4 kbytes ROM and
256-byte RAM.

APPLICATIONS

• Portable smart card readers for protocol T = 0

• GSM mobile phones.

GENERAL DESCRIPTION

The TDA8005 is a low cost card interface for portable
smart card readers. Controlled through a standard serial
interface, it takes care of all ISO 7816 and GSM11-11
requirements. It gives the card and the set a very high level
of security, due to its special hardware against ESD,
short-circuiting, power failure, etc. Its integrated step-up
converter allows operation within a supply voltage range of

2.5 to 6 V.
The very low-power consumption in Power-down and

sleep modes saves battery power. A special version where
the internal connections to the controller are fed outside
through pins allows easy development and evaluation,
together with a standard 80CL51 microcontroller.

Development tools, application report and support
(hardware and software) are available.

The device can be supplied either as a masked chip with
standard software handling all communication between
smart card and a master controller in order to make the
application easier, or as a maskable device.

1996 Sep 25 2

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

I

DD(pd)

I

DD(sm)

I

DD(sm)

I

DD(om)

V

CC

I

CC

SR slew rate on V

t

de

t

act

f

xtal

T

amb

supply voltage doubler and tripler option 2.5 − 6.0 V
supply current in power-down mode VDD= 5 V; card inactive −−100 µA
supply current in sleep mode doubler card powered but clock

−−500 µA

stopped

supply current in sleep mode tripler card powered but clock

−−500 µA

stopped

supply current in operating mode unloaded; f

= 6.5 MHz;

f

µC

f

= 3.25 MHz

card

= 13 MHz;

xtal

card supply voltage including static and

−−5.5 mA

4.75 5.0 5.25 V
dynamic loads on 100 nF
capacitor

card supply current operating −−20 mA

limitation −−30 mA

(rise and fall) maximum load capacitor

CC

0.05 0.1 0.15 V/µs
150 nF (including typical
100 nF decoupling)

deactivation cycle duration −−100 µs
activation cycle duration −−100 µs
crystal frequency 2 − 16 MHz
operating ambient temperature −25 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8005G LQFP64 plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2
TDA8005H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);

SOT307-2

body 10 × 10 × 1.75 mm

1996 Sep 25 3

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

BLOCK DIAGRAM

V

handbook, full pagewidth

V

DDA

2.5 to 6 V
100 nF

ALARM

DELAY

DDD

100 nF

63

44

46

10

SUPPLY

INTERNAL

REFERENCE

VOLTAGE SENSE

2.3 to 2.7 V

ref

47 nF

S1 S2

64 61 3 62

STEP-UP CONVERTER

INTERNAL OSCILLATOR

2.5 MHz

47 nF

S3 S4

V

60

UP S5

47 nF

RESET

RxD

TxD
AUX1
AUX2

INT1

P00
P37

22

28
29
32
33
30

(1)

to

data clk EN S0 S1 R/W

µCclk

alarm

V

CONTROLLER

CL51

4 kbytes ROM

256-byte RAM

OPTIONAL

PORTS

PERIPHERAL

INTERFACE

ISO 7816 UART

TDA8005G

DDD

skill

start

RST

off

SEQUENCER

INT

I/O

V

DDD

SECURITY

EN1

EN2

EN3

EN4

osc ref

V

CC

GENERATOR

RST

BUFFER

I/O

BUFFER

CLOCK

BUFFER

59

58

56

55

57

47

V

LIS

CC

100 nF

RST

I/O

CLK

PRES

CLOCK CIRCUITRY

36 35 37 2 53

XTAL1 XTAL2

(1) For details see Chapter “Pinning”.

osc

DGND AGND

Fig.1 Block diagram (LQFP64; SOT314-2).

1996 Sep 25 4

OUTPUT PORT

EXTENSION

52 51 50 49

K0 K1 K2 K3 K4 K5

4

MLD210

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

PINNING

PIN

SYMBOL

n.c. 1 − not connected
AGND 2 1 analog ground
S3 3 2 contact 3 for the step-up converter
K5 4 − output port from port extension
P03 5 3 general purpose I/O port (connected to P03)
P02 6 4 general purpose I/O port (connected to P02)
P01 7 5 general purpose I/O port (connected to P01)
n.c. 8 − not connected
P00 9 6 general purpose I/O port (connected to P00)
V

DDD

n.c. 11 − not connected
TEST1 12 8 test pin 1 (connected to P10; must be left open-circuit in the application)
P11 13 9 general purpose I/O port or interrupt (connected to P11)
P12 14 10 general purpose I/O port or interrupt (connected to P12)
P13 15 11 general purpose I/O port or interrupt (connected to P13)
P14 16 12 general purpose I/O port or interrupt (connected to P14)
n.c. 17 − not connected
P15 18 13 general purpose I/O port or interrupt (connected to P15)
P16 19 14 general purpose I/O port or interrupt (connected to P16)
TEST2 20 15 test pin 2 (connected to PSEN; must be left open-circuit in the application)
P17 21 16 general purpose I/O port or interrupt (connected to P17)
RESET 22 17 input for resetting the microcontroller (active HIGH)
n.c. 23 − not connected
n.c. 24 − not connected
n.c. 25 − not connected
n.c. 26 − not connected
n.c. 27 − not connected
RxD 28 18 serial interface receive line
TxD 29 19 serial interface transmit line
INT1 30 20 general purpose I/O port or interrupt (connected to P33)
T0 31 21 general purpose I/O port (connected to P34)
AUX1 32 22 push-pull auxiliary output (±5 mA; connected to timer T1 e.g. P35)
AUX2 33 23 push-pull auxiliary output (±5 mA; connected to timer P36)
P37 34 24 general purpose I/O port (connected to P37)
XTAL2 35 25 crystal connection
XTAL1 36 26 crystal connection or external clock input
DGND 37 27 digital ground
n.c. 38 − not connected

LQFP64

SOT314-2

10 7 digital supply voltage

QFP44

SOT307-2

DESCRIPTION

1996 Sep 25 5

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

PIN

SYMBOL

n.c. 39 − not connected
P20 40 28 general purpose I/O port (connected to P20)
P21 41 − general purpose I/O port (connected to P21)
P22 42 29 general purpose I/O port (connected to P22)
P23 43 30 general purpose I/O port (connected to P23)
ALARM 44 − open-drain output for Power-On Reset (active HIGH or LOW by mask option)
n.c. 45 − not connected
DELAY 46 31 external capacitor connection for delayed reset signal
PRES 47 32 card presence contact input (active HIGH or LOW by mask option)
TEST3 48 33 test pin 3 (must be left open-circuit in the application)
K4 49 − output port from port extension
K3 50 − output port from port extension
K2 51 − output port from port extension
K1 52 − output port from port extension
K0 53 − output port from port extension
TEST4 54 34 test pin 4 (must be left open-circuit in the application)
I/O 55 35 data line to/from the card (ISO C7 contact)
RST 56 36 card reset output (ISO C2 contact)
CLK 57 37 clock output to the card (ISO C3 contact)
V

CC

LIS 59 39 supply for low-impedance on cards contacts
S5 60 40 contact 5 for the step-up converter
S2 61 41 contact 2 for the step-up converter
S4 62 42 contact 4 for the step-up converter
V

DDA

S1 64 44 contact 1 for the step-up converter

LQFP64

SOT314-2

58 38 card supply output voltage (ISO C1 contact)

63 43 analog supply voltage

QFP44

SOT307-2

DESCRIPTION

1996 Sep 25 6

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

handbook, full pagewidth

V

n.c.

AGND

S3

K5
P03
P02
P01

n.c.

P00

DDD

n.c.

TEST1

P11
P12
P13
P14

DDA

VS1S4

64

63
1
2
3
4
5
6
7
8

S2

S5.

62

60

61

LIS
59

CC

V

CLK

RST

I/O

TEST4K0K1

57

56

58

55

53

54

K2

K3

K4

52

51

49

50

TEST3

48
47

PRES

46

DELAY

45

n.c.
ALARM

44
43

P23

42

P22

41

P21

TDA8005G

P20

9

10
11
12
13
14
15
16

40
39

n.c.

38

n.c.

37

DGND

36

XTAL1

35

XTAL2

34

P37

33

AUX2

21

22

17
n.c.

18

P15

19

P16

20

P17

TEST2

23
n.c.

RESET

Fig.2 Pin configuration (LQFP64; SOT314-2).

1996 Sep 25 7

24
n.c.

25
n.c.

26

n.c.

27
n.c.

28

RxD

29

TxD

30

INT1

31
T0

32

AUX1

MLD211

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

handbook, full pagewidth

AGND

S3
P03
P02
P01
P00

V

DDD

TEST1

P11
P12
P13

DDA

S1

V

S4

S2

S5

44

43

42

41

40

1
2
3
4
5

14

P16

TDA8005H

15

16

P17

TEST2

6
7
8

9
10
11

12

13

P14

P15

LIS
39

17

RESET

CC

V

38

18

RxD

CLK

37

19

TxD

RST

36

20

INT1

I/O

35

21
T0

TEST4

34

22

AUX1

33
32
31
30
29
28
27
26
25
24
23

MLD212

TEST3
PRES
DELAY
P23
P22
P20
DGND
XTAL1
XTAL2
P37
AUX2

Fig.3 Pin configuration (QFP44; SOT307-2).

1996 Sep 25 8

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

FUNCTIONAL DESCRIPTION
Microcontroller

The microcontroller is an 80CL51 with 256 bytes of RAM
instead of 128. The baud rate of the UART has been
multiplied by four in modes 1, 2 and 3 (which means that
the division factor of 32 in the formula is replaced by 8 in
both reception and transmission, and that in the reception
modes, only four samples per bit are taken with decision
on the majority of samples 2, 3 and 4) and the delay
counter has been reduced from 1536 to 24.

Remark: this has an impact when getting out of
PDOWN mode. It is recommended to switch to internal
clock before entering PDOWN mode
(see

“application report”

).

All the other functions remain unchanged. Please, refer to
the published specification of the 80CL51 for any further
information. Pins INT0, P10, P04 to P07 and P24 to P27
are used internally for controlling the smart card interface.

Mode 0 is unchanged. The baud rate for modes 1 and 3 is:

SMOD

2

----------------- -

×

--------------------------------------------------

8

12 256 TH1 )–(×

The baud rate for mode 2 is:

f

clk

SMOD

2

----------------- ­16

f

×

clk

Table 1 Mode 3 timing

Supply

The circuit operates within a supply voltage range of

2.5 to 6 V. The supply pins are V
Pins V

and AGND supply the analog drivers to the card

DDA

, DGND and AGND.

DDD

and have to be externally decoupled because of the large
current spikes that the card and the step-up converter can
create. An integrated spike killer ensures the contacts to
the card remain inactive during power-up or power-down.
An internal voltage reference is generated which is used
within the step-up converter, the voltage supervisor, and
the V

generator.

CC

The voltage supervisor generates an alarm pulse, whose
length is defined by an external capacitor tied to the
DELAY pin, when V

is too low to ensure proper

DDD

operation (1 ms per 1 nF typical). This pulse is used as a
RESET pulse by the controller, in parallel with an external
RESET input, which can be tied to the system controller.

It is also used in order to either block any spurious card
contacts during controllers reset, or to force an automatic
deactivation of the contacts in the event of supply drop-out
[see Sections “Activation sequence” and “Deactivation
sequence (see Fig.10)”].

In the 64 pin version, this reset pulse is output to the open
drain ALARM pin, which may be selected active HIGH or
active LOW by mask option and may be used as a reset
pulse for other devices within the application.

BAUD

= 6.5 MHz;

clk

VDD=5V

f

= 3.25 MHz;

clk

VDD=5or3V

f

RATE

SMOD TH1 SMOD TH1

135416 1 255 −−
67708 0 255 1 255
45139 1 253 −−
33854 0 254 0 255
27083 1 251 −−
22569 0 253 1 253
16927 −−0 254
13542 −−1 251
11285 0 250 0 253

1996 Sep 25 9

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

handbook, full pagewidth

V

+ V

th1

hys1
V

th1

V

DD

V

th2

V

DEL

ALARM

Fig.4 Supply supervisor.

Low impedance supply (pin LIS)

For some applications, it is mandatory that the contacts to
the card (VCC, RST, CLK and I/O) are low impedance while
the card is inactive and also when the coupler is not
powered. An auxiliary supply voltage on pin LIS ensures
this condition where I

=<5µA for V

LIS

= 5 V. This low

LIS

impedance situation is disabled when VCC starts rising
during activation, and re-enabled when the step-up
converter is stopped during deactivation. If this feature is
not required, the LIS pin must be tied to VDD.

Step-up converter

Except for the V
buffers, the whole circuit is powered by V

generator, and the other cards contacts

CC

and V

DDD

DDA

.
If the supply voltage is 3 V or 5 V, then a higher voltage is
needed for the ISO contacts supply. When a card session
is requested by the controller, the sequencer first starts the
step-up converter, which is a switched capacitors type,
clocked by an internal oscillator at a frequency
approximately 2.5 MHz. The output voltage, VUP, is
regulated at approximately 6,5 V and then fed to the V

CC

generator. VCC and GND are used as a reference for all
other cards contacts. The step-up converter may be

MBH634

chosen as a doubler or a tripler by mask option, depending
on the voltage and the current needed on the card.

ISO 7816 security

The correct sequence during activation and deactivation of
the card is ensured through a specific sequencer, clocked
by a division ratio of the internal oscillator.

Activation (START signal P05) is only possible if the card
is present (PRES HIGH or LOW according to mask
option), and if the supply voltage is correct (ALARM signal
inactive), CLK and RST are controlled by RSTIN (P04),
allowing the correct count of CLK pulses during
Answer-to-Reset from the card.

The presence of the card is signalled to the controller by
the OFF signal (P10).

During a session, the sequencer performs an automatic
emergency deactivation in the event of card take-off,
supply voltage drop, or hardware problems. The OFF
signal falls thereby warning the controller.

1996 Sep 25 10

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

Clock circuitry

The clock to the microcontroller and the clock to the card
are derived from the main clock signal (XTAL from
2 to 16 MHz, or an external clock signal).

Microcontroller clock (f
reduction modes, the microcontroller is clocked with f

) after reset, and during power

clk

INT

/8,
which is always present because it is derived from the
internal oscillator and gives the lowest power
consumption. When required, (for card session, serial
communication or anything else) the microcontroller may
choose to clock itself with

xtal

xtal

or1⁄2f

INT

.

1

⁄2f

,1⁄4f
All frequency changes are synchronous, thereby ensuring
no hang-up due to short spikes etc.

Cards clock: the microcontroller may select to send the
card1⁄2f

xtal

,1⁄4f

xtal

,1⁄8f

xtal

or1⁄2f

(≈1.25 MHz), or to stop

INT

the clock HIGH or LOW. All transition are synchronous,
ensuring correct pulse length during start or change in
accordance with ISO 7816.

After power on, CLK is set at STOP LOW, and f

1

⁄8f

INT.

is set at

clk

Power-down and sleep modes

The TDA8005 offers a large flexibility for defining power
reduction modes by software. Some configurations are
described below.

In the power-down mode, the microcontroller is in
power-down and the supply and the internal oscillator are

active. The card is not active; this is the smallest power
consumption mode. Any change on P1 ports or on PRES
will wake-up the circuit (for example, a key pressed on the
keyboard, the card inserted or taken off).

In the sleep mode, the card is powered, but configured in
the Idle or sleep mode. The step-up converter will only be
active when it is necessary to reactivate V

. When the

UP

microcontroller is in Power-down mode any change on P1
ports or on PRES will wake up the circuit.

In both power reduction modes the sequencer is active,
allowing automatic emergency deactivation in the event of
card take-off, hardware problems, or supply drop-out.

The TDA8005 is set into Power-down or sleep mode by
software. There are several ways to return to normal
mode, Introduction or extraction of the card, detection of a
change on P1 (which can be a key pressed) or a command
from the system microcontroller. For example, if the
system monitors the clock on XTAL1, it may stop this clock
after setting the device into power-down mode and then
wake it up when sending the clock again. In this situation,
the internal clock should have been chosen before the f

clk

Peripheral interface

This block allows synchronous serial communication with
the three peripherals (ISO UART, CLOCK CIRCUITRY
and OUTPUT PORTS EXTENSION).

.

handbook, full pagewidth

RESET

CC0 CC1 CC2 CC3 CC4 CC5 CC6 CC7

UC0

UT0

PE0

P24

DATA

clock configuration

Uart configuration

UC1 UC2 UC3 UC4 UC5 UC6 UC7

Uart transmit

UT1 UT2 UT3 UT4 UT5 UT6 UT7

ports extension

PE1 PE2 PE3 PE4 PE5 PE6 PE7

P06

STROBE

P07

ENABLE

PERIPHERAL CONTROL

P27

REG0

Fig.5 Peripheral interface diagram.

1996 Sep 25 11

P26

REG1

P25
R/W

UR1 UR2 UR3 UR4 UR5 UR6 UR7

UR0

US1 US2 US3 US4 US5 US6 US7

US0

P32
INT

Uart receive

Uart status register

MBH635

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

Table 2 Description of Fig.5

BIT NAME DESCRIPTION

REG0 = 0, REG1 = 0, R/W = 0; CLOCK CONFIGURATION
(Configuration after reset is cards clock STOP LOW, f

CC0 cards clock =
CC1 cards clock =1⁄4f
CC2 cards clock =1⁄8f
CC3 cards clock =1⁄2f

1

⁄2f

xtal
xtal
xtal
INT

CC4 cards clock = STOP HIGH
CC5 f
CC6 f
CC7 f

clk
clk
clk

=1⁄2f
=1⁄4f
=1⁄2f

xtal
xtal
INT

REG0 = 1, REG1 = 0, R/W = 0; UART CONFIGURATION (after reset all bits are cleared)

UC0 ISO UART RESET
UC1 START SESSION
UC2 LCT (Last Character to Transmit)
UC3 TRANSMIT/RECEIVE
UC4 to UC7 not used

clk

=1⁄8f

INT

)

REG0 = 0, REG1 = 1, R/W = 0; UART TRANSMIT

UT0 to UT7 LSB to MSB of the character to be transmitted to the card

REG0 = 1, REG1 = 1, R/W = 0; PORTS EXTENSION (after reset all bits are cleared)

PE0 to PE5 PE0 to PE5 is the inverse of the value to be written on K0 to K5
PE6, PE7 not used

REG0 = 0, REG1 = 0, R/W = 1; UART RECEIVE

UR0 to UR7 LSB to MSB of the character received from the card

REG0 = 1, REG1 = 0, R/W = 1; UART STATUS REGISTER (after reset all bits are cleared)

US0 UART TRANSMIT buffer empty
US1 UART RECEIVE buffer full
US2 first start bit detected
US3 parity error detected during reception of a character (the UART has asked the card to repeat the

character)

US4 parity error detected during transmission of a character. The controller must write the previous

character in UART TRANSMIT, or abort the session.

US5 to US7 not used

1996 Sep 25 12

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

USE OF PERIPHERAL INTERFACE
Write operation:

Select the correct register with R/W, REG0, REG1.
Write the word in the peripheral shift register (PSR) with

DATA and STROBE. DATA is shifted on the rising edge
of STROBE. 8 shifts are necessary.

Give a negative pulse on ENABLE. The data is parallel
loaded in the register on the falling edge of ENABLE.

Table 3 Example of peripheral interface

CHANGE OF CLOCK CONFIGURATION

CLR REG0 CLR REG0
CLR REG1 CLR REG1
CLR R/W SET R/W
MOV R2, #8 CLR ENABLE

LOOP RRC A SET ENABLE

MOV DATA C CLR ENABLE
CLR STROBE SET ENABLE
SET STROBE MOV R2, #8
DJNZ R2, LOOP LOOP MOV C, DATA
CLR ENABLE RRC A
SET ENABLE CLR STROBE
SET DATA SET STROBE
RET DJNZ R2, LOOP

(1)

Read operation:

Select the correct register with R/W, REG0 and REG1.
Give a first negative pulse on ENABLE. The word is

parallel loaded in the peripheral shift register on the
rising edge of ENABLE.

Give a second negative pulse on ENABLE for
configuring the PSR in shift right mode.

Read the word from PSR with DATA and STROBE.
DATA is shifted on the rising edge of STROBE. 7 shifts
are necessary.

READ CHARACTER ARRIVED IN UART RECEIVE

SET DATA
RET

(2)

Notes

1. The new configuration is supposed to be in the accumulator.

2. The character will be in the accumulator.

1996 Sep 25 13

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

ISO UART

The ISO UART handles all the specific requirements
defined in ISO T = 0 protocol type. It is clocked with the
cards clock, which gives the f

/31 sampling rate for start

clk

bit detection (the start bit is detected at the first LOW level
on I/O) and the f

/372 frequency for ETU timing (in the

clk

reception mode the bit is sampled at1⁄2ETU). It also allows
the cards clock frequency changes without interfering with
the baud rate.

This hardware UART allows operating of the
microcontroller at low frequency, thus lowering EM
radiations and power consumption. It also frees the
microcontroller of fastidious conversions and real time jobs
thereby allowing the control of higher level tasks.

The following occurs in the reception mode (see Fig.6):

• Detection of the inverse or direct convention at the begin

of ATR.

• Automatic convention setting, so the microcontroller

only receives characters in direct convention.

• Parity checking and automatic request for character

repetition in case of error (reception is possible at
12 ETU).

In the transmission mode (see Fig.7):

• Transmission according to the convention detected

during ATR, consequently the microcontroller only has
to send characters in direct convention. Transmission of
the next character may start at 12 ETU in the event of no
error or 13 ETU in case of error.

• Parity calculation and detection of repetition request

from the card in the event of error.

• The bit LCT (Last Character to Transmit) allows fast

reconfiguration for receiving the answer 12 ETU after
the start bit of the last transmitted character.

The ISO UART configuration register enables the
microcontroller to configure the ISO UART. cf Peripheral
Interface.

After power-on, all ISO UART registers are reset.
The ISO UART is configured in the reception mode. When

the microcontroller wants to start a session, it sets the bits
START SESSION and RESET ISO UART in UART
CONFIGURATION and then sets START LOW. When the
first start bit on I/O is detected (sampling rate f

/31), the

clk

UART sets the bit US2 (First Start Detect) in the status
register which gives an interrupt on INT0 one CLK pulse
later.

The convention is recognized on the first character of the
ATR and the UART configures itself in order to exchange
direct data without parity processing with the
microcontroller whatever the convention of the card is.
The bit START SESSION must be reset by software. At
the end of every character, the UART tests the parity and
resets what is necessary for receiving another character.

If no parity error is detected, the UART sets the bit US1
(BUFFER FULL) in the STATUS REGISTER which warns
the microcontroller it has to read the character before the
reception of the next one has been completed. The
STATUS REGISTER is reset when read from the
controller.

If a parity error has been detected, the UART pulls the I/O
line LOW between 10.5 and 12 ETU. It also sets the bits
BUFFER FULL and US3 (parity error during reception) in
the STATUS REGISTER which warns the microcontroller
that an error has occurred. The card is supposed to repeat
the previous character.

The ISO UART status register can inform which event has
caused an interrupt. (Buffer full, buffer empty, parity error
detected etc.) cf Peripheral Interface.

This register is reset when the microcontroller reads the
status out of it.

1996 Sep 25 14

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

handbook, full pagewidth

T/R = 0

or

LCT = 1

start session ↑ and T/R = 0

SET ENABLE FSD

clock starts

INHIBIT I/O DURING 200 CLK

SAMPLE I/O EVERY 31 CLK

I/O = 0

SAMPLE I/O AT 186

AND EVERY 372 CLK

10th bit

CONVERT AND LOAD CHARACTER

IN RECEPTION BUFFER AT 10 ETU

CHECK PARITY

DISABLE I/O BUFFER BETWEEN

10 AND 12 ETU

5th bit

parity error

SET FSD STATUS REGISTER

IN FSD IS ENABLED

RESET EN FSD

SET CONVENTION

IF START SESSION = 1

SET BIT RECEPTION PARITY

ERROR AT 10 ETU

PULL I/O LINE LOW FROM

10.5 TILL 11.75 ETU

(1)

SET BIT BUFFER FULL AT 10 ETU

RESET RECEPTION PART AT 12 ETU

T/R =1

(1) The start session is reset by software.
(2) The software may load the received character in the peripheral

control at any time without any action on the ISO UART.

Fig.6 ISO UART reception flow chart.

When the controller needs to transmit data to the card, it
first sets the bit UC3 in the UART CONFIGURATION
which configures the UART in the transmission mode.
As soon as a character has been written in the UART
TRANSMIT register, the UART makes the conversion,

1996 Sep 25 15

(2)

MBH636

calculates the parity and starts the transmission on the
rising edge of ENABLE. When the character has been
transmitted, it surveys the I/O line at 11 ETU in order to
know if an error has been detected by the card.

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

If no error has occurred, the UART sets the bit US0
(BUFFER EMPTY) in the STATUS REGISTER and waits
for the next character. If the next character has been
written before 12 ETU, the transmission will start at
12 ETU. If it was written after 12 ETU it will start on the
rising edge of ENABLE.

If an error has occurred, it sets the bits BUFFER EMPTY
and US4 (parity error during transmission) which warns
the microcontroller to rewrite the previous character in the
UART TRANSMIT register. If the character has been
rewritten before 13 ETU, the transmission will start at

handbook, full pagewidth

transmit register selected

CONVERT, CALCULATE PARITY

T/R ↑

SET TRANSMIT ENABLE

AND LOAD IN TRANSMIT

SHIFT REGISTER

13 ETU. If it has been written after 13 ETU it will start on
the rising edge of ENABLE.

When the transmission is completed, the microcontroller
may set the bit LCT (Last Character to Transmit) so that
the UART will force the reception mode into ready to get
the reply from the card at 12 ETU. This bit must be reset
before the end of the first reception. The bit T/R must be
reset to enable the reception of the following characters.

When the session is completed, the microcontroller
re-initializes the whole UART by resetting the bit RESET
ISO UART.

(1)

SHIFT EVERY ETU IF TRANSMIT

ENABLE IS SET

10th bit shifted

SET I/O BUFFER IN

RECEPTION AT 10 ETU

SAMPLE I/O AT 11 ETU

SET BIT BUFFER EMPTY

AT 11 ETU

LCT = 1

RESET TRANSMIT PART AT 11 ETU

FORCE RECEPTION MODE

(1) The transmit register may be loaded just after reading from the status register.
(2) The software must reset the last character but before completion of the first received character.

RESET TRANSMIT PART AND

ENABLE TRANSMIT AT 12 ETU

T/R = 0

parity error

(2)

Fig.7 ISO UART transmission flow chart.

SET BIT TRANSMISSION PARITY

ERROR AND BUFFER EMPTY

AT 11 ETU

RESET TRANSMIT PART AND

ENABLE TRANSMIT AT 13 ETU

MBH637

1996 Sep 25 16

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

I/O buffer modes (see Fig.8) The following are the I/O buffer modes:

1. I/O buffer disabled by ENIO.

2. I/O buffer in input, 20 kΩ pull-up resister connected

between I/O and VCC, I/O masked till 200 clock pulses.

3. I/O buffer in input, 20 kΩ pull-up resister connected

between I/O and VCC, I/O is sampled every 31 clock
pulses.

4. I/O buffer in output, 20 kΩ pull-up resister connected

between I/O and VCC.

5. I/O buffer in output, I/O is pulled LOW by the N

transistor of the buffer.

6. I/O buffer in output, I/O is strongly HIGH or LOW by the

P or N transistor.

Output ports extension

In the LQFP64 version, 6 auxiliary output ports may be
used for low frequency tasks (for example, keyboard
scanning). These ports are push-pull output types (cf use
in software document).

Activation sequence

When the card is inactive, V

, CLK, RST and I/O are

CC

LOW, with low impedance with respect to GND. The
step-up converter is stopped. The I/O is configured in the
reception mode with a high impedance path to the ISO
UART, subsequently no spurious pulse from the card
during power-up will be taken into account until I/O is
enabled. When everything is satisfactory (voltage supply,
card present, no hardware problems), the microcontroller
may initiate an activation sequence by setting START
LOW (t0):

• The step-up converter is started (t1)

• LIS signal is disabled by ENLI, and VCC starts rising from

0 to 5 V with a controlled rise time of 0.1 V/µs typically
(t2)

• I/O buffer is enabled (t3)

• Clock is sent to the card (t4)

• RST buffer is enabled (t5).

In order to allow a precise count of clock pulses during
ATR, a defined time window (t

; t5) is opened where the

3

clock may be sent to the card by means of RSTIN. Beyond
this window, RSTIN has no more action on clock, and only
monitors the cards RST contact (RST is the inverse of
RSTIN).

The sequencer is clocked by f

/64 which leads to a time

INT

interval T of 25 µs typical. Thus t1=0to1⁄64T,
t2=t1+1⁄23T, t3=t1+ 4T, t4=t3to t5 and t5=t1+7T
(see Fig.9).

Deactivation sequence (see Fig.10) When the session is completed, the microcontroller sets

START HIGH. The circuit then executes an automatic
deactivation sequence:

• Card reset (RST falls LOW) at t

• Clock is stopped at t

11

10

• I/O becomes high impedance to the ISO UART (t12)

• VCC falls to 0 V with typical 0.1 V/µs slew rate (t13)

• The step-up converter is stopped and CLK, RST, V

CC

and I/O become low impedance to GND (t14).

• t10<1⁄64T; t11=t10+1⁄2T; t12=t10+ T; t13=t10+1⁄23T;
t14=t10+ 5T.

Protections

Main hardware fault conditions are monitored by the circuit

• Overcurrent on V

CC

• Short circuits between VCC and other contacts

• Card take-off during transaction.

When one of these problems is detected, the security logic
block pulls the interrupt line OFF LOW, in order to warn the
microcontroller, and initiates an automatic deactivation of
the contacts. When the deactivation has been completed,
the OFF line returns HIGH, except if the problem was due
to a card extraction in which case it remains LOW till a card
is inserted.

1996 Sep 25 17

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

handbook, full pagewidth

I/O

MODE

OUT

IN

T

R

PRES

I/O BUFFER

ISO UART

handbook, full pagewidth

activation character

12 34543416363343 1

character
reception

with error

character

reception

without

error

character

transmission

with error

character

transmission

without

error

reception

without

error

forced

deactivation

MBH638

Fig.8 I/O buffer modes.

t

act

OFF

START

f

/64

INT

V

UP

V

CC

I/O

ENRST

RSTIN

CLK

RST

ENLI

internal

internal

t

3

t

5

Fig.9 Activation sequence.

MBH639

1996 Sep 25 18

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

handbook, full pagewidth

PRES

OFF

START

f

/64

INT

RST

CLK

I/O

V

CC

V

UP

ENLI

internal

t10t11t12t

13

t

de

t

14

Fig.10 Emergency deactivation sequence after a card take-off.

MBH640

1996 Sep 25 19

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DDA

V

DDD

V

n

I

n1

I

n2

I

n3

I

n4

I

n5

I

n6

I

n7

P

tot

T

stg

V

es

T

j

analog supply voltage −0 6.5 V
digital supply voltage −0 6.5 V
all input voltages −0V
DC current into XTAL1, XTAL2, RX, TX,

− 5mA

+ 0.5 V

DD

RESET, INT1, P34, P37, P00 to P03,
P11 to P17, P20 to P23 and
TEST1 to TEST4

DC current from or to AUX1, AUX2 −10 +10 mA
DC current from or to S1 to S5 −30 +30 mA
DC current into DELAY −5 +10 mA
DC current from or to PRES −5+5mA
DC current from and to K0 to K5 −5+5mA
DC current from or into ALARM

−5+5mA

(according to option choice)
continuous total power dissipation T
IC storage temperature −55 +150
electrostatic discharge on pins I/O, VCC,

= −20 to +85°C − 500 mW

amb

−6+6kV

o

C

RST, CLK and PRES
on other pins −2+2kV

Operating Junction Temp. −−125 °C

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

from junction to ambient in free air

LQFP64 70 K/W
QFP44 60 K/W

1996 Sep 25 20

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

CHARACTERISTICS

V

=5V; VSS=0V; T

DD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply

V

DD

I

DD(pd)

supply voltage Option dependant 2.5 − 6.0 V
supply current power-down

mode

I

DD(sm)

I

DD(om)

V

th1

supply current sleep mode card powered, but with clock

supply current operating mode unloaded; f

threshold voltage on V
(falling)

V
V
V
I

DEL

t

W

hys1
th2
DEL

hysteresis on V
threshold voltage on DELAY − 1.38 − V
voltage on pin DELAY 4.6 − V
output current at DELAY pin grounded (charge) −1.5 −1 −0.4 µA

ALARM pulse width C

ALARM (open drain active HIGH or LOW output)

I
V
I
V

OH

OL

OL

OH

HIGH level output current active LOW option; VOH=5V −−10 µA
LOW level output voltage active LOW option; IOL=2mA −−0.4 V
LOW level output current active HIGH option, VOL=0V −−−10 µA

HIGH level output voltage active HIGH option, IOH= −2mA VDD− 1 −− V
Crystal oscillator (note 1)
f

xtal

f

EXT

crystal frequency 2 − 16 MHz

external frequency applied on

XTAL1

=25°C; for general purpose I/O ports see 80CL51 data sheet; unless otherwise specified.

amb

VDD= 5 V; card inactive

− 90 −µA

VDD=3V; “ “

− 500 −µA

stopped

DD

= 13 MHz;

xtal

f

= 6.5 MHz; f

clk

V

=3V; f

DD

f

= 3.25 MHz; f

clk

xtal

= 3.25 MHz

card

= 13 MHz;

= 3.25 MHz

card

supervisor option 2 − 2.3 V

− 5.5 − mA

− 3 − mA

2.45 − 3V

3.8 − 4.5 V

th1

V

DEL=VDD

DEL

(discharge) 4 6.8 10 mA

=10nF − 10 − ms

40 − 350 mV

DD

0 − 16 MHz

V

Step-up converter

f
V

INT

UP

oscillation frequency 2 − 3 MHz

voltage on S5 − 6.5 − V

Low impedance supply (LIS)

V
I

LIS

LIS

voltage on LIS 0 − V

current at LIS −−7µA

1996 Sep 25 21

DD

V

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Reset output to the card (RST)

V

inactive

I

inactive

V

OL

V

OH

t

r

t

f

Clock output to the card (CLK)

V

inactive

I

inactive

V

OL

V

OH

t

r

t

f

f

clk

δ duty cycle CL=30pF 45 − 55 %

output voltage when inactive −0.3 − 0.4 V

when LIS is used; I

current from RST when

=1mA −0.3 − 0.4 V

inactive

−−−1mA

inactive and pin grounded

LOW level output voltage IOL= 200 µA −0.25 − 0.4 V

HIGH level output voltage IOH<−200 µA4−V

+ 0.3 V

CC

rise time CL=30pF −−1µs

fall time CL=30pF −−1µs

output voltage when inactive −0.3 − 0.4 V

when LIS is used; I

current from CLK when

=1mA −0.3 − 0.4 V

inactive

−−−1mA

inactive and pin grounded

LOW level output voltage IOL= 200 µA −0.25 − 0.4 V

HIGH level output voltage IOH<−200 µAV

−0.5 − VCC+0.25 V

CC

rise time CL=30pF −−15 ns

fall time CL=30pF −−15 ns

clock frequency 1 MHz Idle configuration 1 − 1.5 MHz

low operating speed −−2 MHz
middle operating speed −−4 MHz
high operating speed −−8 MHz

Card supply voltage (V

V

inactive

output voltage when inactive −0.3 − 0.4 V

CC

)

when LIS is used; I

I

inactive

current from VCC when

inactive and pin grounded
V

cc

output voltage in active mode

with 100 nF capacitor;

I

= 200 mA, f

max

duration <400 ns

static load (up to 20 mA)

dynamic current of 40 nA

I

CC

output current VCC = 5V −−−20 mA

V

shorted to GND −−−40 mA

CC

SR slew rate up or down

(max capacitance is 150 nF)

1996 Sep 25 22

inactive

= 5 MHz, and

max

=1mA −0.3 − 0.4 V

−−−1mA

−

4.75

4.5

−−

5.25

5.5

0.04 0.1 0.16 V/µs

V

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Data line (I/O)

V

inactive

I

inactive

V

OL

V

OH

V

IL

V

IH

t

r

t

f

R

pu

output voltage when inactive −0.3 − 0.4 V

when LIS is used; I

current from I/O when inactive

=1mA −0.3 − 0.4 V

inactive

−−−1mA

and pin grounded

LOW level output voltage (I/O

IOL=1mA −0.25 − 0.3 V

configured as an output)

HIGH level output voltage (I/O

IOH<−100 µAV

+0.8 − VCC+0.25 V

CC

configured as an output)

input voltage LOW (I/O

IIL= 1 mA 0 − 0.5 V

configured as an input)

input voltage HIGH (I/O

IIL= 100 µAV

+0.6 − V

CC

CC

V

configured as an input)

rise time CL=30pF −−1µs

fall time CL=30pF −−1µs

pull-up resistor connected to

see Table 4 for options −−−

VCC when I/O is input

Protections

I

CC(sd)

shutdown current at V

CC

Timing

t

act

t

de

activation sequence duration −−225 µs

deactivation sequence

duration
t

3(start)

start of the window for sending

clock to the card
t

5(end)

end of the window for sending

clock to the card

Auxiliary outputs (AUX1, AUX2)

V

OL

V

OH

LOW level output voltage IOL=5mA −−0.4 V

HIGH level output voltage IOH= −5mA VDD− 1 −− V

Output ports from extension (K0 to Kn)

V

OL

V

OH

LOW level output voltage IOL=2mA −−0.4 V

HIGH level output voltage IOH= −2mA VDD− 1 −− V

Card presence input (PRES)

V

IL

V

IH

I

IH

LOW level input voltage IIL= −1mA −−0.6 V

HIGH level input voltage IIH= 100 µA 0.7V

HIGH level input current VIH=+5V 0.2 − 3 µA

Note

1. The crystal oscillator is the same as OPTION 3 of the 80CL51.

−−30 − mA

−−150 µs

−−130 µs

140 −− µs

DD

−− V

1996 Sep 25 23

1996 Sep 25 24

KEYBOARD

5 V

(analog)

1615141312111098765432

100 nF

5 V(analog)

1

100 nF

APPLICATION INFORMATION

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

5 V(logic)

MMI-CLK

MMI-REQ

from

system

controller

RESET

RX

TX

MMI-EN

LIS

LED2

LED1

R7

1.5 Ω

1.5 Ω
R8

17
18
19
20
21
22
23
24
25
26
27
28
29
30
31

32

333435363738394041424344454647

TDA8005G

4.7
nF

64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49

48

47 nF

4.7
nF

100

nF

5 V(logic)

100

kΩ

NC8
NC7
NC6
NC5
C1
C2
C3
C4

CARD-READ-C702
K1

K2

NC1
NC2
NC3
NC4

C5
C6
C7
C8

MGC440

handbook, full pagewidth

Fig.11 Possible GSM application.

1996 Sep 25 25

n

KEYBOARD

dbook, full pagewidth

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

V

DD

4.7
nF

47 nF

1

48

100 nF

64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49

47 nF

47
nF

3 V

100
nF

C8
C7
C6
C5
NC1
NC2
NC3
NC4

CARD-READ-LM01
K1

K2

C4
C3
C2

C1
NC5
NC6
NC7
NC8

MGC439

100 nF

1615141312111098765432

17
18
19
20
21
22
23
24
25
26
27
28
29
30
31

32

333435363738394041424344454647

33
pF

7.15

MHz

DD

LED1

LED2

R6

R7

V

TDA8005G

33
pF

R/W

AS E D7 D6 D5 D4 D3 D2 D1 D8

DISPLAY DRIVER

AND DISPLAY

Fig.12 Possible stand-alone application.

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

Table 4 TDA8005 option choice form

FUNCTION DESCRIPTION OPTION

Ports

P00
P01
P02
P03
P04 RSTIN (fixed) 3 S
P05 START (fixed) 3 S
P06 STR (fixed) 3 S
P07 EN (fixed) 3 S
P10 OFF (fixed) 2 S
P11
P12
P13
P14
P15
P16
P17
P20
P21
P22
P23
P24 DATA (fixed) 1 S
P25 R/W (fixed) 3 S
P26 REG1 (fixed) 3 S
P27 REG0 (fixed) 3 S
P30
P31
P32 INT (fixed) 1 S
P33
P34
P35 AUXI (fixed) 3 S
P36 AUX2 (fixed) 3 S
P37

FUNCTION DESCRIPTION OPTION

Analog options

Step-up doubler (updo) or tripler

(uptri)

Supervisor 2.3 (supervb, 3 (supervtr) or

4.5 (superVCI)

I/O low impedance (UARTl) or

high impedance (UARTZ)
I/O pull-up 10, 20 or 30 kΩ
R_CLK 0, 50, 100, 150 or 200 Ω
R_RST 0, 50, 80, 130 or 180 Ω
ALARM active HIGH (alarmbufp) or

active LOW (alarmbufn)
PRES active HIGH (prestopp) or

active LOW (prestopn)

1996 Sep 25 26

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

PACKAGE OUTLINES

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm

c

y

X

A

48 33

49

64

pin 1 index

1

16

Z

32

E

e

H

E

E

A

2

A

A

1

w M

b

p

17

detail X

SOT314-2

(A )

3

θ

L

p

L

Z

e

w M

b

p

D

D

H

D

v M

B

v M

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

mm

A

A1A2A3b

max.

0.20

1.60

0.05

1.45

1.35

0.25

cE

p

0.27

0.18

0.17

0.12

(1)

(1) (1)(1)

D

10.1

9.9

eH

10.1

9.9

0.5

12.15

11.85

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT314-2

1996 Sep 25 27

A

B

E

12.15

11.85

LL

p

0.75

0.45

0.12 0.11.0 0.2

H

D

EUROPEAN

PROJECTION

Z

1.45

1.05

D

Zywv θ

E

o

1.45

7

o

1.05

0

ISSUE DATE

95-12-19
97-08-01

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

c

y

X

A

33 23

34

pin 1 index

44

1

22

Z

E

e

H

E

E

w M

b

p

12

11

A

2

A

A

1

detail X

SOT307-2

(A )

3

θ

L

p

L

w M

b

e

p

D

H

D

Z

D

B

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.10

0.25

0.05

1.85

1.65

0.25

UNIT A1A2A3b

cE

p

0.40

0.25

0.20

0.14

(1)

(1) (1)(1)

D

10.1

9.9

eH

10.1

9.9

12.9

0.8 1.3

12.3

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT307-2

1996 Sep 25 28

v M

H

v M

D

A

B

E

12.9

12.3

LL

p

0.95

0.55

0.15 0.10.15

EUROPEAN

PROJECTION

Z

D

1.2

0.8

Zywv θ

E

o

1.2

10

o

0.8

0

ISSUE DATE

95-02-04
97-08-01

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all LQFP and
QFP packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

Reference Handbook”

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

(order code 9398 652 90011).

“Quality

(order code 9397 750 00192).

Wave soldering

Wave soldering is not recommended for LQFP or QFP
packages. This is because of the likelihood of solder
bridging due to closely-spaced leads and the possibility of
incomplete solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions:

• Do not consider wave soldering LQFP packages

LQFP48 (SOT313-2), LQFP64 (SOT314-2) or
LQFP80 (SOT315-1).

• Do not consider wave soldering QFP packages

QFP52 (SOT379-1), QFP100 (SOT317-1),
QFP100 (SOT317-2), QFP100 (SOT382-1) or
QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

1996 Sep 25 29

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Sep 25 30

Philips Semiconductors Product specification

Low-power smart card coupler TDA8005

NOTES

1996 Sep 25 31

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 647021/1200/02/pp32 Date of release: 1996 Sep 25 Document order number: 9397 750 01154