Datasheet TDA7073A, TDA7073AT Datasheet (Philips) [ru]

INTEGRATED CIRCUITS

DATA SH EET

TDA7073A; TDA7073AT

Dual BTL power driver

Product specification
Supersedes data of 1994 July
File under Integrated Circuits, IC01

1999 Aug 30

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

FEATURES

• No external components

• Very high slew rate

• Single power supply

• Short-circuit proof

GENERAL DESCRIPTION

The TDA7073A/AT aredual power driver circuits in a BTL
configuration, intended for use as a power driver for servo
systems with a single supply. They are specially designed
for compact disc players and are capable of driving focus,
tracking, sled functions and spindle motors.

• High output current (0.6 A)

• Wide supply voltage range

• Low output offset voltage

• Suited for handling PWM signals up to 176 kHz

• ESD protected on all pins.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

G

v

I

P

positive supply voltage range 3.0 5.0 18 V
voltage gain 32.5 33.5 34.5 dB

total quiescent current VP=5V; RL=∞−816mA
SR slew rate − 12 − V/µs
I
I
f

O
bias
co

output current −−0.6 A

input bias current − 100 300 nA

cut-off frequency −3dB − 1.5 − MHz

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA7073A DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TDA7073AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

1999 Aug 30 2

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

BLOCK DIAGRAM

V

P

handbook, full pagewidth

positive input 1

negative input 1

positive input 2

negative input 2

2
1

TDA7073A
TDA7073AT

6
7

5

Ι

SHORT - CIRCUIT AND

THERMAL PROTECTION

I – i

ΙΙ

16I + i

13I – i

12

9I + i

positive output 1

negative output 1

negative output 2

positive output 2

10

ground 2

14

ground 1

Fig.1 Block diagram.

1999 Aug 30 3

3, 4, 8, 11, 15

MCD382 - 1

n.c.

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

PINNING

SYMBOL PIN DESCRIPTION

IN1− 1 negative input 1
IN1+ 2 positive input 1
n.c. 3 not connected
n.c. 4 not connected
V

P

5 positive supply voltage
IN2+ 6 positive input 2
IN2− 7 negative input 2
n.c. 8 not connected
OUT2+ 9 positive output 2
GND2 10 ground 2
n.c. 11 not connected
OUT2− 12 negative output 2
OUT1− 13 negative output 1
GND1 14 ground 1
n.c. 15 not connected
OUT1+ 16 positive output 1

handbook, halfpage

1

IN1–
IN1+

2
3

n.c.

4

n.c.

V

IN2 +
IN2 –

n.c.

P

TDA7073A

TDA7073AT

5
6
7
8

MCD381

Fig.2 Pin configuration.

16
15
14
13
12
11
10

9

OUT1+
n.c.
GND1
OUT1 –
OUT2 –
n.c.
GND2
OUT2 +

FUNCTIONAL DESCRIPTION

The TDA7073A/AT are dual power driver circuits in a BTL
configuration, intended for use as a power driver for servo
systemswith a single supply. Theyareparticular designed
for compact disc players and are capable of driving focus,
tracking, sled functions and spindle motors.

Because of the BTL configuration, the devices can supply
a bi-directional DC current in the load, with only a single
supply voltage. The voltage gain is fixed by internal

feedback at 33.5 dB and the devices operate in a wide
supply voltage range (3 to 18 V). The devices can supply
a maximum output current of 0.6 A. The outputs can be
short-circuited over the load, to the supply and to ground
at all input conditions. The differential inputs can handle
common mode input voltages from ground level up to
(VP− 2.2 V with a maximum of 10 V). The devices have a
very high slew rate. Due to the large bandwidth, they can
handle PWM signals up to 176 kHz.

1999 Aug 30 4

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

I

ORM

I

OSM

P

tot

T

stg

T

vj

T

sc

Note

1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.

positive supply voltage range − 18 V
repetitive peak output current − 1A
non repetitive peak output current − 1.5 A
total power dissipation

TDA7073A T

TDA7073AT T

<25°C − 2.5 W

amb

<25°C − 1.32 W

amb

storage temperature range −55 +150 °C
virtual junction temperature − 150 °C
short-circuit time see note 1 − 1hr

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th (j-a)

from junction to ambient

TDA7073A in free air; note 1 50 K/W

TDA7073AT in free air; note 2 95 K/W

Notes

1. TDA7073A: V
P

=2×0.76 W = 1.52 W; T

tot

= 5 V; RL=8Ω; The typical voltage swing = 5.8 V and V

P

amb (max)

= 150 − 1.52 × 50 = 74 °C.

2. TDA7073AT: VP= 5 V; RL=16Ω; typical voltage swing = 5.8 V and V
P

=2×0.38 W = 0.76 W; T

tot

amb (max)

= 150 − 0.76 × 95 = 77 °C.

is 2.1 V therefore IO= 0.36 A and

loss

is 2.1 V therefore IO= 0.18 A and

loss

1999 Aug 30 5

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

CHARACTERISTICS

VP= 5 V; f = 1 kHz; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

ORM

I

P

∆V

OUT

THD total harmonic distortion

G

v

V

no(rms)

B bandwidth −−1.5 MHz
SVRR supply voltage ripple rejection note 4 38 55 − dB
∆V
V

I(CM)

16-13,12-9

 DC output offset voltage RS= 500 Ω−−100 mV

CMRR DC common mode rejection ratio note 6 − 100 − dB
Z

I

I

bias

α channel separation 40 50 − dB
∆GV channel unbalance −−1dB

SR slew rate − 12 − V/µs

=25°C; unless otherwise specified (see Fig.3). TDA7073A: RL=8Ω; TDA7073AT: RL=16Ω.

amb

positive supply voltage range 3.0 5.0 18 V
repetitive peak output current −−0.6 A
total quiescent current VP=5V; RL=∞;

− 816mA

note 1

output voltage swing note 2 5.2 5.8 − V

TDA7073A V
TDA7073AT V

= 1 V (RMS) − 0.3 − %

OUT

= 1 V (RMS) − 0.1 − %

OUT

voltage gain 32.5 33.5 34.5 dB
noise output voltage (RMS value) note 3 − 75 150 µV

DC common mode voltage range note 5 0 − 2.8 V

input impedance − 100 − kΩ
input bias current − 100 300 nA

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R

.

L

2. The output voltage swing is typically limited to 2 × (VP− 2.1 V) (see Fig.4).

3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS= 500 Ω.

4. The ripple rejection is measured with RS=0Ωandf = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.

5. The DC common mode voltage range is limited to (VP− 2.2 V with a maximum of 10 V).

6. The common mode rejection ratio is measured at V

= 1.4 V, V

ref

= 200 mV and f = 1 kHz.

I(CM)

1999 Aug 30 6

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

APPLICATION INFORMATION

handbook, full pagewidth

driver signal 1

SERVO SYSTEM

driver signal 2

V

ref

(1)

100 nF

5

I + i

2

R

500 Ω

s

1

Ι

I – i

220 µF

16

13

V = 5 V

P

(2)

R

L

TDA7073A
TDA7073AT

I – i

6

R

500 Ω

s

7

ΙΙ

I + i

12

(2)

R

L

9

10

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL can be: focus, tracking, sled function or spindle motor.

Fig.3 Test and application diagram.

1999 Aug 30 7

14

3, 4, 8, 11, 15

n.c.

MCD383

ground

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

+ (V – 2.1) V

handbook, full pagewidth

MCD380

P

0 V

– (V – 2.1) V

P

Fig.4 Typical output voltage swing over RL.

1999 Aug 30 8

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

seating plane

L

Z

16

1

pin 1 index

D

A

2

A

A

1

e

b

w M

b

1

9

E

8

M

E

c

(e )

1

M

H

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

D

21.8

21.4

0.86

0.84

1999 Aug 30 9

6.48

6.20

0.26

0.24

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

w

92-10-02
95-01-19

Z

max.

2.2

0.087

(1)

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

8

w M

b

p

SOT162-1

E

H

E

Q

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT162-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013AA

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.5

7.6

7.4

0.30

0.29

1.27

0.050

10.1

0.41

0.40

REFERENCES

1999 Aug 30 10

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

SOLDERING
Introduction

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

stg(max)

). If the

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Aug 30 11

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

WAVE REFLOW

(2)

− suitable

(1)

DIPPING

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

SOLDERING METHOD

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,

not suitable

(3)

suitable −

SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable −

(4)(5)

suitable −

(6)

suitable −

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Aug 30 12

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

NOTES

1999 Aug 30 13

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

NOTES

1999 Aug 30 14

Philips Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

NOTES

1999 Aug 30 15

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1999

Internet: http://www.semiconductors.philips.com

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Printed in The Netherlands 545002/03/pp16 Date of release: 1999 Aug 30 Document order number: 9397750 06375