Datasheet tda7072a, tda7072at DATASHEETS (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

TDA7072A/AT

Single BTL power driver

Objective speciﬁcation File under Integrated circuits, IC01

July 1994

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

FEATURES

• No external components

• Very high slew rate

• Single power supply

• Short-circuit proof

GENERAL DESCRIPTION

The TDA7072A/AT are single power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are specially designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors.

• High output current (0.6 A)

• Wide supply voltage range

• Low output offset voltage

• Suited for handling PWM signals up to 176 kHz

• ESD protected on all pins

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended).

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

positive supply voltage range 3.0 5.0 18 V internal voltage gain 32.5 33.5 34.5 dB

total quiescent current VP = 5 V; RL = ∞−48mA SR slew rate − 12 − V/µs I I f

O bias co

output current −−0.6 A

input bias current − 100 300 nA

cut-off frequency −3dB − 1.5 − MHz

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

PINS PIN POSITION MATERIAL CODE

PACKAGE

TDA7072A 8 DIL plastic SOT97 TDA7072AT 8 mini-pack plastic SOT96A

Notes

1. SOT97-1; 1996 September 10.

2. SOT96-1; 1996 September 10.

(1)

(2)

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

handbook, full pagewidth

PINNING

positive input

negative input

TDA7072A TDA7072AT

n.c.

I + i

SHORT - CIRCUIT AND

THERMAL PROTECTION

I – i

ground

Fig.1 Block diagram.

n.c.

positive output

negative output

MCD377 - 1

SYMBOL PIN DESCRIPTION

1 positive supply voltage IN+ 2 positive input IN− 3 negative input n.c. 4 not connected OUT+ 5 positive output GND 6 ground n.c. 7 not connected OUT− 8 negative output

handbook, halfpage

IN + IN –

n.c.

1 2

TDA7072A

TDA7072AT

3 4

8 7 6 5

MCD378

Fig.2 Pin configuration.

OUT – n.c. GND OUT +

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

FUNCTIONAL DESCRIPTION

The TDA7072A/AT are single power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are particular designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors.

Because of the BTL configuration, the devices can supply a bi-directional DC current in the load, with only a single

feedback at 33.5 dB and the devices operate in a wide supply voltage range (3 to 18 V). The devices can supply a maximum output current of 0.6 A. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions. The differential inputs can handle common mode input voltages from ground level up to (V

−2.2 V). The devices have a very high slew rate. Due

to the large bandwidth, they can handle PWM signals up to 176 kHz.

supply voltage. The voltage gain is fixed by internal

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

ORM

OSM

tot

positive supply voltage range − 18 V repetitive peak output current − 1A non repetitive peak output current − 1.5 A total power dissipation T

amb

< 25 °C TDA7072A − 1.25 W TDA7072AT − 0.54 W

stg

storage temperature range −55 +150 °C virtual junction temperature − +150 °C short-circuit time see note − 1hr

Note to the limiting values

The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.

THERMAL RESISTANCE

SYMBOL PARAMETER THERMAL RESISTANCE

th j-a

from junction to ambient in free air TDA7072A 100 K/W TDA7072AT 155 K/W

Note to the thermal resistance

TDA7072A: V P

= 0.76 W; T

tot

= 5 V; RL = 8 Ω; The typical voltage swing = 5.8 V and V

amb (max)

= 150 − 0.76 × 100 = 74 °C

TDA7072AT: VP = 5 V; RL = 16 typical voltage swing = 5.8 V and V T

amb (max)

= 150 − 0.38 × 155 = 91 °C

loss

is 2.1 V therefore IO = 0.36 A and

loss

is 2.1 V therefore IO = 0.18 A and P

= 0.38 W;

tot

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

CHARACTERISTICS

= 5 V; f = 1 kHz; T

TDA7072AT: R

= 16 Ω.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ORM

∆V

OUT

positive supply voltage range 3.0 5.0 18 V repetitive peak output current −−0.6 A total quiescent current RL = ∞; note 1 − 48mA output voltage swing note 2 5.2 5.8 − V

THD total harmonic distortion V

TDA7072A − 0.3 − % TDA7072AT − 0.1 − %

no(rms)

voltage gain 32.5 33.5 34.5 dB

noise output voltage (RMS value) note 3 − 75 150 µV B bandwidth −−1.5 MHz SVRR supply voltage ripple rejection note 4 40 55 − dB

| DC output offset voltage RS = 500 Ω−−100 mV

|∆V

5-8

I(CM)

DC common mode voltage range note 5 0 − 2.8 V CMRR DC common mode rejection ratio note 6 − 100 − dB Z I

bias

input impedance − 100 − kΩ

input bias current − 100 300 nA SR slew rate − 12 − V/µs

= 25 °C; unless otherwise speciﬁed (see Fig.3>). TDA7072A: RL = 8 Ω;

amb

= 1 V (RMS)

OUT

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by R

2. The output voltage swing is typically limited to 2 x (VP−2.1 V) (see Fig.4).

3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS = 500 Ω.

4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail.

5. The DC common mode voltage range is limited to (VP−2.2 V).

6. The common mode rejection ratio is measured at V

= 1.4 V, V

ref

= 200 mV and f = 1 kHz.

I(CM)

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

APPLICATION INFORMATION

handbook, full pagewidth

SERVO SYSTEM

driver signal

ref

(1)

100 nF

220 µF

V = 5 V

TDA7072A TDA7072AT

I + i

500 Ω

I – i

n.c.

ground

(2)

MCD379

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1. (1) RL can be: focus, tracking, sled function or spindle motor.

Fig.3 Test and application diagram.

+ (V – 2.1) V

0 V

– (V – 2.1) V

MCD380

Fig.4 Typical output voltage swing over RL.

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

seating plane

pin 1 index

w M

SOT97-1

(e )

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

max.

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT97-1

min.

max.

050G01 MO-001AN

1.73

1.14

0.068

0.045

IEC JEDEC EIAJ

0.021

0.015

0.53

0.38

0 5 10 mm

scale

1.07

0.89

0.042

0.035

REFERENCES

cD E e M

0.36

0.23

0.014

0.009

0.39

0.36

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(1) (1)

9.8

9.2

6.48

6.20

0.26

0.24

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

10.0

0.39

0.33

8.3

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

92-11-17 95-02-04

(1)

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

SO8: plastic small outline package; 8 leads; body width 3.9 mm

pin 1 index

w M

SOT96-1

detail X

v M

(A )

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT96-1

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.0098

0.057

0.0039

0.049

IEC JEDEC EIAJ

076E03S MS-012AA

0.25

0.01

0.49

0.25

0.36

0.19

0.019

0.0098

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)E(2)

5.0

4.8

0.20

0.19

REFERENCES

4.0

3.8

0.16

0.15

0.050

July 1994 8

eHELLpQZywv θ

1.27

6.2

5.8

0.24

0.23

1.05

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

0.25 0.10.25

0.010.010.041 0.004

EUROPEAN

PROJECTION

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

92-11-17 95-02-04

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WA VE

S The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T

stg max

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

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Philips Semiconductors Objective speciﬁcation

Single BTL power driver TDA7072A/AT

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

July 1994 10