Page 1
DATA SH EET
Objective specification
File under Integrated Circuits, IC01
May 1992
INTEGRATED CIRCUITS
TDA7057Q
2 x 3 W stereo BTL audio output
amplifier
Page 2
May 1992 2
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output
amplifier
TDA7057Q
FEATURES
• No external components
• No switch-on and off clicks
• Good overall stability
• Low power consumption
• Short-circuit proof
• Low HF radiation
• ESD protected on all pins.
GENERAL DESCRIPTION
The TDA7057Q is a stereo output amplifier in a 13 pin
power package. The device is designed for battery-fed
portable stereo recorders and radios, but also suitable for
mains-fed applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. SOT141-6; 1996 September 9.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
positive supply voltage range 3.0 11 18 V
P
O
output power VP= 11 V; RL= 16 Ω− 3 − W
G
V
voltage gain 39 40 41 dB
I
P
total quiescent current VP= 11 V; RL= ∞−10 14 mA
THD total harmonic distortion P
O
= 0.5 W − 0.25 1 %
EXTENDED TYPE PACKAGE
NUMBER PIN PIN POSITION MATERIAL CODE
TDA7057Q 13 SBD plastic SOT141
(1)
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May 1992 3
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
Fig.1 Block diagram.
handbook, full pagewidth
3
2
V
P
1
13I + i
11I – i
4
TDA7057Q
5
10
8I + i
I – i
12
9
power
ground 2
n.c.
power
ground 1
6
ΙΙ
Ι
n.c.
7
input 1
signal ground 1
positive output 1
negative output 1
MCD392
input 2
signal ground 2
positive output 2
negative output 2
Page 4
May 1992 4
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
PINNING
SYMBOL PIN DESCRIPTION
SGND1 1 signal ground 1
V
I(1)
2 voltage input 1
V
P
3 positive supply voltage
V
I(2)
4 voltage input 2
SGND2 5 signal ground 2
n.c. 6 not connected
n.c. 7 not connected
OUT2+ 8 positive output 2
PGND2 9 power ground 2
OUT2− 10 negative output 2
OUT1− 11 negative output 1
PGND1 12 power ground 1
OUT1+ 13 positive output 1
Fig.2 Pin configuration.
handbook, halfpage
MCD391
1
2
3
4
5
6
7
8
9
10
11
12
13
TDA7057Q
SGND1
SGND2
OUT2
+
I (2)
V
P
V
I (1)
V
n.c.
OUT1 +
OUT2 –
PGND1
PGND2
OUT1 –
n.c.
Page 5
May 1992 5
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
FUNCTIONAL DESCRIPTION
The TDA7057Q is a stereo output amplifier, designed for battery-fed applications e.g. portable radios, but also suitable
for mains fed applications. The gain is internally fixed at 40 dB.
For space reason there is a trend to decrease the number of battery cells. This means a decrease in supply voltage,
resulting in a reduction of output power at conventional output stages. The latter is not preferred. Using the BTL principle
increases the output power. The TDA7057Q can deliver an output power of 3 W in a speaker load of 16 Ω with 11 V
supply.
The circuit is designed such that no external components are required. Special attention is given to switch-on and off
clicks, low HF radiation and a good overall stability. The load can be short-circuited at all input conditions.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
Note to the limiting values
1. The load can be short-circuited at all input conditions.
THERMAL RESISTANCE
Note to the thermal resistance
V
P
= 11 V; RL= 16 Ω; The maximum sine-wave dissipation is = 3 W; T
amb (max)
= 60 °C; R
th vj-a
= (150 − 60)/3 = 30 K/W
R
th vj-a
= R
th vj-c
+ R
th c-HS
+ R
th HS
R
th c-HS
+ R
th HS
= 30 − 8 = 22 K/W
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
positive supply voltage range − 18 V
I
ORM
repetitive peak output current − 1A
I
OSM
non repetitive peak output current − 1.5 A
P
tot
total power dissipation T
case
< 60 °C − 9W
T
stg
storage temperature range −55 +150 °C
T
vj
virtual junction temperature − +150 °C
T
sc
short-circuit time see note 1 − 1hr
SYMBOL PARAMETER THERMAL RESISTANCE
R
th j-a
from junction to ambient in free air 45 K/W
R
th j-c
from junction to case 8 K/W
Page 6
May 1992 6
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
CHARACTERISTICS
V
P
= 11 V; f = 1 kHz; RL= 16 Ω; T
amb
= 25 °C; unless otherwise specified
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R
L
.
2. The noise output voltage (RMS value) is measured with RS= 5 kΩ unweighted (20 Hz to 20 kHz).
3. The noise output voltage RMS value) at f = 500 kHz is measured with RS= 0 Ω and bandwidth = 5 kHz.
With a practical load (RL= 16 Ω, L = 200 µH) the noise output current is only 50 nA.
4. The ripple rejection is measured with RS= 0 Ω and f = 100 Hz to 10 kHz.
The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
positive supply voltage range 3.0 11 18 V
I
ORM
repetitive peak output current −− 0.6 A
Operating position
I
P
total quiescent current RL= ∞; note 1 − 10 14 mA
P
O
output power THD = 10% 2.5 3 − W
THD total harmonic distortion P
O
= 0.5 W − 0.25 1 %
G
V
voltage gain 39 40 41 dB
V
no(rms)
noise output voltage (RMS value) note 2 − 180 300 µV
V
no(rms)
noise output voltage (RMS value) note 3 − 60 −µV
B bandwidth − 20 Hz to 20 kHz −
SVRR supply voltage ripple rejection note 4 36 60 − dB
V
off
DC output offset voltage RS= 5 kΩ−− 200 mV
Z
I
input impedance − 100 − kΩ
I
bias
input bias current − 100 300 nA
α channel separation R
S
= 5 kΩ 40 −−dB
G
V
channel balance −− 1dB
Page 7
May 1992 7
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
APPLICATION INFORMATION
Fig.3 Test and application diagram.
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 3.
handbook, full pagewidth
input 1
MCD393
input 2
ground
5 kΩ
R
s
5 kΩ
R
s
100 nF
220 µF
(1)
V
P
3
2
1
13I + i
11I – i
4
TDA7057Q
5
10
8I + i
I – i
12 9
n.c.
6
ΙΙ
Ι
n.c.
7
positive
output 1
negative
output 1
positive
output 2
negative
output 2
Page 8
May 1992 8
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
PACKAGE OUTLINE
UNIT A e
1
A2bpcD
(1)
E
(1)
Z
(1)
deD
h
LL3m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10 3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25w0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w M
b
p
1
d
D
Z
e
2
e
e
x
h
113
j
E
h
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v M
B
Page 9
May 1992 9
Philips Semiconductors Objective specification
2 x 3 W stereo BTL audio output amplifier TDA7057Q
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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