Datasheet TDA7057Q Datasheet

INTEGRATED CIRCUITS

DATA SH EET

TDA7057Q

2 x 3 W stereo BTL audio output
amplifier

Objective specification
File under Integrated Circuits, IC01

May 1992

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output

TDA7057Q

amplifier

FEATURES

• No external components

• No switch-on and off clicks

• Good overall stability

• Low power consumption

• Short-circuit proof

• Low HF radiation

• ESD protected on all pins.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

P

O

G

V

I

P

THD total harmonic distortion P

positive supply voltage range 3.0 11 18 V
output power VP= 11 V; RL= 16 Ω− 3 − W
voltage gain 39 40 41 dB
total quiescent current VP= 11 V; RL= ∞−10 14 mA

= 0.5 W − 0.25 1 %

O

GENERAL DESCRIPTION

The TDA7057Q is a stereo output amplifier in a 13 pin
power package. The device is designed for battery-fed
portable stereo recorders and radios, but also suitable for
mains-fed applications.

ORDERING INFORMATION

EXTENDED TYPE PACKAGE

NUMBER PIN PIN POSITION MATERIAL CODE

TDA7057Q 13 SBD plastic SOT141

Note

1. SOT141-6; 1996 September 9.

(1)

May 1992 2

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

V

P

handbook, full pagewidth

input 1

signal ground 1

input 2

signal ground 2

3

13I + i

positive output 1

2
1

Ι

11I – i

negative output 1

TDA7057Q

I – i

4
5

ΙΙ

10

8I + i

negative output 2

positive output 2

7

n.c.

12

power

ground 1

Fig.1 Block diagram.

May 1992 3

9

power

ground 2

n.c.

6

MCD392

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

PINNING

SYMBOL PIN DESCRIPTION

SGND1 1 signal ground 1
V

I(1)

V

P

V

I(2)

2 voltage input 1
3 positive supply voltage

4 voltage input 2
SGND2 5 signal ground 2
n.c. 6 not connected
n.c. 7 not connected
OUT2+ 8 positive output 2
PGND2 9 power ground 2
OUT2− 10 negative output 2
OUT1− 11 negative output 1
PGND1 12 power ground 1
OUT1+ 13 positive output 1

handbook, halfpage

SGND1

V

I (1)

V

V

I (2)

SGND2

n.c.
n.c.

OUT2
PGND2
OUT2 –
OUT1 –
PGND1

P

+

1
2
3
4
5
6

TDA7057Q

7
8

9
10
11
12

OUT1 +

13

MCD391

Fig.2 Pin configuration.

May 1992 4

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

FUNCTIONAL DESCRIPTION

The TDA7057Q is a stereo output amplifier, designed for battery-fed applications e.g. portable radios, but also suitable
for mains fed applications. The gain is internally fixed at 40 dB.

For space reason there is a trend to decrease the number of battery cells. This means a decrease in supply voltage,
resulting in a reduction of output power at conventional output stages. The latter is not preferred. Using the BTL principle
increases the output power. The TDA7057Q can deliver an output power of 3 W in a speaker load of 16 Ω with 11 V
supply.

The circuit is designed such that no external components are required. Special attention is given to switch-on and off
clicks, low HF radiation and a good overall stability. The load can be short-circuited at all input conditions.

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

I

ORM

I

OSM

P

tot

T

stg

T

vj

T

sc

positive supply voltage range − 18 V
repetitive peak output current − 1A
non repetitive peak output current − 1.5 A
total power dissipation T

< 60 °C − 9W

case

storage temperature range −55 +150 °C
virtual junction temperature − +150 °C
short-circuit time see note 1 − 1hr

Note to the limiting values

1. The load can be short-circuited at all input conditions.

THERMAL RESISTANCE

SYMBOL PARAMETER THERMAL RESISTANCE

R
R

th j-a
th j-c

from junction to ambient in free air 45 K/W
from junction to case 8 K/W

Note to the thermal resistance

= 11 V; RL= 16 Ω; The maximum sine-wave dissipation is = 3 W; T

V

P

R

th vj-a

R

th c-HS

= R

+ R

+ R

th vj-c

th HS

th c-HS

= 30 − 8 = 22 K/W

+ R

th HS

amb (max)

= 60 °C; R

= (150 − 60)/3 = 30 K/W

th vj-a

May 1992 5

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

CHARACTERISTICS

= 11 V; f = 1 kHz; RL= 16 Ω; T

V

P

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
I

ORM

P

positive supply voltage range 3.0 11 18 V
repetitive peak output current −− 0.6 A

Operating position

I

P

P

O

total quiescent current RL= ∞; note 1 − 10 14 mA

output power THD = 10% 2.5 3 − W
THD total harmonic distortion P
G

V

V

no(rms)

V

no(rms)

voltage gain 39 40 41 dB

noise output voltage (RMS value) note 2 − 180 300 µV

noise output voltage (RMS value) note 3 − 60 −µV
B bandwidth − 20 Hz to 20 kHz −
SVRR supply voltage ripple rejection note 4 36 60 − dB

V

 DC output offset voltage RS= 5 kΩ−− 200 mV

off

Z
I

I

bias

input impedance − 100 − kΩ

input bias current − 100 300 nA

α channel separation R

 channel balance −− 1dB

G

V

= 25 °C; unless otherwise specified

amb

= 0.5 W − 0.25 1 %

O

= 5 kΩ 40 −−dB

S

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R

.

L

2. The noise output voltage (RMS value) is measured with RS= 5 kΩ unweighted (20 Hz to 20 kHz).

3. The noise output voltage RMS value) at f = 500 kHz is measured with RS= 0 Ω and bandwidth = 5 kHz.
With a practical load (RL= 16 Ω, L = 200 µH) the noise output current is only 50 nA.

4. The ripple rejection is measured with RS= 0 Ω and f = 100 Hz to 10 kHz.
The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail.

May 1992 6

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

APPLICATION INFORMATION

handbook, full pagewidth

input 1

input 2

(1)

100 nF

3

2

R

5 kΩ

s

1

Ι

220 µF

13I + i

11I – i

V

P

positive
output 1

negative
output 1

TDA7057Q

I – i

4

R

5 kΩ

s

5

ΙΙ

10

negative
output 2

7

n.c.

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 3.

12 9

Fig.3 Test and application diagram.

May 1992 7

n.c.

6

ground

8I + i

positive
output 2

MCD393

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

PACKAGE OUTLINE

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

non-concave

x

D

E

h

view B: mounting base side

d

B

j

A

SOT141-6

D

h

2

E

A

113

e

Z

DIMENSIONS (mm are the original dimensions)

UNIT A e

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT141-6

A2bpcD

17.0

4.6

4.2

0.75

0.60

15.5

1

e

(1)

0.48

24.0

23.6

20.0

19.6

0.38

IEC JEDEC EIAJ

w M

b

p

0 5 10 mm

(1)

deD

E

h

12.2

10 3.4

11.8

REFERENCES

scale

1

1.7

e

5.08

L

3

L

E

2

h

6

Q

c

m

LL3m

3.4

12.4

3.1

11.0

e

2

2.4

4.3

1.6

EUROPEAN

PROJECTION

2.1

1.8

v M

(1)

v

Qj

0.8

0.25w0.03

ISSUE DATE

92-11-17
95-03-11

Z

x

2.00

1.45

May 1992 8

Philips Semiconductors Objective specification

2 x 3 W stereo BTL audio output amplifier TDA7057Q

SOLDERING
Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

May 1992 9