Page 1
DATA SH EET
Product specification
File under Integrated Circuits, IC01
May 1992
INTEGRATED CIRCUITS
TDA7056
3 W mono BTL audio output
amplifier
Page 2
May 1992 2
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
FEATURES
• No external components
• No switch-on/off clicks
• Good overall stability
• Low power consumption
• Short circuit proof
• ESD protected on all pins.
GENERAL DESCRIPTION
The TDA7056 is a mono output amplifier contained in a
9 pin medium power package.
The device is designed for battery-fed portable mono
recorders, radios and television.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. SOT110-1; 1996 August 21.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
supply voltage 3 11 18 V
P
O
output power in 16 Ω VP = 11 V 2.5 3 − W
G
V
internal voltage gain 39 40.5 42 dB
I
P
total quiescent current VP = 11 V; − 57mA
R
L
= ∞
THD total harmonic distortion P
O
= 0.5 W − 0.25 1 %
EXTENDED
TYPE NUMBER
PACKAGE
PINS PIN POSITION MATERIAL CODE
TDA7056 9 SIL plastic SOT110
(1)
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May 1992 3
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
Fig.1 Block diagram.
PINNING
PIN DESCRIPTION
1 n.c.
2V
P
3 input (+)
4 signal ground
5 n.c.
6 output (+)
7 power ground
8 output (−)
9 n.c.
FUNCTIONAL DESCRIPTION
The TDA7056 is a mono output amplifier, designed for
battery-fed portable radios and mains-fed equipment such
as television. For space reasons there is a trend to
decrease the number of external components. For
portable applications there is also a trend to decrease the
number of battery cells, but still a reasonable output power
is required.
The TDA7056 fulfills both of these requirements. It needs
no peripheral components, because it makes use of the
Bridge-Tied-Load (BTL) principle. Consequently it has, at
the same supply voltage, a higher output power compared
to a conventional Single Ended output stage. It delivers an
output power of 1 W into a loudspeaker load of 8 Ω with 6
V supply or 3 W into 16 Ω loudspeaker at 11 V without
need of an external heatsink. The gain is internally fixed at
40 dB. Special attention is given to switch-on/off click
suppression, and it has a good overall stability. The load
can be short circuited at all input conditions.
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May 1992 4
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
Note
1. The load can be short-circuited at all input conditions.
THERMAL RESISTANCE
POWER DISSIPATION
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
supply voltage − 18 V
I
ORM
Peak output current repetitive − 1A
I
OSM
Peak output current non-repetitive − 1.5 A
T
stg
storage temperature range −55 150 °C
T
j
junction temperature − 150 °C
P
tot
total power dissipation T
case
< 60 °C − 9W
T
sc
short circuiting time see note 1 − 1hr
SYMBOL PARAMETER NOM. UNIT
R
th j-c
from junction to case 10 K/W
R
th j-a
from junction to ambient in free air 55 K/W
Assume: VP = 11 V; RL = 16 Ω.
The maximum sine-wave dissipation is 1.52 W.
The R
th j-a
of the package is 55 K/W.
T
amb
max = 150 − 55 × 1.52 = 66.4 °C.
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May 1992 5
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
CHARACTERISTICS
At T
amb
= 25 °C; f = 1 kHz; VP = 11 V; RL = 16 Ω (see Fig.2).
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R
L
.
2. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted (20 Hz to 20 kHz).
3. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
With a practical load (RL = 16 Ω, LL = 200 µH) the noise output current is only 50 nA.
4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz.
The ripple voltage (200 mV) is applied to the positive supply rail.
5. RS = 5 kΩ.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
operating supply voltage 3 11 18 V
I
ORM
repetitive peak output current −− 0.6 A
I
P
total quiescent current note 1 − 57mA
R
L
= ∞
P
O
output power THD = 10% 2.5 3 − W
THD total harmonic distortion P
O
= 0.5 W − 0.25 1 %
G
v
voltage gain 39 40.5 42 dB
V
no
noise output voltage note 2 − 180 300 µV
V
no
noise output voltage note 3 − 60 −µV
frequency response − 20 to 20.000 − Hz
RR ripple rejection note 4 36 50 − dB
∆V DC-output offset voltage note 5 −− 200 mV
|Z
i
| input impedance − 100 − kΩ
I
i
input bias current − 100 300 nA
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May 1992 6
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
Fig.2 Test and application diagram.
(1) This capacitor can be omitted if the supply electrolytic capacitor is placed closer to pin 2.
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May 1992 7
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
PACKAGE OUTLINE
UNIT
A
A
max.
2
A
3
b
1
D
1
b
2
bcD
(1)
E
(1)
Z
max.
(1)
eLPP
1
q1q
2
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
18.5
17.8
3.7
8.7
8.0
A
4
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
3.4
3.2
2.54
1.0
5.9
5.7
4.4
4.2
3.9
3.4
15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1
92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A
2
3
A
4
q
1
q
2
L
Q
w M
b
b
1
b
2
D
1
P
q
1
Z
e
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
Page 8
May 1992 8
Philips Semiconductors Product specification
3 W mono BTL audio output amplifier TDA7056
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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