Datasheet TDA7056AT-N2 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated Circuits, IC01

1998 Feb 23

INTEGRATED CIRCUITS

TDA7056AT

3 W mono BTL audio amplifier with
DC volume control

1998 Feb 23 2

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

FEATURES

• DC volume control

• Few external components

• Mute mode

• Thermal protection

• Short-circuit proof

• No switch-on or switch-off clicks

• Good overall stability

• Low power consumption

• Low HF radiation

• ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7056AT is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control. It is designed for use in
TVs and monitors, but is also suitable for battery-fed
portable recorders and radios. The device is contained in
a 20-lead small outline package.

A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for
Single-Ended (SE) headphone applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage 4.5 − 18 V

P

o

output power VP= 12 V; RL=16Ω 3 3.5 − W

G

v(max)

maximum total voltage gain VP= 12 V; RL=16Ω 34.5 35.5 36.5 dB

∆G

v

voltage gain control range 75 80 − dB

I

q(tot)

total quiescent current VP= 12 V; RL= ∞− 816mA

THD total harmonic distortion P

o

= 0.5 W − 0.3 1 %

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA7056AT SO20

plastic small outline package with 20 leads; body width 7.5 mm

SOT163-1

1998 Feb 23 3

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

positive input

15

MGM576

4

5

TDA7056AT

7

14

I + i

17I − i

STABILIZER

TEMPERATURE

PROTECTION

6

DC volume control

V

ref

+

+

−

+

−

positive output

negative output

power

ground

signal

ground

V

P

1 to 3, 8 to 13,
16, 18 to 20

n.c.

1998 Feb 23 4

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
n.c. 2 not connected
n.c. 3 not connected
V

P

4 positive supply voltage

V

I

5 positive input
GND1 6 signal ground
VC 7 DC volume control
n.c. 8 not connected
n.c. 9 not connected
n.c. 10 not connected
n.c. 11 not connected
n.c. 12 not connected
n.c. 13 not connected
OUT+ 14 positive output
GND2 15 power ground
n.c. 16 not connected
OUT− 17 negative output
n.c. 18 not connected
n.c. 19 not connected
n.c. 20 not connected

Fig.2 Pin configuration.

handbook, halfpage

n.c.
n.c.
n.c.

V

P

V

I

GND1

VC
n.c.
n.c.
n.c.

n.c.
n.c.
n.c.
OUT−

GND2
OUT+

n.c.

n.c.
n.c.
n.c.

1
2
3
4
5
6
7
8
9

10

11

12

20
19
18
17
16
15
14
13

TDA7056AT

MGM577

1998 Feb 23 5

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

FUNCTIONAL DESCRIPTION

The TDA7056AT is a mono BTL output amplifier with DC
volume control. It is designed for use in TVs and monitors
but is also suitable for battery-fed portable recorders and
radios.

In conventional DC volume circuits the control or input
stage is AC-coupled to the output stage via external
capacitors to keep the offset voltage low. In the
TDA7056AT the DC volume control stage is integrated into
the input stage so that no coupling capacitors are required.
With this configuration, a low offset voltage is still
maintained and the minimum supply voltage remains low.

The BTL principle offers the following advantages:

• Lower peak value of the supply current

• The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a reduced power supply with smaller
capacitors can be used which also results in cost
reductions. For portable applications there is a trend to
decrease the supply voltage, resulting in a reduction of
output power at conventional output stages. Using the BTL
principle increases the output power.

The maximum gain of the amplifier is fixed at 35.5 dB.
The DC volume control stage has a logarithmic control
characteristic.

The total gain can be controlled from +35.5 to −44 dB.
If the DC volume control voltage is below 0.3 V, the device

switches to the mute mode.
The amplifier is short-circuit proof to ground, V

P

and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.

Power dissipation

Assume V

P

= 12 V; RL=16Ω.

The maximum sine wave dissipation is 1.8 W.
The R

th vj-a

of the package is 60 K/W.

Therefore T

amb(max)

= 150 − 60 × 1.8=42°C.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage − 18 V

V

5, 7

input voltage pins 5 and 7 − 5V

I

ORM

repetitive peak output current − 1.25 A

I

OSM

non-repetitive peak output current − 1.5 A

P

tot

total power dissipation T

case

< 60 °C − 1.5 W

T

amb

operating ambient temperature −40 +85 °C

T

stg

storage temperature −55 +150 °C

T

vj

virtual junction temperature − 150 °C

t

sc

short-circuit time − 1h

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 60 K/W

1998 Feb 23 6

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

CHARACTERISTICS

V

P

= 12 V; VDC= 1.4 V; f = 1 kHz; RL=16Ω; T

amb

=25°C; unless otherwise specified (see Fig.14).

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R

L

.

2. The noise output voltage (V

n(o)(rms)

) at f = 500 kHz, is measured with Rs=0Ω and B = 5 kHz.

3. The ripple rejection is measured with Rs=0Ω and f = 100 Hz to 10 kHz. The ripple voltage (V

ripple

= 200 mV RMS)

is applied to the positive supply rail.

4. The noise output voltage (V

n(o)(rms)

) is measured with Rs=5kΩ unweighted.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage 4.5 − 18 V

I

q(tot)

total quiescent current RL= ∞; note 1 − 816mA

Maximum gain (V

7

= 1.4 V)

P

o

output power THD = 10%; RL=16Ω 3 3.5 − W

THD total harmonic distortion P

o

= 0.5 W − 0.3 1 %

G

v(max)

maximum total voltage gain 34.5 35.5 36.5 dB

V

i(rms)

input signal handling (RMS value) VVC= 0.8 V; THD < 1% 0.5 0.65 − V

V

n(o)(rms)

noise output voltage (RMS value) f = 500 kHz; note 2 − 210 −µV
B bandwidth at −1dB − 0.02 to 300 − kHz
SVRR supply voltage ripple rejection note 3 38 46 − dB
∆V

OS

 DC output offset voltage V17− v14−0 150 mV

Z

i

input impedance (pin 3) 15 20 25 kΩ

Minimum gain (V

7

= 0.5 V)

G

v

voltage gain −−44 − dB
V

o(n)(rms)

noise output voltage (RMS value) note 4 − 20 30 µV

Mute position

V

o(mute)

output voltage in mute position VVC≤ 0.3 V;

VI= 600 mV; note 4

− 35 45 µV

DC volume control

∆G

v

voltage gain control range 75 80 − dB
I

VC

control current VVC=0V 60 70 80 µA

1998 Feb 23 7

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

Fig.3 Quiescent current as a function of the

supply voltage.

V5= 1.4V; no load.

handbook, halfpage

20

0

4

MGM578

8

12

16

04 2081216

I

q

(mA)

VP (V)

Fig.4 THD as a function of output power.

VDC= 1.4 V.
(1) VP= 12 V; RL=16Ω.

handbook, halfpage

12

0

MGM579

Po (W)

THD

(%)

10

−1

110

2

4

6

10

8

(1)

Fig.5 THD as a function of frequency.

VP= 12 V, Po= 0.5 W, VDC= 1.4 V.
(1) RL=16Ω.

handbook, halfpage

0

2

4

6

8

MGM580

10 10

2

10

3

10

4

10

5

f (Hz)

THD

(%)

(1)

Fig.6 Ripple rejection as a function of frequency.

VP= 12 V; RL=16Ω; Vr= 200 mV.
(1) V7= 0.3 V; Rs=5kΩ.
(2) V7= 1.4 V; Rs=0Ω.
(3) V7= 1.4 V; Rs=5kΩ.

handbook, halfpage

0

100

20

40

60

80

MGM581

10 10

2

10

3

10

4

10

5

f (Hz)

RR

(dB)

(2)

(3)

(1)

1998 Feb 23 8

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

Fig.7 Gain control as a function of DC volume

control.

handbook, halfpage

MGM582

40

−80

20

−20

−40

0

0 1.2 2.00.4 1.60.8

V7 (V)

gain
(dB)

−60

Fig.8 Noise output voltage as a function of DC

volume control.

Measured with Rs=5kΩ unweighted; f = 22 Hz to 22 kHz.

handbook, halfpage

1000

0

800

400

200

600

0 1.2 2.0

MGM583

0.4 1.60.8

V

n

(µV)

V7 (V)

Fig.9 Input signal handling as a function of the

supply voltage.

T

amb

=25°C; THD = 1%; RL=16Ω; VDC= 0.8 V.

handbook, halfpage

1000

0

200

MGM584

400

600

800

04 2081216

V

i

(mV)

VP (V)

Fig.10 Output power as a function of the supply

voltage.

Measured at THD = 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.

(1) R

L

=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

handbook, halfpage

5

0

1

MGM585

2

3

4

04 2081216

P

o

(W)

VP (V)

(1) (2) (3)

1998 Feb 23 9

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

Fig.11 Total worst case power dissipation as a

function of supply voltage.

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

handbook, halfpage

0

3

2

1

0

420

MGM586

81216

P

(W)

VP (V)

(1) (3)(2)

Fig.12 Control current as a function of DC volume

control.

handbook, halfpage

0 1.2 2.0

100

−20

MGM587

60

20

−60

−100

0.4 1.60.8
V7 (V)

I

5

(µA)

1998 Feb 23 10

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

Fig.13 Printed-circuit board layout.

handbook, full pagewidth

MGM591

+V

P

−OUT

volume

+OUT

1

20

TDA7056A/BT

5 kΩ

220 µF

0.47 µF

100 nF

100

nF

IN

GND

D&A AUDIO POWER

CIC NIJMEGEN

b. Top view of component side.

a. Top view of bottom copper.

1998 Feb 23 11

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

TEST AND APPLICATION INFORMATION
Test conditions

T

amb

=25°C if not specified: VP= 12 V; VDC= 1.4 V;

f = 1 kHz; RL=16Ω; audio bandpass: 22 Hz to 22 kHz.
In Figures 5 and 6 a low-pass filter of 80 kHz was applied.

It should be noted that capacitive loads (100 pF and 5 nF)
connected between the output pins to a common ground
can cause oscillations. The BTL application circuit diagram
is shown in Fig.14. To avoid instabilities and too high
distortion, the input and power ground traces must be
separated as far as possible and connected together as
close as possible to the IC. The quiescent current has
been measured without load impedance.

Voltage gain

The maximum closed-loop voltage gain has been
internally fixed at 35.5 dB. The input sensitivity at
maximum gain for P

o

= 3 W (RL=16Ω) is 115 mV.

The gain bandwidth is 20 Hz to 300 kHz within 1 dB.

Output power

The output power as a function of supply voltage has been
measured at THD = 10%. The maximum output power is
limited by the maximum allowed power dissipation at
T

amb

=25°C approximately 2 W, and the maximum

available output current is 1.25 A repetitive peak current.

Switch-on/switch-off

The switch-on behaviour depends on the following:

• The rise time of the power supply (if t

r

> 40 ms for
VP= 0 to 12 V then the switch-on behaviour will be
good)

• The input capacitor and source impedance (a higher
source impedance and/or lower input capacitor value
will have a positive influence on the switch-on/switch-off
behaviour)

• The DC volume control pin (a capacitor of >0.1 µF
avoids disturbances).

Thermal behaviour:

The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductors manufacturers because the
application boards and test methods are not (yet)
standardized. The thermal performance of packages for a
specific application may also be different than presented
here, because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.

Using a practical PCB layout with wider copper tracks and
some copper area to the IC pins and just under the IC, the
thermal resistance from junction to ambient can be
reduced. In the demonstration application PCB the
R

th(j-a)

= 56 K/W for the SO20 plastic package. For a

maximum ambient temperature of T

amb

=50°C the

following calculation can be made for the maximum power
dissipation:

For the application at V

P

= 12 V and RL=16Ω the worst
case sine wave dissipation is 1.85 W. Because in practice
the ‘music-power’ causes about the half of the sine wave
dissipation, this application (V

P

= 12 V; RL=16Ω) has

been allowed.

Short-circuit protection:

The output pins (pins 14 and 17) can be short-circuited to
ground respectively to +V

P

. The Missing Current Limiter
(MCL) protection circuit will shut-off the amplifier.
Removing the short-circuit will reset the amplifier
automatically. Short-circuit across the load
(pins 14 and 17) will activate the thermal protection circuit;
this will result in reducing the short-circuit current.

150 K/W 50 K/W–()

56 K/W

-------------------------------------------------------

1.79 W=

1998 Feb 23 12

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.

Fig.14 Test and application diagram.

To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.

handbook, full pagewidth

positive input

MGM588

5

kΩ

0.47 µF

100 nF

220 µF

RL = 16 Ω

(1)

ground

DC
volume
control

R

s

V

P

15

4

5

TDA7056AT

7

14

I + i

17I − i

STABILIZER

TEMPERATURE

PROTECTION

6

V

ref

+

+

−

+

−

1 to 3, 8 to 13,
16, 18 to 20

n.c.

1998 Feb 23 13

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

Fig.15 Application with potentiometer as volume

control; maximum gain = 30 dB.

handbook, halfpage

MGM589

7

100 kΩ

1 µF

GND

volume

control

TDA7056AT

Fig.16 Application with potentiometer as volume

control; maximum gain = 36 dB.

handbook, halfpage

MGM590

7 TDA7056AT

22 kΩ

82 kΩ

1 µF

GND

VP = 12 V

volume

control

1998 Feb 23 14

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

PACKAGE OUTLINE

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

1998 Feb 23 15

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Feb 23 16

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1998 Feb 23 17

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

NOTES

1998 Feb 23 18

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

NOTES

1998 Feb 23 19

Philips Semiconductors Product specification

3 W mono BTL audio amplifier with DC
volume control

TDA7056AT

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 545102/25/01/pp20 Date of release: 1998Feb 23 Document order number: 9397 75003253