3 W mono BTL audio amplifier with
DC volume control
Product specification
File under Integrated Circuits, IC01
1998 Feb 23
Page 2
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
TDA7056AT
volume control
FEATURES
• DC volume control
• Few external components
• Mute mode
• Thermal protection
• Short-circuit proof
• No switch-on or switch-off clicks
• Good overall stability
• Low power consumption
• Low HF radiation
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
G
∆G
I
q(tot)
P
o
v(max)
v
supply voltage4.5−18V
output powerVP= 12 V; RL=16Ω33.5−W
maximum total voltage gainVP= 12 V; RL=16Ω34.535.536.5dB
voltage gain control range7580−dB
total quiescent currentVP= 12 V; RL= ∞− 816mA
THDtotal harmonic distortionP
GENERAL DESCRIPTION
The TDA7056AT is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control. It is designed for use in
TVs and monitors, but is also suitable for battery-fed
portable recorders and radios. The device is contained in
a 20-lead small outline package.
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for
Single-Ended (SE) headphone applications.
= 0.5 W−0.31%
o
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
TDA7056ATSO20
PACKAGE
plastic small outline package with 20 leads; body width 7.5 mm
SOT163-1
1998 Feb 232
Page 3
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
BLOCK DIAGRAM
handbook, full pagewidth
positive input
DC volume control
5
7
n.c.
1 to 3, 8 to 13,
16, 18 to 20
TDA7056AT
+
V
STABILIZER
ref
+
−
TEMPERATURE
PROTECTION
V
P
4
I + i
TDA7056AT
+
14
17I − i
positive output
−
negative output
ground
Fig.1 Block diagram.
signal
power
ground
15
MGM576
6
1998 Feb 233
Page 4
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
PINNING
SYMBOLPINDESCRIPTION
n.c.1not connected
n.c.2not connected
n.c.3not connected
V
3 W mono BTL audio amplifier with DC
volume control
FUNCTIONAL DESCRIPTION
The TDA7056AT is a mono BTL output amplifier with DC
volume control. It is designed for use in TVs and monitors
but is also suitable for battery-fed portable recorders and
radios.
In conventional DC volume circuits the control or input
stage is AC-coupled to the output stage via external
capacitors to keep the offset voltage low. In the
TDA7056AT the DC volume control stage is integrated into
the input stage so that no coupling capacitors are required.
With this configuration, a low offset voltage is still
maintained and the minimum supply voltage remains low.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a reduced power supply with smaller
capacitors can be used which also results in cost
reductions. For portable applications there is a trend to
decrease the supply voltage, resulting in a reduction of
output power at conventional output stages. Using the BTL
principle increases the output power.
TDA7056AT
The maximum gain of the amplifier is fixed at 35.5 dB.
The DC volume control stage has a logarithmic control
characteristic.
The total gain can be controlled from +35.5 to −44 dB.
If the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
The amplifier is short-circuit proof to ground, V
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
Power dissipation
Assume V
= 12 V; RL=16Ω.
P
The maximum sine wave dissipation is 1.8 W.
The R
Therefore T
of the package is 60 K/W.
th vj-a
amb(max)
= 150 − 60 × 1.8=42°C.
and
P
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
P
V
5, 7
I
ORM
I
OSM
P
tot
T
amb
T
stg
T
vj
t
sc
supply voltage−18V
input voltage pins 5 and 7−5V
repetitive peak output current−1.25A
non-repetitive peak output current−1.5A
total power dissipationT
thermal resistance from junction to ambientin free air60K/W
1998 Feb 235
Page 6
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
TDA7056AT
volume control
CHARACTERISTICS
V
= 12 V; VDC= 1.4 V; f = 1 kHz; RL=16Ω; T
P
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply
V
P
I
q(tot)
Maximum gain (V
P
o
supply voltage4.5−18V
total quiescent currentRL= ∞; note 1−816mA
= 1.4 V)
7
output powerTHD = 10%; RL=16Ω33.5−W
THDtotal harmonic distortionP
G
v(max)
V
i(rms)
V
n(o)(rms)
maximum total voltage gain34.535.536.5dB
input signal handling (RMS value)VVC= 0.8 V; THD < 1%0.50.65−V
noise output voltage (RMS value)f = 500 kHz; note 2−210−µV
Bbandwidthat −1dB−0.02 to 300−kHz
SVRRsupply voltage ripple rejectionnote 33846−dB
∆V
DC output offset voltageV17− v14−0150mV
OS
Z
i
Minimum gain (V
G
v
V
o(n)(rms)
input impedance (pin 3)152025kΩ
= 0.5 V)
7
voltage gain−−44−dB
noise output voltage (RMS value)note 4−2030µV
Mute position
V
o(mute)
output voltage in mute positionVVC≤ 0.3 V;
=25°C; unless otherwise specified (see Fig.14).
amb
= 0.5 W−0.31%
o
−3545µV
VI= 600 mV; note 4
DC volume control
∆G
I
VC
v
voltage gain control range7580−dB
control currentVVC=0V607080µA
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R
2. The noise output voltage (V
) at f = 500 kHz, is measured with Rs=0Ω and B = 5 kHz.
n(o)(rms)
3. The ripple rejection is measured with Rs=0Ω and f = 100 Hz to 10 kHz. The ripple voltage (V
.
L
= 200 mV RMS)
ripple
is applied to the positive supply rail.
4. The noise output voltage (V
) is measured with Rs=5kΩ unweighted.
n(o)(rms)
1998 Feb 236
Page 7
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
Fig.6 Ripple rejection as a function of frequency.
Page 8
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
40
handbook, halfpage
gain
(dB)
20
0
−20
−40
−60
−80
01.22.00.41.60.8
MGM582
V7 (V)
1000
handbook, halfpage
V
n
(µV)
800
600
400
200
0
01.22.0
TDA7056AT
MGM583
0.41.60.8
V7 (V)
Fig.7Gain control as a function of DC volume
control.
1000
handbook, halfpage
V
i
(mV)
800
600
400
200
0
042081216
T
=25°C; THD = 1%; RL=16Ω; VDC= 0.8 V.
amb
MGM584
VP (V)
Measured with Rs=5kΩ unweighted; f = 22 Hz to 22 kHz.
Fig.8Noise output voltage as a function of DC
volume control.
handbook, halfpage
5
P
o
(W)
4
3
2
1
0
042081216
Measured at THD = 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
=8Ω.
(1) R
L
(2) RL=16Ω.
(3) RL=25Ω.
(1) (2) (3)
MGM585
VP (V)
Fig.9Input signal handling as a function of the
supply voltage.
1998 Feb 238
Fig.10 Output power as a function of the supply
voltage.
Page 9
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
handbook, halfpage
3
P
(W)
2
1
0
0
(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.
(1)(3)(2)
420
81216
MGM586
VP (V)
100
handbook, halfpage
I
5
(µA)
60
20
−20
−60
−100
01.22.0
TDA7056AT
MGM587
0.41.60.8
V7 (V)
Fig.11 Total worst case power dissipation as a
function of supply voltage.
Fig.12 Control current as a function of DC volume
control.
1998 Feb 239
Page 10
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
handbook, full pagewidth
TDA7056AT
a. Top view of bottom copper.
−OUT
+OUT
GND
20
TDA7056A/BT
220 µF
100 nF
+V
P
0.47 µF
1
D&A AUDIO POWER
CIC NIJMEGEN
b. Top view of component side.
5 kΩ
100
nF
volume
IN
MGM591
Fig.13 Printed-circuit board layout.
1998 Feb 2310
Page 11
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
TEST AND APPLICATION INFORMATION
Test conditions
T
=25°C if not specified: VP= 12 V; VDC= 1.4 V;
amb
f = 1 kHz; RL=16Ω; audio bandpass: 22 Hz to 22 kHz.
In Figures 5 and 6 a low-pass filter of 80 kHz was applied.
It should be noted that capacitive loads (100 pF and 5 nF)
connected between the output pins to a common ground
can cause oscillations. The BTL application circuit diagram
is shown in Fig.14. To avoid instabilities and too high
distortion, the input and power ground traces must be
separated as far as possible and connected together as
close as possible to the IC. The quiescent current has
been measured without load impedance.
Voltage gain
The maximum closed-loop voltage gain has been
internally fixed at 35.5 dB. The input sensitivity at
maximum gain for P
The gain bandwidth is 20 Hz to 300 kHz within 1 dB.
Output power
The output power as a function of supply voltage has been
measured at THD = 10%. The maximum output power is
limited by the maximum allowed power dissipation at
T
=25°C approximately 2 W, and the maximum
amb
available output current is 1.25 A repetitive peak current.
= 3 W (RL=16Ω) is 115 mV.
o
TDA7056AT
Thermal behaviour:
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductors manufacturers because the
application boards and test methods are not (yet)
standardized. The thermal performance of packages for a
specific application may also be different than presented
here, because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.
Using a practical PCB layout with wider copper tracks and
some copper area to the IC pins and just under the IC, the
thermal resistance from junction to ambient can be
reduced. In the demonstration application PCB the
= 56 K/W for the SO20 plastic package. For a
R
th(j-a)
maximum ambient temperature of T
following calculation can be made for the maximum power
case sine wave dissipation is 1.85 W. Because in practice
the ‘music-power’ causes about the half of the sine wave
dissipation, this application (V
= 12 V; RL=16Ω) has
P
been allowed.
=50°C the
amb
1.79 W=
Switch-on/switch-off
The switch-on behaviour depends on the following:
• The rise time of the power supply (if t
> 40 ms for
r
VP= 0 to 12 V then the switch-on behaviour will be
good)
• The input capacitor and source impedance (a higher
source impedance and/or lower input capacitor value
will have a positive influence on the switch-on/switch-off
behaviour)
• The DC volume control pin (a capacitor of >0.1 µF
avoids disturbances).
1998 Feb 2311
Short-circuit protection:
The output pins (pins 14 and 17) can be short-circuited to
ground respectively to +V
. The Missing Current Limiter
P
(MCL) protection circuit will shut-off the amplifier.
Removing the short-circuit will reset the amplifier
automatically. Short-circuit across the load
(pins 14 and 17) will activate the thermal protection circuit;
this will result in reducing the short-circuit current.
Page 12
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
handbook, full pagewidth
n.c.
1 to 3, 8 to 13,
16, 18 to 20
positive input
0.47 µF
5
R
s
kΩ
DC
volume
control
5
7
TDA7056AT
+
V
STABILIZER
ref
+
−
TEMPERATURE
PROTECTION
4
I + i
TDA7056AT
V
(1)
100 nF
6
15
220 µF
+
14
−
17I − i
P
RL = 16 Ω
MGM588
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.
Fig.14 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1998 Feb 2312
Page 13
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
handbook, halfpage
volume
1 µF
control
100 kΩ
7
TDA7056AT
GND
MGM589
handbook, halfpage
1 µF
volume
control
TDA7056AT
VP = 12 V
82 kΩ
7TDA7056AT
22 kΩ
GND
MGM590
Fig.15 Application with potentiometer as volume
control; maximum gain = 30 dB.
Fig.16 Application with potentiometer as volume
control; maximum gain = 36 dB.
1998 Feb 2313
Page 14
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TDA7056AT
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
p
cD
0.32
0.23
0.013
0.009
3
0.49
0.36
0.019
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1)(1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
1.1
1.0
0.043
0.039
(A )
L
p
L
0.25
0.01
A
3
θ
0.250.1
0.01
ywvθ
Z
0.9
0.4
0.035
0.004
0.016
o
8
o
0
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
1998 Feb 2314
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 15
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
(order code 9398 652 90011).
TDA7056AT
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1998 Feb 2315
Page 16
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
TDA7056AT
volume control
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Feb 2316
Page 17
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
NOTES
TDA7056AT
1998 Feb 2317
Page 18
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
NOTES
TDA7056AT
1998 Feb 2318
Page 19
Philips SemiconductorsProduct specification
3 W mono BTL audio amplifier with DC
volume control
NOTES
TDA7056AT
1998 Feb 2319
Page 20
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands545102/25/01/pp20 Date of release: 1998Feb 23Document order number: 9397 75003253
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