Datasheet TDA7056AT Specification

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA7056AT
3 W mono BTL audio amplifier with DC volume control
Product specification File under Integrated Circuits, IC01
1998 Feb 23
Page 2
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC
TDA7056AT
volume control

FEATURES

DC volume control
Few external components
Mute mode
Thermal protection
Short-circuit proof
No switch-on or switch-off clicks
Good overall stability
Low power consumption
Low HF radiation
ESD protected on all pins.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V P G G I
q(tot)
P o
v(max)
v
supply voltage 4.5 18 V output power VP= 12 V; RL=16 3 3.5 W maximum total voltage gain VP= 12 V; RL=16 34.5 35.5 36.5 dB voltage gain control range 75 80 dB total quiescent current VP= 12 V; RL= ∞− 816mA
THD total harmonic distortion P

GENERAL DESCRIPTION

The TDA7056AT is a mono Bridge-Tied Load (BTL) output amplifier with DC volume control. It is designed for use in TVs and monitors, but is also suitable for battery-fed portable recorders and radios. The device is contained in a 20-lead small outline package.
A Missing Current Limiter (MCL) is built in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (300 mA typ.). This level of 100 mA allows for Single-Ended (SE) headphone applications.
= 0.5 W 0.3 1 %
o

ORDERING INFORMATION

TYPE
NUMBER
NAME DESCRIPTION VERSION
TDA7056AT SO20
PACKAGE
plastic small outline package with 20 leads; body width 7.5 mm
SOT163-1
Page 3
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control

BLOCK DIAGRAM

handbook, full pagewidth
positive input
DC volume control
5
7
n.c.
1 to 3, 8 to 13, 16, 18 to 20
TDA7056AT
+
V
STABILIZER
ref
+
TEMPERATURE
PROTECTION
V
P
4
I + i
TDA7056AT
+
14
17I i
positive output
negative output
ground
Fig.1 Block diagram.
signal
power
ground
15
MGM576
6
Page 4
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control

PINNING

SYMBOL PIN DESCRIPTION
n.c. 1 not connected n.c. 2 not connected n.c. 3 not connected V
P
V
I
GND1 6 signal ground VC 7 DC volume control n.c. 8 not connected n.c. 9 not connected n.c. 10 not connected n.c. 11 not connected n.c. 12 not connected n.c. 13 not connected OUT+ 14 positive output GND2 15 power ground n.c. 16 not connected OUT 17 negative output n.c. 18 not connected n.c. 19 not connected n.c. 20 not connected
4 positive supply voltage 5 positive input
handbook, halfpage
n.c.
1
n.c.
2
n.c.
3
V
4
P
V
5
I
VC n.c. n.c. n.c.
TDA7056AT
6 7 8 9
10
MGM577
GND1
Fig.2 Pin configuration.
TDA7056AT
n.c.
20 19
n.c.
18
n.c.
17
OUT
16
n.c. GND2
15
OUT+
14
n.c.
13
n.c.
12
n.c.
11
Page 5
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control

FUNCTIONAL DESCRIPTION

The TDA7056AT is a mono BTL output amplifier with DC volume control. It is designed for use in TVs and monitors but is also suitable for battery-fed portable recorders and radios.
In conventional DC volume circuits the control or input stage is AC-coupled to the output stage via external capacitors to keep the offset voltage low. In the TDA7056AT the DC volume control stage is integrated into the input stage so that no coupling capacitors are required. With this configuration, a low offset voltage is still maintained and the minimum supply voltage remains low.
The BTL principle offers the following advantages:
Lower peak value of the supply current
The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a reduced power supply with smaller capacitors can be used which also results in cost reductions. For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power.
TDA7056AT
The maximum gain of the amplifier is fixed at 35.5 dB. The DC volume control stage has a logarithmic control characteristic.
The total gain can be controlled from +35.5 to 44 dB. If the DC volume control voltage is below 0.3 V, the device
switches to the mute mode. The amplifier is short-circuit proof to ground, V
across the load. A thermal protection circuit is also implemented. If the crystal temperature rises above +150 °C the gain will be reduced, thereby reducing the output power. Special attention is given to switch-on and switch-off clicks, low HF radiation and a good overall stability.

Power dissipation

Assume V
= 12 V; RL=16Ω.
P
The maximum sine wave dissipation is 1.8 W. The R
Therefore T
of the package is 60 K/W.
th vj-a
amb(max)
= 150 60 × 1.8=42°C.
and
P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
V
5, 7
I
ORM
I
OSM
P
tot
T
amb
T
stg
T
vj
t
sc
supply voltage 18 V input voltage pins 5 and 7 5V repetitive peak output current 1.25 A non-repetitive peak output current 1.5 A total power dissipation T
< 60 °C 1.5 W
case
operating ambient temperature 40 +85 °C storage temperature 55 +150 °C virtual junction temperature 150 °C short-circuit time 1h

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 60 K/W
Page 6
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC
TDA7056AT
volume control

CHARACTERISTICS

V
= 12 V; VDC= 1.4 V; f = 1 kHz; RL=16Ω; T
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
I
q(tot)
Maximum gain (V
P
o
supply voltage 4.5 18 V total quiescent current RL= ; note 1 816mA
= 1.4 V)
7
output power THD = 10%; RL=16 3 3.5 W THD total harmonic distortion P G
v(max)
V
i(rms)
V
n(o)(rms)
maximum total voltage gain 34.5 35.5 36.5 dB
input signal handling (RMS value) VVC= 0.8 V; THD < 1% 0.5 0.65 V
noise output voltage (RMS value) f = 500 kHz; note 2 210 −µV B bandwidth at 1dB 0.02 to 300 kHz SVRR supply voltage ripple rejection note 3 38 46 dB
∆V
DC output offset voltage V17− v14−0 150 mV
OS
Z
i
Minimum gain (V
G
v
V
o(n)(rms)
input impedance (pin 3) 15 20 25 k
= 0.5 V)
7
voltage gain −−44 dB
noise output voltage (RMS value) note 4 20 30 µV
Mute position
V
o(mute)
output voltage in mute position VVC≤ 0.3 V;
=25°C; unless otherwise specified (see Fig.14).
amb
= 0.5 W 0.3 1 %
o
35 45 µV
VI= 600 mV; note 4
DC volume control
G I
VC
v
voltage gain control range 75 80 dB
control current VVC=0V 60 70 80 µA
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by R
2. The noise output voltage (V
) at f = 500 kHz, is measured with Rs=0Ω and B = 5 kHz.
n(o)(rms)
3. The ripple rejection is measured with Rs=0Ω and f = 100 Hz to 10 kHz. The ripple voltage (V
.
L
= 200 mV RMS)
ripple
is applied to the positive supply rail.
4. The noise output voltage (V
) is measured with Rs=5kΩ unweighted.
n(o)(rms)
Page 7
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
20
handbook, halfpage
I
q
(mA)
16
12
8
4
0
04 2081216
MGM578
VP (V)
12
handbook, halfpage
THD
(%)
10
8
6
4
2
0
1
10
TDA7056AT
MGM579
(1)
110
Po (W)
V5= 1.4V; no load.
Fig.3 Quiescent current as a function of the
supply voltage.
handbook, halfpage
8
THD
(%)
6
4
2
0
10 10
(1)
2
3
10
4
10
MGM580
f (Hz)
VDC= 1.4 V. (1) VP= 12 V; RL=16Ω.
Fig.4 THD as a function of output power.
100
handbook, halfpage
RR
(dB)
80
60
40
20
5
10
0
10 10
2
3
10
MGM581
(1)
(2)
(3)
4
10
f (Hz)
5
10
VP= 12 V, Po= 0.5 W, VDC= 1.4 V. (1) RL=16Ω.
Fig.5 THD as a function of frequency.
VP= 12 V; RL=16Ω; Vr= 200 mV. (1) V7= 0.3 V; Rs=5kΩ. (2) V7= 1.4 V; Rs=0Ω. (3) V7= 1.4 V; Rs=5kΩ.
Fig.6 Ripple rejection as a function of frequency.
Page 8
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
40
handbook, halfpage
gain (dB)
20
0
20
40
60
80
0 1.2 2.00.4 1.60.8
MGM582
V7 (V)
1000
handbook, halfpage
V
n
(µV)
800
600
400
200
0
0 1.2 2.0
TDA7056AT
MGM583
0.4 1.60.8 V7 (V)
Fig.7 Gain control as a function of DC volume
control.
1000
handbook, halfpage
V
i
(mV)
800
600
400
200
0
04 2081216
T
=25°C; THD = 1%; RL=16Ω; VDC= 0.8 V.
amb
MGM584
VP (V)
Measured with Rs=5kΩ unweighted; f = 22 Hz to 22 kHz.
Fig.8 Noise output voltage as a function of DC
volume control.
handbook, halfpage
5
P
o
(W)
4
3
2
1
0
04 2081216
Measured at THD = 10%. The maximum output power is limited by the maximum power dissipation and the maximum available output current.
=8Ω.
(1) R
L
(2) RL=16Ω. (3) RL=25Ω.
(1) (2) (3)
MGM585
VP (V)
Fig.9 Input signal handling as a function of the
supply voltage.
Fig.10 Output power as a function of the supply
voltage.
Page 9
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
handbook, halfpage
3
P
(W)
2
1
0
0
(1) RL=8Ω. (2) RL=16Ω. (3) RL=25Ω.
(1) (3)(2)
420
81216
MGM586
VP (V)
100
handbook, halfpage
I
5
(µA)
60
20
20
60
100
0 1.2 2.0
TDA7056AT
MGM587
0.4 1.60.8 V7 (V)
Fig.11 Total worst case power dissipation as a
function of supply voltage.
Fig.12 Control current as a function of DC volume
control.
Page 10
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
handbook, full pagewidth
TDA7056AT
a. Top view of bottom copper.
OUT
+OUT
GND
20
TDA7056A/BT
220 µF
100 nF
+V
P
0.47 µF
1
D&A AUDIO POWER
CIC NIJMEGEN
b. Top view of component side.
5 k
100
nF
volume
IN
MGM591
Fig.13 Printed-circuit board layout.
1998 Feb 23 10
Page 11
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
TEST AND APPLICATION INFORMATION Test conditions
T
=25°C if not specified: VP= 12 V; VDC= 1.4 V;
amb
f = 1 kHz; RL=16Ω; audio bandpass: 22 Hz to 22 kHz. In Figures 5 and 6 a low-pass filter of 80 kHz was applied.
It should be noted that capacitive loads (100 pF and 5 nF) connected between the output pins to a common ground can cause oscillations. The BTL application circuit diagram is shown in Fig.14. To avoid instabilities and too high distortion, the input and power ground traces must be separated as far as possible and connected together as close as possible to the IC. The quiescent current has been measured without load impedance.

Voltage gain

The maximum closed-loop voltage gain has been internally fixed at 35.5 dB. The input sensitivity at maximum gain for P The gain bandwidth is 20 Hz to 300 kHz within 1 dB.

Output power

The output power as a function of supply voltage has been measured at THD = 10%. The maximum output power is limited by the maximum allowed power dissipation at T
=25°C approximately 2 W, and the maximum
amb
available output current is 1.25 A repetitive peak current.
= 3 W (RL=16Ω) is 115 mV.
o
TDA7056AT

Thermal behaviour:

The measured thermal resistance of the IC package is highly dependent on the configuration and size of the application board. Data may not be comparable between different semiconductors manufacturers because the application boards and test methods are not (yet) standardized. The thermal performance of packages for a specific application may also be different than presented here, because the configuration of the application boards (copper area) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating. The measurements have been carried out with vertical placed boards.
Using a practical PCB layout with wider copper tracks and some copper area to the IC pins and just under the IC, the thermal resistance from junction to ambient can be reduced. In the demonstration application PCB the
= 56 K/W for the SO20 plastic package. For a
R
th(j-a)
maximum ambient temperature of T following calculation can be made for the maximum power
dissipation:
For the application at V
150 K/W 50 K/W()
------------------------------------------------------­56 K/W
= 12 V and RL=16Ω the worst
P
case sine wave dissipation is 1.85 W. Because in practice the ‘music-power’ causes about the half of the sine wave dissipation, this application (V
= 12 V; RL=16Ω) has
P
been allowed.
=50°C the
amb
1.79 W=

Switch-on/switch-off

The switch-on behaviour depends on the following:
The rise time of the power supply (if t
> 40 ms for
r
VP= 0 to 12 V then the switch-on behaviour will be good)
The input capacitor and source impedance (a higher source impedance and/or lower input capacitor value will have a positive influence on the switch-on/switch-off behaviour)
The DC volume control pin (a capacitor of >0.1 µF avoids disturbances).
1998 Feb 23 11

Short-circuit protection:

The output pins (pins 14 and 17) can be short-circuited to ground respectively to +V
. The Missing Current Limiter
P
(MCL) protection circuit will shut-off the amplifier. Removing the short-circuit will reset the amplifier automatically. Short-circuit across the load (pins 14 and 17) will activate the thermal protection circuit; this will result in reducing the short-circuit current.
Page 12
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
handbook, full pagewidth
n.c.
1 to 3, 8 to 13, 16, 18 to 20
positive input
0.47 µF
5
R
s
k
DC volume control
5
7
TDA7056AT
+
V
STABILIZER
ref
+
TEMPERATURE
PROTECTION
4
I + i
TDA7056AT
V
(1)
100 nF
6
15
220 µF
+
14
17I i
P
RL = 16
MGM588
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as possible to the IC.
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.
Fig.14 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit protection (MLC) will be activated.
1998 Feb 23 12
Page 13
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
handbook, halfpage
volume
1 µF
control
100 k
7
TDA7056AT
GND
MGM589
handbook, halfpage
1 µF
volume
control
TDA7056AT
VP = 12 V
82 k
7 TDA7056AT
22 k
GND
MGM590
Fig.15 Application with potentiometer as volume
control; maximum gain = 30 dB.
Fig.16 Application with potentiometer as volume
control; maximum gain = 36 dB.
1998 Feb 23 13
Page 14
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control

PACKAGE OUTLINE

SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TDA7056AT

SOT163-1

E
H
E
A
X
v M
A
pin 1 index
1
e
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
p
cD
0.32
0.23
0.013
0.009
3
0.49
0.36
0.019
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1) (1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
1.1
1.0
0.043
0.039
(A )
L
p
L
0.25
0.01
A
3
θ
0.25 0.1
0.01
ywv θ
Z
0.9
0.4
0.035
0.004
0.016
o
8
o
0
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
1998 Feb 23 14
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24 97-05-22
Page 15
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
(order code 9398 652 90011).
TDA7056AT
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1998 Feb 23 15
Page 16
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC
TDA7056AT
volume control

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Feb 23 16
Page 17
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
NOTES
TDA7056AT
1998 Feb 23 17
Page 18
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
NOTES
TDA7056AT
1998 Feb 23 18
Page 19
Philips Semiconductors Product specification
3 W mono BTL audio amplifier with DC volume control
NOTES
TDA7056AT
1998 Feb 23 19
Page 20
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South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998 SCA57 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 545102/25/01/pp20 Date of release: 1998Feb 23 Document order number: 9397 75003253
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