Datasheet TDA7053A-N2 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1995 Nov 09
File under Integrated Circuits, IC01

1997 Jul 15

INTEGRATED CIRCUITS

TDA7053A

Stereo BTL audio output amplifier
with DC volume control

1997 Jul 15 2

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

FEATURES

• DC volume control

• Few external components

• Mute mode

• Thermal protection

• Short-circuit proof

• No switch-on and switch-off clicks

• Good overall stability

• Low power consumption

• Low HF radiation

• ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7053A (2 × 1 W) and TDA7053AT (2 × 0.5 W) are
stereo BTL output amplifiers with DC volume control.
The devices are designed for use in TV and monitors, but
are also suitable for battery-fed portable recorders and
radios.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(typical 300 mA). This level of 100 mA allows for
headphone applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage 4.5 − 18 V

P

out

output power VP=6V

TDA7053A R

L

=8Ω 0.85 1.0 − W

TDA7053AT R

L

=16Ω 0.5 0.55 − W

G

v

voltage gain 39.5 40.5 41.5 dB

G

C

gain control 68.0 73.5 − dB

I

q(tot)

total quiescent current VP=6V; RL=∞−22 25 mA

THD total harmonic distortion

TDA7053A P

out

= 0.5 W − 0.3 1 %

TDA7053AT P

out

= 0.25 W − 0.3 1 %

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA7053A DIP16

plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

TDA7053AT SO16

plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

1997 Jul 15 3

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

BLOCK DIAGRAM

Fig.1 Block diagram.

MSA717 - 2

I i

I i

Ι

STABILIZER

TEMPERATURE

PROTECTION

V

ref

13

2

4

16

I i

I i

ΙΙ

9

8

6

12

14

power

ground 1

power

ground 2

107

signal

ground

input 1

DC volume

control 1

input 2

DC volume

control 2

TDA7053A

TDA7053AT

5

V

P

positive
output 1

negative
output 1

negative
output 2

1,3,11,15

not

connected

positive
output 2

1997 Jul 15 4

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
VC1 2 DC volume control 1
n.c. 3 not connected
V

I (1)

4 voltage input 1

V

P

5 positive supply voltage

V

I (2)

6 voltage input 2
SGND 7 signal ground
VC2 8 DC volume control 2
OUT2+ 9 positive output 2
PGND2 10 power ground 2
n.c. 11 not connected
OUT2− 12 negative output 2
OUT1− 13 negative output 1
PGND1 14 power ground 1
n.c. 15 not connected
OUT1+ 16 positive output 1

Fig.2 Pin configuration.

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

VC1

n.c.

V

P

I (1)

V

I (2)

V

SGND

VC2

OUT1

PGND1

PGND2

OUT1
OUT2

OUT2

n.c.

TDA7053A

TDA7053AT

n.c.

n.c.

MSA719 - 2

FUNCTIONAL DESCRIPTION

The TDA7053A and TDA7053AT are stereo output
amplifiers with two DC volume control stages, designed for
TV and monitors, but also suitable for battery-fed portable
recorders and radios.

In conventional DC volume control circuits the control or
input stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.

The two DC volume control stages are integrated into the
input stages so that no coupling capacitors are required
and a low offset voltage is still maintained. The minimum
supply voltage also remains low.

The BTL principle offers the following advantages:

• Lower peak value of the supply current

• The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.

For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.

The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stages have a logarithmic control
characteristic. Therefore, the total gain can be controlled
from +40.5 to −33 dB.

If the DC volume control voltage falls below 0.4 V, the
device will switch to the mute mode.

The amplifier is short-circuit protected to ground, V

P

and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
150 °C the gain will be reduced, thereby reducing the
output power.

Special attention is given to switch-on and switch-off
clicks, low HF radiation and a good overall stability.

1997 Jul 15 5

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

Power dissipation

TDA7053A:

Assume V

P

= 6 V and RL=8Ω.
The maximum sine wave dissipation is 2 × 0.9 W = 1.8 W.
The R

th j-a

of the package is 50 K/W therefore T

amb(max)

= 150 − (50 × 1.8) = 60 °C.

TDA7053AT:

Assume V

P

= 6 V and RL=16Ω.
The maximum sine wave dissipation is 2 × 0.46 W = 0.92 W.
The R

th j-a

of the package is 95 K/W therefore T

amb(max)

= 150 − (95 × 0.92) = 62.6 °C.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage − 18 V

I

ORM

repetitive peak output current − 1.25 A

I

OSM

non-repetitive peak output current − 1.5 A

P

tot

total power dissipation T

amb

≤ 25 °C
TDA7053A − 2.5 W
TDA7053AT − 1.32 W

t

sc

short-circuit time − 1hr

V

n

input voltage pins 2, 4, 6 and 8 − 5V

T

amb

operating ambient temperature −40 +85 °C

T

stg

storage temperature −55 +150 °C

T

vj

virtual junction temperature − +150 °C

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

TDA7053A 50 K/W
TDA7053AT 95 K/W

1997 Jul 15 6

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

CHARACTERISTICS

VP=6V; T

amb

=25°C; fi= 1 kHz; TDA7053A: RL=8Ω; TDA7053AT: RL=16Ω; unless otherwise specified

(see Fig.13).

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R

L

.

2. The noise output voltage (RMS value) at fi= 500 kHz is measured with RS=0Ω and bandwidth = 5 kHz.

3. 20 Hz to 300 kHz (typical).

4. The ripple rejection is measured with RS=0Ω and fi= 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.

5. The channel unbalance is measured with V

DC1=VDC2

.

6. The channel unbalance at G1= 0 dB is measured with V

DC1=VDC2

.

7. The noise output voltage (RMS value) is measured with RS=5kΩ unweighted.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage 4.5 − 18 V

I

q(tot)

total quiescent current VP=6V; RL=∞; note 1 − 22 25 mA

Maximum gain; V

2,8

≥ 1.4 V

P

out

output power THD = 10%

TDA7053A 1.0 1.1 − W
TDA7053AT 0.5 0.55 − W

THD total harmonic distortion

TDA7053A P

out

= 0.5 W − 0.3 1 %

TDA7053AT P

out

= 0.25 W − 0.3 1 %

G

v

voltage gain 39.5 40.5 41.5 dB

V

I(rms)

input signal handling (RMS value) Gv= 0 dB; THD < 1% 1 −−V

V

no

noise output voltage fi= 500 kHz; note 2 − 210 −µV
B bandwidth at −1dB − note 3 − Hz
SVRR supply voltage ripple rejection note 4 34 38 − dB
V

O(os)

DC output offset voltage V16− V13 and V12− V9− 0 200 mV
Z

i

input impedance (pins 4 and 6) 15 20 25 kΩ

α

cs

channel separation RS=5kΩ 40 −−dB
G

v

 channel unbalance note 5 −−1dB

G

1

= 0 dB; note 6 −−1dB

Mute position; V

2,8

= 0.4 V ±30 mV

V

O

output voltage in mute position Vi= 1.0 V; note 7 − 30 40 µV

DC volume control

G

C

gain control 68.5 73.5 − dB
I

DC

volume control current V2=V8=0V −20 −25 −30 µA

1997 Jul 15 7

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

Fig.3 Quiescent current as a function of supply

voltage.

handbook, halfpage

04 20

V

P

(V)

40

30

10

0

20

MBG672

81216

I

q

(mA)

Fig.4 THD as a function of output power.

(1) VP= 4.5V.
(2) VP= 6 V; RL=8Ω.
(3) VP= 12 V; RL=25Ω.

handbook, halfpage

12

THD

(%)

P

out

(W)

0

8

10

−2

10

−1

1

MBG671

10

4

(1) (2) (3)

Fig.5 THD as a function of frequency.

(1) Gv= 30 dB; Po= 0.1 W.
(2) Gv= 40 dB; Po= 0.1 W.

handbook, halfpage

10

2

MBG669

10110

−2

10

−1

f (kHz)

THD

(%)

10

0

4

6

8

2

(2)

(1)

Fig.6 Output power as a function of supply

voltage.

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

handbook, halfpage

0

VP (V)

P

out

(W)

2.5

0

0.5

MBG670

1.0

1.5

2.0

4 8 12 16

(1) (2) (3)

1997 Jul 15 8

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

Fig.7 Total worst case power dissipation as a

function of supply voltage.

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

handbook, halfpage

048 16

V

P

(V)

4

3

1

0

2

MBG668

12

P

diss

(W)

(2) (3)(1)

Fig.8 Voltage gain as a function of volume control

voltage.

handbook, halfpage

0

G

v

(dB)

2.0

VVC (V)

80

−40

−80

−120

40

0

MBG667

0.4 0.8 1.2 1.6

Fig.9 Noise voltage as a function of volume

control voltage.

f = 22 Hz to 22 kHz.

handbook, halfpage

2.0

VVC (V)

0

10

−2

10

−1

MBG664

1

0.4 0.8 1.2 1.6

V

no

(mV)

Fig.10 SVRR as a function of frequency.

(1) VDC= 1.4 V;V

ripple

= 0.2 V.

(2) VDC= 0.4 V; V

ripple

= 0.2 V.

handbook, halfpage

10

2

MBG663

10110

−2

10

−1

f (kHz)

SVRR

(dB)

−20

−40

−60

−80

0

(1)

(2)

1997 Jul 15 9

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

Fig.11 Input signal handling.

THD = 1 %.

handbook, halfpage

020

V

P

(V)

V

in

(V)

2.0

0

0.4

MBG665

0.8

1.2

1.6

4 8 12 16

Fig.12 Volume control current as a function of

volume control voltage.

handbook, halfpage

0

I

VC

(µA)

2.0

VVC (V)

30

−10

−20

−30

20

10

0

MBG666

0.4 0.8 1.2 1.6

APPLICATION INFORMATION

The application diagram is illustrated in Fig.13.

Test conditions

T

amb

=25°C unless otherwise specified; VP=6V;

VDC= 1.4 V; fi= 1 kHz; RL=8Ω.
The quiescent current has been measured without load

impedance.
The output power as a function of the supply voltage has

been measured at THD = 10%. The maximum output
power is limited by the maximum power dissipation and the
maximum available output current.

The maximum input signal voltage is measured at
THD = 1% at the output with a voltage gain of 0 dB.

To avoid instabilities and too high distortion, the input
ground and power ground must be separated as far as
possible and connected as close as possible to the IC.

The DC volume control can be applied in several ways.
Two possible circuits are shown below the main
application diagram. The circuits at the control pin will
influence the switch-on and switch-off behaviour and the
maximum voltage gain.

For single-end applications the output peak current must
not exceed 100 mA. At higher output currents the
short-circuit protection (MCL) will be active.

1997 Jul 15 10

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

Fig.13 Test and application diagram.

(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL=8Ω.

handbook, full pagewidth

MBG673

16

13

TEMPERATURE

MCL

PROTECTION

STABILIZER

12

9

10 147

220 µF

100 nF

5

(1)

(2)

(2)

VP = 6 V

VP = 6 V

6
8

Rs = 5 kΩ

1 MΩ1 µF

Rs = 5 kΩ

DC-

volume

signal

ground

volume

control

volume

control

power

ground

470 nF

470 nF

input 1

input 2

TDA7053A

4
2

I − i

I + i

−

+

−

+

I + i

I − i

maximum voltage

gain 34 dB

2, 8

22 kΩ

56 kΩ

1 µF

maximum voltage

gain 40 dB

2, 8

1997 Jul 15 11

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

cEe M

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

92-10-02
95-01-19

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15

0.021

0.015

0.013

0.009

0.010.100.0200.19

050G09 MO-001AE

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

16

1

9

8

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

1997 Jul 15 12

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

8

16

w

M

b

p

D

detail X

Z

e

9

1

y

0.25

075E03 MS-013AA

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.41

0.40

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v

M

A

(A )

3

A

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

95-01-24
97-05-22

1997 Jul 15 13

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Jul 15 14

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1997 Jul 15 15

Philips Semiconductors Product specification

Stereo BTL audio output amplifier with DC
volume control

TDA7053A

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1997 SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 547027/1200/04/pp16 Date of release: 1997 Jul 15 Document order number: 9397 750 02591