Datasheet TDA7052-N2, TDA7052-N1 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated Circuits, IC01

July 1994

INTEGRATED CIRCUITS

TDA7052

1 W BTL mono audio amplifier

July 1994 2

Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

GENERAL DESCRIPTION

The TDA7052 is a mono output amplifier in a 8-lead dual-in-line (DIL) plastic package. The device is designed for
battery-fed portable audio applications.

Features:

• No external components

• No switch-on or switch-off clicks

• Good overall stability

• Low power consumption

• No external heatsink required

• Short-circuit proof

QUICK REFERENCE DATA

PACKAGE OUTLINE

8-lead DIL; plastic (SOT97); SOT97-1; 1996 August 21.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

Supply voltage range 3 6 18 V

I

tot

Total quiescent current RL = ∞−48mA

G

v

Voltage gain 38 39 40 dB

P

o

Output power THD = 10%; 8 Ω− 1,2 − W

THD Total harmonic distortion P

o

= 0,1 W − 0,2 1,0 %

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Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

PINNING

1V

P

supply voltage 5 OUT1 output1
2 IN input 6 GND2 ground (substrate)
3 GND1 ground (signal) 7 n.c. not connected
4 n.c. not connected 8 OUT2 output2

Fig.1 Block diagram.

July 1994 4

Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

FUNCTIONAL DESCRIPTION

The TDA7052 is a mono output amplifier designed for battery-fed portable audio applications, such as tape recorders
and radios.

The gain is fixed internally at 40 dB. A large number of tape recorders and radios are still designed for mono sound, plus
a space-saving trend by reduction of the number of battery cells. This means a decrease in supply voltage which results
in an reduction of output power. To compensate for this reduction, the TDA7052 uses the Bridge-Tied-Load principle
(BTL) which can deliver an output power of 1,2 W (THD = 10%) into an 8 Ω load with a power supply of 6 V. The load
can be short-circuited at each signal excursion.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

POWER DISSIPATION

Assume V

P

= 6 V; RL = 8 Ω; T

amb

= 50 °C maximum.

The maximum sinewave dissipation is 0,9 W.

Where R

th j-a

of the package is 110 K/W, so no external heatsink is required.

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

Supply voltage − 18 V

I

OSM

Non-repetitive peak output current − 1,5 A

P

tot

Total power dissipation see Fig. 2

T

c

Crystal temperature − 150 °C

T

stg

Storage temperature range −55 +150 °C

Fig.2 Power derating curve.

R

th j-a

150 50–

09,

----------------------

110 K/W.≈=

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Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

CHARACTERISTICS

V

P

= 6 V; RL = 8 Ω; f = 1 kHz; T

amb

= 25 °C; unless otherwise specified.

Notes to the characteristics

1. The unweighted RMS noise output voltage is measured at a bandwidth of 60 Hz to 15 kHz with a source impedance
(R

S

) of 5 kΩ.

2. The RMS noise output voltage is measured at a bandwidth of 5 kHz with a source impedance of 0 Ω and a frequency
of 500 kHz. With a practical load (R = 8 Ω; L = 200 µH) the noise output current is only 100 nA.

3. Ripple rejection is measured at the output with a source impedance of 0 Ω and a frequency between 100 Hz and
10 kHz. The ripple voltage = 200 mV (RMS value) is applied to the positive supply rail.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

Supply voltage range 3 6 18 V

I

tot

Total quiscent current RL = ∞−48mA

G

v

Voltage gain 38 39 40 dB

P

o

Output power THD = 10% − 1,2 − W
Noise output voltage

(RMS value)

V

no(rms)

note 1 − 150 300 µV

V

no(rms)

note 2 − 60 −µV

f

r

Frequency response − 20 Hz to − Hz

20 kHz

SVRR Supply voltage ripple rejection note 3 40 50 − dB

DC output offset voltage

∆V

5-8

pin 5 to 8 RS = 5 k Ω− − 100 mV

THD Total harmonic distortion P

O

= 0,1 W − 0,2 1,0 %

Z

I

 Input impedance − 100 − kΩ

I

bias

Input bias current − 100 300 nA

July 1994 6

Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

Fig.3 Application diagram.

July 1994 7

Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

PACKAGE OUTLINE

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT97-1

92-11-17
95-02-04

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

1.154.2 0.51 3.2

inches

0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12

0.010.10 0.30

0.32

0.31

0.39

0.33

0.0450.17 0.020 0.13

b

2

050G01 MO-001AN

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

8

1

5

4

b

E

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

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Philips Semiconductors Product specification

1 W BTL mono audio amplifier TDA7052

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.