The TDA7052A/AT are mono BTL output amplifiers with
DC volume control. They are designed for use in TV and
monitors, but also suitable for battery-fed portable
recorders and radios.
Missing Current Limiter (MCL)
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).
1 W BTL mono audio amplifier with DC
volume control
handbook, full pagewidth
n.c.
positive input
DC volume
control
7
TDA7052A
TDA7052AT
2
4
V
ref
STABILIZER
TEMPERATURE
PROTECTION
TDA7052A/AT
V
P
1
I + i
3
5
positive output
8I – i
negative output
6
MCD385 - 1
PINNING
SYMBOLPINDESCRIPTION
V
P
1positive supply voltage
IN+2positive input
GND13signal ground
VC4DC volume control
OUT+5positive output
GND26power ground
n.c7not connected
OUT−8negative output
Fig.1 Block diagram.
handbook, halfpage
V
IN +
GND1
VC
P
power
ground
1
2
3
4
TDA7052A
TDA7052AT
signal
ground
Fig.2 Pin configuration.
MCD384
8
7
6
5
OUT –
n.c.
GND2
OUT +
July 19943
Page 4
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
volume control
FUNCTIONAL DESCRIPTION
The TDA7052A/AT are mono BTL output amplifiers with
DC volume control, designed for use in TV and monitors
but also suitable for battery fed portable recorders and
radios.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.
In the TDA7052A/AT the DC volume control stage is
integrated into the input stage so that no coupling
capacitors are required and yet a low offset voltage is
maintained. At the same time the minimum supply remains
low.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
TDA7052A/AT
Thus a reduced power supply with smaller capacitors can
be used which results in cost savings.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
The maximum gain of the amplifier is fixed at 35.5 dB. The
DC volume control stage has a logarithmic control
characteristic.
The total gain can be controlled from 35.5 dB to −44 dB. If
the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
The amplifier is short-circuit proof to ground, V
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, so the output power is
reduced.
Special attention is given to switch on and off clicks, low
HF radiation and a good overall stability.
and
P
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
I
ORM
I
OSM
P
P
tot
supply voltage range−18V
repetitive peak output current−1.25A
non-repetitive peak output current−1.5A
total power dissipationT
amb
≤ 25%
TDA7052A−1.25W
TDA7052AT−0.8W
T
amb
T
stg
T
vj
T
sc
V
2
V
4
operating ambient temperature range−40+85°C
storage temperature range−55+150°C
virtual junction temperature−+150°C
short-circuit time−1hr
input voltage pin 2−8V
input voltage pin 4−8V
July 19944
Page 5
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
TDA7052A/AT
volume control
THERMAL RESISTANCE
SYMBOLPARAMETERTHERMAL RESISTANCE
R
th j-a
Notes to the thermal resistance
TDA7052A: V
Therefore T
TDA7052AT: VP = 6 V; RL = 16 Ω. The maximum sine-wave dissipation is 0.46 W.
Therefore T
= 6 V; RL = 8 Ω. The maximum sine-wave dissipation is 0.9 W.
positive supply voltage range4.5−18V
total quiescent currentVP = 6 V; RL = ∞
−712mA
note 1
= 1.4 V
4
output powerTHD = 10%
TDA7052A1.01.1−W
TDA7052AT0.50.55−W
TDA7052AP
TDA7052ATP
= 0.5 W−0.31%
O
= 0.25 W−0.31%
O
voltage gain34.535.536.5dB
input signal handlingV4 = 0.8 V; THD < 1%0.50.65−V
noise output voltage (RMS value)f = 500 kHz; note 2−210−µV
−
300 kHz
input impedance (pin 2)152025kΩ
= 0.5 V
4
voltage gain−−44−dB
noise output voltage (RMS value)note 4−2030µV
output voltage in mute positionV4≤ 0.3 V; VI = 600 mV−−30µV
control currentV4 = 0.4 V607080µA
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage dividend by R
.
L
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value)
is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
July 19946
Page 7
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
volume control
40
handbook, halfpage
gain
(dB)
20
0
– 20
– 40
– 60
– 80
01.22.00.41.60.8
MCD388
V (V)
4
1000
handbook, halfpage
V
noise
(µV)
800
600
400
200
0
01.22.0
0.41.60.8
TDA7052A/AT
MCD389 - 1
V (V)
4
Fig.3 Gain control as a function of DC volume control.
100
handbook, halfpage
I
4
(µA)
60
20
– 20
– 60
– 100
01.22.0
0.41.60.8
MCD390 - 1
V (V)
4
Fig.4Noise output voltage as a function of DC
volume control.
Fig.5Control current as a function of DC volume
control.
July 19947
Page 8
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
volume control
APPLICATION INFORMATION
handbook, full pagewidth
7
positive
input
R
n.c.
0.47 µF
5 kΩ
S
DC
volume
control
2
4
TDA7052A
TDA7052AT
STABILIZERTEMPERATURE
V
ref
PROTECTION
1
I + i
(1)
100 nF220 µF
5
8I – i
6
3
TDA7052A/AT
V = 6 V
P
R = 8 Ω
L
(TDA7052A)
R = 16 Ω
L
(TDA7052A/AT)
This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1.
Fig.6 Test and application diagram.
handbook, halfpage
volume
control
1 MΩ1 µF
4
MCD387
Fig.7Application with potentiometer as volume
control; maximum gain = 30 dB.
MCD386 - 1
ground
July 19948
Page 9
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
volume control
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
12
min.
max.
050G01MO-001AN
b
1.73
1.14
0.068
0.045
IEC JEDEC EIAJ
0.021
0.015
b
1
0.53
0.38
4
0510 mm
scale
b
2
0.36
1.07
0.23
0.89
0.014
0.042
0.009
0.035
REFERENCES
(1)(1)
cD E eM
9.8
9.2
0.39
0.36
6.48
6.20
0.26
0.24
L
e
1
M
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
E
10.0
0.39
0.33
H
8.3
w
max.
0.2542.547.62
1.154.20.513.2
0.010.100.30
0.0450.170.0200.13
ISSUE DATE
92-11-17
95-02-04
(1)
Z
July 19949
Page 10
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
volume control
SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
5
TDA7052A/AT
SOT96-1
E
H
E
A
X
v M
A
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
UNIT
inches
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
4
w M
b
p
02.55 mm
scale
(1)E(2)
cD
5.0
4.8
0.20
0.19
eHELLpQZywv θ
4.0
1.27
3.8
0.16
0.050
0.15
2
A
6.2
5.8
0.244
0.228
Q
3
A
θ
0.250.10.25
0.010.010.0410.004
0.7
0.3
0.028
0.012
(1)
o
8
o
0
L
p
L
0.7
0.6
0.028
0.024
(A )
1
detail X
1.0
1.05
0.4
0.039
0.016
OUTLINE
VERSION
SOT96-1
IEC JEDEC EIAJ
076E03S MS-012AA
REFERENCES
July 199410
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
Page 11
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
volume control
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA7052A/AT
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
July 199411
Page 12
Philips SemiconductorsProduct specification
1 W BTL mono audio amplifier with DC
TDA7052A/AT
volume control
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 199412
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