Datasheet TDA7052A Specification

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA7052A/AT
1 W BTL mono audio amplifier with DC volume control
Product specification File under Integrated circuits, IC01
July 1994
Page 2
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
TDA7052A/AT
volume control

FEATURES

DC volume control
Few external components
Mute mode
Thermal protection
Short-circuit proof
No switch-on and off clicks
Good overall stability
Low power consumption
Low HF radiation
ESD protected on all pins

QUICK REFERENCE DATA

SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT
V
P
P
O
positive supply voltage range 4.5 18 V output power
TDA7052A R TDA7052AT R
G
v
maximum total voltage gain 34.5 35.5 36.5 dB φ gain control range 75 80 dB I
P
total quiescent current VP = 6 V; RL = ∞−712mA THD total harmonic distortion
TDA7052A P TDA7052AT P

GENERAL DESCRIPTION

The TDA7052A/AT are mono BTL output amplifiers with DC volume control. They are designed for use in TV and monitors, but also suitable for battery-fed portable recorders and radios.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended).
= 8 ; VP = 6 V 1.0 1.1 W
L
= 16 ; VP = 6 V 0.5 0.55 W
L
= 0.5 W 0.3 1 %
O
= 0.25 W 0.3 1 %
O

ORDERING INFORMATION

EXTENDED TYPE
NUMBER
PINS PIN POSITION MATERIAL CODE
PACKAGE
TDA7052A 8 DIL plastic SOT97 TDA7052AT 8 mini-pack plastic SOT96A
Notes
1. SOT97-1; 1996 September 10.
2. SOT96-1; 1996 September 10.
(1)
(2)
Page 3
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control
handbook, full pagewidth
n.c.
positive input
DC volume
control
7
TDA7052A TDA7052AT
2
4
V
ref
STABILIZER
TEMPERATURE
PROTECTION
TDA7052A/AT
V
P
1
I + i
3
5
positive output
8I – i
negative output
6
MCD385 - 1

PINNING

SYMBOL PIN DESCRIPTION
V
P
1 positive supply voltage IN+ 2 positive input GND1 3 signal ground VC 4 DC volume control OUT+ 5 positive output GND2 6 power ground n.c 7 not connected OUT 8 negative output
Fig.1 Block diagram.
handbook, halfpage
V
IN +
GND1
VC
P
power
ground
1 2 3 4
TDA7052A
TDA7052AT
signal
ground
Fig.2 Pin configuration.
MCD384
8 7 6 5
OUT – n.c. GND2 OUT +
Page 4
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control

FUNCTIONAL DESCRIPTION

The TDA7052A/AT are mono BTL output amplifiers with DC volume control, designed for use in TV and monitors but also suitable for battery fed portable recorders and radios.
In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitors to keep the offset voltage low.
In the TDA7052A/AT the DC volume control stage is integrated into the input stage so that no coupling capacitors are required and yet a low offset voltage is maintained. At the same time the minimum supply remains low.
The BTL principle offers the following advantages:
Lower peak value of the supply current
The frequency of the ripple on the supply voltage is twice
the signal frequency.
TDA7052A/AT
Thus a reduced power supply with smaller capacitors can be used which results in cost savings.
For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power.
The maximum gain of the amplifier is fixed at 35.5 dB. The DC volume control stage has a logarithmic control characteristic.
The total gain can be controlled from 35.5 dB to 44 dB. If the DC volume control voltage is below 0.3 V, the device switches to the mute mode.
The amplifier is short-circuit proof to ground, V across the load. Also a thermal protection circuit is implemented. If the crystal temperature rises above +150 °C the gain will be reduced, so the output power is reduced.
Special attention is given to switch on and off clicks, low HF radiation and a good overall stability.
and
P

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V I
ORM
I
OSM
P
P
tot
supply voltage range 18 V repetitive peak output current 1.25 A non-repetitive peak output current 1.5 A total power dissipation T
amb
25% TDA7052A 1.25 W TDA7052AT 0.8 W
T
amb
T
stg
T
vj
T
sc
V
2
V
4
operating ambient temperature range 40 +85 °C storage temperature range 55 +150 °C virtual junction temperature +150 °C short-circuit time 1hr input voltage pin 2 8V input voltage pin 4 8V
Page 5
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
TDA7052A/AT
volume control

THERMAL RESISTANCE

SYMBOL PARAMETER THERMAL RESISTANCE
R
th j-a
Notes to the thermal resistance
TDA7052A: V Therefore T
TDA7052AT: VP = 6 V; RL = 16 . The maximum sine-wave dissipation is 0.46 W. Therefore T
= 6 V; RL = 8 . The maximum sine-wave dissipation is 0.9 W.
P
amb(max)
amb(max)
from junction to ambient in free air
TDA7052A 100 K/W TDA7052AT 155 K/W
= 150 100 × 0.9 = 60 °C.
= 150 155 × 0.46 = 78 °C.
Page 6
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
TDA7052A/AT
volume control

CHARACTERISTICS

V
= 6 V; T
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
I
P
Maximum gain; V
P
O
THD total harmonic distortion
G
v
V
I
V
no(rms)
B bandwidth 1 dB 20 Hz to
SVRR supply voltage ripple rejection note 3 38 46 dB
|V
| DC output offset voltage 0 150 mV
off
Z
I
Minimum gain; V
G
v
V
no(rms)
Mute position
V
O
DC volume control
φ gain control range 75 80 dB I
4
= 25 °C; f = 1 kHz; TDA7052A: RL = 8 ; TDA7052A T: RL = 16 ; unless otherwise specified (see Fig.6).
amb
positive supply voltage range 4.5 18 V total quiescent current VP = 6 V; RL =
712mA
note 1
= 1.4 V
4
output power THD = 10%
TDA7052A 1.0 1.1 W TDA7052AT 0.5 0.55 W
TDA7052A P TDA7052AT P
= 0.5 W 0.3 1 %
O
= 0.25 W 0.3 1 %
O
voltage gain 34.5 35.5 36.5 dB input signal handling V4 = 0.8 V; THD < 1% 0.5 0.65 V noise output voltage (RMS value) f = 500 kHz; note 2 210 −µV
300 kHz
input impedance (pin 2) 15 20 25 k
= 0.5 V
4
voltage gain −−44 dB noise output voltage (RMS value) note 4 20 30 µV
output voltage in mute position V4≤ 0.3 V; VI = 600 mV −− 30 µV
control current V4 = 0.4 V 60 70 80 µA
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage dividend by R
.
L
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and bandwidth = 5 kHz.
3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted.
Page 7
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control
40
handbook, halfpage
gain (dB)
20
0
– 20
– 40
– 60
– 80
0 1.2 2.00.4 1.60.8
MCD388
V (V)
4
1000
handbook, halfpage
V
noise (µV)
800
600
400
200
0
0 1.2 2.0
0.4 1.60.8
TDA7052A/AT
MCD389 - 1
V (V)
4
Fig.3 Gain control as a function of DC volume control.
100
handbook, halfpage
I
4
(µA)
60
20
– 20
– 60
– 100
0 1.2 2.0
0.4 1.60.8
MCD390 - 1
V (V)
4
Fig.4 Noise output voltage as a function of DC
volume control.
Fig.5 Control current as a function of DC volume
control.
Page 8
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control

APPLICATION INFORMATION

handbook, full pagewidth
7
positive
input
R
n.c.
0.47 µF
5 k
S
DC volume control
2
4
TDA7052A TDA7052AT
STABILIZER TEMPERATURE
V
ref
PROTECTION
1
I + i
(1)
100 nF 220 µF
5
8I – i
6
3
TDA7052A/AT
V = 6 V
P
R = 8
L
(TDA7052A)
R = 16
L
(TDA7052A/AT)
This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1.
Fig.6 Test and application diagram.
handbook, halfpage
volume
control
1 M1 µF
4
MCD387
Fig.7 Application with potentiometer as volume
control; maximum gain = 30 dB.
MCD386 - 1
ground
Page 9
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)
D
seating plane
L
Z
b
e
b
8
1
5
A
A
1
w M
b
2
TDA7052A/AT

SOT97-1

M
E
2
A
c
(e )
1
M
H
pin 1 index
E
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT97-1
12
min.
max.
050G01 MO-001AN
b
1.73
1.14
0.068
0.045
IEC JEDEC EIAJ
0.021
0.015
b
1
0.53
0.38
4
0 5 10 mm
scale
b
2
0.36
1.07
0.23
0.89
0.014
0.042
0.009
0.035
REFERENCES
(1) (1)
cD E e M
9.8
9.2
0.39
0.36
6.48
6.20
0.26
0.24
L
e
1
M
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
E
10.0
0.39
0.33
H
8.3
w
max.
0.2542.54 7.62
1.154.2 0.51 3.2
0.010.10 0.30
0.0450.17 0.020 0.13
ISSUE DATE
92-11-17 95-02-04
(1)
Z
Page 10
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control
SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
5
TDA7052A/AT

SOT96-1

E
H
E
A
X
v M
A
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
1.75
0.069
A1A2A
0.25
1.45
0.10
1.25
0.010
0.057
0.004
0.049
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
UNIT
inches
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
4
w M
b
p
0 2.5 5 mm
scale
(1)E(2)
cD
5.0
4.8
0.20
0.19
eHELLpQZywv θ
4.0
1.27
3.8
0.16
0.050
0.15
2
A
6.2
5.8
0.244
0.228
Q
3
A
θ
0.25 0.10.25
0.010.010.041 0.004
0.7
0.3
0.028
0.012
(1)
o
8
o
0
L
p
L
0.7
0.6
0.028
0.024
(A )
1
detail X
1.0
1.05
0.4
0.039
0.016
OUTLINE
VERSION
SOT96-1
IEC JEDEC EIAJ
076E03S MS-012AA
REFERENCES
July 1994 10
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04 97-05-22
Page 11
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC volume control
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
DIP
SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA7052A/AT
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
AVE SOLDERING
W Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
July 1994 11
Page 12
Philips Semiconductors Product specification
1 W BTL mono audio amplifier with DC
TDA7052A/AT
volume control

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994 12
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