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TDA7052
Datasheet (Philips)
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Specification
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Datasheet TDA7052 Datasheet (Philips)

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Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA7052
1 W BTL mono audio amplifier
Product specification File under Integrated Circuits, IC01
July 1994
Page 2
1 W BTL mono audio amplifier TDA7052

GENERAL DESCRIPTION

The TDA7052 is a mono output amplifier in a 8-lead dual-in-line (DIL) plastic package. The device is designed for battery-fed portable audio applications.
Features:
• No external components
• No switch-on or switch-off clicks
• Good overall stability
• Low power consumption
• No external heatsink required
• Short-circuit proof

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
I
tot
G
v
P
o
THD Total harmonic distortion P
Supply voltage range 3 6 18 V Total quiescent current RL = ∞−48mA Voltage gain 38 39 40 dB Output power THD = 10%; 8 Ω− 1,2 − W
= 0,1 W − 0,2 1,0 %
o

PACKAGE OUTLINE

8-lead DIL; plastic (SOT97); SOT97-1; 1996 August 21.
July 1994 2
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1 W BTL mono audio amplifier TDA7052
Fig.1 Block diagram.

PINNING

1V 2 IN input 6 GND2 ground (substrate) 3 GND1 ground (signal) 7 n.c. not connected 4 n.c. not connected 8 OUT2 output2
P
supply voltage 5 OUT1 output1
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1 W BTL mono audio amplifier TDA7052

FUNCTIONAL DESCRIPTION

The TDA7052 is a mono output amplifier designed for battery-fed portable audio applications, such as tape recorders and radios.
The gain is fixed internally at 40 dB. A large number of tape recorders and radios are still designed for mono sound, plus a space-saving trend by reduction of the number of battery cells. This means a decrease in supply voltage which results in an reduction of output power. To compensate for this reduction, the TDA7052 uses the Bridge-Tied-Load principle (BTL) which can deliver an output power of 1,2 W (THD = 10%) into an 8 Ω load with a power supply of 6 V. The load can be short-circuited at each signal excursion.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER MIN. MAX. UNIT
V I
OSM
P T T
P
tot c stg
Supply voltage − 18 V Non-repetitive peak output current − 1,5 A Total power dissipation see Fig. 2 Crystal temperature − 150 °C Storage temperature range −55 +150 °C
Fig.2 Power derating curve.

POWER DISSIPATION

Assume V
= 6 V; RL = 8 Ω; T
P
= 50 °C maximum.
amb
The maximum sinewave dissipation is 0,9 W.
R
th j-a
Where R
150 50–
---------------------­09,
of the package is 110 K/W, so no external heatsink is required.
th j-a
110 K/W.≈=
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1 W BTL mono audio amplifier TDA7052

CHARACTERISTICS

V
= 6 V; RL = 8 Ω; f = 1 kHz; T
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
I
tot
G
v
P
o
Supply voltage range 3 6 18 V Total quiscent current RL = ∞−48mA Voltage gain 38 39 40 dB Output power THD = 10% − 1,2 − W Noise output voltage
(RMS value)
V
no(rms)
V
no(rms)
f
r
Frequency response − 20 Hz to − Hz
SVRR Supply voltage ripple rejection note 3 40 50 − dB
DC output offset voltage
∆V
5-8
pin 5 to 8 RS = 5 k Ω− − 100 mV
THD Total harmonic distortion P
Input impedance − 100 − kΩ
Z
I
I
bias
Input bias current − 100 300 nA
= 25 °C; unless otherwise specified.
amb
note 1 − 150 300 µV note 2 − 60 −µV
= 0,1 W − 0,2 1,0 %
O
20 kHz
Notes to the characteristics
1. The unweighted RMS noise output voltage is measured at a bandwidth of 60 Hz to 15 kHz with a source impedance ) of 5 kΩ.
(R
S
2. The RMS noise output voltage is measured at a bandwidth of 5 kHz with a source impedance of 0 Ω and a frequency
of 500 kHz. With a practical load (R = 8 Ω; L = 200 µH) the noise output current is only 100 nA.
3. Ripple rejection is measured at the output with a source impedance of 0 Ω and a frequency between 100 Hz and
10 kHz. The ripple voltage = 200 mV (RMS value) is applied to the positive supply rail.
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1 W BTL mono audio amplifier TDA7052
Fig.3 Application diagram.
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1 W BTL mono audio amplifier TDA7052

PACKAGE OUTLINE

DIP8: plastic dual in-line package; 8 leads (300 mil)
D
seating plane
A
L
Z
e
b
8
pin 1 index
1
w M
b
1
b
2
5

SOT97-1

M
E
A
2
A
c
(e )
1
M
H
E
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT97-1
12
min.
max.
050G01 MO-001AN
b
1.73
1.14
0.068
0.045
IEC JEDEC EIAJ
0.021
0.015
b
1
0.53
0.38
4
0 5 10 mm
scale
b
cD E e M
2
0.36
1.07
0.23
0.89
0.014
0.042
0.009
0.035
REFERENCES
0.39
0.36
July 1994 7
(1) (1)
9.8
9.2
6.48
6.20
0.26
0.24
L
e
1
M
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
E
10.0
0.39
0.33
H
8.3
w
max.
0.2542.54 7.62
1.154.2 0.51 3.2
0.010.10 0.30
0.0450.17 0.020 0.13
ISSUE DATE
92-11-17 95-02-04
(1)
Z
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1 W BTL mono audio amplifier TDA7052
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

DEFINITIONS

(order code 9398 652 90011).
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994 8
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