5 V mixer/oscillator-PLL
synthesizers for hyperband tuners
Product specification
Supersedes data of 1998 Jan 19
File under Integrated Circuits, IC02
1999 Jan 13
Page 2
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers
for hyperband tuners
FEATURES
• Single chip 5 V mixer/oscillator-PLL synthesizer for
hyperband tuners
• I2C-bus protocol
• 3 PNP band switch buffers (25 mA)
• 33 V tuning voltage output
• In-lock detector
• 5-level Analog-to-Digital Converter (ADC)
• 15-bit programmable divider
• Programmable reference divider ratio
(512, 640 or 1024)
• Programmable charge pump current
• Balanced mixer with a common emitter input for VHF
(single input)
• Balanced mixer with a common base input for UHF
(double input)
• 4-pin common emitter oscillator for VHF
• 4-pin common emitter oscillator for UHF
• IF amplifier with a low output impedance to drive a SAWfilter directly (≈2kΩ load)
• Low power, low radiation, small size
APPLICATIONS
• Hyperband tuners for Europe using a 2-band
mixer/oscillator in a switched concept.
GENERAL DESCRIPTION
The TDA6404, TDA6405 and TDA6405A are
programmable 2-band mixer/oscillator-PLL synthesizers
intended for VHF/UHF and hyperband tuners (see Fig.1).
The devices include two double balanced mixers and two
oscillators for the VHF and UHF band, an IF amplifier and
a PLL synthesizer. With proper oscillator application and
by using a switchable inductor to split the VHF band into
two sub-bands (the full VHF/UHF and hyperband) the TV
bands can be covered.
TDA6404; TDA6405;
TDA6405A
The PLL synthesizer consists of a divide-by-eight
prescaler, a 15-bit programmable divider, a 4 MHz crystal
oscillator and its programmable reference divider and a
phase comparator combined with a charge pump which
drives the tuning amplifier, including 33 V output.
Depending on the reference divider ratio (512, 640
or 1024), the phase comparator operates at 7.8125 kHz,
6.25 kHz or 3.90625 kHz.
2
The devices are controlled according to the I
format. The in-lock detector bit FL is set to logic 1 when the
loop is locked and is read on the SDA line (status byte)
during a read operation. The ADC input is available for
digital Automatic Frequency Control (AFC). The ADC code
is read during a read operation on the I2C-bus
(see Table 9). In test mode, pin ADC is used as a test
output for f
When the charge pump current switch mode is activated
and the loop is phase-locked the charge pump current
value is automatically switched to LOW. This is to improve
carrier-to-noise ratio. The status of this feature can be read
in the ACPS flag during a read operation on the I2C-bus
(see Table 7).
Five serial bytes (including address byte) are required for
the I2C-bus format to address the devices, select the VCO
frequency, program the three PNP ports, set the charge
pump current and to set the reference divider ratio.
The devices have four independent I2C-bus addresses
which can be selected by applying a specific voltage on the
AS input (see Table 4).
REF
and1⁄2f
DIV
.
C-bus
Two pins are available between the mixer output and the
IF amplifier input to enable IF filtering for improved signal
handling. Three PNP ports are provided for band
switching. Band selection is made according to the band
switch bits VHFL, VHFH and UHF.
1999 Jan 132
Page 3
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
PNP port output current−−25mA
IC storage temperature−40−+150°C
operating ambient temperature−20−+85°C
RF input frequencyVHF band45.25−399.25 MHz
UHF band407.25 −855.25 MHz
G
V
voltage gainVHF band−27−dB
UHF band−38−dB
Fnoise figureVHF band−8−dB
UHF band−8.5−dB
V
o
output voltage causing 1% cross
modulation in channel
VHF band−119−dBµV
UHF band−118−dBµV
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
TDA6404TS;
TDA6405TS;
SSOP28plastic shrink small outline package; 28 leads; body width 5.3 mmSOT341-1
TDA6405ATS
PACKAGE
1999 Jan 133
Page 4
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
BLOCK DIAGRAM
IFFIL1
handbook, full pagewidth
XTAL
3 (26)
4 (25)
1 (28)
2 (27)
16 (13)
VHFIN
RFGND
UHFIN1
UHFIN2
BS
RF INPUT
VHF
BSVHF
ELECTRONIC
BAND SWITCH
BSUHF
RF INPUT
UHF
XTAL
OSCILLATOR
4 MHz
IFFIL2
5 (24)17 (12)
6 (23)
VHF
MIXER
UHF
MIXER
f
REFERENCE
DIVIDER
512, 640, 1024
REF
DIGITAL
PHASE
COMPARATOR
TDA6404; TDA6405;
TDA6405A
V
CC
BSVHF
BSUHF
CHARGE
PUMP
VHF
OSCILLATOR
IF
AMPLIFIER
UHF
OSCILLATOR
TUNING
AMPLIFIER
(4) 25
(3) 26
(2) 27
(1) 28
(11) 18
(10) 19
(5) 24
(6) 23
(7) 22
(8) 21
(15) 14
(14) 15
VHFOSCIB1
VHFOSCOC1
VHFOSCOC2
VHFOSCIB2
IFOUT1
IFOUT2
UHFOSCIB2
UHFOSCOC2
UHFOSCOC1
UHFOSCIB1
CP
VT
f
DIV
1/2f
DIV
f
1/2f
REF
DIV
GATE
13 (16)7 (22)8 (21)9 (20)
ADC
SCL
SDA
AS
12 (17)
11 (18)
10 (19)
PRESCALER
DIVIDE BY 8
POWER-ON
RESET
SCL
SDA
AS
5-LEVEL A/D
CONVERTER
RSA
15-BIT
PROGRAMMABLE
DIVIDER
15-BIT
FREQUENCY
REGISTER
FL
I2C-BUS
TRANSCEIVER
RSB
FL
The pin numbers in parenthesis represent the TDA6405 and TDA6405A.
IN-LOCK
DETECTOR
FL
T2, T1, T0
T2, T1, T0
CHP
TDA6404
TDA6405
TDA6405A
7-BIT CONTROL
T2 T1 T0 RSA RSB OSCHP
3-BIT BAND SWITCH
VHFLVHFHUHF
V
CC
PVHFL
OS
REGISTER
REGISTER
PVHFH
LOGIC
PUHF
BS
(9) 20
MGK813
GND
Fig.1 Block diagram.
1999 Jan 134
Page 5
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
TDA6404; TDA6405;
hyperband tuners
PINNING
PIN
SYMBOL
UHFIN1128UHF input 1
UHFIN2227UHF input 2
VHFIN326VHF input
RFGND425RF ground
IFFIL1524IF filter output 1
IFFIL2623IF filter output 2
PVHFL722PNP port output for VHF low band
PVHFH821PNP port output for VHF high band
PUHF920PNP port output for UHF band
AS1019address selection input
SDA1118serial data input/output (I
SCL1217serial clock input (I
ADC1316Analog-to-Digital Converter input/output
CP1415charge pump output
VT1514tuning output
XTAL1613crystal oscillator input
V
The devices are controlled via the I2C-bus.
For programming, there is one module address (7 bits)
and the R/W bit for selecting the read or write mode.
Write mode
Data bytes can be sent to the devices after the address
transmission (first byte) by setting the R/
W bit to logic 0.
Four data bytes are needed to fully program the devices.
The I2C-bus transceiver has an auto-increment facility
which permits the programming of the devices within one
single transmission (address + 4 data bytes).
The devices can also be partially programmed, providing
that the first data byte following the address is divider
byte 1 (DB1) or control byte (CB). The bits in the data
bytes are defined in Tables 1 and 2.
Fig.3 Pin configuration for TDA6405(A)
The first bit of the data byte transmitted indicates whether
frequency data (first bit = 0) or control and band switch
data (first bit = 1) will follow. Until an I
2
C-bus STOP
condition is sent by the controller, additional data bytes
can be entered without the need to re-address the devices.
The frequency register is loaded after the 8th clock pulse
of the second divider byte (DB2). The control register is
loaded after the 8th clock pulse of the CB. The band switch
register is loaded after the 8th clock pulse of the band
switch byte (BB).
1999 Jan 136
Page 7
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
Table 1 I2C-bus mode, write data format for the TDA6404 and TDA6405
The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several
synthesizers (up to 4) in one system by applying a specific voltage on the AS input. The relationship between MA1 and
MA0 and the input voltage applied to the AS input is given in Table 4.
Table 3 Description of symbols used in Tables 1 and 2
SYMBOLDESCRIPTION
Aacknowledge
MA1 and MA0programmable address bits (see Table 4)
N14 to N0programmable divider bits; N = N14 × 2
CHPcharge pump current bit:
CHP = 0; ICP=60µA
CHP = 1; I
T2, T1 and T0test bits (see Table 5)
RSA and RSBreference divider ratio select bits (see Table 6)
OStuning amplifier control bit:
OS = 0; normal operation; tuning voltage is ‘ON’
OS = 1; tuning voltage is ‘OFF’ (high-impedance)
UHF, VHFH and VHFLPNP ports control bits:
bit = 0; buffer n is ‘OFF’ (default)
bit = 1; buffer n is ‘ON’
Xdon’t care bit: may be a logic 0 or a logic 1
= 280 µA (default)
CP
14
+ N13 × 213+ ... + N1 × 21+N0
1999 Jan 137
Page 8
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
Table 4 Address selection I2C-bus
MA1MA0VOLTAGE APPLIED ON AS INPUT
000 to 0.1V
01open or 0.2VCCto 0.3V
100.4VCCto 0.6V
110.9VCCto 1.0V
Table 5 Test mode
T2T1T0TEST MODES
000automatic charge pump off
001automatic charge pump on; note 1
01Xcharge pump is ‘OFF’
110charge pump is sinking current
111charge pump is sourcing current
100f
101
CC
REF
1
⁄
2
CC
CC
CC
is available on pin ADC; note 2
f
is available on pin ADC; note 2
DIV
TDA6404; TDA6405;
TDA6405A
Notes
1. This is the default mode at Power-on reset.
2. The ADC input cannot be used when these test modes are active.
Table 6 Reference divider ratio select bits
RSARSBREFERENCE DIVIDER RATIOFREQUENCY STEP (kHz)
X06406.25
0110243.90625
115127.8125
Read mode
Data can be read from the devices by setting the R/W bit
to logic 1 (see Tables 7 and 8). After the slave address
has been recognized, the devices generate an
acknowledge pulse and the first data byte (status byte) is
transferred on the SDA line (MSB first). Data is valid on the
SDA line during a HIGH-level of the SCL clock signal.
A second data byte can be read from the devices if the
The ACPS flag is LOW when the automatic charge pump
switch mode is ‘ON’ and the loop is locked. In other
conditions, ACPS = 1. When ACPS = 0, the charge pump
current is forced to the LOW value.
A built-in ADC is available on ADC pin. This converter can
be used to apply AFC information to the controller from the
IF section of the television. The relationship between the
bits A2, A1 and A0 is given in Table 9.
processor generates an acknowledge on the SDA line
(master acknowledge). End of transmission will occur if no
master acknowledge occurs. The devices will then release
the data line to allow the processor to generate a STOP
condition. The POR flag is set to logic 1 at power-on.
The flag is reset when an end-of-data is detected by the
devices (end of a read sequence). Control of the loop is
made possible with the in-lock flag FL which indicates
when the loop is locked (FL = 1).
1999 Jan 138
Page 9
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
TDA6404; TDA6405;
TDA6405A
Table 7 Read data format
BITS
NAMEBYTE
Address byteADB11000MA1MA0R/
MSB
(1)
LSB
W=1A
Status byteSBPORFLACPS11A2A1A0−
Note
1. MSB is transmitted first.
Table 8 Description of symbols used in Table 7
SYMBOLDESCRIPTION
Aacknowledge
PORPower-on reset flag (POR = 1 at power-on)
FLin-lock flag (FL = 1 when the loop is locked)
ACPSautomatic charge pump switch flag:
ACPS = 0; active
ACPS = 1; not active
A2, A1 and A0digital outputs of the 5-level ADC (see Table 9)
1000.60V
0110.45VCCto 0.60V
0100.30VCCto 0.45V
0010.15VCCto 0.30V
0000 to 0.15V
Note
1. Accuracy is ±0.03V
CC
.
Power-on reset
The power-on detection threshold voltage V
POR
is set to
VCC= 2 V at room temperature. Below this threshold, the
device is reset to the power-on state.
At power-on state, the charge pump current is set to
280 µA, the tuning voltage output is disabled, the test
bits T2, T1 and T0 are set to logic 001 (automatic charge
pump switch ‘ON’) and RSB is set to logic 1.
to 1.00V
CC
CC
CC
CC
CC
CC
PUHF is ‘OFF’, which means that the UHF oscillator and
the UHF mixer are switched off. Consequently, the VHF
oscillator and the VHF mixer are switched on. PVHFL and
PVHFH are ‘OFF’, which means that the VHF tank circuit
is working in the VHF I sub-band. The tuning amplifier is
switched off until the first transmission. In that case, the
tank circuit in VHF I is supplied with the maximum tuning
voltage. The oscillator is therefore working at the end of
the VHF I sub-band.
1999 Jan 139
Page 10
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
In accordance with the Absolute Maximum Rating System (IEC 134) (note 1).
SYMBOLPARAMETERMIN.MAX.UNIT
V
CC
V
O(n)
I
O(n)
V
O(CP
V
O(VT)
V
I/O(ADC)
V
I(SCL)
V
I/O(SDA)
I
O(SDA)
V
I(AS)
V
I(XTAL)
I
O(n)
supply voltage−0.3+6V
output voltage on pins PVHFL, PVHFH and PUHF−0.3+6V
output current on pins PVHFL, PVHFH and PUHF−1+30mA
)charge pump output voltage−0.3+6V
tuning output voltage−0.3+35V
ADC input/output voltage−0.3+6V
serial clock input voltage−0.3+6V
serial data input/output voltage−0.3+6V
data output current−1+10mA
address selection input voltage−0.3+6V
crystal oscillator input voltage−0.3+6V
output current of each pin to ground:
for TDA6404, pins 1 to 6 and 17 to 28−−10mA
for TDA6405 and TDA6405A, pins 1 to 12 and 23 to 28−−10mA
t
sc(max)
T
stg
T
amb
T
j
maximum short-circuit time (all pins to VCC and all pins to GND, RFGND)−10s
IC storage temperature−40+150°C
operating ambient temperature−20+85°C
junction temperature−150°C
Note
1. Maximum ratings can not be exceeded, not even momentarily without causing irreversible IC damage.
Maximum ratings can not be accumulated.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSTYPICALUNIT
R
th(j-a)
thermal resistance from junction to ambientin free air85K/W
1999 Jan 1310
Page 11
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
TDA6404; TDA6405;
TDA6405A
CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply (T
V
CC
I
CC
=25°C)
amb
supply voltage4.555.5V
supply current at VCC= 5 V all PNP ports are ‘OFF’−7886mA
one PNP port is ‘ON’, sourcing 25 mA−110121mA
PLL Synthesizer part (V
F
UNCTIONAL RANGE
V
POR
Power-on reset voltagebelow this supply voltage Power-on
= 4.5 to 5.5 V; T
CC
= −20 to +85 °C; unless otherwise specified)
amb
1.52.0−V
reset becomes active; see Table 10
D/Ddivider ratio15-bit frequency word256−32767
f
XTAL
Z
XTAL
crystal oscillator frequency R
input impedancef
= 25 to 150 Ω3.244.48MHz
XTAL
= 4 MHz6001200−Ω
XTAL
PNP PORTS
I
L(off)
V
O(sat)
leakage currentVCC= 5.5 V; V
=0−10−−µA
PNPn
output saturation voltageone PNP port is ‘ON’, sourcing 25 mA;
∆VCC= 5%; worst case in the frequency
range; note 2
= 10%; worst case in the
∆V
CC
−3080kHz
−80−kHz
frequency range; note 2
∆f
osc(T)
∆f
osc(t)
Φ
osc
RSC
oscillator frequency drift
with temperature
oscillator frequency drift
with time
phase noise, carrier to
noise sideband
ripple susceptibility of V
(p-p)
(peak-to-peak value)
∆T=25°C; with compensation; worst
case in the frequency range; note 3
with compensation; worst case in the
frequency range; note 4
±100 kHz frequency offset; worst case
in the frequency range
VCC= 5 V; worst case in the frequency
CC
range; ripple frequency 500 kHz; note 5
−6001000kHz
−200400kHz
−106−dBc/Hz
1520−mV
1999 Jan 1313
Page 14
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
TDA6404; TDA6405;
TDA6405A
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
R
EJECTION AT THE IF AMPLIFIER OUTPUT
INT
DIF
level of divider
note 6−20−dBµV
interferences in the IF
signal
INTR
crystal oscillator
XTAL
note 760−−dBc
interferences rejection
INTRF
reference frequency
REF
note 850−−dBc
rejection
INT
INT
CHX
S02
channel x beatnote 960−−dBc
S02 beatnote 1066−−dBc
Notes
1. This is the level of the RF signal (100% amplitude modulated with 11.89 kHz) that causes a 750 Hz frequency
deviation on the oscillator signal; it produces sidebands 30 dB below the level of the oscillator signal.
2. The frequency shift is defined as the change of the oscillator frequency when the supply voltage varies from
VCC= 5 to 4.75 V (4.5 V) or from VCC= 5 to 5.25 V (5.5 V). The oscillator is free-running during this measurement.
3. The frequency drift is defined as the change of the oscillator frequency when the ambient temperature varies from
T
=25to0°C or from T
amb
=25to50°C. The oscillator is free-running during this measurement.
amb
4. The switching on drift is defined as the change of the oscillator frequency between 5 seconds and 15 minutes after
switching on. The oscillator is free-running during this measurement.
5. The ripple susceptibility is measured for a 500 kHz ripple at the IF amplifier output using the measurement circuit;
the level of the ripple signal is increased until a difference of 53.5 dB between the IF carrier set at 100 dBµV and the
sideband components is reached.
6. This is the level of divider interferences close to the IF frequency. For example:
Ch S1: f
Ch S2: f
Ch S14: f
= 144.15 MHz and1⁄4f
osc
= 151.15 MHz and1⁄4f
osc
= 291.15 MHz and1⁄8f
osc
= 36.0375 MHz.
osc
= 37.7875 MHz.
osc
= 36.39375 MHz.
osc
The VHF RF input must be left open (i.e. not connected to any load or cable).
The UHF RF inputs are connected to a hybrid.
7. Crystal oscillator interference means the 4 MHz sidebands caused by the crystal oscillator.
The rejection should be >60 dB for an IF output signal of 100 dBµV.
8. The reference frequency rejection is the level of reference frequency sidebands related to the sound subcarrier.
The rejection should be >50 dB for an IF output signal of 100 dBµV, f
= 7.8125 kHz.
REF
9. Channel x beat: picture carrier frequency (69.25 MHz) and sound carrier frequency (74.75 MHz) both at 80 dBµV,
f
at 108.15 MHz. The rejection of the interfering product RF picture carrier frequency + RF sound carrier
osc
frequency − f
10. Channel S02: picture carrier frequency is 76.25 MHz at 80 dBµV, f
The rejection of f
at 35.85 MHz should be >60 dB.
osc
− 2 × fIF= 37.35 MHz should be >66 dB.
osc
= 115.15 MHz.
osc
1999 Jan 1314
Page 15
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
(1) N1 is 2 × 5 turns
(2) N2 is 2 turns
Z
>> 50 Ω⇒Vi=2×V
i
V
=V’
o
G
v
+ 16 dB (transformer ratio and transformer loss)
meas
V
=20log
o
-----V
i
e
50 Ω
V
; Vi=80dBµV
meas
signal
source
meas
V
RMS
voltmeter
N1
------- N2
50 Ω
5=
VHFINIFOUT1
V
i
D.U.T.
IFOUT2
TDA6404; TDA6405;
TDA6405A
T
(1)N1(2)
V
C
o
N2
V'
meas
spectrum
analyzer
50 Ω
MGK828
Fig.4 Voltage gain (Gv) measurement in the VHF band.
handbook, full pagewidth
e
(1) N1 is 2 × 5 turns
(2) N2 is 2 turns
V
V
G
; Vi=70dBµV
i=Vmeas
=V’
o
meas
= 20 log+1 dB (1 dB = correction for hybrid loss)
v
signal
source
50 Ω
V
V
RMS
voltmeter
50 Ω
50 Ω
N1
------- N2
meas
+ 16 dB (transformer ratio and transformer loss)
V
o
-----V
i
V
5=
i
A
HYBRID
B
(1)N1(2)
C
T
N2
V'
meas
spectrum
analyzer
50 Ω
MGK829
C
D
UHFIN1 IFOUT1
D.U.T.
IFOUT2UHFIN2
V
o
Fig.5 Voltage gain (Gv) measurement in the UHF band.
1999 Jan 1315
Page 16
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
handbook, full pagewidth
V
meas
unwanted
signal
source
50 Ω
AM = 30%
e
u
50 Ω
e
w
(1) N1 is 2 × 5 turns
(2) N2 is 2 turns
>> 50 Ω⇒Vi=2×V
Z
i
Wanted input signal V
Measured level of the unwanted output signal V
unwanted f
RF
wanted
= 50.75 MHz (404.75 MHz); Vou=V’
AC
HYBRID
BD
signal
source
; V’
meas
meas=Vo
=80dBµV at wanted fRF= 45.25 MHz (399.25 MHz).
i
−16 dB (transformer ratio and transformer loss)
V
50 Ω
RMS
voltmeter
VHFIN IFOUT1
V
i
50 Ω
causing 0,3% AM modulation in the wanted output signal;
ou
meas
+16dB.
D.U.T.
IFOUT2
N1
------- N2
TDA6404; TDA6405;
TDA6405A
V'
meas
FILTER
38.9 MHz
modulation
analyzer
50 Ω
MGL275
18 dB
T
(1)
N1
V
o
C
5=
N2
attenuator
(2)
V
RMS
voltmeter
Fig.6 Cross modulation measurement in the VHF band.
handbook, full pagewidth
V
meas
unwanted
signal
source
50 Ω
AM = 30%
e
u
50 Ω
e
w
(1) N1 is 2 × 5 turns
(2) N2 is 2 turns
V
i=Vmeas
Wanted input signal V
Measured level of the unwanted output signal V
unwanted f
wanted
source
; V’
meas=Vo
RF
AC
HYBRID
BD
signal
−16 dB (transformer ratio and transformer loss)
=70dBµV at fRF= 407.25 MHz (855.25 MHz).
i
= 412.75 MHz (860.75 MHz); Vou=V’
50
Ω
V
50 Ω
RMS
voltmeter
5=
+16dB.
UHFIN1 IFOUT1
D.U.T.
IFOUT2UHFIN2
V
o
AC
HYBRID
V
i
BD
50
Ω
N1
------- N2
causing 0,3% AM modulation in the wanted output signal;
ou
meas
18 dB
T
(1)
N1
C
attenuator
(2)
N2
V
RMS
voltmeter
FILTER
38.9 MHz
modulation
analyzer
50 Ω
MGL276
Fig.7 Cross modulation measurement in the UHF band.
1999 Jan 1316
Page 17
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
1. The pin numbers in parenthesis represent the TDA6405 and TDA6405A.
2. Not applicable.
1999 Jan 1325
Page 26
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
PACKAGE OUTLINE
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
c
y
Z
2815
TDA6404; TDA6405;
TDA6405A
SOT341-1
E
H
E
A
X
v M
A
pin 1 index
114
w M
b
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.0
0.21
0.05
1.80
1.65
0.25
b
0.38
0.25
p
cD
0.20
0.09
3
UNITA1A2A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
p
02.55 mm
scale
(1)E(1)(1)
10.4
10.0
eHELLpQZywv θ
5.4
0.651.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
1.03
0.9
0.63
0.7
(A )
L
p
L
0.130.10.2
A
3
θ
1.1
0.7
o
8
o
0
OUTLINE
VERSION
SOT341-1 MO-150AH
IEC JEDEC EIAJ
REFERENCES
1999 Jan 1326
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
Page 27
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
TDA6404; TDA6405;
TDA6405A
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Jan 1327
Page 28
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, SQFPnot suitablesuitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJsuitablesuitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
TDA6404; TDA6405;
TDA6405A
PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
1999 Jan 1329
Page 30
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
NOTES
TDA6404; TDA6405;
TDA6405A
1999 Jan 1330
Page 31
Philips SemiconductorsProduct specification
5 V mixer/oscillator-PLL synthesizers for
hyperband tuners
NOTES
TDA6404; TDA6405;
TDA6405A
1999 Jan 1331
Page 32
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands545004/750/02/pp32 Date of release: 1999 Jan 13Document order number: 9397 750 04901
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