Datasheet tda6404, tda 6405 DATASHEETS (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA6404; TDA6405; TDA6405A
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
Product specification Supersedes data of 1998 Jan 19 File under Integrated Circuits, IC02
1999 Jan 13
Page 2
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners

FEATURES

• Single chip 5 V mixer/oscillator-PLL synthesizer for hyperband tuners
• I2C-bus protocol
• 3 PNP band switch buffers (25 mA)
• 33 V tuning voltage output
• In-lock detector
• 5-level Analog-to-Digital Converter (ADC)
• 15-bit programmable divider
• Programmable reference divider ratio
(512, 640 or 1024)
• Programmable charge pump current
• Balanced mixer with a common emitter input for VHF
(single input)
• Balanced mixer with a common base input for UHF (double input)
• 4-pin common emitter oscillator for VHF
• 4-pin common emitter oscillator for UHF
• IF amplifier with a low output impedance to drive a SAW filter directly (≈2kΩ load)
• Low power, low radiation, small size

APPLICATIONS

• Hyperband tuners for Europe using a 2-band mixer/oscillator in a switched concept.

GENERAL DESCRIPTION

The TDA6404, TDA6405 and TDA6405A are programmable 2-band mixer/oscillator-PLL synthesizers intended for VHF/UHF and hyperband tuners (see Fig.1).
The devices include two double balanced mixers and two oscillators for the VHF and UHF band, an IF amplifier and a PLL synthesizer. With proper oscillator application and by using a switchable inductor to split the VHF band into two sub-bands (the full VHF/UHF and hyperband) the TV bands can be covered.
TDA6404; TDA6405;
TDA6405A
The PLL synthesizer consists of a divide-by-eight prescaler, a 15-bit programmable divider, a 4 MHz crystal oscillator and its programmable reference divider and a phase comparator combined with a charge pump which drives the tuning amplifier, including 33 V output.
Depending on the reference divider ratio (512, 640 or 1024), the phase comparator operates at 7.8125 kHz,
6.25 kHz or 3.90625 kHz.
2
The devices are controlled according to the I format. The in-lock detector bit FL is set to logic 1 when the loop is locked and is read on the SDA line (status byte) during a read operation. The ADC input is available for digital Automatic Frequency Control (AFC). The ADC code is read during a read operation on the I2C-bus (see Table 9). In test mode, pin ADC is used as a test output for f
When the charge pump current switch mode is activated and the loop is phase-locked the charge pump current value is automatically switched to LOW. This is to improve carrier-to-noise ratio. The status of this feature can be read in the ACPS flag during a read operation on the I2C-bus (see Table 7).
Five serial bytes (including address byte) are required for the I2C-bus format to address the devices, select the VCO frequency, program the three PNP ports, set the charge pump current and to set the reference divider ratio. The devices have four independent I2C-bus addresses which can be selected by applying a specific voltage on the AS input (see Table 4).
REF
and1⁄2f
DIV
.
C-bus
Two pins are available between the mixer output and the IF amplifier input to enable IF filtering for improved signal handling. Three PNP ports are provided for band switching. Band selection is made according to the band switch bits VHFL, VHFH and UHF.
1999 Jan 13 2
Page 3
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CC
I
CC
f
XTAL
I
o(PNP)
T
stg
T
amb
f
(i)RF
supply voltage operating 4.5 5 5.5 V supply current all PNP ports are ‘OFF’ − 78 − mA crystal oscillator frequency R
= 25 to 150 Ω 3.2 4.0 4.48 MHz
XTAL
PNP port output current −−25 mA IC storage temperature −40 − +150 °C operating ambient temperature −20 − +85 °C RF input frequency VHF band 45.25 − 399.25 MHz
UHF band 407.25 − 855.25 MHz
G
V
voltage gain VHF band − 27 − dB
UHF band − 38 − dB
F noise figure VHF band − 8 − dB
UHF band − 8.5 − dB
V
o
output voltage causing 1% cross modulation in channel
VHF band − 119 − dBµV UHF band − 118 − dBµV

ORDERING INFORMATION

TYPE
NUMBER
NAME DESCRIPTION VERSION
TDA6404TS; TDA6405TS;
SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
TDA6405ATS
PACKAGE
1999 Jan 13 3
Page 4
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners

BLOCK DIAGRAM

IFFIL1
handbook, full pagewidth
XTAL
3 (26)
4 (25)
1 (28) 2 (27)
16 (13)
VHFIN
RFGND
UHFIN1 UHFIN2
BS
RF INPUT
VHF
BSVHF
ELECTRONIC
BAND SWITCH
BSUHF
RF INPUT
UHF
XTAL
OSCILLATOR
4 MHz
IFFIL2
5 (24) 17 (12)
6 (23)
VHF
MIXER
UHF
MIXER
f
REFERENCE
DIVIDER
512, 640, 1024
REF
DIGITAL
PHASE
COMPARATOR
TDA6404; TDA6405;
TDA6405A
V
CC
BSVHF
BSUHF
CHARGE
PUMP
VHF
OSCILLATOR
IF
AMPLIFIER
UHF
OSCILLATOR
TUNING AMPLIFIER
(4) 25 (3) 26 (2) 27 (1) 28
(11) 18
(10) 19
(5) 24 (6) 23 (7) 22 (8) 21
(15) 14
(14) 15
VHFOSCIB1 VHFOSCOC1 VHFOSCOC2 VHFOSCIB2
IFOUT1
IFOUT2
UHFOSCIB2 UHFOSCOC2 UHFOSCOC1 UHFOSCIB1
CP
VT
f
DIV
1/2f
DIV
f
1/2f
REF
DIV
GATE
13 (16) 7 (22) 8 (21) 9 (20)
ADC
SCL
SDA
AS
12 (17) 11 (18) 10 (19)
PRESCALER
DIVIDE BY 8
POWER-ON
RESET
SCL SDA AS
5-LEVEL A/D
CONVERTER
RSA
15-BIT
PROGRAMMABLE
DIVIDER
15-BIT
FREQUENCY
REGISTER
FL
I2C-BUS
TRANSCEIVER
RSB
FL
The pin numbers in parenthesis represent the TDA6405 and TDA6405A.
IN-LOCK
DETECTOR
FL
T2, T1, T0
T2, T1, T0
CHP
TDA6404 TDA6405
TDA6405A
7-BIT CONTROL
T2 T1 T0 RSA RSB OSCHP
3-BIT BAND SWITCH
VHFL VHFH UHF
V
CC
PVHFL
OS
REGISTER
REGISTER
PVHFH
LOGIC
PUHF
BS
(9) 20
MGK813
GND
Fig.1 Block diagram.
1999 Jan 13 4
Page 5
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for
TDA6404; TDA6405;
hyperband tuners

PINNING

PIN
SYMBOL
UHFIN1 1 28 UHF input 1 UHFIN2 2 27 UHF input 2 VHFIN 3 26 VHF input RFGND 4 25 RF ground IFFIL1 5 24 IF filter output 1 IFFIL2 6 23 IF filter output 2 PVHFL 7 22 PNP port output for VHF low band PVHFH 8 21 PNP port output for VHF high band PUHF 9 20 PNP port output for UHF band AS 10 19 address selection input SDA 11 18 serial data input/output (I SCL 12 17 serial clock input (I ADC 13 16 Analog-to-Digital Converter input/output CP 14 15 charge pump output VT 15 14 tuning output XTAL 16 13 crystal oscillator input V
CC
IFOUT1 18 11 IF amplifier output 1 IFOUT2 19 10 IF amplifier output 2 GND 20 9 ground UHFOSCIB1 21 8 UHF oscillator base input 1 UHFOSCOC1 22 7 UHF oscillator collector output 1 UHFOSCOC2 23 6 UHF oscillator collector output 2 UHFOSCIB2 24 5 UHF oscillator base input 2 VHFOSCIB1 25 4 VHF oscillator base input 1 VHFOSCOC1 26 3 VHF oscillator collector output 1 VHFOSCOC2 27 2 VHF oscillator collector output 2 VHFOSCIB2 28 1 VHF oscillator base input 2
TDA6404
17 12 supply voltage
TDA6405;
TDA6405A
DESCRIPTION
2
2
C-bus)
C-bus)
TDA6405A
1999 Jan 13 5
Page 6
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
handbook, halfpage
UHFIN1 UHFIN2
VHFIN
RFGND
IFFIL1 IFFIL2
PVHFL
PVHFH
PUHF
AS
SDA
SCL
ADC
CP
1 2 3 4 5 6 7 8
9 10 11 12 13
TDA6404
MGK830
VHFOSCIB2
28
VHFOSCOC2
27
VHFOSCOC1
26
VHFOSCIB1
25
UHFOSCIB2
24 23
UHFOSCOC2 UHFOSCOC1
22 21
UHFOSCIB1 GND
20
IFOUT2
19
IFOUT1
18
V
17
CC
XTAL
16 1514
VT
handbook, halfpage
VHFOSCIB2 VHFOSCOC2 VHFOSCOC1
VHFOSCIB1
UHFOSCIB2 UHFOSCOC2 UHFOSCOC1
UHFOSCIB1
GND IFOUT2 IFOUT1
V
CC
XTAL
VT
TDA6404; TDA6405;
TDA6405A
1 2 3 4 5 6 7
TDA6405
TDA6405A
8
9 10 11 12 13
MGK831
28 27 26 25 24 23 22 21 20 19 18 17 16 1514
UHFIN1 UHFIN2 VHFIN RFGND IFFIL1 IFFIL2 PVHFL PVHFH PUHF AS SDA SCL ADC CP
Fig.2 Pin configuration for TDA6404.

FUNCTIONAL DESCRIPTION

The devices are controlled via the I2C-bus. For programming, there is one module address (7 bits) and the R/W bit for selecting the read or write mode.
Write mode
Data bytes can be sent to the devices after the address transmission (first byte) by setting the R/
W bit to logic 0. Four data bytes are needed to fully program the devices. The I2C-bus transceiver has an auto-increment facility which permits the programming of the devices within one single transmission (address + 4 data bytes).
The devices can also be partially programmed, providing that the first data byte following the address is divider byte 1 (DB1) or control byte (CB). The bits in the data bytes are defined in Tables 1 and 2.
Fig.3 Pin configuration for TDA6405(A)
The first bit of the data byte transmitted indicates whether frequency data (first bit = 0) or control and band switch data (first bit = 1) will follow. Until an I
2
C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the devices. The frequency register is loaded after the 8th clock pulse of the second divider byte (DB2). The control register is loaded after the 8th clock pulse of the CB. The band switch register is loaded after the 8th clock pulse of the band switch byte (BB).
1999 Jan 13 6
Page 7
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
Table 1 I2C-bus mode, write data format for the TDA6404 and TDA6405
NAME BYTE
Address byte ADB 11000MA1MA0R/ Divider byte 1 DB1 0 N14 N13 N12 N11 N10 N9 N8 A Divider byte 2 DB2 N7 N6 N5 N4 N3 N2 N1 N0 A Control byte CB 1 CHP T2 T1 T0 RSA RSB OS A Band-switch byte BB XXXXXUHFVHFH VHFL A
2
Table 2 I
Address byte ADB 11000MA1MA0R/ Divider byte 1 DB1 0 N14 N13 N12 N11 N10 N9 N8 A Divider byte 2 DB2 N7 N6 N5 N4 N3 N2 N1 N0 A Control byte CB 1 CHP T2 T1 T0 RSA RSB OS A Band-switch byte BB XXXXUHFXVHFH VHFL A
C-bus mode, write data format for the TDA6405A
NAME BYTE
MSB LSB
MSB LSB
BITS
BITS
TDA6404; TDA6405;
TDA6405A
W=0 A
W=0 A
ACK
ACK
2
C-bus address selection
I
The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several synthesizers (up to 4) in one system by applying a specific voltage on the AS input. The relationship between MA1 and MA0 and the input voltage applied to the AS input is given in Table 4.
Table 3 Description of symbols used in Tables 1 and 2
SYMBOL DESCRIPTION
A acknowledge MA1 and MA0 programmable address bits (see Table 4) N14 to N0 programmable divider bits; N = N14 × 2 CHP charge pump current bit:
CHP = 0; ICP=60µA
CHP = 1; I T2, T1 and T0 test bits (see Table 5) RSA and RSB reference divider ratio select bits (see Table 6) OS tuning amplifier control bit:
OS = 0; normal operation; tuning voltage is ‘ON’
OS = 1; tuning voltage is ‘OFF’ (high-impedance) UHF, VHFH and VHFL PNP ports control bits:
bit = 0; buffer n is ‘OFF’ (default)
bit = 1; buffer n is ‘ON’ X don’t care bit: may be a logic 0 or a logic 1
= 280 µA (default)
CP
14
+ N13 × 213+ ... + N1 × 21+N0
1999 Jan 13 7
Page 8
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
Table 4 Address selection I2C-bus
MA1 MA0 VOLTAGE APPLIED ON AS INPUT
0 0 0 to 0.1V 0 1 open or 0.2VCCto 0.3V 1 0 0.4VCCto 0.6V 1 1 0.9VCCto 1.0V
Table 5 Test mode
T2 T1 T0 TEST MODES
0 0 0 automatic charge pump off 0 0 1 automatic charge pump on; note 1 0 1 X charge pump is ‘OFF’ 1 1 0 charge pump is sinking current 1 1 1 charge pump is sourcing current 100f 101
CC
REF
1
⁄
2
CC CC CC
is available on pin ADC; note 2
f
is available on pin ADC; note 2
DIV
TDA6404; TDA6405;
TDA6405A
Notes
1. This is the default mode at Power-on reset.
2. The ADC input cannot be used when these test modes are active.
Table 6 Reference divider ratio select bits
RSA RSB REFERENCE DIVIDER RATIO FREQUENCY STEP (kHz)
X 0 640 6.25 0 1 1024 3.90625 1 1 512 7.8125
Read mode
Data can be read from the devices by setting the R/W bit to logic 1 (see Tables 7 and 8). After the slave address has been recognized, the devices generate an acknowledge pulse and the first data byte (status byte) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a HIGH-level of the SCL clock signal. A second data byte can be read from the devices if the
The ACPS flag is LOW when the automatic charge pump switch mode is ‘ON’ and the loop is locked. In other conditions, ACPS = 1. When ACPS = 0, the charge pump current is forced to the LOW value.
A built-in ADC is available on ADC pin. This converter can be used to apply AFC information to the controller from the IF section of the television. The relationship between the
bits A2, A1 and A0 is given in Table 9. processor generates an acknowledge on the SDA line (master acknowledge). End of transmission will occur if no master acknowledge occurs. The devices will then release the data line to allow the processor to generate a STOP condition. The POR flag is set to logic 1 at power-on. The flag is reset when an end-of-data is detected by the devices (end of a read sequence). Control of the loop is made possible with the in-lock flag FL which indicates when the loop is locked (FL = 1).
1999 Jan 13 8
Page 9
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A
Table 7 Read data format
BITS
NAME BYTE
Address byte ADB 1 1000MA1MA0R/
MSB
(1)
LSB
W=1 A
Status byte SB POR FL ACPS 1 1 A2 A1 A0 −
Note
1. MSB is transmitted first.
Table 8 Description of symbols used in Table 7
SYMBOL DESCRIPTION
A acknowledge POR Power-on reset flag (POR = 1 at power-on) FL in-lock flag (FL = 1 when the loop is locked) ACPS automatic charge pump switch flag:
ACPS = 0; active ACPS = 1; not active
A2, A1 and A0 digital outputs of the 5-level ADC (see Table 9)
ACK
Table 9 Analog-to-digital converter levels; note 1
A2 A1 A0 VOLTAGE APPLIED ON ADC INPUT
1 0 0 0.60V 0 1 1 0.45VCCto 0.60V 0 1 0 0.30VCCto 0.45V 0 0 1 0.15VCCto 0.30V 0 0 0 0 to 0.15V
Note
1. Accuracy is ±0.03V
CC
.
Power-on reset
The power-on detection threshold voltage V
POR
is set to VCC= 2 V at room temperature. Below this threshold, the device is reset to the power-on state.
At power-on state, the charge pump current is set to 280 µA, the tuning voltage output is disabled, the test bits T2, T1 and T0 are set to logic 001 (automatic charge pump switch ‘ON’) and RSB is set to logic 1.
to 1.00V
CC
CC CC CC CC
CC
PUHF is ‘OFF’, which means that the UHF oscillator and the UHF mixer are switched off. Consequently, the VHF oscillator and the VHF mixer are switched on. PVHFL and PVHFH are ‘OFF’, which means that the VHF tank circuit is working in the VHF I sub-band. The tuning amplifier is switched off until the first transmission. In that case, the tank circuit in VHF I is supplied with the maximum tuning voltage. The oscillator is therefore working at the end of the VHF I sub-band.
1999 Jan 13 9
Page 10
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A
Table 10 Default bits at Power-on reset
BITS
NAME BYTE
MSB LSB
Address byte ADB 11000MA1MA0X Divider byte 1 DB1 0 XXXXXXX Divider byte 2 DB2 XXXXXXXX Control byte CB 11001X10 Band-switch byte BB XXXX0000

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134) (note 1).
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
V
O(n)
I
O(n)
V
O(CP
V
O(VT)
V
I/O(ADC)
V
I(SCL)
V
I/O(SDA)
I
O(SDA)
V
I(AS)
V
I(XTAL)
I
O(n)
supply voltage −0.3 +6 V output voltage on pins PVHFL, PVHFH and PUHF −0.3 +6 V output current on pins PVHFL, PVHFH and PUHF −1 +30 mA
) charge pump output voltage −0.3 +6 V
tuning output voltage −0.3 +35 V ADC input/output voltage −0.3 +6 V serial clock input voltage −0.3 +6 V serial data input/output voltage −0.3 +6 V data output current −1 +10 mA address selection input voltage −0.3 +6 V crystal oscillator input voltage −0.3 +6 V output current of each pin to ground:
for TDA6404, pins 1 to 6 and 17 to 28 −−10 mA for TDA6405 and TDA6405A, pins 1 to 12 and 23 to 28 −−10 mA
t
sc(max)
T
stg
T
amb
T
j
maximum short-circuit time (all pins to VCC and all pins to GND, RFGND) − 10 s IC storage temperature −40 +150 °C operating ambient temperature −20 +85 °C junction temperature − 150 °C
Note
1. Maximum ratings can not be exceeded, not even momentarily without causing irreversible IC damage.
Maximum ratings can not be accumulated.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 85 K/W
1999 Jan 13 10
Page 11
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A

CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply (T
V
CC
I
CC
=25°C)
amb
supply voltage 4.5 5 5.5 V supply current at VCC= 5 V all PNP ports are ‘OFF’ − 78 86 mA
one PNP port is ‘ON’, sourcing 25 mA − 110 121 mA
PLL Synthesizer part (V
F
UNCTIONAL RANGE
V
POR
Power-on reset voltage below this supply voltage Power-on
= 4.5 to 5.5 V; T
CC
= −20 to +85 °C; unless otherwise specified)
amb
1.5 2.0 − V
reset becomes active; see Table 10 D/D divider ratio 15-bit frequency word 256 − 32767 f
XTAL
Z
XTAL
crystal oscillator frequency R
input impedance f
= 25 to 150 Ω 3.2 4 4.48 MHz
XTAL
= 4 MHz 600 1200 −Ω
XTAL
PNP PORTS I
L(off)
V
O(sat)
leakage current VCC= 5.5 V; V
=0 −10 −−µA
PNPn
output saturation voltage one PNP port is ‘ON’, sourcing 25 mA;
V
PNPn(sat)=VCC
− V
PNPn
− 0.25 0.4 V
ADC INPUT V
I
I
IH
I
IL
ADC input voltage see Table 9 0 − V HIGH-level input current V LOW-level input current V
ADC=VCC
=0 −10 −−µA
ADC
−−10 µA
CC
V
ADDRESS SELECTION INPUT (AS) V
IL
V
IH
I
IH
I
IL
LOW-level input voltage 0 − 1.5 V HIGH-level input voltage 3 − 5.5 V HIGH-level input current VAS= 5.5 V −−10 µA
LOW-level input current VAS=0 −10 −−µA SCL AND SDA INPUTS V
IL
V
IH
I
IH
I
IL
f
SCL
LOW-level input voltage 0 − 1.5 V
HIGH-level input voltage 3.0 − 5.5 V
HIGH-level input current V
LOW-level input current V
= 5.5 V; VCC=0 −−10 µA
bus
V
= 5.5 V; VCC= 5.5 V −−10 µA
bus
= 1.5 V; VCC=0 −−10 µA
bus
V
= 0; VCC= 5.5 V −10 −−µA
bus
serial clock frequency − 100 150 kHz SDA OUTPUT I
L
V
O
leakage current V
output voltage I
= 5.5 V −−10 µA
SDA
= 3 mA (sink current) −−0.4 V
SDA
1999 Jan 13 11
Page 12
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
CHARGE PUMP OUTPUT (CP)
HIGH-level input current CHP = 1 − 280 −µA
I
IH
I
LOW-level input current CHP = 0 − 60 −µA
IL
V
O
I
L(off)
output voltage PLL is locked; T
=25°C − 1.95 − V
amb
off-state leakage current T2 = 0; T1 = 1 −15 −0.5 +15 nA TUNING VOLTAGE OUTPUT (VT) I
L(off)
V
O
Mixer/oscillator part (V
IF
AMPLIFIER
S
22
R
s
L
s
off-state leakage current OS = 1; tuning supply = 33 V −−10 µA
output voltage when the
loop is closed
=5V; T
CC
OS = 0; T2 = 0; T1 = 0; T0 = 1;
0.2 − 32.7 V
RL=27kΩ; tuning supply = 33 V
=25°C; unless otherwise specified); measured in Fig.11
amb
output reflection coefficient magnitude at 36.15 MHz; Zo=50Ω− −12.5 − dB
phase at 36.15 MHz; Z
=50Ω−1.41 − deg
o
real part of Zo=Rs+jωLsRs at 36.15 MHz − 81 −Ω
imaginary part of
Zo=Rs+jωL
s
Ls at 36.15 MHz − 9.5 − nH
VHF MIXER (INCLUDING IF AMPLIFIER) f
i(RF)
F noise figure f
g
os
g
i
C
i
V
o
V
i
RF input frequency picture carrier frequency 45.25 − 399.25 MHz
= 50 MHz; see Figs 8 and 9 − 79dB
RF
f
= 150 MHz; see Figs 8 and 9 − 810dB
RF
= 300 MHz; − 911dB
f
RF
optimum source
conductance for noise
figure
fRF= 50 MHz − 0.7 − mS f
= 150 MHz − 0.9 − mS
RF
= 300 MHz − 1.5 − mS
f
RF
input conductance fRF= 45.25 MHz − 0.25 − mS
f
= 399.25 MHz − 0.5 − mS
RF
input capacitance fRF= 45.25 to 399.25 MHz − 2 − pF
output voltage causing 1%
cross modulation in
channel
input voltage causing
fRF= 45.25 MHz; see Fig.6 116 119 − dBµV
= 399.25 MHz; see Fig.6 116 119 − dBµV
f
RF
fRF= 399.25 MHz; note 1 − 88 − dBµV
pulling in channel (750 Hz) G
V
voltage gain fRF= 45.25 MHz; see Fig.4 24.5 27 29.5 dB
f
= 399.25 MHz; see Fig.4 24.5 27 29.5 dB
RF
VHF OSCILLATOR f
∆f
osc
osc(V)
oscillator frequency 84.15 − 438.15 MHz
oscillator frequency shift
with supply voltage
∆VCC= 5%; worst case in the frequency range; note 2
∆V
= 10%; worst case in the
CC
− 100 200 kHz
− 200 − kHz
frequency range; note 2
1999 Jan 13 12
Page 13
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
∆f
osc(T)
∆f
osc(t)
Φ
osc
RSC
oscillator frequency drift
with temperature
oscillator frequency drift
with time
phase noise, carrier to
noise sideband
ripple susceptibility of V
(p-p)
(peak-to-peak value)
∆T=25°C with compensation; worst case in the frequency range; note 3
with compensation; worst case in the frequency range; note 4
±100 kHz frequency offset; worst case in the frequency range
VCC= 5 V; worst case in the frequency
CC
range; ripple frequency 500 kHz; note 5
− 1300 2000 kHz
− 600 900 kHz
− 106 − dBc/Hz
15 40 − mV
UHF MIXER (INCLUDING IF AMPLIFIER) f
i(RF)
F noise figure f
RF input frequency picture carrier frequency 407.25 − 855.25 MHz
= 407.25 MHz; not corrected for
RF
− 810dB
image; see Fig.10 f
= 855.25 MHz; not corrected for
RF
− 911dB
image; see Fig.10
R
s
L
s
V
o
V
i
real part of Zi=Rs+jωLsfRF= 407.25 MHz − 30 −Ω
= 855.25 MHz − 38 −Ω
f
RF
imaginary part of
Zi=Rs+jωL
s
output voltage causing 1%
cross modulation in
channel
input voltage causing
fRF= 407.25 MHz − 9 − nH f
= 855.25 MHz − 6 − nH
RF
fRF= 407.25 MHz; see Fig.7 116 119 − dBµV f
= 855.25 MHz; see Fig.7 114 117 − dBµV
RF
fRF= 855.25 MHz; note 1 − 78 − dBµV
pulling in channel (750 Hz) G
V
voltage gain fRF= 407.25 MHz; see Fig.5 35 38 41 dB
f
= 855.25 MHz; see Fig.5 35 38 41 dB
RF
UHF OSCILLATOR f
∆f
osc
osc(V)
oscillator frequency 446.15 − 894.15 MHz
oscillator frequency shift
with supply voltage
∆VCC= 5%; worst case in the frequency range; note 2
= 10%; worst case in the
∆V
CC
− 30 80 kHz
− 80 − kHz
frequency range; note 2
∆f
osc(T)
∆f
osc(t)
Φ
osc
RSC
oscillator frequency drift
with temperature
oscillator frequency drift
with time
phase noise, carrier to
noise sideband
ripple susceptibility of V
(p-p)
(peak-to-peak value)
∆T=25°C; with compensation; worst case in the frequency range; note 3
with compensation; worst case in the frequency range; note 4
±100 kHz frequency offset; worst case in the frequency range
VCC= 5 V; worst case in the frequency
CC
range; ripple frequency 500 kHz; note 5
− 600 1000 kHz
− 200 400 kHz
− 106 − dBc/Hz
15 20 − mV
1999 Jan 13 13
Page 14
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
EJECTION AT THE IF AMPLIFIER OUTPUT
INT
DIF
level of divider
note 6 − 20 − dBµV interferences in the IF signal
INTR
crystal oscillator
XTAL
note 7 60 −−dBc interferences rejection
INTRF
reference frequency
REF
note 8 50 −−dBc rejection
INT INT
CHX S02
channel x beat note 9 60 −−dBc S02 beat note 10 66 −−dBc
Notes
1. This is the level of the RF signal (100% amplitude modulated with 11.89 kHz) that causes a 750 Hz frequency deviation on the oscillator signal; it produces sidebands 30 dB below the level of the oscillator signal.
2. The frequency shift is defined as the change of the oscillator frequency when the supply voltage varies from VCC= 5 to 4.75 V (4.5 V) or from VCC= 5 to 5.25 V (5.5 V). The oscillator is free-running during this measurement.
3. The frequency drift is defined as the change of the oscillator frequency when the ambient temperature varies from T
=25to0°C or from T
amb
=25to50°C. The oscillator is free-running during this measurement.
amb
4. The switching on drift is defined as the change of the oscillator frequency between 5 seconds and 15 minutes after switching on. The oscillator is free-running during this measurement.
5. The ripple susceptibility is measured for a 500 kHz ripple at the IF amplifier output using the measurement circuit; the level of the ripple signal is increased until a difference of 53.5 dB between the IF carrier set at 100 dBµV and the sideband components is reached.
6. This is the level of divider interferences close to the IF frequency. For example: Ch S1: f Ch S2: f Ch S14: f
= 144.15 MHz and1⁄4f
osc
= 151.15 MHz and1⁄4f
osc
= 291.15 MHz and1⁄8f
osc
= 36.0375 MHz.
osc
= 37.7875 MHz.
osc
= 36.39375 MHz.
osc
The VHF RF input must be left open (i.e. not connected to any load or cable). The UHF RF inputs are connected to a hybrid.
7. Crystal oscillator interference means the 4 MHz sidebands caused by the crystal oscillator. The rejection should be >60 dB for an IF output signal of 100 dBµV.
8. The reference frequency rejection is the level of reference frequency sidebands related to the sound subcarrier. The rejection should be >50 dB for an IF output signal of 100 dBµV, f
= 7.8125 kHz.
REF
9. Channel x beat: picture carrier frequency (69.25 MHz) and sound carrier frequency (74.75 MHz) both at 80 dBµV, f
at 108.15 MHz. The rejection of the interfering product RF picture carrier frequency + RF sound carrier
osc
frequency − f
10. Channel S02: picture carrier frequency is 76.25 MHz at 80 dBµV, f The rejection of f
at 35.85 MHz should be >60 dB.
osc
− 2 × fIF= 37.35 MHz should be >66 dB.
osc
= 115.15 MHz.
osc
1999 Jan 13 14
Page 15
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners

TEST AND APPLICATION INFORMATION

handbook, full pagewidth
(1) N1 is 2 × 5 turns (2) N2 is 2 turns Z
>> 50 Ω⇒Vi=2×V
i
V
=V’
o
G
v
+ 16 dB (transformer ratio and transformer loss)
meas
V
=20log
o
-----­V
i
e
50 Ω
V
; Vi=80dBµV
meas
signal source
meas
V
RMS
voltmeter
N1
------- ­N2
50 Ω
5=
VHFIN IFOUT1
V
i
D.U.T.
IFOUT2
TDA6404; TDA6405;
TDA6405A
T
(1)N1(2)
V
C
o
N2
V'
meas
spectrum analyzer
50 Ω
MGK828
Fig.4 Voltage gain (Gv) measurement in the VHF band.
handbook, full pagewidth
e
(1) N1 is 2 × 5 turns (2) N2 is 2 turns V
V
G
; Vi=70dBµV
i=Vmeas
=V’
o
meas
= 20 log +1 dB (1 dB = correction for hybrid loss)
v
signal source
50 Ω
V
V
RMS
voltmeter
50 Ω
50 Ω
N1
------- ­N2
meas
+ 16 dB (transformer ratio and transformer loss) V
o
-----­V
i
V
5=
i
A
HYBRID
B
(1)N1(2)
C
T
N2
V'
meas
spectrum analyzer
50 Ω
MGK829
C
D
UHFIN1 IFOUT1
D.U.T.
IFOUT2UHFIN2
V
o
Fig.5 Voltage gain (Gv) measurement in the UHF band.
1999 Jan 13 15
Page 16
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
handbook, full pagewidth
V
meas
unwanted
signal
source
50 Ω
AM = 30%
e
u
50 Ω
e
w
(1) N1 is 2 × 5 turns (2) N2 is 2 turns
>> 50 Ω⇒Vi=2×V
Z
i
Wanted input signal V Measured level of the unwanted output signal V unwanted f
RF
wanted
= 50.75 MHz (404.75 MHz); Vou=V’
AC
HYBRID
BD
signal
source
; V’
meas
meas=Vo
=80dBµV at wanted fRF= 45.25 MHz (399.25 MHz).
i
−16 dB (transformer ratio and transformer loss)
V
50 Ω
RMS
voltmeter
VHFIN IFOUT1
V
i
50 Ω
causing 0,3% AM modulation in the wanted output signal;
ou
meas
+16dB.
D.U.T.
IFOUT2
N1
------- ­N2
TDA6404; TDA6405;
TDA6405A
V'
meas
FILTER
38.9 MHz
modulation analyzer
50 Ω
MGL275
18 dB
T
(1)
N1
V
o
C
5=
N2
attenuator
(2)
V
RMS
voltmeter
Fig.6 Cross modulation measurement in the VHF band.
handbook, full pagewidth
V
meas
unwanted
signal
source
50 Ω
AM = 30%
e
u
50 Ω
e
w
(1) N1 is 2 × 5 turns (2) N2 is 2 turns
V
i=Vmeas
Wanted input signal V Measured level of the unwanted output signal V unwanted f
wanted
source
; V’
meas=Vo
RF
AC
HYBRID
BD
signal
−16 dB (transformer ratio and transformer loss)
=70dBµV at fRF= 407.25 MHz (855.25 MHz).
i
= 412.75 MHz (860.75 MHz); Vou=V’
50
Ω
V
50 Ω
RMS
voltmeter
5=
+16dB.
UHFIN1 IFOUT1
D.U.T.
IFOUT2UHFIN2
V
o
AC
HYBRID
V
i
BD
50
Ω
N1
------- ­N2
causing 0,3% AM modulation in the wanted output signal;
ou
meas
18 dB
T
(1)
N1
C
attenuator
(2)
N2
V
RMS
voltmeter
FILTER
38.9 MHz
modulation analyzer
50 Ω
MGL276
Fig.7 Cross modulation measurement in the UHF band.
1999 Jan 13 16
Page 17
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
handbook, full pagewidth
C1
BNC BNC
L1 C2
(a) For fRF= 50 MHz: VHF mixer frequency response measured = 57 MHz; loss = 0 dB. Image suppression = 16 dB. C1 = 9 pF;C2= L1 = 7 turns (Ø 5.5 mm; wire Ø = 0.5 mm). I1 = semi rigid cable (RIM): 5 cm long. (semi rigid cable (RIM); 33 dB/100 m;
15 pF.
I1
RIM-RIM
PCB
plug plug
(a) (b)
50 Ω; 96 pF/m)
.
TDA6404; TDA6405;
TDA6405A
I3
C3
I2
C4
(b) For fRF= 150 MHz: VHF mixer frequency response measured = 150.3 MHz; loss = 1.3 dB. Image suppression = 13 dB. C3 = 5 pF; C4 = 25 pF. I2 = semi rigid cable (RIM): 30 cm long. I3 = semi rigid cable (RIM): 5 cm long (semi rigid cable (RIM); 33 dB/100 m; 50 Ω; 96 pF/m).
RIM-RIM
PCB
MBE286 - 1
handbook, full pagewidth
Fig.8 Input circuit for optimum noise figure in the VHF band.
NOISE
SOURCE
BNC
RIM
INPUT
CIRCUIT
VHFIN
IFOUT1
D.U.T.
IFOUT2
T
C
NOISE
FIGURE
METER
MGL277
F=F
− loss (of input circuit) (dB).
meas
Fig.9 Noise figure (F) measurement in the VHF band.
1999 Jan 13 17
Page 18
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
handbook, full pagewidth
NOISE
SOURCE
50 Ω
A
HYBRID
B
UHFIN1
C
D
UHFIN2
D.U.T.
IFOUT2
IFOUT1
TDA6404; TDA6405;
TDA6405A
T
C
NOISE
FIGURE
METER
MGL278
Loss (in hybrid) = 1 dB. F=F
− loss (in hybrid).
meas
Fig.10 Noise figure (F) measurement in the UHF band.
1999 Jan 13 18
Page 19
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
andbook, full pagewidth
C1P1
UHFIN1
J7
UHFIN2
VHFIN
RFGND
IFFIL1
IFFIL2
PVHFL
PVHFH
PUHF
SDA
SCL
ADC
1 (28)
2 (27)
3 (26)
4 (25)
5 (24)
6 (23)
7 (22)
TDA6404
(TDA6405)
(TDA6405A)
8 (21)
9 (20)
AS
10 (19)
11 (18)
12 (17)
13 (16)
CP
14 (15)
C25
100 nF
R19 330 Ω
D5
VHFL
LED-3R
VHFH
D6
LED-3Y
D7
UHF
LED-3G
for test purpose only
J5
TR1
BC847B
R17
1.2 kΩ
10 µF
C27 C28
(16 V)
R22
50 Ω
P9
V
ripple
R8
330 Ω
R10
330 Ω
R11
330 Ω
V
CC
+V
CC
10 µF (16 V)
UHF1
UHF2
VHF
L3
TOKO 7 km
L value/C value
6
4
J1
J2
J3
J4
UHF
VHFL
VHFH
V
CC
123456
P7
SCL
GND
1 nF
P2
C3
1 nF
P3
C6
1 nF
7
15 pF
1
C11
2
C13
3
15 pF
8
PLL
R12
330 Ω
R13
330 Ω
P5
SDA
+5 V
(1) 28
(2) 27
(3) 26
(4) 25
(5) 24
(6) 23
(7) 22
(8) 21
(9) 20
(10) 19
(11) 18
(12) 17
(13) 16
(14) 15
J6
for test purpose only
VHFOSCIB2
VHFOSCOC2
VHFOSCOC1
VHFOSCIB1
UHFOSCIB2
UHFOSCOC2
UHFOSCOC1
UHFOSCIB1
GND
IFOUT2
IFOUT1
V
CC
XTAL
VT
R15 33 kΩ
R18 1 kΩ
C29 10 nF
R20 68 kΩ
C19
1 nF C20
1 nF
4 MHz
C26
2.2 nF
X1
C2D1BB149
150 pF
C4
2.2 pF C7
R21 R2
2.2 pF C8
2.2 pF
C12
1 pF C14
1 pF C16
1 pF C17
1 pF
80 nH
80 nH
C23
18 pF
TR2 BC847B
TDA6404; TDA6405;
TDA6405A
L1
1 µH
L2
D2
30 nH
BB152
C5
4.7 nF
C9
L4
100
80 nH
pF
22
22
kΩ
kΩ
D4 BB149
C18 10 pF
L9
L8
C22
10 nF
V
CC
P10
f
REF
C10
4.7 nF
R6 22 kΩ
C15
47 pF
for test purpose only
1 2
C21 18 pF
3 L7
P6
+V
1234
+V
AGND
+33 V
CC
R1 1.5 kΩ
R3 22 kΩ
D3
R4 1.5 kΩ
BA792
R5 2.7 kΩ
R7
22 kΩ
L5 16 nH
L6 30 nH
R9
4.7 kΩ
P4
7
6
OUT
4
8
CC
P8
+5 V
MGK812
VHFL
IF
C24
10 nF
VHFH
C30
4.7 nF
R14 22 kΩ
R16 22 kΩ
The pin numbers in parenthesis represent the TDA6405 and TDA6405A.
Fig.11 Measurement circuit.
1999 Jan 13 19
Page 20
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
Component values for measurement circuit Table 11 Capacitors (all SMD and NP0 unless otherwise
specified)
COMPONENT VALUE
C1 1 nF C2 150 pF C3 1 nF C4 2.2 pF (N750) C5 4.7 nF C6 1 nF C7 2.2 pF (N750) C8 2.2 pF (N750) C9 100 pF (N750) C10 4.7 nF C11 15 pF C12 1 pF (N750) C13 15 pF C14 1 pF (N750) C15 47 pF C16 1 pF (N750) C17 1 pF (N750) C18 10 pF (N750) C19 1 nF C20 1 nF C21 18 pF C22 10 nF C23 18 pF C24 10 nF C25 100 nF C26 2.2 nF C27 10 µF (16 V; electrolytic) C28 10 µF (16 V; electrolytic) C29 10 nF C30 4.7 nF
TDA6404; TDA6405;
TDA6405A
Table 12 Resistors (all SMD)
COMPONENT VALUE
R1 1.5 kΩ R2 22 kΩ R3 22 kΩ R4 1.5 kΩ R5 2.7 kΩ R6 22 kΩ R7 22 kΩ R8 330 Ω R9 4.7 kΩ R10 330 Ω R11 330 Ω R12 330 Ω R13 330 Ω R14 22 kΩ R15 33 kΩ R16 22 kΩ R17 1.2 kΩ R18 1 kΩ R19 330 Ω R20 68 kΩ R21 22 kΩ R22 50 Ω
1999 Jan 13 20
Page 21
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
Table 13 Diodes and ICs
COMPONENT VALUE
D1 BB149 D2 BB152 D3 BA792 D4 BB149 D5 LED-3R D6 LED-3Y D7 LED-3G IC TDA6404; TDA6405;
TDA6405A
Table 14 Coils
COMPONENT VALUE
L1 1 µH (inductor) L2 30 nH L4 80 nH L5 16 nH L6 30 nH L8 80 nH L9 80 nH
TDA6404; TDA6405;
TDA6405A
Table 15 Transformer
COMPONENT VALUE
L3 23 turns
(TOKO, wire 0.07 mm)
L7 N1 = 2 × 5 turns
N2 = 2 turns (TOKO, wire 0.09 mm)
Table 16 Crystal
COMPONENT VALUE
X1 4 MHz
Table 17 Transistors
COMPONENT VALUE
TR1 BC847B TR2 BC847B
1999 Jan 13 21
Page 22
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
TDA6404; TDA6405;
TDA6405A

INTERNAL PIN CONFIGURATION

A VERAGE DC VOL TAGE
(V)
VHF UHF
SYMBOL
TDA6404
PIN
TDA6405:
TDA6405A
CONFIGURATION
(1)
UHFIN1 1 28 note 2 1.0 UHFIN2 2 27 note 2 1.0
1
(28)
2
(27)
MGE704
VHFIN 3 26 1.9 note 2
3
(26)
MGE705
RFGND 4 25 0.0 0.0
4
(25)
MGE706
IFFIL1 5 24 3.4 3.4
65 (23)(24)
IFFIL2 6 23 3.4 3.4
MGD617
PVHFL 7 22 0.0 or
(V
− VCE)
CC
PVHFH 8 21 (V
PUHF 9 20 0.0 (V
(22)
7
8
(21)
CC
or 0.0
− VCE)
0.0
0.0
CC
− VCE)
1999 Jan 13 22
9
(20)
MGK814
Page 23
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
PIN
SYMBOL
TDA6404
TDA6405:
TDA6405A
CONFIGURATION
AS 10 19 V
10
(19)
(1)
MGK815
TDA6404; TDA6405;
TDA6405A
A VERAGE DC VOL TAGE
(V)
VHF UHF
AS
V
AS
SDA 11 18 note 2 note 2
11
(18)
MGK816
SCL 12 17 note 2 note 2
12
(17)
MGK817
ADC 13 16 1.9 1.9
13
(16)
MGK818
CP 14 15 1.9 1.9
14
(15)
MGK819
1999 Jan 13 23
Page 24
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
PIN
SYMBOL
TDA6404
TDA6405:
TDA6405A
CONFIGURATION
VT 15 14 V
(1)
15
(14)
MGK820
TDA6404; TDA6405;
TDA6405A
A VERAGE DC VOL TAGE
(V)
VHF UHF
VT
V
XTAL 16 13 3.0 3.0
16
(13)
MGK821
VT
V
CC
17 12 supply voltage 5.0 5.0 IFOUT1 18 11 2.2 2.2 IFOUT2 19 10 2.2 2.2
18
(11)19(10)
MGK822
GND 20 9 0.0 0.0
20 (9)
MGK823
UHFOSCIB1 21 8 note 2 1.9 UHFOSCOC1 22 7 note 2 2.5 UHFOSCOC2 23 6 note 2 2.5
(6) 23
(7)
22
UHFOSCIB2 24 5 note 2 1.9
21
(8)
24 (5)
MGK824
1999 Jan 13 24
Page 25
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
PIN
SYMBOL
TDA6404
TDA6405:
TDA6405A
CONFIGURATION
(1)
TDA6404; TDA6405;
TDA6405A
A VERAGE DC VOL TAGE
(V)
VHF UHF
VHFOSCIB1 25 4 2.0 note 2 VHFOSCOC1 26 3 2.7 note 2 VHFOSCOC2 27 2 2.7 note 2
(2) 27
(3)
26
VHFOSCIB2 28 1 2.0 note 2
25
(4)
28 (1)
MGK825
Notes
1. The pin numbers in parenthesis represent the TDA6405 and TDA6405A.
2. Not applicable.
1999 Jan 13 25
Page 26
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners

PACKAGE OUTLINE

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
c
y
Z
28 15
TDA6404; TDA6405;
TDA6405A
SOT341-1
E
H
E
A
X
v M
A
pin 1 index
114
w M
b
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.0
0.21
0.05
1.80
1.65
0.25
b
0.38
0.25
p
cD
0.20
0.09
3
UNIT A1A2A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
p
0 2.5 5 mm
scale
(1)E(1) (1)
10.4
10.0
eHELLpQZywv θ
5.4
0.65 1.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
1.03
0.9
0.63
0.7
(A )
L
p
L
0.13 0.10.2
A
3
θ
1.1
0.7
o
8
o
0
OUTLINE
VERSION
SOT341-1 MO-150AH
IEC JEDEC EIAJ
REFERENCES
1999 Jan 13 26
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08 95-02-04
Page 27
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
SOLDERING Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011). There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.
TDA6404; TDA6405;
TDA6405A
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Manual soldering
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1999 Jan 13 27
Page 28
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, SQFP not suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(3)
PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJ suitable suitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
WAVE REFLOW
(2)
(3)(4) (5)
SOLDERING METHOD
TDA6404; TDA6405;
TDA6405A
(1)
suitable
suitable suitable
.
1999 Jan 13 28
Page 29
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
TDA6404; TDA6405;
TDA6405A
PURCHASE OF PHILIPS I
Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
1999 Jan 13 29
Page 30
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
NOTES
TDA6404; TDA6405;
TDA6405A
1999 Jan 13 30
Page 31
Philips Semiconductors Product specification
5 V mixer/oscillator-PLL synthesizers for hyperband tuners
NOTES
TDA6404; TDA6405;
TDA6405A
1999 Jan 13 31
Page 32
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Printed in The Netherlands 545004/750/02/pp32 Date of release: 1999 Jan 13 Document order number: 9397 750 04901
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