Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA5332T
Double mixer/oscillator for TV and
VCR tuners
Preliminary specification
File under Integrated Circuits, IC02
March 1989
Page 2
Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
GENERAL DESCRIPTION
The TDA5332T is an integrated circuit that performs the mixer/oscillator functions in TV and VCR tuners. This device
gives the designer the capability to design an economical and physically small tuner which will be capable of meeting the
most stringent requirements e.g. FTZ or FCC. The tuner development time can be drastically reduced by using this
device.
Features
• Balanced mixer with a common emitter input for band A
• Amplitude-controlled oscillator for band A
• Balanced mixer with common base input for band B
• Balanced oscillator for band B
• SAW filter preamplifier with an output impedance of 75 Ω in application
• Bandgap voltage stabilizer for oscillator stability
• Electronic bandswitch
QUICK REFERENCE DATA
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage V
Band A frequency range depending on application f
Band B frequency range depending on application f
A
B
Band A noise factor 50 MHz NF
Band B noise factor 860 MHz NF
Band A input voltage 1% cross-modulation V
Band B input power 1% cross-modulation
note 5 P
Band A voltage gain G
Band B voltage gain G
P
A
B
18-20
I
VA
VB
− 12 − V
45 − 470 MHz
160 − 860 MHz
− 7.5 − dB
− 9 − dB
− 100 − dBµV
−−21 − dBm
− 25 − dB
− 36 − dB
PACKAGE OUTLINE
20-lead mini-pack, plastic (SO20L; SOT163A); SOT163-1; 1996 November 29.
March 1989 2
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
tuners
TDA5332T
Fig.1 Block diagram.
March 1989 3
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
tuners
Fig.2 Pinning diagram.
PINNING
1 A OSC band A oscillator input
2 GND ground (0 V)
3 A OSC band A oscillator output
4 B OSC band B oscillator input
5 B OSC band B oscillator output
6 B OSC band B oscillator output
7 B OSC band B oscillator input
8 BS electronic bandswitch
9 IF OUT IF amplifier output
10 IF OUT IF amplifier output
11 IF IN IF amplifier input
12 IF IN IF amplifier input
13 MIX OUT mixer output
14 MIX OUT mixer output
15 V
P
positive supply voltage
16 B IN band B input
17 B IN band B input
18 A IN band A input
19 A IN band A input
20 RF GND ground for RF inputs
TDA5332T
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage V
Switching voltage V
Output current of each pin to ground I
Maximum short-circuit time (all pins) t
Storage temperature range T
Operating ambient temperature range T
Junction temperature T
P
8
O
SC
stg
amb
j
−0.3 14 V
014V
−−10 mA
− 10 s
−55 + 150 °C
−25 + 80 °C
−+150 °C
THERMAL RESISTANCE
From junction to ambient in free air R
th j-a
typ. 100 K/W
HANDLING
Pins 8, 9 and 10 withstand the ESD test in accordance with MIL-STD-883C category B (2000 V).
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
CHARACTERISTICS
V
= 12 V; T
P
specified.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage V
Supply current I
Switching voltage;
band A V
band B V
Switching current
band A I
band B I
IF Amplifier
Input reflection
coefficient note 4 S
Reverse transmission
coefficient S
Forward transmission
coefficient S
Output reflection
coefficient S
Input admittance in
application Y
Output admittance
in application Z
Band A mixer
(including IF amplifier)
Frequency range f
Noise factor 50 MHz NF − 7.5 9 dB
Optimum source
conductance 50 MHz G
=25°C; all voltages are referenced to ground (pins 2 and 20); measured in Fig.3; unless otherwise
amb
15
15
SA
SB
SA
SB
10 − 13.2 V
− 42 55 mA
0 − 1.1 V
3 − 5V
−−10 µA
−−50 µA
differentially
measured at
36 MHz mod. phase
11
12
21
22
I
−−0.5 −2 − dB/
−−41 −7 − dB/
− 12 160 − dB/
−−910− dB/
−−1.4 − mS
0.9 − pF
O
−−55 −Ω
230 − nH
measured using
circuit shown
in Fig.3
A
45 − 470 MHz
225 MHz NF − 911dB
300 MHz NF − 10 12 dB
470 MHz NF − 11 13 dB
− 0.5 − mS
− 1.1 − mS
− 1.2 − mS
− 1.9 − mS
225 MHz G
300 MHz G
470 MHz G
18-20
18-20
18-20
18-20
o
o
o
o
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Input capacitance 50 −470 MHz C
18-20
Input voltage 1% cross-modulation;
in channel;
V
18-20
Input voltage 10 kHz pulling;
in channel;
f < 300 MHz
V
18-20
Voltage gain 20 log
(V
9-10/V18
)G
V
Band A mixer
Conversion transadmittance
mixer I
13/V18
= −I14/V
18
C
t
Mixer output admittance pins 13 and 14 − 0.1 − mS
Mixer output capacitance C
13-14
Band A oscillator
Frequency range f
Frequency shift ∆V
= 10%
P
A
note 6; f = 330 MHz ∆f −−200 kHz
Frequency drift ∆T=25°C
note 7; f = 330 MHz ∆f −−400 kHz
Frequency drift 5 s to 15 min
after switching on; ∆f −−200 kHz
f = 330 MHz
Band B mixer
(including IF)
measured using
circuit shown in
Fig.3; measurements
using hybrid; note 1
Frequency range f
B
Noise factor not corrected
for image pins 16 and 17
160 MHz NF
860 MHz NF
B
B
Available input power note 5;
1% cross-modulation;
in channel;
pins 16 and 17;
160 MHz P
860 MHz P
IB
IB
10 kHz pulling note 5;
pins 16 and 17; in
channel
860 MHz −−20 − dBm
− 2.5 − pF
97 100 − dBµV
100 108 − dBµV
22.5 25.0 27.5 dB
− 3.5 − mS
− 2 − pF
80 − 520 MHz
160 − 860 MHz
− 911dB
− 911dB
−25 −21 − dBm
−25 −21 − dBm
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
N + 5 − 1 MHz
pulling notes 2 and 5;
820 MHz −42 −35 − dBm
Voltage gain note 3;
160 MHz G
860 MHz G
VB
VB
Band B oscillator
Frequency range f
B
Frequency shift note 6;
∆V
= 10% ∆f −−400 kHz
P
Frequency drift note 7;
∆T=25°C ∆f −−800 kHz
Frequency drift 5 s to 15 min
after switching on ∆f −−400 kHz
Notes to the characteristics
1. The values have been corrected for hybrid and cable losses. The symmetrical output impedance of
the circuit is 100 Ω.
2. The input level of a N + 5 − 1 MHz signal (just visible).
3. The gain is defined as the transducer gain (measured in Fig.3) plus the voltage transformation ratio
of L6 to L7 (6:1, 16 dB).
4. All S parameters are referred to a 50 Ω system.
5. The input power is defined as the power delivered by the generator on a 50 Ω load.
6. The frequency shift is defined for a variation of power supply from;
a) VP= 12 V to VP= 10.8 V
b) VP= 12 V to VP= 13.2 V.
In both cases the frequency shift is below the specified value.
7. The frequency drift is defined for a variation of ambient temperature from;
a) T
b) T
=25°C to T
amb
=25°C to T
amb
amb
amb
=0°C
=50°C
In both cases the frequency shift is below the specified value.
33 36 39 dB
33 36 39 dB
200 − 900 MHz
March 1989 7
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
tuners
APPLICATION INFORMATION
TDA5332T
March 1989 8
Fig.3 Application diagram.
band B = UHF (470 to 900 MHz)
Proposal of VHF/UHF tuner band A = VHF I + VHF III (45 to 300 MHz)
Page 9
Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
Component values of the application diagram
resistors
R1 = 47 kΩ R2 = 18 Ω R3 = 1.2 kΩ R4 = 4.7 kΩ
R5 = 100 Ω R6 = 22 kΩ R7 = 1 kΩ R8 = 2.2 kΩ
R9 = 22 kΩ R10 = 15 kΩ R11 = 47 kΩ
capacitors
C1 = 1 nF C2 = 1 nF C3 = 1 nF C4 = 1 nF
C5 = 1 nF C6 = 1 nF C7 = 1 nF C8 = 15 pF (N750)
C9 = 15 pF (N750) C10 = 1 nF C11 = 1 nF C12 = 1 nF
C13 = 0.68 pF (SMD) C14 = 1 pF (SMD) C15 = 1 pF (SMD)
C16 = 0.68 pF (SMD) C17 = 100 pF (SMD) C18 = 5.6 pF (SMD) C19 = 1 pF (NPO)
C20 = 1 pF (NPO) C21 = 82 pF (N750) C22 = 1 nF C23 = 1 nF
C24 = 1 nF C25 = 1 nF C26 = 1 µF (40V) C27 = 1 nF
Cm = 18 pF (N750)
diodes and IC
D1 = BB911 D2 = BA482 D3 = BB405B IC = TDA5332T
coils
L1 = 2.5 t (φ3) L2 = 8.5 t (φ3) L3 = 1.5 t (φ3)
L4 = 1.5 t (φ3) L5 = 2 × 5 t (note 1) L8 = 5 µH (choke coil)
transformer
L6 = 12t (note 1) L7 = 2 t
wire size for L1 to L4 = 0.4 and for L5 to L7 = 0.1 mm.
Note
1. Coil type: TOKO 7 kN; material: 113 kN, screw core (03-0093), pot core (04-0026).
March 1989 9
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
tuners
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TDA5332T
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
1
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
0.49
0.36
p
cD
0.32
0.23
0.013
0.009
3
0.019
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1) (1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
1.1
1.0
0.043
0.039
(A )
L
p
L
0.25
0.01
A
3
θ
0.25 0.1
0.01
ywv θ
Z
0.9
0.4
8
0.004
0.035
0.016
0
o
o
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
March 1989 10
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 11
Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
March 1989 11
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Philips Semiconductors Preliminary specification
Double mixer/oscillator for TV and VCR
TDA5332T
tuners
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1989 12
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