Datasheet TDA5145TS Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA5145TS
Brushless DC motor drive circuit
Product specification File under Integrated Circuits, IC11
1998 Oct 27
Page 2
Brushless DC motor drive circuit TDA5145TS
FEATURES
Full-wave commutation (using push-pull drivers at the output stages) without position sensors
Built-in start-up circuitry
Three push-pull outputs:
APPLICATIONS
General purpose spindle driver e.g.: – Hard disk drive – Tape drive – Optical disk drive.
– Output current 2.0 A (typ.) – Built-in current limiter – Soft-switching outputs for low Electromagnetic
Interference (EMI).
Thermal protection
Flyback diodes
Motor brake facility
Direction control input
GENERAL DESCRIPTION
The TDA5145TS is a bipolar integrated circuit used to drive 3-phase brushless DC motors in full-wave mode. The device is sensorless (saving of 3 hall-sensors) using the back EMF sensing technique to sense the rotor position. It includes bidirectional control, brake function and has a special circuit built-in to reduce the EMI (soft-switching output stages).
Reset function.
QUICK REFERENCE DATA
Measured over full voltage and temperature range.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
V
i(VMOT)
supply voltage note 1 4 18 V input voltage to the output driver
note 2 1.7 16 V
stages V I
DO
LIM
drop-out output voltage Io= 100 mA 0.90 1.05 V
current limiting V
=10V; Ro= 1.2 1.8 2.0 2.5 A
VMOT
Notes
1. An unstabilized supply can be used.
2. V
VMOT=VP
; all outputs Io= 0 mA.
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA5145TS SSOP24 plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
1998 Oct 27 2
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Brushless DC motor drive circuit TDA5145TS
BLOCK DIAGRAM
handbook, full pagewidth
CAP-ST
CAP-DC CAP-CD
TEST
CAP-TI
DIR
14
13 12
3
15
9
THERMAL
PROTECTION
START-UP
OSCILLATOR
ADAPTIVE
COMMUTATION
DELAY
TIMING
DIRECTION
CONTROL
BRAKE
BRAKE
COMMUTATION
RESET
818
RESET
LOGIC
VMOT
6, 7
PUSH/PULL
FLYBACK
D
H
D
OUTPUT DRIVER
OUTPUT DRIVER
L
STAGE 2
STAGE 3
OUTPUT
DRIVER
STAGE 1
1, 2
4, 5
20, 21
MOT1
MOT2
MOT3
TDA5145TS
10 11
GND2
GND1 V
Fig.1 Block diagram.
1998 Oct 27 3
23, 24
22
MOT0
EMF COMPARATORS
MGR391
P
Page 4
Brushless DC motor drive circuit TDA5145TS
PINNING
SYMBOL PIN DESCRIPTION
MOT1 1 driver output 1 MOT1 2 driver output 1 TEST 3 test input/output MOT2 4 driver output 2 MOT2 5 driver output 2 VMOT 6 input voltage for the output driver
stages
VMOT 7 input voltage for the output driver
stages
BRAKE 8 brake input; this pin may not be left
floating, a LOW-level voltage must be applied to disable this function
DIR 9 direction control input; this pin may
not be left floating
GND2 10 ground supply return for control
circuits
V
P
11 supply voltage
CAP-CD 12 external capacitor connection for
adaptive communication delay timing
CAP-DC 13 external capacitor connection for
adaptive communication delay timing copy
CAP-ST 14 external capacitor connection for
start-up oscillator
CAP-TI 15 external capacitor connection for
timing n.c. 16 not connected n.c. 17 not connected RESET 18 reset input; this pin may not be left
floating, a LOW-level voltage must
be applied to disable this function n.c. 19 not connected MOT3 20 driver output 3 MOT3 21 driver output 3 MOT0 22 input from the star point of the motor
coils GND1 23 ground (0 V) motor supply return for
output stages GND1 24 ground (0 V) motor supply return for
output stages
handbook, halfpage
MOT1 MOT1
TEST MOT2 MOT2
VMOT VMOT
BRAKE
DIR
GND2
V
CAP-CD
1 2 3 4 5 6 7 8
9 10 11
P
12
TDA5145TS
MGR392
24 23 22 21 20 19 18 17
16 15 14 13
GND1 GND1 MOT0 MOT3 MOT3 n.c. RESET n.c. n.c. CAP-TI CAP-ST CAP-DC
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
The TDA5145TS offers a sensorless 3-phase motor drive function. It is unique in its combination of sensorless motor drive and full-wave drive. The TDA5145TS offers protected outputs capable of handling high currents and can be used with star or delta connected motors. It can easily be adapted for different motors and applications. The TDA5145TS offers the following features:
Sensorless commutation by using the motor EMF
Built-in start-up circuit
Optimum commutation, independent of motor type or
motor loading
Built-in flyback diodes
Three phase full-wave drive
High output current (2.0 A)
Outputs protected by current limiting and thermal
protection of each output transistor
Low current consumption by adaptive base-drive
Soft-switching pulse output for low radiation
Direction of rotation controlled by one pin
Brake function.
1998 Oct 27 4
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Brushless DC motor drive circuit TDA5145TS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
V
I(n)
V
I(VMOT)
V
O
V
I(n1)
T
stg
T
amb
P
tot
V
es
supply voltage 18 V input voltage; all pins except
VI<18V −0.3 VP+ 0.5 V
VMOT VMOT input voltage 0.5 +17 V output voltage MOT0, MOT1,
1V
VMOT+VdFD
V
MOT2 and MOT3 input voltage CAP-ST, CAP-TI,
2.5 V
CAP-CD and CAP-DC storage temperature 55 +150 °C operating ambient temperature 0 +70 °C total power dissipation see Fig. 3 −− W electrostatic handling see Chapter “Handling” 2000 V
HANDLING
Every pin withstands the ESD test according to
“MIL-STD-883C class 2”
positive and 3 pulses negative on each pin referenced to ground.
1.00
0.57
P (W)
2
tot
1
0
50
0 200
50 100 150
70
handbook, halfpage
. Method 3015 (HBM 1500 ; 100 pF) 3 pulses
MGL529
T
(°C)
amb
Fig.3 Power derating curve.
1998 Oct 27 5
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Brushless DC motor drive circuit TDA5145TS
CHARACTERISTICS
V
= 14.5 V; T
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
I
P
V
i(VMOT)
Thermal protection
T
SD
T reduction in temperature before
MOT0; centre tap
V
i
I
bias
V
CSW
V
CSW
V
hys
MOT1, MOT2 and MOT3; see Fig.4 V
DO
V
sat(lt)
V
sat(ut)
I
LIM
t
r
t
f
V
dF(DH)
V
dF(DL)
I
dM
DIR
V
IH
V
IL
I
IL
I
IH
=25°C; unless otherwise specified.
amb
supply voltage note 1 4 18 V supply current note 2 6.8 7.8 mA input voltage to the output driver
see Fig.1 1.7 16 V
stages
local temperature at temperature
130 140 150 °C
sensor causing shut-down
after shut-down T
30 K
SD
switch-on
input voltage 0.5 V input bias current 0.5 V < Vi<V
1.5 V 10 −−µA
VMOT
VMOT
V
comparator switching level note 3 ±20 ±25 ±30 mV variation in comparator switching
−− 3mV
levels comparator input hysteresis 75 −µV
drop-out output voltage Io= 100 mA 0.9 1.05 V
I
= 1000 mA 1.6 1.85 V
o
variation in saturation voltage
Io= 100 mA −− 180 mV
between lower transistors variation in saturation voltage
Io= 100 mA −− 180 mV
between upper transistors current limiting V rise time switching output V fall time switching output V diode forward voltage (diode DH)Io=500 mA;
=10V; Ro= 1.2 1.8 2.0 2.5 A
VMOT
= 15 V; see Fig.5 5 10 15 µs
VMOT
= 15 V; see Fig.5 10 15 20 µs
VMOT
−− 1.5 V
notes 4 and 5; see Fig.1
diode forward voltage (diode DL)Io= 500 mA;
1.5 −−V
notes 4 and 5; see Fig.1
peak diode current note 5 −− 2.5 A
HIGH-level input voltage 4V<VP< 18 V 2.0 −−V LOW-level input voltage 4V<VP<18V −− 0.8 V LOW-level input current −−20 −µA HIGH-level input current 20 −µA
1998 Oct 27 6
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Brushless DC motor drive circuit TDA5145TS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
RESET
V
IH
V
IL
I
IL
I
IH
BRAKE
V
IH
V
IL
I
IL
I
IH
CAP-ST
I
o(sink)
I
o(source)
V
swL
V
swH
CAP-TI
I
o(sink)
I
o(source)
V
swL
V
swM
V
swH
CAP-CD
I
o(sink)
I
o(source)
I
sink/Isource
V
IL
V
IH
CAP-DC
I
o(sink)
I
o(source)
I
sink/Isource
V
IL
V
IH
HIGH-level input voltage reset mode;
4V<VP<18V
LOW-level input voltage normal mode;
4V<VP<18V LOW-level input current Vi= 2.0 V −−20 −µA HIGH-level input current Vi= 0.8 V 20 −µA
HIGH-level input voltage brake mode;
4V<VP<18V LOW-level input voltage normal mode;
4V<VP<18V LOW-level input current Vi= 2.0 V −−20 −µA HIGH-level input current Vi= 0.8 V 20 −µA
output sink current 1.5 2.0 2.5 µA output source current 2.5 2.0 1.5 µA LOW-level switching voltage 0.20 V HIGH-level switching voltage 2.20 V
output sink current 28 −µA output source current 0.2 V < V
0.3V<V
< 0.3 V −−57 −µA
CAP-TI
< 2.2 V −−5−µA
CAP-TI
LOW-level switching voltage 50 mV MIDDLE-level switching voltage 0.30 V HIGH-level switching voltage 2.20 V
output sink current 10.6 16.2 22 µA output source current 5.3 8.1 11 µA ratio of sink to source current 1.85 2.05 2.25 LOW-level input voltage 850 875 900 mV HIGH-level input voltage 2.3 2.4 2.55 V
output sink current 10.1 15.5 20.9 µA output source current 20.9 15.5 10.1 µA ratio of sink to source current 0.9 1.025 1.15 LOW-level input voltage 850 875 900 mV HIGH-level input voltage 2.3 2.4 2.55 V
2.0 −−V
−− 0.8 V
2.0 −−V
−− 0.8 V
1998 Oct 27 7
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Brushless DC motor drive circuit TDA5145TS
Notes
1. An unstabilized supply can be used.
2. V
VMOT=VP
3. Switching levels with respect to MOT1, MOT2 and MOT3.
4. Drivers are in the high-impedance OFF-state.
5. The outputs are short-circuit protected by limiting the current and the IC temperature.
, all other inputs at 0 V; all outputs at VP; Io= 0 mA.
handbook, full pagewidth
back EMF signal
V
MOT0
Fig.4 Switching levels with respect to MOT1, MOT2 and MOT3.
handbook, halfpage
V
CSW
12.5 V
hysteresis 75 µV typ.
V
CSW
12.5 V
MGR381
MOT1, MOT2 and MOT3 comparator threshold voltages
2.0 V
t
r
Fig.5 Output transition time measurement.
1998 Oct 27 8
2.0 V
t
f
MGR382
Page 9
Brushless DC motor drive circuit TDA5145TS
APPLICATION INFORMATION
handbook, full pagewidth
GND1
24
23 22 21 20 19 18 17 16 15 14 13
1234567891011
(1) Value selected for 3 Hz start-up oscillator frequency.
Fig.6 Application diagram.
Introduction (see Fig.7) Full-wave driving of a three phase motor requires three
push-pull output stages. In each of the six possible states two outputs are active, one sourcing (H) and one sinking (L). The third output presents a high impedance (Z) to the motor, which enables measurement of the motor back EMF in the corresponding motor coil by the EMF comparator at each output. The commutation logic is responsible for control of the output transistors and selection of the correct EMF comparator. The sequence of the six possible states of the outputs is given in Table 1.
The zero-crossing in the motor EMF (detected by the comparator selected by the commutation logic) is used to calculate the correct moment for the next commutation, that is, the change to the next output state. The delay is calculated (depending on the motor loading) by the adaptive commutation delay block.
Because of high inductive loading the output stages contain flyback diodes. The output stages are also protected by a current limiting circuit and by thermal protection of the six output transistors.
(1)
18 nF
220
10
nF
nF
TDA5145TS
12
18 nF
BRAKE DIR
VMOT
10 µF
V
P
MGR393
Table 1 Output states; note 1
STATE MOT1 MOT2 MOT3
1ZLH 2HLZ 3HZL 4ZHL 5LHZ 6LZH
Note
1. H = HIGH state; L = LOW state; Z = high-impedance OFF-state.
The system will only function when the EMF voltage from the motor is present. Therefore, a start oscillator is provided that will generate commutation pulses when no zero-crossings in the motor voltage are available.
A timing function is incorporated into the device for internal timing and for timing of the reverse rotation detection.
1998 Oct 27 9
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Brushless DC motor drive circuit TDA5145TS
The TDA5145TS is designed for systems with low current consumption: use of I2L logic, adaptive base drive for the output transistors (patented).
Adjustments
The system has been designed in such a way that the tolerances of the application components are not critical. However, the approximate values of the following components must still be determined:
The start capacitor; this determines the frequency of the start oscillator.
The two capacitors in the adaptive commutation delay circuit; these are important in determining the optimum moment for commutation, depending on the type and loading of the motor.
The timing capacitor; this provides the system with its timing signals.
HE START CAPACITOR (CAP-ST)
T This capacitor determines the frequency of the start
oscillator. It is charged and discharged, with a current of 2 µA, from 0.05 to 2.2 V and back to 0.05 V. The time taken to complete one cycle is given by: t
= (2.15 × C) s (with C in µF)
start
The start oscillator is reset by a commutation pulse and so is only active when the system is in the start-up mode. A pulse from the start oscillator will cause the outputs to change to the next state (torque in the motor). If the movement of the motor generates enough EMF the TDA5145TS will run the motor. If the amount of EMF generated is insufficient, then the motor will move one step only and will oscillate in its new position. The amplitude of the oscillation must decrease sufficiently before the arrival of the next start pulse, to prevent the pulse arriving during the wrong phase of the oscillation. The oscillation of the motor is given by:
f
osc
=
1
---------------------------------- ­K
I× p×
t
---------------------- -
2π
J
where:
= torque constant (N.m/A)
K
t
I = current (A) p = number of magnetic pole-pairs J = inertia J (kg.m2)
If the damping is high then a start frequency of 2 Hz can be chosen or t = 500 ms, thus C = 0.5/2 = 0.25 µF (choose 220 nF).
T
HE ADAPTIVE COMMUTATION DELAY (CAP-CD AND
CAP-DC) In this circuit, capacitor CAP-CD is charged during one
commutation period, with an interruption of the charging current during the diode pulse. During the next commutation period this capacitor (CAP-CD) is discharged at twice the charging current. The charging current is
8.1 µA and the discharging current 16.2 µA; the voltage range is from 0.9 to 2.2 V. The voltage must stay within this range at the lowest commutation frequency of interest, f
==
C
:
C1
×
8.1 10
-------------------------­f 1.3×
6–
6231
(C in nF)
------------ ­f
C1
If the frequency is lower, then a constant commutation delay after the zero-crossing is generated by the discharge from 2.2 to 0.9 V at 16.2 µA; maximum delay = (0.076 × C) ms (with C in nF)
Example: nominal commutation frequency = 900 Hz and the lowest usable frequency = 400 Hz; thus:
CAP-CD
6231
------------ ­400
15.6==
(choose 18 nF)
The other capacitor, CAP-DC, is used to repeat the same delay by charging and discharging with 15.5 µA. The same value can be chosen as for CAP-CD. Figure 8 illustrates typical voltage waveforms.
Example: J = 72 × 10−6kg.m2, Kt=25×10−3N.m/A, p = 6 and I = 0.5 A; this gives f
osc
= 5 Hz.
1998 Oct 27 10
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Brushless DC motor drive circuit TDA5145TS
handbook, full pagewidth
220 nF
18 nF
18 nF
TEST
10 nF
14
13 12
3
PROTECTION
15
10
THERMAL
START-UP
OSCILLATOR
ADAPTIVE
COMMUNICATION
DELAY
TIMING
DIRECTION
CONTROL
BRAKE RESET VMOT
8
BRAKE
COMMUNICATION
18 6, 7 23, 24
RESET
LOGIC
TP
TP
TP
TN
TN
TN
TN
TN
TN
D
D
D
D
D
D
1, 2 4, 5
20, 21
MOTOR
11
V
P
TDA5145TS
GND2
GND1
9
DIR
Fig.7 Typical application of the TDA5145TS as a scanner driver.
1998 Oct 27 11
EMF COMPARATORS
22
MGR394
Page 12
Brushless DC motor drive circuit TDA5145TS
handbook, full pagewidth
voltage
on CAP-CD
voltage
on CAP-DC
Fig.8 CAP-CD and CAP-DC typical voltage waveforms in normal running mode.
THE TIMING CAPACITOR (CAP-TI) Capacitor CAP-TI is used for timing the successive steps
within one commutation period; these steps include some internal delays.
The most important function is the watchdog time in which the motor EMF has to recover from a negative diode pulse back to a positive EMF voltage (or vice versa). A watchdog timer is a guarding function that only becomes active when the expected event does not occur within a predetermined time.
The EMF usually recovers within a short time if the motor is running normally (<<ms). However, if the motor is motionless or rotating in the reverse direction, then the time can be longer (>>ms).
A watchdog time must be chosen so that it is long enough for a motor without EMF (still) and eddy currents that may stretch the voltage in a motor winding; however, it must be short enough to detect reverse rotation. If the watchdog time is made too long, then the motor may run in the wrong direction (with little torque).
t
MGH317
The capacitor is charged with a current of 57 µA, from
0.2 to 0.3 V. Above this level it is charged with a current of 5 µA, up to 2.2 V only if the selected motor EMF remains in the wrong polarity (watchdog function). At the end, or, if the motor voltage becomes positive, the capacitor is discharged with a current of 28 µA. The watchdog time is the time taken to charge the capacitor with a current of 5 µA, from 0.3 to 2.2 V.
To ensure that the internal delays are covered CAP-TI must have a minimum value of 2 nF. For the watchdog function a value of 10 nF for CAP-TI is recommended.
To ensure a good start-up and commutation, care must be taken that no oscillations occur at the trailing edge of the flyback pulse. Snubber networks at the outputs should be critically damped.
Typical voltage waveforms are illustrated in Fig.9.
1998 Oct 27 12
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Brushless DC motor drive circuit TDA5145TS
handbook, full pagewidth
V
MOT 1
voltage
on CAP-TI
MGH318
If the chosen value of CAP-TI is too small oscillations can occur in certain positions of a blocked rotor. If the chosen value is too large, then it is possible that the motor may run in the reverse direction (synchronously with little torque).
Fig.9 Typical CAP-TI and V
voltage waveforms in normal running mode.
MOT1
Other design aspects
There are other design aspects concerning the application of the TDA5145TS besides the commutation function. They are:
Direction function
Brake function
Reliability.
D
IRECTION FUNCTION
If the voltage at pin 9 is less than 0.8 V, the motor is running in one direction (depending on the motor connections). If the voltage at pin 9 is greater than 2.0 V, the motor is running in the opposite direction.
BRAKE
FUNCTION
If the voltage at pin 8 is greater than 2.0 V, the motor brakes. In that condition, the 3 outputs MOT1, MOT2 and MOT3 are forced to a LOW voltage level and the current limitation is performed internally by the sink drivers.
RESET
FUNCTION
If the voltage at pin 18 is greater than 2.0 V, the output states are shown in Table 2.
Table 2 Output states if V
DRIVER OUTPUT STATE
RESET
> 2.0 V
(1)
MOT1 Z MOT2 L MOT3 H
Note
1. Z = high-impedance OFF-state; L = LOW state; H = HIGH state.
1998 Oct 27 13
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Brushless DC motor drive circuit TDA5145TS
Table 3 Switching sequence after a reset pulse; note 1
DIR RESET MOT1 MOT2 DIR FUNCTION
H H Z L H reset H L Z L H normal direction HLHLZ HLHZL HLZHL HLLHZ HLLZH
L H H L Z reset L L H L Z reverse direction LLZLH LLLZH LLLHZ LLZHL LLHZL
mode sequence
mode sequence
Note
1. Z = high-impedance OFF-state; L = LOW state; H = HIGH state.
Table 4 Priority of function; note 1
BRAKE TEST RESET FUNCTION
L L L normal L L H reset L H L test
L H H test H L L brake H L H brake H H L brake H H H brake
Note
1. L = LOW state; H = HIGH state.
R
ELIABILITY
It is necessary to protect high current circuits and the output stages are protected in two ways:
Current limiting of the ‘lower’ output transistors. The ‘upper’ output transistors use the same base current as the conducting ‘lower’ transistor (+15%). This means that the current to and from the output stages is limited.
Thermal protection of the six output transistors is achieved by each transistor having a thermal sensor that is active when the transistor is switched on. The transistors are switched off when the ambient temperature becomes too high.
1998 Oct 27 14
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Brushless DC motor drive circuit TDA5145TS
PACKAGE OUTLINE
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
c
y
Z
24 13
A
2
A
pin 1 index
1
SOT340-1
E
H
E
Q
L
p
L
(A )
A
X
v M
A
A
3
θ
112
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNIT A1A2A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
0.21
mm
2.0
OUTLINE
VERSION
SOT340-1 MO-150AG
0.05
1.80
1.65
IEC JEDEC EIAJ
0.25
b
3
p
0.38
0.25
p
cD
0.20
8.4
0.09
8.0
REFERENCES
0 2.5 5 mm
scale
(1)E(1) (1)
5.4
0.65 1.25
5.2
1998 Oct 27 15
detail X
eHELLpQZywv θ
7.9
7.6
1.03
0.63
0.9
0.7
EUROPEAN
PROJECTION
0.13 0.10.2
0.8
0.4
ISSUE DATE
93-09-08 95-02-04
o
8
o
0
Page 16
Brushless DC motor drive circuit TDA5145TS
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SSOP packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate solder thieves at the downstream end.
Even with these conditions, only consider wave soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1998 Oct 27 16
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Brushless DC motor drive circuit TDA5145TS
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Oct 27 17
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Brushless DC motor drive circuit TDA5145TS
NOTES
1998 Oct 27 18
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Brushless DC motor drive circuit TDA5145TS
NOTES
1998 Oct 27 19
Page 20
Philips Semiconductors – a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands Brazil: seeSouth America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,
51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: seeAustria India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381
Middle East: see Italy Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 295102/750/01/pp20 Date of release: 1998 Oct 27 Document order number: 9397 750 04042
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