Datasheet TDA5051AT, TDA5051 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA5051A

Home automation modem

Product specification
Supersedes data of 1997 Sep 19
File under Integrated Circuits, IC11

1999 May 31

Philips Semiconductors Product specification

Home automation modem TDA5051A

FEATURES

• Full digital carrier generation and shaping

• Modulation/demodulation frequency set by clock

adjustment, from microcontroller or on-chip oscillator

• High clock rate of 6-bit A/D (Digital to Analog) converter
for rejection of aliasing components

APPLICATIONS

• Home appliance control (air conditioning, shutters,
lighting, alarms and so on)

• Energy/heating control

• Amplitude Shift Keying (ASK) data transmission using

the home power network.

• Fully integrated output power stage with overload
protection

• Automatic Gain Control (AGC) at receiver input

• 8-bit A/D (Analog to Analog) converter and narrow

digital filtering

• Digital demodulation delivering baseband data

GENERAL DESCRIPTION

The TDA5051A is a modem IC, specifically dedicated to
ASK transmission by means of the home power supply
network, at 600 or 1200 baud data rate. It operates from a
single 5 V supply.

• Easy compliance with EN50065-1 with simple coupling
network

• Few external components for low cost applications

• SO16 plastic package.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

I

DD(tot)

supply voltage 4.75 5.0 5.25 V
total supply current f

= 8.48 MHz

osc

reception mode − 28 38 mA
transmission mode (

DATAIN=0) ZL=30Ω−47 68 mA

power-down mode − 19 25 mA

f

cr

f

osc

V

o(rms)

carrier frequency note 1 95 132.5 148.5 kHz
oscillator frequency 6.08 8.48 9.504 MHz
output carrier signal on CISPR16 load

120 − 122 dBµV

(RMS value)

V

i(rms)

THD total harmonic distortion on CISPR16

input signal (RMS value) note 2 82 − 122 dBµV

−−55 − dB

load with coupling network

Z

L

load impedance 1 30 −Ω
BR baud rate − 600 1200 bits/s
T

amb

ambient temperature 0 − 70 °C

Notes

1. Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator
frequency.

2. The minimum value can be improved by using an external amplifier, see application diagrams Figs 22 and 23.

1999 May 31 2

Philips Semiconductors Product specification

Home automation modem TDA5051A

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA5051AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

BLOCK DIAGRAM

handbook, full pagewidth

DATA

IN

CLK

OUT

DGND

1

4

AGND12V

5

CONTROL LOGIC

ROM

10

DDA

13

V

DDD

311

modulated

6

DAC clock

D/A

filter clock

carrier

V

DDAP

POWER

DRIVE

WITH

PROTECTION

TDA5051A

10

9

15

TX

OUT

APGND

PD

7

OSCILLATOR

8

2

DIGITAL

DEMODULATOR

16

TEST1 SCANTEST

2

÷

DIGITAL

BAND-PASS

FILTER

DETECT

6

DATA

OSC1

OSC2

OUT

Fig.1 Block diagram.

1999 May 31 3

PEAK

14

A/D

8

H

L

U
D

COUNT

5

U/D

MGK832

RX

IN

Philips Semiconductors Product specification

Home automation modem TDA5051A

PINNING

SYMBOL PIN DESCRIPTION

DATA

IN

DATA

OUT

V

DDD

CLK

OUT

DGND 5 digital ground
SCANTEST 6 test input (LOW in application)
OSC1 7 oscillator input
OSC2 8 oscillator output
APGND 9 analog ground for power amplifier
TX

OUT

V

DDAP

AGND 12 analog ground
V

DDA

RX

IN

PD 15 power-down input (active HIGH)
TEST1 16 test input (HIGH in application)

1 digital data input (active LOW)
2 digital data output (active LOW)
3 digital supply voltage
4 clock output

10 analog signal output
11 analog supply voltage for power

amplifier

13 analog supply voltage
14 analog signal input

handbook, halfpage

DATA

SCANTEST

DATA

CLK

OUT

V

DDD
OUT

DGND

OSC1
OSC2

IN

1
2
3
4

TDA5051AT

5
6
7
8

Fig.2 Pin configuration.

MGK833

16
15
14
13
12
11
10

9

TEST1
PD
RX

IN

V

DDA

AGND
V

DDAP

TX

OUT

APGND

FUNCTIONAL DESCRIPTION

Both transmission and reception stages are controlled
either by the master clock of the microcontroller or by the
on-chip reference oscillator connected to a crystal. This
ensures the accuracy of the transmission carrier and the
exact trimming of the digital filter, thus making the
performance totally independent of application
disturbances such as component spread, temperature,
supply drift and so on.

The interface with the power network is made by means of
an LC network (see Fig.18). The device includes a power
output stage that feeds a 120 dBµV (RMS) signal on a
typical 30 Ω load.

To reduce power consumption, the IC is disabled by a
power-down input (pin PD): in this mode, the on-chip
oscillator remains active and the clock continues to be
supplied at pin CLK

. For low-power operation in

OUT

reception mode, this pin can be dynamically controlled by
the microcontroller, see Section “Power-down mode”.

When the circuit is connected to an external clock
generator (see Fig.6), the clock signal must be applied at
pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit.
Fig.7 shows the use of the on-chip clock circuit.

All logic inputs and outputs are compatible with
TTL/CMOS levels, providing an easy connection to a
standard microcontroller I/O port.

The digital part of the IC is fully scan-testable. Two digital
inputs, SCANTEST and TEST1, are used for production
test: these pins must be left open-circuit in functional mode
(correct levels are internally defined by pull-up or
pull-down resistors).

Transmission mode

To provide strict stability with respect to environmental
conditions, the carrier frequency is generated by scanning
the ROM memory under the control of the microcontroller
clock or the reference frequency provided by the on-chip
oscillator. High frequency clocking rejects the aliasing
components to such an extent that they are filtered by the
coupling LC network and do not cause any significant
disturbance. The data modulation is applied through
pin DATAIN and smoothly applied by specific digital circuits
to the carrier (shaping). Harmonic components are limited
in this process, thus avoiding unacceptable disturbance of
the transmission channel (according to CISPR16 and
EN50065-1 recommendations). A −55 dB Total Harmonic
Distortion (TDH) is reached when the typical LC coupling
network (or an equivalent filter) is used.

1999 May 31 4

Philips Semiconductors Product specification

Home automation modem TDA5051A

The DAC and the power stage are set in order to provide
a maximum signal level of 122 dBµV (RMS) at the output.

The output of the power stage (TX

) must always be

OUT

connected to a decoupling capacitor, because of a DC
level of 0.5VDD at this pin, which is present even when the
device is not transmitting. This pin must also be protected
against overvoltage and negative transient signals.
The DC level of TX

can be used to bias a unipolar

OUT

transient suppressor, as shown in the application diagram;
see Fig.18.

Direct connection to the mains is done through an LC
network for low-cost applications. However, a HF signal
transformer could be used when power-line insulation has
to be performed.

CAUTION

In transmission mode, the receiving part of the circuit is
not disabled and the detection of the transmitted signal
is normally performed. In this mode, the gain chosen
before the beginning of the transmission is stored, and
the AGC is internally set to −6dB as long as DATA

IN

is LOW. Then, the old gain setting is automatically

restored.

Reception mode

After digital demodulation, the baseband data signal is
made available after pulse shaping.

The signal pin (RXIN) is a high-impedance input which has
to be protected and DC decoupled for the same reasons
as with pin TX

. The high sensitivity (82 dBµV) of this

OUT

input requires an efficient 50 Hz rejection filter (realized by
the LC coupling network), which also acts as an
anti-aliasing filter for the internal digital processing;
see Fig.18.

Data format

T

RANSMISSION MODE

The data input (DATAIN) is active LOW: this means that a
burst is generated on the line (pin TX

) when DATA

OUT

IN

pin is LOW.
Pin TX

is in a high-impedance state as long as the

OUT

device is not transmitting. Successive logic 1s are treated
in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in
Figs 8 and 9.

R

ECEPTION MODE

The data output (pin DATA

) is active LOW; this means

OUT

that the data output is LOW when a burst is received.
Pin DATA

remains LOW as long as a burst is received.

OUT

The input signal received by the modem is applied to a
wide range input amplifier with AGC (−6 to +30 dB). This is
basically for noise performance improvement and signal
level adjustment, which ensures a maximum sensitivity of
the ADC. An 8-bit conversion is then performed, followed

Power-down mode

Power-down input (pin PD) is active HIGH; this means that
the power consumption is minimum when pin PD is HIGH.
Now, all functions are disabled, except clock generation.

by digital band-pass filtering, to meet the CISPR
normalization and to comply with some additional
limitations met in current applications.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V
f
T
T
T

DD

osc

stg
amb
j

supply voltage 4.5 5.5 V
oscillator frequency − 12 MHz
storage temperature −50 +150 °C
ambient temperature −10 +80 °C
junction temperature − 125 °C

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.

1999 May 31 5

Philips Semiconductors Product specification

Home automation modem TDA5051A

CHARACTERISTICS

V

DDD=VDDA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DD

I

DD(RX/TX)(tot)

I

DD(PD)(tot)

I

DD(PAMP)

I

DD(PAMP)(max)

=5V±5%; T

= 0 to 70 °C; V

amb

connected to V

DDD

; DGND connected to AGND.

DDA

supply voltage 4.75 5 5.25 V
total analog + digital

supply current
total analog + digital

supply current;

VDD=5V±5%
TX or RX mode

VDD=5V±5%;
PD = HIGH

− 28 38 mA

− 19 25 mA

Power-down mode

power amplifier supply
current

VDD=5V±5%;
ZL=30Ω;

− 19 30 mA

DATAIN= LOW
in transmission mode

maximum power amplifier
supply current

VDD=5V±5%;
ZL=1Ω;

− 76 − mA

DATAIN= LOW
in transmission mode

DATAIN and PD inputs: DATA

V

IH

V

IL

V

OH

V

OL

HIGH-level input voltage 0.2VDD+ 0.9 − VDD+ 0.5 V
LOW-level input voltage −0.5 − 0.2VDD− 0.1 V
HIGH-level output voltage IOH= −1.6 mA 2.4 −− V
LOW-level output voltage IOL= 1.6 mA −−0.45 V

and CLK

OUT

OUT

outputs

OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit
when using an external clock generator)

V

IH

V

IL

V

OH

V

OL

HIGH-level input voltage 0.7V

DD

− VDD+ 0.5 V
LOW-level input voltage −0.5 − 0.2VDD− 0.1 V
HIGH-level output voltage IOH= −1.6 mA 2.4 −− V
LOW-level output voltage IOL= 1.6 mA −−0.45 V

Clock

f

osc

f

osc

-------­f

cr

f

osc

---------------------

f

CLKOUT

oscillator frequency 6.080 − 9.504 MHz
ratio between oscillator

− 64 −

and carrier frequency

ratio between oscillator

− 2 −

and clock output frequency

Transmission mode

f

cr

t

su

t

h

carrier frequency f
set-up time of the shaped

burst
hold time of the shaped

burst

= 8.48 MHz − 132.5 − kHz

osc

f

= 8.48 MHz;

osc

− 170 −µs

see Fig.8
f

= 8.48 MHz;

osc

− 170 −µs

see Fig.8

1999 May 31 6

Philips Semiconductors Product specification

Home automation modem TDA5051A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

W(DI)(min)

V

o(rms)

I

o(max)

Z

o

V

O

THD total harmonic distortion on

B

−20dB

minimum pulse width of
DATAIN signal

output carrier signal
(RMS value)

power amplifier maximum
output current (peak value)

output impedance of the
power amplifier

output DC level at
pin TX

OUT

CISPR16 load with the
coupling network
(measured on the first ten
harmonics)

bandwidth of the shaped
output signal (at −20 dB)
on CISPR16 load with the
coupling network

f

= 8.48 MHz;

osc

see Fig.8
ZL= CISPR16;

DATAIN= LOW
ZL=1Ω;

DATAIN= LOW

V

= 121 dBµV on

o(rms)

CISPR16 load;
f

= 8.48 MHz;

osc

DATAIN= LOW
(no modulation);
see Figs 3 and 16

V

= 121 dBµV on

o(rms)

CISPR16 load;
f

= 8.48 MHz;

osc

DATAIN= 300 Hz;
duty factor = 50%;
see Fig.4

− 190 −µs

120 − 122 dBµV

− 160 − mA

− 5 −Ω

− 2.5 − V

−−55 − dB

− 3000 − Hz

Reception mode

V

i(rms)

analog input signal
(RMS value)

V

I

Z

i

R

AGC

t

c(AGC)

t

d(dem)(su)

DC level at pin RX

IN

RXIN input impedance − 50 − kΩ
AGC range − 36 − dB
AGC time constant f

demodulation delay set-up
time

t

d(dem)(h)

demodulation delay hold
time

B

det

detection bandwidth f

BER bit error rate f

82 − 122 dBµV

− 2.5 − V

= 8.48 MHz;

osc

− 296 −µs

see Fig.5
f

= 8.48 MHz;

osc

− 350 400 µs

see Fig.15
f

= 8.48 MHz;

osc

− 420 470 µs

see Fig.15

= 8.48 MHz − 3 − kHz

osc

= 8.48 MHz;

osc

− 1 − 1 × 10
600 baud; S/N = 35 dB;
signal 76 dBµV;
see Fig.17

−4

1999 May 31 7

Philips Semiconductors Product specification

Home automation modem TDA5051A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Power-up timing

t

d(pu)(TX)

delay between power-up
and DATAIN in
transmission mode

t

d(pu)(RX)

delay between power-up
and DATA
mode

Power-down timing

t

d(pd)(TX)

delay between PD = 0 and
DA TAIN in transmission
mode

t

d(pd)(RX)

delay between PD = 0 and
DA TA
mode

t

active(min)

minimum active time with
T = 10 ms power-down
period in reception mode

OUT

in reception

OUT

in reception

XTAL = 8.48 MHz;
C1 = C2 = 27 pF;
Rp= 2.2 MΩ; see Fig.10

XTAL = 8.48 MHz;
C1 = C2 = 27 pF;
Rp= 2.2 MΩ;
f

= 132.5 kHz;

RXIN

120 dBµV sine wave;
see Fig.11

f

= 8.48 MHz;

osc

see Fig.12

f

= 8.48 MHz;

osc

f

= 132.5 kHz;

RXIN

120 dBµV sine wave;
see Fig.13

f

= 8.48 MHz;

osc

f

= 132.5 kHz;

RXIN

120 dBµV sine wave;
see Fig.14

− 1 −µs

− 1 −µs

− 10 −µs

− 500 −µs

− 1 −µs

book, full pagewidth

0

V

o(rms)

(dBV)

−100

5

10

Resolution bandwidth =9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at −5 dBV (RMS) = 115 dBµV (RMS);
the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS).

132.5 kHz

Fig.3 Carrier spectrum.

f (Hz)

MGK834

6

10

1999 May 31 8

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

−10

dBV

(RMS)

−60

117.5 132.5

Resolution bandwidth = 100 Hz; B

= 3000 Hz (2 × 1500 Hz).

−20dB

1500 Hz

20 dB

Fig.4 Shaped signal spectrum.

f (kHz)

MBH664

147.5

handbook, full pagewidth

V

RXIN

V

G

AGC

+30 dB

−6 dB

(I)

0

(AGC time constant)

modulated sine wave 122 dBµV amplitude

t

c(AGC)

Fig.5 AGC time constant definition (not to scale).

1999 May 31 9

t

8.68 dB
AGC range

MGK011

Philips Semiconductors Product specification

Home automation modem TDA5051A

TIMING
Configuration for clock

handbook, full pagewidth

For parameter description, see Table 1.

XTAL

CLK

OUT

MICRO-

CONTROLLER

GND

Fig.6 External clock.

f

osc

OSC1

DGND

7

TDA5051A

5

MGK835

handbook, full pagewidth

MICRO-

CONTROLLER

For parameter description, see Table 1.

CLK

GND

IN

CLK

OUT

1

/2 f

osc

4

TDA5051A R

DGND

5

Fig.7 Typical configuration for on-chip clock circuit.

1999 May 31 10

8

7

OSC2

OSC1

C1

p

XTAL

C2

MGK836

Philips Semiconductors Product specification

Home automation modem TDA5051A

Table 1 Clock oscillator parameters

OSCILLATOR

FREQUENCY

f

osc

CARRIER FREQUENCY

f

cr

CLOCK OUTPUT

FREQUENCY

1

⁄2f

osc

EXTERNAL COMPONENTS

6.080 to 9.504 MHz 95 to 148.5 kHz 3.040 to 4.752 MHz C1 = C2 = 27 to 47 pF;
= 2.2 to 4.7 MΩ;

R

p

XTAL = standard quartz crystal

Table 2 Calculation of parameters depending on the clock frequency

SYMBOL PARAMETER CONDITIONS UNIT

f

osc

oscillator frequency with on-chip oscillator: frequency of the crystal

Hz
quartz; with external clock: frequency of the
signal applied at OSC1

f

CLKOUT

f

cr

clock output frequency
carrier frequency/digital filter tuning

1
1

⁄2f
⁄64f

osc

osc

Hz

Hz

frequency

t

su

t

h

t

W(DI)(min)

t

W(burst)(min)

t

c(AGC)

t

su(demod)

t

h(demod)

set-up time of the shaped burst

hold time of the shaped burst

minimum pulse width of DATAIN signal

minimum burst time of V

signal t

O(DC)

AGC time constant s

demodulation set-up time

demodulation hold time

23

1472

or

------

------------ -

f
23

-----­f

t

2514

------------ -

3200

------------ -

3800

------------ -

f

cr

osc

1472

or

------------ ­f

cr

osc

1

+

-----

su

f

cr

W(DI)(min)+th

f

osc

(≈max.)

f

osc

(≈max.)

f

osc

s

s

s

s

s

s

1999 May 31 11

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

(1) t

W(DI)>tW(DI)(min)

(2) t

W(DI)(min)=tsu

(3) t

W(DI)(min)<tsu

+

; wrong operation.

TX

OUT

V

O(DC)

t

su

0

t

DATA

IN

.

1

----­f

cr

W(DI)

Fig.8 Relationship between DATAIN and TX

Table 3 Relationship between DATAIN and TX

t

W(burst)

t

(1) (2) (3)

OUT

t

W(burst)(min)

h

t

W(DI)(min)

(see Table 3).

OUT

MGK837

Note

1. X = don’t care.

PD

1X

DATA

(1)

IN

TX

OUT

high-impedance
0 1 high-impedance (after t
0 0 active with DC offset

handbook, halfpage

100%

t

W(burst)

t

su

t

h

MGK010

Fig.9 Pulse shape characteristics.

)

h

1999 May 31 12

Philips Semiconductors Product specification

Home automation modem TDA5051A

Timing diagrams

OUT

OUT

90% V

DD

NOT DEFINED CLOCK STABLE

t

d(pu)(TX)

HIGH

IN

handbook, full pagewidth

DATAIN is an edge-sensitive input and must be HIGH before starting a transmission.

V

DD

CLK

DATA

TX

Fig.10 Timing diagram during power-up in transmission mode.

MGK015

OUT

OUT

90% V

DD

NOT DEFINED

NOT DEFINED

t

d(pu)(RX)

HIGH

handbook, full pagewidth

V

DD

CLK

RX

DATA

IN

Fig.11 Timing diagram during power-up in reception mode.

1999 May 31 13

CLOCK STABLE

t

d(dem)(h)

MGK016

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

handbook, full pagewidth

PD

DATA

TX

PD

RX

DATA

OUT

IN

OUT

IN

t

d(pd)(TX)

normal operation wrong operation

TX

OUT

delayed by PD

MGK017

Fig.12 Power-down sequence in transmission mode.

handbook, full pagewidth

PD

RX

DATA

I

DD

IN

OUT

I
I

0

DD(RX)
DD(PD)

t

d(dem)(su)

DATA

delayed by PD

OUT

t

d(pd)(RX)

Fig.13 Power-down sequence in reception mode.

t

active(min)

T

Fig.14 Power saving by dynamic control of power-down.

t

d(pd)(RX)

MGK018

MGK845

1999 May 31 14

Philips Semiconductors Product specification

Home automation modem TDA5051A

TEST INFORMATION

handbook, full pagewidth

pulse

generator

300 Hz

50%

DATA

TX

OUT

DATA

IN

/RX

OUT

OSCILLOSCOPE

IN

DATA

Y1

t

d(dem)(su)

DATA

OUT

Y2

OUT

1 µF

IN

1

TX

10

TDA5051A

(to be tested)

2

78

t

d(dem)(h)

XTAL

f

osc

14

RX

10 nF

IN

30 Ω

MGK838

Fig.15 Test set-up for measuring demodulation delay.

1999 May 31 15

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

OSC1

OSC2

7

TDA5051A

8

1 13, 3, 11

DATA

IN

(2)(1)

TX

OUT

10

AGND, DGND, APGND

12, 5, 9

V

DDA, VDDD, VDDAP

+5 V

POWER
SUPPLY

10 µF

33 nF

coupling

network

47 µH

(3)

33 nF

47 µH

CISPR16

network

250 nF

50 µH

5 Ω

250 nF

50 µH

5 Ω

(4)

50 Ω

SPECTRUM

ANALYSER

50 Ω

MGK839

(1) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3).
(2) DATAIN= LOW for measuring total harmonic distortion (see spectrum Fig.3).
(3) Tuned for fcr= 132.5 kHz.
(4) The CISPR16 network provides a −6 dB attenuation.

Fig.16 Test set-up for measuring THD and bandwidth of the TX

1999 May 31 16

OUT

signal.

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

DATA

TDA5051A

1

IN

78

OSC1 OSC2

XTAL = 8.48 MHz

OSC1 OSC2

78

TDA5051A

(to be tested)

2

DATA

OUT

TX

OUT

10

AGND, DGND, APGND

12,

5,

9

RX

IN

14

12,

AGND, DGND, APGND

5,

9

DATA

DATA

in

out

IN

OUT

COUPLING
NETWORK

(1)

WHITE
NOISE

GENERATOR

COUPLING
NETWORK

(1)

V24/TTL

INTERFACE

out

out

in

+

+

PARAMETERS

PSEUDO RANDOM SEQUENCE:

RXD

TXD

9

2

−1 BITS LONG

V24 SERIAL DATA

ANALYSER

SPECTRUM

ANALYSER

50 Ω

600 BAUD

(1) See Fig.16.

Fig.17 Test set-up for measuring Bit Error Rate (BER).

1999 May 31 17

MGK840

Philips Semiconductors Product specification

Home automation modem TDA5051A

APPLICATION INFORMATION

handbook, full pagewidth

+5 V

250 V (AC)

max

MICRO-

CONTROLLER

+5 V

DATA

DATA

CLK

78L05

47 nF

OUT

OUT

PD

2

IN

T 630 mA

31

1

2

4
15

7

470 µF

(16 V)

OSC1

2.2 MΩ

MOV

250 V (AC)

1N4006

7V5

(1.3 W)

100 µF

(16 V)

V

DDDVDDAP

3

TDA5051A

859 12

OSC2

APGND AGNDDGND

250 V (AC)

68 Ω
(2 W)

1 mH

1N4006

V

DDA

1311

14

10

2 µF

RX

TX

IN

OUT

10 nF

47 nF
(63 V)

47 µH

SA5.0A

47 nF/X2
250 V (AC)

47 µH
low R

S

1 µF

(16 V)

XTAL

7.3728 MHz

fcr= 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

Fig.18 Application diagram without power line insulation.

1999 May 31 18

27 pF27 pF

MGK841

Philips Semiconductors Product specification

Home automation modem TDA5051A

20

handbook, full pagewidth

gain
(dB)

0

−

20

−

40

−

60

−

80

−

100

10

Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the
sampling frequency (

2

10

1

⁄2f

). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band.

osc

1

2

3

10

4

10

5

10

6

10

f (Hz)

Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr= 115.2 kHz; L = 47 µH;

C = 47 nF).

MBH907

3

10

impedance

2

10

10

7

10

input

(Ω)

130

handbook, halfpage

V

o

(dBµV)

120

110

100

110

Fig.20 Output voltage as a function of line impedance (with coupling network; L = 47 µH; C = 47 nF).

1999 May 31 19

MBH908

2

Z

(Ω)

line

10

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

+5 V

250 V (AC)

max

MICRO-

CONTROLLER

+5 V

DATA

DATA

CLK

47 nF

OUT

OUT

PD

78L05

2

IN

1

2

4
15

T 630 mA

31

470 µF

(16 V)

7

OSC1

2.2 MΩ

MOV

250 V (AC)

1 VA

FDB08

100 µF

(16 V)

V

DDDVDDAPVDDA

3

TDA5051A

859 12

OSC2

APGND AGNDDGND

100 Ω

(0.5 W)

230 V

6 V

1311

470 nF/X2
250 V (AC)

47 µH
low R

NEWPORT

76250

26
15

100 Ω

100 nF

(63 V)

22 µH

RX

14

TX

OUT

10

10 nF

IN

SA5.0A

S

1 µF

(16 V)

XTAL

7.3728 MHz

27 pF27 pF

fcr= 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

Fig.21 Application diagram with power line insulation.

1999 May 31 20

MGK842

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

+5 V

CONTROLLER

250 V (AC)

MICRO-

max

+5 V

DATA

DATA

CLK

78L05

47 nF

OUT

OUT

PD

2

IN

T 630 mA

1

2

4
15

7

31

470 µF

(16 V)

OSC1

100 µF

2.2 MΩ

MOV

250 V (AC)

1N4006

7V5

(1.3 W)

(16 V)

V

DDDVDDAP

3

TDA5051A

859 12

OSC2

APGND AGNDDGND

250 V (AC)

68 Ω

(2 W)

1 mH

1N4006

V

DDA

1311

14

10

2 µF

RX

TX

IN

OUT

10 nF

BC547B

47 nF/X2

250 V (AC)

10
kΩ

1 kΩ

47 µH

low R

47 nF
(63 V)

47 µH

150

kΩ

10 nF

33
kΩ

S

1 µF

(16 V)

XTAL

7.3728 MHz

27 pF27 pF

fcr= 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBµV typ.).

1999 May 31 21

SA5.0A

MGK843

Philips Semiconductors Product specification

Home automation modem TDA5051A

handbook, full pagewidth

+5 V

250 V (AC)

max

MICRO-

CONTROLLER

+5 V

DATA

DATA

CLK

47 nF

OUT

OUT

PD

78L05

2

IN

1

2

4
15

T 630 mA

31

470 µF

(16 V)

7

OSC1

2.2 MΩ

MOV

250 V (AC)

1 VA

FDB08

100 µF

(16 V)

V

DDDVDDAPVDDA

3

TDA5051A

859 12

OSC2

APGND AGNDDGND

100 Ω

(0.5 W)

230 V

6 V

1311

470 nF/X2
250 V (AC)

47 µH
low R

NEWPORT

76250

26
15

100 Ω

100 nF

(63 V)

22 µH

10
kΩ

1 kΩ

150

kΩ

33
kΩ

10 nF

10 nF

RX

IN

14

BC547B

TX

OUT

10

S

1 µF

(16 V)

XTAL

7.3728 MHz

27 pF27 pF

fcr= 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBµV typ.).

1999 May 31 22

SA5.0A

MGK844

Philips Semiconductors Product specification

Home automation modem TDA5051A

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

8

w M

b

p

SOT162-1

E

H

E

Q

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT162-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013AA

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.5

7.6

7.4

0.30

0.29

1.27

0.050

10.1

0.41

0.40

REFERENCES

1999 May 31 23

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

95-01-24
97-05-22

o

8

o

0

Philips Semiconductors Product specification

Home automation modem TDA5051A

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 May 31 24

Philips Semiconductors Product specification

Home automation modem TDA5051A

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable

SOLDERING METHOD

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 May 31 25

Philips Semiconductors Product specification

Home automation modem TDA5051A

NOTES

1999 May 31 26

Philips Semiconductors Product specification

Home automation modem TDA5051A

NOTES

1999 May 31 27

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999 65

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 295002/25/02/pp28 Date of release: 1999 May 31 Document order number: 9397750 05035