Datasheet TDA4863J, TDA4863AJ Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA4863J; TDA4863AJ

Vertical deflection booster

Product specification
File under Integrated Circuits, IC02

2000 Aug 17

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

FEATURES

• Power amplifier with differential inputs

• Output current up to 3 A (p-p)

• High vertical deflection frequency up to 200 Hz

• High linear sawtooth signal amplification

• Flyback generator:

– TDA4863J: separate adjustable flyback supply

voltage up to 60 V

– TDA4863AJ: internally doubled supply voltage

GENERAL DESCRIPTION

The TDA4863J and TDA4863AJ are deflection boosters
for usein vertical deflection systems for frame frequencies
up to 200 Hz.

The TDA4863J needs a separate flyback supply voltage,
so the supply voltages are independently adjustable to
optimize power consumption and flyback time.

For the TDA4863AJ the flyback supply voltage will be
generated internally by doubling the supply voltage and
therefore a separate flyback supply voltage is not needed.

(two supply voltages only for DC-coupled outputs).

Both circuits provide differential input stages and fit well
with the TDA485X monitor deflection controller family.

QUICK REFERENCE DATA

Measurements referenced to ground (pin GND).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

V

P2

supply voltage 1 (pin 1) 9 − 30 V
supply voltage 2 for vertical output

VP1− 1 − 60 V

(pin 3)

V

FB

flyback supply voltage of TDA4863J

VP1− 1 − 60 V

(pin 2)

V

P3

flyback generator output voltage of

I5= −1.5 A 0 − VP1+ 2.2 V

TDA4863AJ (pin 2)

I

5(p-p)

vertical output current (pin 5)

−−3A

(peak-to-peak value)

I

P1

I

P2

V

INP

V

INN

T

amb

supply current 1 (pin 1) during scan − 610mA
quiescent supply current 2 (pin 3) I5=0 − 25 60 mA
input voltage (pin 7) 1.6 − VP1− 0.5 V
input voltage (pin 6) 1.6 − VP1− 0.5 V
ambient temperature −20 − +75 °C

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA4863J DBS7P plastic DIL-bent-SIL power package; 7 leads
TDA4863AJ

(lead length 12/11 mm); exposed die pad

2000 Aug 17 2

SOT524-1

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

BLOCK DIAGRAM

handbook, full pagewidth

from TDA485X

THERMAL

PROTECTION

DIFFERENTIAL

INPUT

STAGE

76 5 43 2 1

INNINP

R3

R2

R

P

VERTICAL

OUTPUT

V-OUT

R

S1

deflection
coil

R1

FLYBACK

GENERATOR

V

GND

P2

C

S1

C1

V

N

TDA4863J

C4

V

F

REFERENCE

V

FB

D1

R4

CIRCUIT

V

P1

C2

V

MHB714

P

Fig.1 Block diagram of TDA4863J.

2000 Aug 17 3

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

handbook, full pagewidth

from TDA485X

THERMAL

PROTECTION

DIFFERENTIAL

INPUT

STAGE

76 5 43 2 1

INNINP

R3

R2

R

P

VERTICAL

OUTPUT

V-OUT

R

S1

deflection
coil

R1

GND

C

S1

V

N

V

R5

C1

FLYBACK

GENERATOR

P2

C

F

TDA4863AJ

V

P3

REFERENCE

CIRCUIT

D1

V

P1

C2

R6

V

MHB715

P

Fig.2 Block diagram of TDA4863AJ.

2000 Aug 17 4

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

PINNING

SYMBOL

DESCRIPTION

TDA4863J TDA4863AJ

PIN

V

P1

V

FB

V

P3

V

P2

1 1 positive supply voltage 1
2 − flyback supply voltage

− 2 flyback generator output

3 3 supply voltage 2 for vertical output
GND 4 4 ground or negative supply voltage
V-OUT 5 5 vertical output
INN 6 6 inverted input of differential input stage
INP 7 7 non-inverted input of differential input stage

handbook, halfpage

V

P1

V

FB

V

P2

GND

V-OUT

INN
INP

1
2
3
4

TDA4863J

5
6
7

MHB716

handbook, halfpage

V

P1

V

P3

V

P2

GND

V-OUT

INN
INP

1
2
3
4

TDA4863AJ

5
6
7

MHB717

Fig.3 Pin configuration of TDA4863J.

2000 Aug 17 5

Fig.4 Pin configuration of TDA4863AJ.

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

FUNCTIONAL DESCRIPTION

Both the TDA4863J and TDA4863AJ consist of a
differential input stage, a vertical output stage, a flyback
generator, a reference circuit and a thermal protection
circuit.

The TDA4863J operates with a separate flyback supply
voltage (see Fig.1) while the TDA4863AJ generates the
flyback voltage internally by doubling the supply voltage
(see Fig.2).

Differential input stage

Thedifferential sawtoothinputsignal (e.g.comingfrom the
deflection controller family TDA485X) is connected to the
inputs (inverted signal to pin 6 and non-inverted signal to
pin 7). The vertical feedback signal is superimposed on
the inverted signal on pin 6.

Vertical output and thermal protection

The vertical output stage is a quasi-complementary
class-B amplifier with a high linearity.

The outputstage is protected againstthermal overshoots.
For a junction temperature Tj> 150 °C this protection will
be activated andwill reducethen thedeflection current(I5).

Flyback generator

The flyback generator supplies the vertical output stage
during flyback.

The TDA4863J is used with separate flyback supply
voltage to achieve a short flyback time with minimized
power dissipation.

The TDA4863AJ needs a capacitor CF between
pins 2 and 3 (see Fig.2). Capacitor CF is charged during
scan, using the external diode D1 and resistor R5. During
flyback the cathode of capacitor CF is connected to the
positive supply voltage and the flyback voltage is then
twice the supply voltage. For the TDA4863AJ the
resistor R6 in the positive supply line can be used to
reduce the power consumption.

In parallel with the deflection coil a damping resistor R
and an RC combination (RS1= 5.6 Ω and CS1= 100 nF)
are needed. Furthermore, another additional
RC combination (RS2= 5.6 Ω and CS2= 47 to 150 nF)
can be used to minimize the noise effect and the flyback
time (see Figs 9 and 10).

P

2000 Aug 17 6

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to ground (pin 4); unless
otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
V
V
V
V
I
I
I
T
T
T
V

P1
P2
FB
P3
i(6,7)

o(5)
P2
o(5)
2

stg

amb

j

es

supply voltage 1 (pin 1) − 40 V
supply voltage 2 (pin 3) − 60 V
flyback supply voltage of TDA4863J (pin 2) − 60 V
flyback generator output voltageof TDA4863AJ (pin 2) 0 VP1+3 V
input voltage on pins 6 and 7 − V

P1

V
output voltage on pin 5 − 62 V
supply current 2 (pin 3) −±1.8 A
output current (pin 5) note 1 −±1.8 A
flyback current on pin 2 −±1.8 A
storage temperature −25 +150 °C
ambient temperature −20 +75 °C
junction temperature note 1 − 150 °C
electrostatic discharge voltage on all pins note 2 −300 +300 V

Notes

1. Internally limited by thermal protection; will be activated for Tj≥ 150 °C.

2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-mb)

thermal resistance from junction to mounting base note 1 6 K/W

Note

1. To minimize the thermal resistance from mounting base to heatsink [R

] follow the recommended mounting

th(mb-h)

instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases R

th(mb-h)

.

2000 Aug 17 7

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

CHARACTERISTICS

VP1=25V; V4=0V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V

P1

V

P2

V

FB

supply voltage 1 (pin 1) 9 − 30 V
supply voltage 2 (pin 3) VP1− 1 − 60 V
flyback supply voltage of TDA4863J

(pin 2)

V

P3

flyback generator output voltage of
TDA4863AJ (pin 2)

I

P1

I

P2

supply current 1 (pin 1) during scan − 610mA
quiescent supply current 2 (pin 3) I5=0 − 25 60 mA

Differential input stage

V
V
I
I

INP

INN
INP
INN

input voltage (pin 7) 1.6 − VP1− 0.5 V
input voltage (pin 6) 1.6 − VP1− 0.5 V
input quiescent current (pin 7) −−100 −500 nA
input quiescent current (pin 6) −−100 −500 nA

Flyback generator

I

2

V

3-2

current during flyback −−±1.5 A
voltage drop during flyback of

TDA4863J

reverse I

forward I

V

2-1

voltage drop during flyback of
TDA4863AJ

reverse I

forward I

Vertical output stage; see Fig.5
I

5

I

5(p-p)

vertical deflection output current −−±1.5 A
vertical deflection output current on

pin 5 (peak-to-peak value)

V

5-4

V

5-3

output saturation voltage to ground I5=1A − 1.4 1.7 V

output saturation voltage to V

LIN non-linearity of output signal note 1 −−1%

=25°C; voltages referenced to ground (pin 4); unless otherwise specified.

amb

VP1− 1 − 60 V

I5= −1.5 A 0 − VP1+ 2.2 V

= −1A −−1.5 − V

5

I

= −1.5 A −−2−V

5

=1A − 2.2 − V

5

= 1.5 A − 2.5 − V

I

5

= −1A −−1.5 − V

5

= −1.5 A −−2−V

I

5

=1A − 2.2 − V

5

= 1.5 A − 2.5 − V

I

5

−−3A

I

= 1.5 A − 1.8 2.3 V

5

P2

I5=1A −2.3 −2 − V
I

= 1.5 A −2.8 −2.3 − V

5

Note

1. Deviation of the output slope at a constant input slope.

2000 Aug 17 8

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

handbook, full pagewidth

input signal

on pin INN

t

input signal

on pin INP

V

FB

output voltage
on pin V-OUT

GND

deflection current

through the coil

t

(1)

V

P1

t

t

MHB718

(1) VFB for TDA4863J; 2VP1 for TDA4863AJ.

Fig.5 Timing diagram.

2000 Aug 17 9

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

INP INN

76 13245

Fig.6 Internal circuits of TDA4863J.

GNDV-OUT

V

P2

TDA4863J

V

FB

V

P1

MHB719

handbook, full pagewidth

INP INN

76 13245

Fig.7 Internal circuits of TDA4863AJ.

2000 Aug 17 10

GNDV-OUT

TDA4863AJ

V

V

P2

P3

V

P1

MHB720

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

APPLICATION INFORMATION

handbook, full pagewidth

handbook, full pagewidth

V

F

V

P

2

TDA4863J

5

vertical

output

signal

1N4448

2.2 Ω
BC556

3.3 kΩ

22 µF

>

1 kΩ

220 kΩ

guard output
HIGH = error

BC548

MHB721

Fig.8 Application circuit with TDA4863J for external guard signal generation.

THERMAL

PROTECTION

TDA4863J

DIFFERENTIAL

INPUT

STAGE

76 5 43 2 1

INNINP

(1)

C

S2

R

S2

R3

from TDA485X

Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin 4).

(1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.

1.8 kΩ
R2

1.8 kΩ

5.6

R

P

270

Ω

Ω

R1

VERTICAL

OUTPUT

V-OUT

R

S1

5.6 Ω

deflection
coil

1 Ω

(1 W)

C

100

nF

S1

−8 V

GND

470 µF

V

N

FLYBACK

GENERATOR

V

P2

470 µF

+50 V

Fig.9 Application circuit with TDA4863J.

V

FB

4.3 Ω

V

F

D1

BYV27

REFERENCE

CIRCUIT

V

P1

470

V

P

+9 V

µF

MHB722

2000 Aug 17 11

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

handbook, full pagewidth

from TDA485X

THERMAL

PROTECTION

DIFFERENTIAL

INPUT

STAGE

76 5 43 2 1

INNINP

(1)

C

R3

1.8 kΩ
R2

1.8 kΩ

R

5.6

S2

S2

R

P

270

Ω

Ω

R1

VERTICAL

OUTPUT

V-OUT

R

S1

5.6 Ω

deflection
coil

1 Ω

(1 W)

C

S1

100

nF

−12.5 V

V

GND

R5

240 Ω (2 W)

470 µF

V

N

FLYBACK

GENERATOR

P2

C

F

100 µF

(2)

TDA4863AJ

V

P3

REFERENCE

CIRCUIT

D1

BYV27

3.9 Ω
(2 W)

V

V

+12.5 V

P1

470 µF

(3)

R6

P

MHB723

Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin 4).

(1) With CS2 (typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.
(2) With R5 capacitor CF will be charged during scan and the value (typical value between 150 and 270 Ω) depends on I
(3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application.

Fig.10 Application circuit with TDA4863AJ.

2000 Aug 17 12

defl

, t

and CF.

flb

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

Example for both TDA4863J and TDA4863AJ
Table 1 Values given from application

SYMBOL VALUE UNIT

I

defl(max)

L

deflcoil

R

deflcoil

R

P

0.71 A
6mH
6 Ω

270 Ω
R1 1 Ω
R2 1.8 kΩ
R3 1.8 kΩ

(1)

V

FB

T

amb

T

deflcoil

R

th(j-mb)

R

th(mb-amb)

50 V
60 °C
75 °C

6 K/W
8 K/W

Note

1. For TDA4863J only.

Table 2 Calculated values

VALUE

SYMBOL

TDA4863J TDA4863AJ

V

P1

V

N

P

tot

P

defl

P

IC

R

th(tot)

T

j(max)

V

P1,VN

and VFB are referenced to ground of application;

9 12.5 V

−8 −12.5 V

3.2 4.4 W

1.2 1.2 W
2 3.2 W

14 14 K/W
88 105 °C

voltages are calculated with +10% tolerances.

UNIT

Calculation formulae for power consumption:

P

P

IC

P

tot

P

defl

–=

totPdefl

I

R1+

defl(max)

-------------------­4

2

×=

I

defl(max)

VP1UD1–()

–()0.01 A 0.2 W+×+

V

P1VN

R

deflcoil

-------------------------------­3

V

N

I

defl(max)

×+×=

-------------------­4

where

P

= power dissipation of the IC

IC

P

= total power dissipation

tot

P

= power dissipation of the deflection coil.

defl

Calculation formulae for maximum required thermal
resistance for the heatsink at T

T

–

j(max)Tamb

R

th(mb-amb)



---------------------------------- -



P

IC

= 110 °C:

j(max)

R

– 19 K/W (max.)==

th(j-mb)

Table 3 tflb as a function of VFB for TDA4863J

tflb (µs) VFB(V)

350 30
250 40
210 50

Table 4 t

t

(µs) VP1(V) VN(V) PIC(W) R6 (Ω)

flb

as a function of VP1 and VN for TDA4863AJ

flb

360 10 −10 2.5 1
290 12.5 −12.5 3.2 3.9
240 15 −15 3.9 6.8

Calculation formulae for supply voltages:
VP1= −V
VN=V

+(R1+R

5-3

+(R1+R

5-4

deflcoil

deflcoil

) × I

) × I

defl(max)

defl(max)

− U’L+U

+U’

L

D1

where

U’L=L

deflcoil

× 2I

defl(max)

× f

v

fv= vertical deflection frequency
UD1= forward voltage drop across D1.

2000 Aug 17 13

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

PACKAGE OUTLINE

DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad

q

non-concave

x

D

h

D

D

1

P

view B: mounting base side

A

2

E

h

1

SOT524-1

k

17

Z

DIMENSIONS (mm are the original dimensions)

(2)

UNIT b

A

p

2

2.7

mm

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

0.80

2.3

0.65

OUTLINE
VERSION

SOT524-1

cD

0.58

0.48

(1)

(2)

D

1

13.2

6.2

12.8

5.8

IEC JEDEC EIAJ

e

1

b

e

D

h

14.7

3.5

14.3

p

(1)

E

h

2.54

3.5

q

2

E

w M

0 10 mm5

scale

e

e

e

1

2

3.0

1.27

5.08 4.85

REFERENCES

2.0

12.4

11.0

B

q

L

3

L

2

L

L

Qc

m

L

Lq

11.4

10.0

L

L

m

2.8

Pk

3.4

3.1

1

2

3

6.7

4.5

5.5

3.7

e

2

QE

q

q

1

1.15

17.5

0.85

16.3

EUROPEAN

PROJECTION

1

v M

(1)

v

2

3.8

3.6

w

0.8

0.3

ISSUE DATE

98-11-12
00-07-03

x

0.02

Z

2.92

2.37

2000 Aug 17 14

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.A morein-depth account ofsoldering ICscanbe
found in our

Packages”

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

DBS, DIP, HDIP, SDIP, SIL suitable suitable

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

“Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

PACKAGE

Thetotal contacttimeof successivesolderwaves mustnot
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may benecessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less)to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

SOLDERING METHOD

DIPPING WAVE

(1)

stg(max)

). If the

2000 Aug 17 15

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet containspreliminary data, and supplementary datawill be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting valuesdefinition Limiting values givenare in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese oratany otherconditions above thosegiven inthe
Characteristics sectionsof the specification isnot implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarrantythat such applicationswillbe
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers usingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse ofanyof theseproducts,conveys nolicenceor title
under any patent, copyright, or mask work right to these
products,and makesno representations orwarranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Aug 17 16

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

NOTES

2000 Aug 17 17

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

NOTES

2000 Aug 17 18

Philips Semiconductors Product specification

Vertical deflection booster TDA4863J; TDA4863AJ

NOTES

2000 Aug 17 19

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Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PTPhilipsDevelopmentCorporation,SemiconductorsDivision,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, ViaCasati, 23 -20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotationor contract, is believed tobe accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

70

Printed in The Netherlands 753504/01/pp20 Date of release:2000 Aug 17 Document order number: 9397 750 07125