Datasheet TDA4856-V2 Datasheet (Philips)

Page 1
DATA SH EET
Product specification Supersedes data of 1998 Oct 02 File under Integrated Circuits, IC02
1999 Jul 13
INTEGRATED CIRCUITS
TDA4856
2
C-bus autosync deflection
controller for PC monitors
Page 2
1999 Jul 13 2
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
FEATURES Concept features
Full horizontal plus vertical autosync capability
Extended horizontal frequency range from
15 to 130 kHz
Comprehensive set of I2C-bus driven geometry adjustments and functions, including standby mode
Very good vertical linearity
Moire cancellation
Start-up and switch-off sequence for safe operation of
all power components
X-ray protection
Power dip recognition
Flexible switched mode B+ supply function block for
feedback and feed forward converter
Internally stabilized voltage reference
Drive signal for focus amplifiers with combined
horizontal and vertical parabola waveforms
DC controllable inputs for Extremely High Tension (EHT) compensation
SDIP32 package.
Synchronization
Can handle all sync signals (horizontal, vertical, composite and sync-on-video)
Output for video clamping (leading/trailing edge selectable by the I2C-bus), vertical blanking and protection blanking
Output for fast unlock status of horizontal synchronization and blanking on grid 1 of picture tube.
Horizontal section
I2C-bus controllable wide range linear picture position, pin unbalance and parallelogram correction via horizontal phase
Frequency-lockedloopforsmoothcatchingofhorizontal frequency
Simple frequency preset of f
min
and f
max
by external
resistors
Low jitter
Soft start for horizontal and B+ control drive signals.
Vertical section
I2C-bus controllable vertical picture size, picture position, linearity (S-correction) and linearity balance
Outputfor the I2C-buscontrollable vertical sawtooth and parabola (for pin unbalance and parallelogram)
Vertical picture size independent of frequency
Differential current outputs for DC coupling to vertical
booster
50 to 160 Hz vertical autosync range.
East-West (EW) section
I2C-bus controllable output for horizontal pincushion, horizontal size, corner and trapezium correction
Optional tracking of EW drive waveform with line frequency selectable by the I2C-bus.
Focus section
I2C-bus controllable output for horizontal and vertical parabolas
Verticalparabolaisindependentoffrequencyandtracks with vertical adjustments
Horizontal parabola independent of frequency
Adjustable pre-correction of delay in focus output stage.
Page 3
1999 Jul 13 3
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
GENERAL DESCRIPTION
The TDA4856 is a high performance and efficient solution for autosync monitors. All functions are controllable by the I2C-bus.
The TDA4856 provides synchronization processing, horizontal and vertical synchronization with full autosync capability and very short settling times after mode changes. External power components are given a great deal of protection. The IC generates the drive waveforms for DC-coupled vertical boosters such as the TDA486x and TDA835x.
The TDA4856 provides extended functions e.g. as a flexible B+ control, an extensive set of geometry control facilities, and a combined output for horizontal and vertical focus signals.
Together with the I2C-bus driven Philips TDA488x video processor family, a very advanced system solution is offered.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
CC
supply voltage 9.2 16 V
I
CC
supply current 70 mA
I
CC(stb)
supply current during standby mode 9 mA VSIZE vertical size 60 100 % VGA VGA overscan for vertical size 16.8 % VPOS vertical position −±11.5 % VLIN vertical linearity (S-correction) 2 −−46 % VLINBAL vertical linearity balance −±1.25 % V
HSIZE
horizontal size 0.13 3.6 V V
HPIN
horizontal pincushion (EW parabola) 0.04 1.42 V V
HEHT
horizontal size modulation 0.02 0.69 V V
HTRAP
horizontal trapezium correction −±0.5 V V
HCORT
horizontal corner correction at top of picture 0.64 +0.2 V V
HCORB
horizontal corner correction at bottom of picture 0.64 +0.2 V HPOS horizontal position −±13 % HPARAL horizontal parallelogram −±1.5 % HPINBAL EW pin unbalance −±1.5 % T
amb
operating ambient temperature 20 +70 °C
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA4856 SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
Page 4
1999 Jul 13 4
Philips Semiconductors Product specification
I
2
C-bus autosync deflection controller for
PC monitors
TDA4856
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BLOCK DIAGRAM
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VERTICAL
SYNC INPUT
AND POLARITY
CORRECTION
VERTICAL
SYNC
INTEGRATOR
VERTICAL
OSCILLATOR
AND AGC
EW OUTPUT
HORIZONTAL PINCUSHION HORIZONTAL CORNER HORIZONTAL TRAPEZIUM HORIZONTAL SIZE
VERTICAL LINEARITY VERTICAL LINEARITY
BALANCE
EHT COMPENSATION
HORIZONTAL AND
VERTICAL SIZE
ASYMMETRIC
EW-CORRECTION
OUTPUT
HORIZONTAL
AND VERTICAL
I2C-BUS
RECEIVER
HUNLOCK
OUTPUT
VERTICAL POSITION VERTICAL SIZE AND
VERTICAL OVERSCAN
VIDEO CLAMPING
AND
VERTICAL BLANK
SUPPLY
AND
REFERENCE
HORIZONTAL OSCILLATOR
PLL1 AND
HORIZONTAL
POSITION
PLL2, PARALLELOGRAM,
PIN UNBALANCE AND
SOFT START
COINCIDENCE DETECTOR
FREQUENCY DETECTOR
I2C-BUS REGISTERS
PROTECTION
AND SOFT START
X-RAY
PROTECTION
HORIZONTAL
OUTPUT
B+
CONTROL
22 k
3.3 k
100 nF
8.2 nF
150
nF
(1%)
10 nF
R
HBUF
(2%)
R
HREF
(1%)
(1)
B+ CONTROL APPLICATION
(2)
(TTL level)
(TTL level)
9.2 to 16 V
(video)
clamping blanking
14
23 22 21 31
11
100
nF
(5%)
24
VOUT2
12
VOUT1
ASCOR
13
32 FOCUS
BDRV BSENS BOP BIN
8
HDRV
or
20
17
19 18
6 4 3 5
10
7
25
16
15
26
27
28 29
12 nF
30 1
TDA4856
H/C SYNC INPUT
AND POLARITY
CORRECTION
MGS272
29
VERTICAL OUTPUT
FOCUS
SDA SCL
HSYNC
SGND
PGND
CLBL
VSYNC
V
CC
EWDRV
VSMODVAGCVCAPVREF HSMOD
7 V
1.2 V
EHT compensation
via horizontal size
EHT compensation
via vertical size
HFLB
HPLL2HCAPHREFHBUFHPLL1
XSEL XRAY
HUNLOCK
Fig.1 Block diagram and application circuit.
(1) For the calculation of fH range see Section“Calculation of line frequency range”. (2) See Figs 22 and23.
Page 5
1999 Jul 13 5
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
PINNING
SYMBOL PIN DESCRIPTION
HFLB 1 horizontal flyback input XRAY 2 X-ray protection input BOP 3 B+ control OTA output BSENS 4 B+ control comparator input BIN 5 B+ control OTA input BDRV 6 B+ control driver output PGND 7 power ground HDRV 8 horizontal driver output XSEL 9 select input for X-ray reset V
CC
10 supply voltage EWDRV 11 EW waveform output VOUT2 12 vertical output 2 (ascending sawtooth) VOUT1 13 vertical output 1 (descending sawtooth) VSYNC 14 vertical synchronization input HSYNC 15 horizontal/composite synchronization input CLBL 16 video clamping pulse/vertical blanking output HUNLOCK 17 horizontal synchronization unlock/protection/vertical blanking output SCL 18 I2C-bus clock input SDA 19 I2C-bus data input/output ASCOR 20 output for asymmetric EW corrections VSMOD 21 input for EHT compensation (via vertical size) VAGC 22 external capacitor for vertical amplitude control VREF 23 external resistor for vertical oscillator VCAP 24 external capacitor for vertical oscillator SGND 25 signal ground HPLL1 26 external filter for PLL1 HBUF 27 buffered f/v voltage output HREF 28 reference current for horizontal oscillator HCAP 29 external capacitor for horizontal oscillator HPLL2 30 external filter for PLL2/soft start HSMOD 31 input for EHT compensation (via horizontal size) FOCUS 32 output for horizontal and vertical focus
Page 6
1999 Jul 13 6
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
FUNCTIONAL DESCRIPTION Horizontal sync separator and polarity correction
HSYNC (pin 15) is the input for horizontal synchronization signals, which can be DC-coupled TTL signals (horizontal or composite sync) and AC-coupled negative-going video sync signals. Video syncs are clamped to 1.28 V and sliced at 1.4 V. This results in a fixed absolute slicing level of 120 mV related to top sync.
For DC-coupled TTL signals the input clamping current is limited. The slicing level for TTL signals is 1.4 V.
The separated sync signal (either video or TTL) is integrated on an internalcapacitor to detect and normalize the sync polarity.
Normalized horizontal sync pulses are used as input signals for the vertical sync integrator, the PLL1 phase detector and the frequency-locked loop.
Vertical sync integrator
Normalized composite sync signals from HSYNC are integrated on an internal capacitor in order to extract vertical sync pulses. The integration time is dependent on the horizontal oscillator reference current at HREF (pin 28). The integrator output directly triggers the vertical oscillator.
Vertical sync slicer and polarity correction
Vertical sync signals (TTL) applied to VSYNC (pin 14) are sliced at 1.4 V. The output signal of the sync slicer is integrated on an internalcapacitor to detect and normalize the sync polarity. The output signals of vertical sync integrator and sync normalizer are disjuncted before they are fed to the vertical oscillator.
Video clamping/vertical blanking generator
The video clamping/vertical blanking signal at CLBL (pin 16) is a two-level sandcastle pulse which is especially suitableforvideoICs such as the TDA488x family, but also for direct applications in video output stages.
The upper level is the video clamping pulse, which is triggeredbythehorizontalsyncpulse.Either the leading or trailing edge can be selected by setting control bit CLAMP via the I2C-bus. The width of the video clamping pulse is determined by an internal single-shot multivibrator.
The lower level of the sandcastle pulse is the vertical blanking pulse, which is derived directly from the internal oscillator waveform. It is started by the vertical sync and stopped with the start of the vertical scan. This results in optimum vertical blanking. Two different vertical blanking times are accessible, by control bit VBLK, via the I2C-bus.
Blanking will be activated continuously if one of the following conditions is true:
Soft start of horizontal and B+ drive [voltage at HPLL2 (pin 30) pulled down externally or by the I2C-bus]
PLL1 is unlocked while frequency-locked loop is in search mode
No horizontal flyback pulses at HFLB (pin 1) X-ray protection is activated Supply voltage at VCC (pin 10) is low (see Fig.24).
Horizontal unlock blanking can be switched off, by control bit BLKDIS, via the I2C-bus while vertical blanking is maintained.
Fig.2 Pin configuration.
handbook, halfpage
TDA4856
MGS273
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
HFLB
XRAY
BOP
BSENS
BIN
BDRV PGND HDRV
XSEL
V
CC
EWDRV
VOUT2 VOUT1 VSYNC
FOCUS HSMOD HPLL2 HCAP
HBUF HPLL1
HREF
SGND VCAP VREF VAGC VSMOD ASCOR SDA
HSYNC
CLBL
SCL HUNLOCK
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1999 Jul 13 7
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Frequency-locked loop
The frequency-locked loop can lock the horizontal oscillatorover a wide frequencyrange. This is achievedby a combined search and PLL operation. The frequency range is preset by two external resistors and the
recommended maximum ratio is
This can, for instance, be a range from 15.625 to 90 kHz with all tolerances included.
Without a horizontal sync signal the oscillator will be free-running at f
min
. Any change of sync conditions is detected by the internal coincidence detector. A deviation of more than 4% between horizontal sync and oscillator frequency switches the horizontal section into search mode.This means that PLL1control currents are switched off immediately. The internal frequency detector then starts tuning the oscillator. Very small DC currents at HPLL1 (pin 26) are used to perform this tuning with a well defined change rate. When coincidence between horizontal sync and oscillator frequency is detected, the search mode is first replaced by a soft-lock mode which lasts for the first part of the next vertical period. The soft-lock mode is then replaced by a normal PLL operation. This operation ensures smooth tuning and avoids fast changes of horizontal frequency during catching.
In this concept it is not allowed to load HPLL1. The frequency dependent voltage at this pin is fed internally to HBUF (pin 27) via a sample-and-hold and buffer stage. The sample-and-hold stage removes all disturbances caused by horizontal sync or composite vertical sync from the buffered voltage. An external resistorconnectedbetweenpins HBUFand HREF defines the frequency range.
Out-of-lock indication (pin HUNLOCK)
Pin HUNLOCK is floating during search mode, or if a protection condition is true. All this can be detected by the microcontroller if a pull-up resistor is connected to its own supply voltage.
For an additional fast vertical blanking at grid 1 of the picture tube a 1 V signal referenced to ground is available at this output. The continuous protection blanking (see Section“Videoclamping/verticalblankinggenerator”) is also available at this pin. Horizontal unlock blanking can be switched off, by control bit BLKDIS via the I2C-bus while vertical blanking is maintained.
Horizontal oscillator
The horizontal oscillator is of the relaxation type and requires a capacitor of 10 nF at HCAP (pin 29). For optimum jitter performance the value of 10 nF must not be changed.
The minimum oscillator frequency is determined by a resistor from HREF to ground. A resistor connected between pins HREF and HBUF defines the frequency range.
The reference current at pin HREF also defines the integration time constant of the vertical sync integration.
Calculation of line frequency range
The oscillator frequencies f
min
and f
max
must first be calculated. This is achieved by adding the spread of the relevant components to the highest and lowest sync frequencies f
sync(min)
and f
sync(max)
. The oscillator is driven
by the currents in R
HREF
and R
HBUF
.
The following example is a 31.45 to 90 kHz application:
Table 1 Calculation of total spread
Thus the typical frequency range of the oscillator in this example is:
The resistors R
HREF
and R
HBUFpar
can be calculated using
the following formulae:
.
The resistor R
HBUFpar
is calculated as the value of R
HREF
and R
HBUF
in parallel.
f
max
f
min
----------
6.5 1
------- -
=
spread of for f
max
for f
min
IC ±3% ±5% C
HCAP
±2% ±2%
R
HREF
, R
HBUF
±2% ±2%
Total ±7% ±9%
f
maxfsync max()
1.07× 96.3 kHz==
f
min
f
sync min()
1.09
-----------------------
28.4 kHz==
R
HREF
78 kHz k××Ω
f
min
0.0012 f
min
2
×+ kHz[]
-----------------------------------------------------------------
2.61 k==
R
HBUFpar
78 kHz k××Ω
f
max
0.0012 f
max
2
×+ kHz[]
--------------------------------------------------------------------
726 ==
Page 8
1999 Jul 13 8
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Theformulae for R
HBUF
alsotakesinto account the voltage
swing across this resistor:
PLL1 phase detector
The phase detector is a standard type using switched current sources, which are independent of horizontal frequency. It compares the middle of horizontal sync with a fixed point on the oscillator sawtooth voltage. The PLL1 loop filter is connected to HPLL1 (pin 26).
See also Section “Horizontal position adjustment and corrections”.
Horizontal position adjustment and corrections
A linear adjustment of the relative phase between the horizontal sync and the oscillator sawtooth (in PLL1 loop) is achieved via register HPOS.Once adjusted, the relative phase remains constant over the whole frequency range.
Correctionof pin unbalance and parallelogramis achieved by modulating the phase between oscillator sawtooth and horizontal flyback (in loop PLL2) via registers HPARAL and HPINBAL. If those asymmetric EW corrections are performed in the deflection stage, both registers can be disconnected from the horizontal phase via control bit ACD. This does not change the output at pin ASCOR.
Horizontal moire cancellation
To achieve a cancellation of horizontal moire (also known as ‘video moire’), the horizontal frequency is divided-by-two to achieve a modulation of the horizontal phase via PLL2. The amplitude is controlled by register HMOIRE. To avoid a visible structure on screen the polarity changes with half of the vertical frequency. Control bit MOD disables the moire cancellation function.
PLL2 phase detector
The PLL2 phase detector is similar to the PLL1 detector and compares the line flyback pulse at HFLB (pin 1) with the oscillator sawtooth voltage. The control currents are independent of the horizontal frequency. The PLL2 detector thus compensates for the delay in the external horizontal deflection circuit by adjusting the phase of the HDRV (pin 8) output pulse.
An external modulation of the PLL2 phase is not allowed, because this would disturb the pre-correction of the horizontal focus parabola.
Soft start and standby
If HPLL2 is pulled to ground, either by an external DC current or by resetting register SOFTST, the horizontal outputpulses and B+ control driver pulseswillbeinhibited. This means that HDRV (pin 8) and BDRV (pin 6) are floating in this state. In both cases PLL2 and the frequency-locked loop are disabled, and CLBL (pin 16) provides a continuous blanking signal and HUNLOCK (pin 17) is floating.
This option can be used for soft start, protection and power-down modes. When pin HPLL2 is released again, anautomatic soft start sequenceon the horizontal driveas well as on the B-drive output will be performed (see Fig.24).
A soft start can only be performed if the supply voltage for the IC is a minimum of 8.6 V.
The soft start timing is determined by the filter capacitor at HPLL2 (pin 30), which is charged with a constant current during soft start. In the beginning the horizontal driver stage generates very small output pulses. The width of these pulses increases with the voltage at HPLL2 until the final duty cycle is reached. The voltage at HPLL2 increases further and performsa soft start at BDRV (pin 6) as well. After BDRV has reached full duty cycle, the voltage at HPLL2 continues to rise until HPLL2 enters its normaloperatingrange.Theinternalchargecurrentisnow disabled. Finally PLL2 and the frequency-locked loop are activated. If both functions reach normal operation, HUNLOCK (pin 17) switches from the floating status to normal vertical blanking, andcontinuous blanking at CLBL (pin 16) is removed.
Output stage for line drive pulses [HDRV (pin 8)]
An open-collector output stage allows direct drive of an inverting driver transistor because of a low saturation voltage of 0.3 V at 20 mA. To protect the line deflection transistor, the output stage is disabled (floating) for a low supply voltage at V
CC
(see Fig.23).
The duty cycle of line drive pulses is slightly dependent on the actual horizontal frequency. This ensures optimum drive conditions over the whole frequency range.
R
HBUF
R
HREFRHBUFpar
×
R
HREFRHBUFpar
----------------------------------------------
0.8×= 805 =
Page 9
1999 Jul 13 9
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
X-ray protection
TheX-rayprotectioninputXRAY(pin 2)providesavoltage detector with a precise threshold. If the input voltage at XRAY exceeds this threshold for a certain time, then control bit SOFTST is reset, which switches the IC into protection mode. In this mode several pins are forced into defined states:
HUNLOCK (pin 17) is floating The capacitor connected to HPLL2 (pin 30) is
discharged Horizontal output stage (HDRV) is floating B+ control driver stage (BDRV) is floating CLBL provides a continuous blanking signal.
There are two different methods of restarting ways the IC:
1. XSEL (pin 9) is open-circuit or connected to ground. The control bit SOFTST must be set to logic 1 via the I2C-bus. Then the IC returns to normal operation via soft start.
2. XSEL (pin 9) is connected to VCC via an external resistor.Thesupplyvoltage of the IC must be switched off for a certain period of time, before the IC can be restarted again using the standard power-on procedure.
Vertical oscillator and amplitude control
This stage is designed for fast stabilization of vertical size after changes in sync frequency conditions. The free-running frequency f
fr(V)
is determined by the
resistor R
VREF
connected to pin 23 and the capacitor
C
VCAP
connected to pin 24. The value of R
VREF
is not only optimized for noise and linearity performance in the whole vertical and EW section, but also influences several internal references. Therefore the value of R
VREF
must not
be changed. Capacitor C
VCAP
should be used toselect the free-running frequency of the vertical oscillator in accordance with the following formula:
To achieve a stabilized amplitude the free-running frequencyf
fr(V)
,withoutadjustment,shouldbe at least 10% lower than the minimum trigger frequency. The contributions shown in Table 2 can be assumed.
Table 2 Calculation of f
fr(V)
total spread
Result for 50 to 160 Hz application:
The AGC of the vertical oscillator can be disabled by setting control bit AGCDIS via the I
2
C-bus. A precise external current has to be injected into VCAP (pin 24) to obtain the correct vertical size. This special application mode can be used when the vertical sync pulses are serrated (shifted); this condition is found in some display modes, e.g. when using a 100 Hz up converter for video signals.
Application hint: VAGC (pin 22) has a high input impedance during scan. Therefore, the pin must not be loaded externally otherwise non-linearities in the vertical output currents may occur due to the changing charge current during scan.
Adjustment of vertical size, VGA overscan and EHT compensation
There are four differentways to adjust the amplitude of the differential output currents at VOUT1 and VOUT2.
1. Register VGAIN changes the vertical size without
affecting any other output signal of the IC. This adjustment is meant for factory alignments.
2. Register VSIZE changes not only the vertical size, but
also provides the correct tracking of all other related waveforms (see Section “Tracking of vertical adjustments”). This register should be used for user adjustments.
3. For the VGA350 mode register VOVSCN can activate
a +17% step in vertical size.
4. VSMOD(pin 21) can be used for a DC controlled EHT
compensation of vertical size by correcting the differential output currents at VOUT1 and VOUT2. The EW waveforms, verticalfocus, pin unbalance and parallelogram corrections are not affected by VSMOD.
f
fr(V)
1
10.8 R
VREF
× C
VCAP
×
-----------------------------------------------------------
=
Contributing elements
Minimum frequency offset between f
fr(V)
and
lowest trigger frequency
10%
Spread of IC ±3% Spread of R
VREF
±1%
Spread of C
VCAP
±5%
Total 19%
f
fr(V)
50 Hz
1.19
---------------
42 Hz==
Page 10
1999 Jul 13 10
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Adjustment of vertical position, vertical linearity and vertical linearity balance
Register VOFFS provides a DC shift at the sawtooth outputs VOUT1 and VOUT2 (pins 13 and 12) without affecting any other output waveform. This adjustment is meant for factory alignments.
Register VPOS provides a DC shift at the sawtooth output VOUT1 and VOUT2 with correct tracking of all other related waveforms (see Section “Tracking of vertical adjustments”). This register should be used for user adjustments. Due to the tracking the whole picture moves vertically while maintaining the correct geometry.
Register VLIN is used to adjust the amount of the vertical S-correction in the output signal. This function can be switched off by control bit VSC.
Register VLINBAL is used to correct the unbalance of vertical S-correction in the output signal.
Tracking of vertical adjustments
The adjustments via registers VSIZE, VOVSCN and VPOS also affect the waveforms of horizontal pincushion, vertical linearity (S-correction), vertical linearity balance, focus parabola, pin unbalance and parallelogram correction. The result of this interaction is that no readjustment of these parameters is necessary after an user adjustment of vertical picture size and vertical picture position.
Adjustment of vertical moire cancellation
To achieve a cancellation of vertical moire (also known as ‘scanmoire’)theverticalpicturepositioncanbemodulated by half the vertical frequency. The amplitude of the modulation is controlled by register VMOIRE and can be switched off via control bit MOD.
Horizontal pincushion (including horizontal size, corner correction and trapezium correction)
EWDRV(pin 11) provides a complete EW drive waveform. The components horizontal pincushion, horizontal size, corner correction and trapezium correction are controlled by the registers HPIN, HSIZE, HCORT, HCORB and HTRAP.
The corner correction can be adjusted separately for the top (HCORT) and bottom (HCORB) part of the picture.
The pincushion (EW parabola) amplitude, corner and trapezium correction track with the vertical picture size (VSIZE) and also with the adjustment for vertical picture position(VPOS). The corner correctiondoes not track with the horizontal pincushion (HPIN).
Further the horizontal pincushion amplitude, corner and trapezium correction track with the horizontal picture size, which is adjusted via register HSIZE and the analog modulation input HSMOD. If the DC component in the EWDRV output signal is increased via HSIZE or I
HSMOD
, the pincushion, corner and trapezium component of the EWDRV output will be reduced by a factor of
The value 14.4 V is a virtual voltage for calculation only. The output pin can not reach this value, but the gain (and DCbias)oftheexternalapplicationshouldbesuchthatthe horizontal deflection is reduced to zero when EWDRV reaches 14.4 V.
HSMOD (pin 31) can be used for a DC controlled EHT compensation by correcting horizontal size, horizontal pincushion, corner and trapezium. The control range at this pin tracks with the actual value of HSIZE. For an increasing DC component V
HSIZE
in the EWDRV output
signal, the DC component V
HEHT
caused by I
HSMOD
will be
reducedbyafactorof asshownintheequation above.
The whole EWDRV voltage is calculated as follows: V
EWDRV
= 1.2 V + [V
HSIZE+VHEHT
× f(HSIZE) + (V
HPIN
+
V
HCOR+VHTRAP
) × g(HSIZE, HSMOD)] × h(I
HREF
)
Where:
1
V
HSIZEVHEHT
1
V
HSIZE
14.4 V
-----------------


+
14.4 V
-------------------------------------------------------------------------
1
V
HSIZE
14.4 V
-----------------
V
HEHT
I
HSMOD
120 µA
------------------- -
0.69×=
f(HSIZE) 1
V
HSIZE
14.4 V
-----------------
=
g(HSIZE, HSMOD) 1
V
HSIZEVHEHT
1
V
HSIZE
14.4 V
-----------------


+
14.4 V
--------------------------------------------------------------------------
=
hI
HREF
()
I
HREF
I
HREF
f70kHz=
--------------------------------
=
Page 11
1999 Jul 13 11
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Two different modes of operation can be chosen for the EW output waveform via control bit FHMULT:
1. Mode 1 Horizontal size is controlled via register HSIZE and
causesaDCshift at the EWDRV output. The complete waveform is also multiplied internally by a signal proportional to the line frequency [which is detected via the current at HREF (pin 28)]. This mode is to be used for driving EW diode modulator stages which require a voltage proportional to the line frequency.
2. Mode 2 The EW drive waveform does not track with the line
frequency. This mode is to be used for driving EW modulatorswhich require a voltage independent ofthe line frequency.
Output stage for asymmetric correction waveforms [ASCOR (pin 20)]
This output is designed as a voltage output for superimposed waveforms of vertical parabola and sawtooth. The amplitude and polarity of both signals can be changed by registers HPARAL and HPINBAL via the I2C-bus.
Application hint: The TDA4856 offers two possibilities to control registers HPINBAL and HPARAL.
1. Control bit ACD = 1 The two registers now control the horizontal phase by
means of internal modulation of the PLL2 horizontal phase control. The ASCOR output (pin 20) can be left unused, but it will always provide an output signal because the ASCOR output stage is not influenced by the control bit ACD.
2. Control bit ACD = 0 The internal modulation via PLL2 is disconnected.
In order to obtain the required effect on the screen, pin ASCORmust now be fedtothe DC amplifier which controls the DC shift of the horizontal deflection. This option is useful for applications which already use a DC shift transformer.
If the tube does not need HPINBAL and HPARAL, then pin ASCOR can be used for other purposes, i.e. for a simple dynamic convergence.
Dynamic focus section [FOCUS (pin 32)]
Thissectiongeneratesacompletedrivesignalfordynamic focus applications. The amplitude of the horizontal parabola is internally stabilized, thus it is independent of the horizontal frequency. The amplitude can be adjusted via register HFOCUS. Changing horizontal size may require a correction of HFOCUS. To compensate for the delay in external focus amplifiers a ‘pre-correction’ for the phase of the horizontal parabola has been implemented (see Fig.28). The amount of this pre-correction can be adjusted via register HFOCAD. The amplitude of the vertical parabola is independent of frequency and tracks with all vertical adjustments. The amplitude can be adjusted via register VFOCUS.
FOCUS (pin 32) is designed as a voltage output for the superimposed vertical and horizontal parabolas.
B+ control function block
The B+ control function block of the TDA4856 consists of an Operational Transconductance Amplifier (OTA), a voltagecomparator, a flip-flop and a dischargecircuit.This configuration allows easy applications for different B+ control concepts. See also Application Note AN96052:
“B+ converter Topologies for Horizontal Deflection and EHT with TDA4855/58”
.
GENERAL DESCRIPTION The non-inverting input of the OTA is connected internally
toa high precision referencevoltage. The inverting inputis connectedto BIN (pin 5). Aninternal clamping circuit limits the maximum positive output voltage of the OTA. The output itself is connected to BOP (pin 3) and to the inverting input of the voltage comparator. The non-inverting input of the voltage comparator can be accessed via BSENS (pin 4).
B+ drive pulses are generated by an internal flip-flop and fed to BDRV (pin 6) via an open-collector output stage. This flip-flop is set at the rising edge of the signal at HDRV (pin 8). The falling edge of the output signal at BDRV has a defined delay of t
d(BDRV)
to the rising edge of the HDRV pulse. When the voltage at BSENS exceeds the voltageat BOP, the voltage comparator output resets the flip-flop and, therefore, the open-collector stage at BDRV is floating again.
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Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
An internal discharge circuit allows a well defined discharge of capacitors at BSENS. BDRV is active at a LOW-level output voltage (see Figs 22 and 23), thus it requires an external inverting driver stage.
The B+ function block can be used for B+ deflection modulators in many different ways. Two popular application combinations are as follows:
Boost converter in feedback mode (see Fig.22) In this application the OTA is used as an error amplifier
witha limited output voltagerange. The flip-flop isset on the rising edge of the signal at HDRV. A reset will be generated when the voltage at BSENS, taken from the current sense resistor, exceeds the voltage at BOP.
If no reset is generated within a line period, the rising edgeof the next HDRV pulseforces the flip-flop to reset. The flip-flop is set immediately after the voltage at BSENS has dropped below the threshold voltage V
RESTART(BSENS)
.
Buck converter in feed forward mode (see Fig.23) This application uses an external RC combination at
BSENS to provide a pulse width which is independent from the horizontal frequency. The capacitor is charged via an external resistor and discharged by the internal discharge circuit. For normal operation the discharge circuit is activated when the flip-flop is reset by the internal voltage comparator. The capacitor will now be discharged with a constant current until the internally controlled stop level V
STOP(BSENS)
is reached. This level willbe maintained until therising edge of thenext HDRV pulse sets the flip-flop again and disables the discharge circuit.
If no reset is generated within a line period, the rising edge of the next HDRV pulse automatically starts the discharge sequence and resets the flip-flop. When the voltage at BSENS reaches the threshold voltage V
RESTART(BSENS)
, the discharge circuit will be disabled automatically and the flip-flop will be set immediately. This behaviour allows a definition of the maximum duty cycle of the B+ control drive pulse by the relationship of charge current to discharge current.
Supply voltage stabilizer, references, start-up procedures and protection functions
The TDA4856 provides an internal supply voltage stabilizer for excellent stabilization of all internal references.Aninternalgap reference, especially designed for low-noise, is the reference for the internal horizontal andverticalsupplyvoltages.Allinternalreference currents and drive current for the vertical output stage are derived from this voltage via external resistors.
If either the supply voltage is below 8.3 V or no data from the I2C-bus has been received after power-up, the internal softstart and protection functions do not allowanyof those outputs [HDRV, BDRV, VOUT1, VOUT2 and HUNLOCK (see Fig.24)] to be active.
For supply voltages below 8.3 V the internal I2C-bus will not generate an acknowledge and the IC is in standby mode. This is because the internal protection circuit has generated a reset signal for the soft start register SOFTST. Above 8.3 V data is accepted and all registers can be loaded. If the register SOFTST has received a set from the I2C-bus, the internal soft start procedure is released, which activates all above mentioned outputs.
If during normal operation the supply voltage has dropped below 8.1 V, the protection mode is activated and HUNLOCK(pin 17)changesto the protection status and is floating. This can be detected by the microcontroller.
This protection mode has been implemented in order to protect the deflection stages and the picture tube during start-up, shut-down and fault conditions. This protection mode can be activated as shown in Table 3.
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Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Table 3 Activation of protection mode
When the protection mode is active, several pins of the TDA4856 are forced into a defined state:
HDRV (horizontal driver output) is floating BDRV (B+ control driver output) is floating HUNLOCK (indicates, that the frequency-to-voltage
converter is out of lock) is floating (HIGH-level via external pull-up resistor)
CLBL provides a continuous blanking signal The capacitor at HPLL2 is discharged.
If the soft start procedure is activated via the I2C-bus, all of these actions will beperformed in a well defined sequence (see Figs 24 and 25).
Power dip recognition
In standby mode the I2C-bus will only answer with an acknowledge, when data is sent to control register with subaddress 1AH. This register contains the standby and soft start control bit.
If the I2C-bus master transmits data to another register, an aknowledge is given after the chip address and the subaddress; an acknowledge is not given after the data. This indicates that only in soft start mode data can be stored into normal registers.
If the supply voltage dips under 8.1 V the TDA4856leaves normal operation mode and changes into standby mode. The microcontroller can check this state by sending data intoaregister with the subaddress 0XH. The acknowledge will only be given on the data if the TDA4856 is active.
Due to this behaviour the start-up of the TDA4856 is defined as follows. The first data that is transferred to the TDA4856 must be sent to the control register with subaddress 1AH. Any other subaddress will not lead to an acknowledge. This is a limitation in checking the I2C-busses of the monitor during start-up.
ACTIVATION RESET
Low supply voltage at pin 10 increase supply voltage;
reload registers; soft start via I2C-bus
Power dip, below 8.1 V reload registers;
soft start via I2C-bus or via supply voltage
X-ray protection XRAY (pin 2) triggered
reload registers; soft start via I2C-bus
HPLL2 (pin 30) externally pulled to ground
release pin 30
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Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
Notes
1. Machine model: 200 pF; 0.75 µH; 10 .
2. Human body model: 100 pF; 7.5 µH; 1500 .
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
“URF-4-2-59/601”
; EMC emission/immunity test in accordance with
“DIS 1000 4.6”
(IEC 801.6).
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
supply voltage 0.5 +16 V
V
i(n)
input voltage on pins:
BIN 0.5 +6.0 V HSYNC, VSYNC, VREF, HREF, VSMOD and HSMOD 0.5 +6.5 V SDA and SCL 0.5 +8.0 V XRAY 0.5 +8.0 V
V
o(n)
output voltage on pins:
VOUT2, VOUT1 and HUNLOCK 0.5 +6.5 V BDRV and HDRV 0.5 +16 V
V
I/O(n)
input/output voltages at pins BOP and BSENS 0.5 +6.0 V
I
o(HDRV)
horizontal driver output current 100 mA
I
i(HFLB)
horizontal flyback input current 10 +10 mA
I
o(CLBL)
video clamping pulse/vertical blanking output current −−10 mA
I
o(BOP)
B+ control OTA output current 1mA
I
o(BDRV)
B+ control driver output current 50 mA
I
o(EWDRV)
EW driver output current −−5mA
I
o(FOCUS)
focus driver output current −−5mA
T
amb
operating ambient temperature 20 +70 °C
T
j
junction temperature 150 °C
T
stg
storage temperature 55 +150 °C
V
ESD
electrostatic discharge for all pins note 1 150 +150 V
note 2 2000 +2000 V
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 55 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
EMC
emission test note 1 1.5 mV immunity test note 1 2.0 V
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Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
CHARACTERISTICS
VCC= 12 V; T
amb
=25°C; peripheral components in accordance with Fig.1; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Horizontal sync separator
I
NPUT CHARACTERISTICS FOR DC-COUPLED TTL SIGNALS: PIN HSYNC
V
i(HSYNC)
sync input signal voltage 1.7 −−V
V
HSYNC(sl)
slicing voltage level 1.2 1.4 1.6 V
t
r(HSYNC)
rise time of sync pulse 10 500 ns
t
f(HSYNC)
fall time of sync pulse 10 500 ns
t
W(HSYNC)(min)
minimum width of sync pulse 0.7 −−µs
I
i(HSYNC)
input current V
HSYNC
= 0.8 V −−−200 µA
V
HSYNC
= 5.5 V −−10 µA INPUT CHARACTERISTICS FOR AC-COUPLED VIDEO SIGNALS (SYNC-ON-VIDEO, NEGATIVE SYNC POLARITY) V
HSYNC
sync amplitude of video input signal voltage
R
source
=50Ω−300 mV
V
HSYNC(sl)
slicing voltage level (measured from top sync)
R
source
=50 90 120 150 mV
V
clamp(HSYNC)
top sync clamping voltage level
R
source
=50 1.1 1.28 1.5 V
I
ch(HSYNC)
charge current for coupling capacitor
V
HSYNC>Vclamp(HSYNC)
1.7 2.4 3.4 µA
t
W(HSYNC)(min)
minimum width of sync pulse 0.7 −−µs
R
source(max)
maximum source resistance duty cycle = 7% −−1500
R
i(diff)(HSYNC)
differential input resistance during sync 80 −Ω
Automatic polarity correction for horizontal sync
horizontal sync pulse width related to line period
−−25 %
t
d(HPOL)
delay time for changing polarity
0.3 1.8 ms
Vertical sync integrator
t
int(V)
integration time for generation of a vertical trigger pulse
fH= 15.625 kHz; I
HREF
= 0.52 mA
14 20 26 µs
fH= 31.45 kHz; I
HREF
= 1.052 mA
71013µs
fH= 64 kHz; I
HREF
= 2.141 mA
3.9 5.7 6.5 µs
fH= 100 kHz; I
HREF
= 3.345 mA
2.5 3.8 4.5 µs
Vertical sync slicer (DC-coupled, TTL compatible): pin VSYNC
V
i(VSYNC)
sync input signal voltage 1.7 −−V
V
VSYNC(sl)
slicing voltage level 1.2 1.4 1.6 V
I
i(VSYNC)
input current 0 V < V
SYNC
< 5.5 V −−±10 µA
t
P(H)
t
H
---------- -
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Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Automatic polarity correction for vertical sync
t
W(VSYNC)(max)
maximum width of vertical sync pulse
−−400 µs
t
d(VPOL)
delay for changing polarity 0.45 1.8 ms
Video clamping/vertical blanking output: pin CLBL
t
clamp(CLBL)
width of video clamping pulse measured at V
CLBL
= 3 V 0.6 0.7 0.8 µs
V
clamp(CLBL)
top voltage level of video clamping pulse
4.32 4.75 5.23 V
TC
clamp
temperature coefficient of V
clamp(CLBL)
4 mV/K
STPS
clamp
steepness of slopes for clamping pulse
RL=1MΩ; CL=20pF 50 ns/V
t
d(HSYNCt-CLBL)
delay between trailing edge of horizontal sync and start of video clamping pulse
clamping pulse triggered on trailing edge of horizontal sync; control bit CLAMP = 0; measured at V
CLBL
=3V
130 ns
t
clamp1(max)
maximum duration of video clamping pulse referenced to end of horizontal sync
−−1.0 µs
t
d(HSYNCl-CLBL)
delay between leading edge of horizontal sync and start of video clamping pulse
clamping pulse triggered on leading edge of horizontal sync; control bit CLAMP = 1; measured at V
CLBL
=3V
300 ns
t
clamp2(max)
maximum duration of video clamping pulse referenced to end of horizontal sync
−−0.15 µs
V
blank(CLBL)
top voltage level of vertical blanking pulse
notes 1 and 2 1.7 1.9 2.1 V
t
blank(CLBL)
width of vertical blanking pulse at pins CLBL and HUNLOCK
control bit VBLK = 0 220 260 300 µs control bit VBLK = 1 305 350 395 µs
TC
blank
temperature coefficient of V
blank(CLBL)
2 mV/K
V
scan(CLBL)
output voltage during vertical scan
I
CLBL
= 0 0.59 0.63 0.67 V
TC
scan
temperature coefficient of V
scan(CLBL)
−−2 mV/K
I
sink(CLBL)
internal sink current 2.4 −−mA
I
L(CLBL)
external load current −−−3.0 mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Horizontal oscillator: pins HCAP and HREF
f
fr(H)
free-running frequency without PLL1 action (for testing only)
R
HBUF
= ;
R
HREF
= 2.4 k;
C
HCAP
= 10 nF; note 3
30.53 31.45 32.39 kHz
f
fr(H)
spread of free-running frequency(excludingspreadof external components)
−−±3.0 %
TC
fr
temperature coefficient of free-running frequency
100 0 +100 106/K
f
H(max)
maximum oscillator frequency −−130 kHz
V
HREF
voltage at input for reference current
2.43 2.55 2.68 V
Unlock blanking detection: pin HUNLOCK
V
scan(HUNLOCK)
low level of HUNLOCK saturation voltage in case
of locked PLL1; internal sink current = 1 mA
−−250 mV
V
blank(HUNLOCK)
blanking level of HUNLOCK external load current = 0 0.9 1 1.1 V
TC
blank
temperature coefficient of V
blank(HUNLOCK)
−−0.9 mV/K
TC
sink
temperature coefficient of I
sink(HUNLOCK)
0.15 %/K
I
sink(int)
internal sink current for blanking pulses;
PLL1 locked
1.4 2.0 2.6 mA
I
L(HUNLOCK)
maximum external load current
V
HUNLOCK
=1V −−−2mA
I
L
leakage current V
HUNLOCK
= 5 V in case of unlocked PLL1 and/or protection active
−−±5 µA
PLL1 phase comparator and frequency-locked loop: pins HPLL1 and HBUF
t
W(HSYNC)(max)
maximum width of horizontal sync pulse (referenced to line period)
−−25 %
t
lock(HPLL1)
total lock-in time of PLL1 40 80 ms
I
ctrl(HPLL1)
control currents notes 4 and 5
locked mode; level 1 15 −µA locked mode; level 2 145 −µA
V
HBUF
buffered f/v voltage at HBUF (pin 27)
minimum horizontal frequency
2.55 V
maximum horizontal frequency
0.5 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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1999 Jul 13 18
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Phase adjustments and corrections via PLL1 and PLL2
HPOS horizontal position (referenced
to horizontal period)
register HPOS = 0 −−13 % register HPOS = 127 0 % register HPOS = 255 13 %
HPINBAL horizontal pin unbalance
correction via HPLL2 (referenced to horizontal period)
register HPINBAL = 0; note 6
−−1.2 %
register HPINBAL = 63; note 6
1.2 %
register HPINBAL = 32; note 6
0.02 %
HPARAL horizontal parallelogram
correction (referenced to horizontal period)
register HPARAL = 0; note 6
−−1.2 %
register HPARAL = 63; note 6
1.2 %
register HPARAL = 32; note 6
0.02 %
HMOIRE relative modulation of
horizontal position by 0.5fH; phase alternates with 0.5f
V
register HMOIRE = 0; control bit MOD = 0
0 %
register HMOIRE = 63; control bit MOD = 0
0.07 %
HMOIRE
moire cancellation off control bit MOD = 1 0 %
PLL2 phase detector: pins HFLB and HPLL2
φ
PLL2
PLL2 control (advance of horizontal drive with respect to middle of horizontal flyback)
maximum advance; register HPINBAL = 32; register HPARAL = 32
36 −−%
minimum advance; register HPINBAL = 32; register HPARAL = 32
7 %
I
ctrl(PLL2)
PLL2 control current 75 −µA
Φ
PLL2
relative sensitivity of PLL2 phase shift related to horizontal period
28 mV/%
V
PROT(HPLL2)(max)
maximum voltage for PLL2 protection mode/soft start
4.6 V
I
ch(HPLL2)
charge current for external capacitor during soft start
V
HPLL2
< 3.7 V 1 −µA
I
dch(HPLL2)
discharge current for external capacitor during soft down
V
HPLL2
< 3.7 V −−1 −µA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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1999 Jul 13 19
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
HORIZONTAL FLYBACK INPUT: PIN HFLB V
pos(HFLB)
positive clamping level I
HFLB
=5mA 5.5 V
V
neg(HFLB)
negative clamping level I
HFLB
= 1mA −−0.75 V
I
pos(HFLB)
positive clamping current −−6mA
I
neg(HFLB)
negative clamping current −−−2mA
V
sl(HFLB)
slicing level 2.8 V
Output stage for line driver pulses: pin HDRV
OPEN-COLLECTOR OUTPUT STAGE V
sat(HDRV)
saturation voltage I
HDRV
=20mA −−0.3 V
I
HDRV
=60mA −−0.8 V
I
LO(HDRV)
output leakage current V
HDRV
=16V −−10 µA AUTOMATIC VARIATION OF DUTY CYCLE t
HDRV(OFF)/tH
relative t
OFF
time of HDRV output; measured at V
HDRV
= 3 V; HDRV duty cycle is modulated by the relation I
HREF/IVREF
I
HDRV
=20mA;
fH= 31.45 kHz; see Fig.16
42 45 48 %
I
HDRV
=20mA;
fH= 58 kHz; see Fig.16
45.5 48.5 51.5 %
I
HDRV
=20mA;
fH= 110 kHz; see Fig.16
49 52 55 %
X-ray protection: pin XRAY
V
XRAY(sl)
slicing voltage level for latch 6.22 6.39 6.56 V
t
W(XRAY)(min)
minimum width of trigger pulse −−30 µs
R
i(XRAY)
input resistance at XRAY (pin 2)
V
XRAY
<6.38V+V
BE
500 −−k
V
XRAY
>6.38V+V
BE
5 k
standby mode 5 k
XRAY
rst
reset of X-ray latch pin 9 open-circuit or
connected to GND
set control bit SOFTST via I2C-bus
pin 9 connected to VCCvia R
XSEL
switch off VCC, then re-apply V
CC
V
CC(XRAY)(min)
minimum supply voltage for correct function of the X-ray latch
pin 9 connected to VCCvia R
XSEL
−−4V
V
CC(XRAY)(max)
maximum supply voltage for reset of the X-ray latch
pin 9 connected to VCCvia R
XSEL
2 −−V
R
XSEL
external resistor at pin 9 no reset via I2C-bus 56 130 k
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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1999 Jul 13 20
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Vertical oscillator [oscillator frequency in application without adjustment of free-running frequency f
fr(V)
]
f
fr(V)
free-running frequency R
VREF
=22kΩ;
C
VCAP
= 100 nF
40 42 43.3 Hz
f
cr(V)
vertical frequency catching range
constant amplitude; note 7 50 160 Hz
V
VREF
voltage at reference input for vertical oscillator
3.0 V
t
d(scan)
delay between trigger pulse and start of ramp at VCAP (pin 24) (width of vertical blanking pulse)
control bit VBLK = 0 220 260 300 µs control bit VBLK = 1 305 350 395 µs
I
VAGC
currents of amplitude control control bit AGCDIS = 0 ±120 ±200 ±300 µA
control bit AGCDIS = 1 0 −µA
C
VAGC
external capacitor at VAGC (pin 22)
150 220 nF
Differential vertical current outputs
ADJUSTMENT OF VERTICAL SIZE INCLUDING VGA AND EHT COMPENSATION; see Figs 3 and 4 VGAIN vertical size (gain) without
VGA overscan (referenced to nominal vertical size)
register VGAIN = 0; register VSIZE = 127; bit VOVSCN = 0; note 8
70 %
register VGAIN = 63; register VSIZE = 127; bit VOVSCN = 0; note 8
100 %
VSIZE vertical size (size) without VGA
overscan (referenced to nominal vertical size)
register VSIZE = 0; register VGAIN = 63; bit VOVSCN = 0; note 8
60 %
register VSIZE = 127; register VGAIN = 63; bit VOVSCN = 0; note 8
100 %
VSIZE
VGA
vertical size with VGA overscan (referenced to nominal vertical size)
register VSIZE = 0; register VGAIN = 63; bit VOVSCN = 1; note 8
70 %
register VSIZE = 127; register VGAIN = 63; bit VOVSCN = 1; note 8
115.9 116.8 117.7 %
VSMOD
EHT
EHT compensation on vertical size via VSMOD (pin 21) (referenced to 100% vertical size)
I
VSMOD
=0 0 %
I
VSMOD
= 120 µA −−7 %
I
i(VSMOD)
input current (pin 21) VSMOD = 0 0 −µA
VSMOD = 7% −−120 −µA
R
i(VSMOD)
input resistance 300 500
V
ref(VSMOD)
reference voltage at input 5.0 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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1999 Jul 13 21
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
f
ro(VSMOD)
roll-off frequency (3 dB) I
VSMOD
= 60 µA
+15µA (RMS value)
1 −−MHz
ADJUSTMENT OF VERTICAL POSITION (see Fig.5) VOFFS vertical position (referenced to
100% vertical size)
register VOFFS = 0 −−4 % register VOFFS = 15 4 % register VOFFS = 8 0.25 %
VPOS vertical position (referenced to
100% vertical size)
register VPOS = 0 −−11.5 % register VPOS = 127 11.5 %
register VPOS = 64 0.09 % ADJUSTMENT OF VERTICAL LINEARITY; see Fig.6 VLIN vertical linearity (S-correction) register VLIN = 0; control
bit VSC = 0; note 8
2 %
register VLIN = 15;control
bit VSC = 0; note 8
46 %
register VLIN = X; control
bit VSC = 1; note 8
0 %
δVLIN symmetry error of S-correction maximum VLIN −−±0.7 %
ADJUSTMENT OF VERTICAL LINEARITY BALANCE; see Fig.7 VLINBAL vertical linearity balance
(referenced to 100% vertical size)
register VLINBAL = 0;
note 8
1.85 1.40 0.95 %
register VLINBAL = 15;
note 8
0.95 1.40 1.85 %
register VLINBAL = 8;
note 8
0.08 %
VMOIRE modulation of vertical picture
position by1⁄2vertical frequency (related to 100% vertical size)
register VMOIRE = 0;
control bit MOD = 0
0 %
register VMOIRE = 63;
control bit MOD = 0
0.08 %
moire cancellation off control bit MOD = 1 0 % Vertical output stage: pins VOUT1 and VOUT2; see Fig.27 I
VOUT(nom)(p-p)
nominal differential output
current (peak-to-peak value)
I
VOUT=IVOUT1
I
VOUT2
;
nominal settings; note 8
0.76 0.85 0.94 mA
I
o(VOUT)(max)
maximum output current at
pins VOUT1 and VOUT2
control bit VOVSCN = 1 0.54 0.6 0.66 mA
V
VOUT
allowed voltage at outputs 0 4.2 V δI
os(vert)(max)
maximum offset error of
vertical output currents
nominal settings; note 8 −−±2.5 %
δI
lin(vert)(max)
maximum linearity error of
vertical output currents
nominal settings; note 8 −−±1.5 %
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 22
1999 Jul 13 22
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
EW drive output
EW DRIVE OUTPUT STAGE: pin EWDRV; see Figs 8 to 11 V
const(EWDRV)
bottom output voltage at
pin EWDRV
(internally stabilized)
register HPIN = 0; register HTRAP = 32; register HSIZE = 255; control bit VSC = 1
1.05 1.2 1.35 V
V
o(EWDRV)(max)
maximum output voltage note 9 7.0 −−V I
L(EWDRV)
load current −−±2mA TC
EWDRV
temperature coefficient of
output signal
−−600 106/K
V
HPIN(EWDRV)
horizontal pincushion register HPIN = 0; control
bit VSC = 1; note 8
0.04 V
register HPIN = 63; control bit VSC = 1; note 8
1.42 V
V
HCORT(EWDRV)
horizontal corner correction at
top of picture
register HCORT = 0; control bit VSC = 0; note 8
0.2 V
register HCORT = 63; control bit VSC = 0; note 8
−−0.64 V
register HCORT = X; control bit VSC = 1; note 8
0 V
V
HCORB(EWDRV)
horizontal corner correction at
bottom of picture
register HCORB = 0; control bit VSC = 0; note 8
0.2 V
register HCORB = 63; control bit VSC = 0; note 8
−−0.64 V
register HCORB = X; control bit VSC = 1; note 8
0 V
V
HTRAP(EWDRV)
horizontal trapezium correction register HTRAP = 63;
note 8
−−0.5 V
register HTRAP = 0; note 8
0.5 V
register HTRAP = 32; note 8
−−0.01 V
V
HSIZE(EWDRV)
horizontal size register HSIZE = 255;
note 8
0.13 V
register HSIZE = 0; note 8 3.6 V
V
HEHT(EWDRV)
EHT compensation on
horizontal size via HSMOD
(pin 31)
I
HSMOD
= 0; note 8 0.02 V
I
HSMOD
= 120 µA; note 8 0.69 V
I
i(HSMOD)
input current (pin 31) V
HEHT
= 0.02 V 0 −µA
V
HEHT
= 0.69 V −−120 −µA
R
i(HSMOD)
input resistance 300 500 V
ref(HSMOD)
reference voltage at input I
HSMOD
=0 5.0 V
f
ro(HSMOD)
roll-off frequency (3 dB) I
HSMOD
= 60 µA
+15µA (RMS)
1 −−MHz
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 23
1999 Jul 13 23
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
TRACKING OF EWDRV OUTPUT SIGNAL WITH HORIZONTAL FREQUENCY PROPORTIONAL VOLTAGE f
H(MULTI)
horizontal frequency range for
tracking
15 80 kHz
V
PAR(EWDRV)
parabola amplitude at EWDRV
(pin 11)
I
HREF
= 1.052 mA; fH= 31.45 kHz; control bit FHMULT = 1; note 10
0.72 V
I
HREF
= 2.341 mA; fH= 70 kHz; control bit FHMULT = 1; note 10
1.42 V
function disabled; control bit FHMULT = 0; note 10
1.42 V
LE
EWDRV
linearity error of horizontal frequency tracking
−−8%
Output for asymmetric EW corrections: pin ASCOR
V
HPARAL(ASCOR)
vertical sawtooth voltage for EW parallelogram correction
register HPARAL = 0; note 8
−−0.825 V
register HPARAL = 63; note 8
0.825 V
register HPARAL = 32; note 8
0.05 V
V
HPINBAL(ASCOR)
vertical parabola for pin unbalance correction
register HPINBAL = 0; note 8
−−1.0 V
register HPINBAL = 63; note 8
1.0 V
register HPINBAL = 32; note 8
0.05 V
V
o(ASCOR)(max)(p-p)
maximumoutputvoltageswing (peak-to-peak value)
4 V
V
o(ASCOR)(max)
maximum output voltage 6.5 V
V
c(ASCOR)
centre voltage 4.0 V
V
o(ASCOR)(min)
minimum output voltage 1.9 V
I
o(ASCOR)(max)
maximum output current V
ASCOR
1.9 V −−1.5 mA
I
o(sink)(ASCOR)(max)
maximum output sink current V
ASCOR
1.9 V 50 −µA Focus section: pin FOCUS; see Figs 15 and 28 t
precor
pre-correction of phase for horizontal focus parabola
register HFOCAD = 0 300 ns register HFOCAD = 1 350 ns register HFOCAD = 2 400 ns register HFOCAD = 3 450 ns
t
W(hfb)(min)
minimum horizontal flyback pulse width
1.9 −−µs
t
W(hfb)(max)
maximum horizontal flyback pulse width
−−5.5 µs
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 24
1999 Jul 13 24
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
t
W(hfb)(off)
minimum width of horizontal flyback pulse for operation without pre-correction
7.5 −µs
V
HFOCUS(p-p)
amplitude of horizontal focus parabola (peak-to-peak value)
register HFOCUS = 0 0.06 V register HFOCUS = 31 3.3 V
V
VFOCUS(p-p)
amplitude of vertical parabola (peak-to-peak value)
register VFOCUS = 0; note 8
0.02 V
register VFOCUS = 15; note 8
1.1 V
V
o(FOCUS)(max)
maximum output voltage I
FOCUS
= 0 6.15 6.4 6.65 V
V
o(FOCUS)(min)
minimum output voltage I
FOCUS
= 0 1.0 1.3 1.6 V
I
o(FOCUS)(max)
maximum output current ±1.5 −−mA
C
L(FOCUS)(max)
maximum capacitive load −−20 pF
B+ control section; see Figs 22 and 23 TRANSCONDUCTANCE AMPLIFIER: PINS BIN AND BOP
V
i(BIN)
input voltage 0 5.25 V
I
i(BIN)(max)
maximum input current −−±1 µA
V
ref(int)
reference voltage at internal non-inverting input of OTA
2.37 2.5 2.58 V
V
o(BOP)(min)
minimum output voltage −−0.5 V
V
o(BOP)(max)
maximum output voltage I
BOP
< 1 mA 5.0 5.3 5.6 V
I
o(BOP)(max)
maximum output current −±500 −µA
g
m(OTA)
transconductance of OTA note 11 30 50 70 mS
G
v(ol)
open-loop voltage gain note 12 86 dB
C
BOP(min)
minimum value of capacitor at BOP
10 −−nF
VOLTAGE COMPARATOR: PIN BSENS V
i(BSENS)
voltage range of positive comparator input
0 5V
V
i(BOP)
voltage range of negative comparator input
0 5V
I
L(BSENS)(max)
maximum leakage current discharge disabled −−−2 µA OPEN-COLLECTOR OUTPUT STAGE: PIN BDRV I
o(BDRV)(max)
maximum output current note 13 20 −−mA I
LO(BDRV)
output leakage current V
BDRV
=16V −−3 µA
V
sat(BDRV)
saturation voltage I
BDRV
<20mA −−300 mV
t
off(BDRV)(min)
minimum off-time 250 ns t
d(BDRV-HDRV)
delay between BDRV pulse
and HDRV pulse
measured at V
HDRV=VBDRV
=3V
500 ns
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 25
1999 Jul 13 25
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
BSENS DISCHARGE CIRCUIT: PIN BSENS V
STOP(BSENS)
discharge stop level capacitive load;
I
BSENS
= 0.5 mA
0.85 1.0 1.15 V
I
dch(BSENS)
discharge current V
BSENS
> 2.5 V 4.5 6.0 7.5 mA
V
th(BSENS)(restart)
threshold voltage for restart fault condition 1.2 1.3 1.4 V C
BSENS(min)
minimum value of capacitor at
BSENS (pin 4)
2 −−nF
Internal reference, supply voltage, soft start and protection
V
CC(stab)
external supply voltage for
complete stabilization of all
internal references
9.2 16 V
I
CC
supply current 70 mA I
CC(stb)
standby supply current STDBY = 1; V
PLL2
<1V;
3.5V<VCC<16V
9 mA
PSRR power supply rejection ratio of
internal supply voltage
f = 1 kHz 50 −−dB
V
CC(blank)
supply voltage level for
activation of continuous
blanking
VCC decreasing from 12 V 8.2 8.6 9.0 V
V
CC(blank)(min)
minimum supply voltage level
for function of continuous
blanking
VCC decreasing from 12 V 2.5 3.5 4.0 V
V
on(VCC)
supply voltage level for
activation of HDRV, BDRV,
VOUT1, VOUT2 and
HUNLOCK
VCCincreasing from below typical 8.1 V
7.9 8.3 8.7 V
V
off(VCC)
supply voltage level for
deactivation of BDRV, VOUT1,
VOUT2 and HUNLOCK; also
sets register SOFTST
VCC decreasing from above typical 8.3 V
7.7 8.1 8.5 V
THRESHOLDS DERIVED FROM HPLL2 VOLTAGE V
HPLL2(blank)(ul)
upper limit voltage for
continuous blanking
4.6 V
V
HPLL2(bduty)(ul)
upper limit voltage for variation
of BDRV duty cycle
4.0 V
V
HPLL2(bduty)(ll)
lower limit voltage for variation
of BDRV duty cycle
3.2 V
V
HPLL2(hduty)(ul)
upper limit voltage for variation
of HDRV duty cycle
3.2 V
V
HPLL2(hduty)(ll)
lower limit voltage for variation
of HDRV duty cycle
1.8 V
V
HPLL2(stb)(ul)
upper limit voltage for standby
voltage
1 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 26
1999 Jul 13 26
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Notes
1. For duration of vertical blanking pulse see subheading ‘Vertical oscillator [oscillator frequency in application without adjustment of free-running frequency f
fr(V)
]’.
2. Continuous blanking at CLBL (pin 16) will be activated, if one of the following conditions is true: a) No horizontal flyback pulses at HFLB (pin 1) within a line b) X-ray protection is triggered c) Voltage at HPLL2 (pin 30) is low during soft start d) Supply voltage at VCC (pin 10) is low e) PLL1 unlocked while frequency-locked loop is in search mode.
3. Oscillator frequency is f
min
when no sync input signal is present (continuous blanking at pins 16 and 17).
4. Loading of HPLL1 (pin 26) is not allowed.
5. Voltage at HPLL1 (pin 26) is fed to HBUF (pin 27) via a buffer. Disturbances caused by horizontal sync are removed by an internal sample-and-hold circuit.
6. All vertical and EW adjustments according note 8, but VSIZE = 80% (register VSIZE = 63, VGAIN = 63 and control bit VOVSCN = 0).
7. Value of resistor at VREF (pin 23) may not be changed.
8. All vertical and EW adjustments are specified at nominal vertical settings; unless otherwise specified, which means: a) VSIZE = 100% (register VSIZE = 127, VGAIN = 63 and control bit VOVSCN = 0) b) VSMOD = 0 (no EHT compensation) c) VPOS centred (register VPOS = 64) d) VLIN = 0 (register VLIN = X and control bit VSC = 1) e) VLINBAL = 0 (register VLINBAL = 8) f) FHMULT = 0 g) HPARAL = 0 (register HPARAL = 32) h) HPINBAL = 0 (register HPINBAL = 32) i) Vertical oscillator synchronized.
9. The output signal at EWDRV (pin 11) may consist of horizontal pincushion + corner correction + DC shift + trapezium correction. If the control bit VOVSCN is set, and the VPOS adjustment is set to an extreme value, the tip of the parabola may be clipped at the upper limit of the EWDRV output voltage range. The waveform of corner correction will clip if the vertical sawtooth adjustment exceeds 110% of the nominal setting.
10. If fH tracking is enabled, the amplitude of the complete EWDRV output signal (horizontal pincushion + corner correction + DC shift + trapezium) will be changed proportional to I
HREF
. The EWDRV low level of 1.2 V remains fixed.
11. First pole of transconductance amplifier is5 MHz without external capacitor (will become the second pole, if the OTA operates as an integrator).
12. Open-loop gain is at f = 0 with no resistive load and C
BOP
= 10 nF [from BOP (pin 3) to GND].
13. The recommended value for the pull-up resistor BDRV (pin 6) is 1 kΩ.
V
BOP
V
BIN
--------------
Page 27
1999 Jul 13 27
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Vertical and EW adjustments
handbook, halfpage
t
I
VOUT1
I
VOUT2
l
2
l
1
(1)
MBG590
Fig.3 Adjustment of vertical size (VSIZE).
(1) I1 is the maximum amplitude setting at register VSIZE = 127,
register VGAIN = 63, control bit VOVSCN = 0.
,VSIZE
I
2
I
1
------- -
100%×= VSMOD
I
2
I
1
------- -
100%×=
Fig.4 Adjustment of vertical size (VGAIN).
(1) I1 is the maximum amplitude setting at register VSIZE = 127,
register VGAIN = 63, control bit VOVSCN = 0.
VGAIN
I
2
I
1
------- -
100%×=
handbook, halfpage
MGS274
I
VOUT1
I
VOUT2
t
I
2
I
1
(1)
Fig.5 Adjustment of vertical position.
handbook, halfpage
t
I
VOUT1
I
VOUT2
l
2
l
1
(1)
MBG592
(1) I1 is the maximum amplitude setting at register VSIZE = 127
and register VGAIN = 63.
,VPOS
I
2
I1∆
2I
1
∆×
--------------------- -
100%×= VOFFS
I
2
I1∆
2I
1
∆×
--------------------- -
100%×=
Fig.6 Adjustment of vertical linearity (vertical
S-correction).
(1) I1 is the maximum amplitude setting at register VSIZE = 127
and VLIN = 0%.
VLIN
I
1I2
I
1
--------------------- -
100%×=
handbook, halfpage
t
I
VOUT1
I
VOUT2
l2/∆t
l
1
(1)
/∆t
MBG594
Page 28
1999 Jul 13 28
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.7 Adjustment of vertical linearity balance.
(1) I1 is the maximum amplitude setting at register VSIZE = 127
and register VOVSCN = 0.
VLINBAL
I
1I2
2I
1
∆×
--------------------- -
100%×=
handbook, halfpage
t
I
VOUT1
I
VOUT2
I
1
(1)
I
2
MGM068
Fig.8 Adjustment of parabola amplitude at
pin EWDRV.
handbook, halfpage
t
V
EWDRV
V
HPIN(EWDRV)
MGM069
Fig.9 Influence of corner correction at pin EWDRV.
handbook, halfpage
t
V
EWDRV
V
HCOR(EWDRV)
MGM070
Fig.10 Influence of trapezium at pin EWDRV.
handbook, halfpage
t
V
EWDRV
V
HTRAP(EWDRV)
MGM071
Page 29
1999 Jul 13 29
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.11 Influence of HSIZE and EHT compensation
at pin EWDRV.
handbook, halfpage
t
V
EWDRV
V
HSIZE(EWDRV)
+
V
HEHT(EWDRV)
MGM072
Fig.12 Adjustment of parallelogram at pin ASCOR.
handbook, halfpage
t
V
HPARAL(ASCOR)
MGM073
V
ASCOR
V
c(ASCOR)
Fig.13 Adjustment of pin balance at pin ASCOR.
handbook, halfpage
t
V
ASCOR
V
HPINBAL(ASCOR)
MGM074
V
c(ASCOR)
Page 30
1999 Jul 13 30
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Pulse diagrams
Fig.14 Pulse diagram for vertical part.
handbook, full pagewidth
internal trigger
inhibit window
(typical 4 ms)
1.4 V
3.8 V
automatic trigger level
vertical sync pulse
4.0 V
differential output currents
VOUT1 (pin 13) and
VOUT2 (pin 12)
inhibited
vertical oscillator sawtooth
at VCAP (pin 24)
vertical blanking pulse
at CLBL (pin 16)
vertical blanking pulse
at HUNLOCK (pin 17)
synchronized trigger level
EW drive waveform
at EWDRV (pin 11)
DC shift 3.6 V maximum
7.0 V maximum
low-level 1.2 V fixed
I
VOUT1
I
VOUT2
MGM075
Page 31
1999 Jul 13 31
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.15 Pulse diagram for horizontal part.
handbook, full pagewidth
+
-
+
horizontal sync pulse
PLL2 control current
at HPLL2 (pin 30)
PLL1 control current
at HPLL1 (pin 26)
line flyback pulse
at HFLB (pin 1)
horizontal oscillator sawtooth
at HCAP (pin 29)
line drive pulse
at HDRV (pin 8)
triggered on trailing edge
of horizontal sync
video clamping pulse
at CLBL (pin 16)
vertical blanking level
horizontal focus parabola
at FOCUS (pin 32)
PLL2
control range
45 to 52% of line period
MGS275
Page 32
1999 Jul 13 32
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.16 Relative t
OFF
time of HDRV versus H-frequency.
handbook, full pagewidth
relative t
HDRV(OFF)/tH
(%)
MGM077
15 30 110 130
fH (kHz)
Fig.17 Pulse diagrams for composite sync applications.
a. Reduced influence of vertical sync on horizontal phase.
b. Generation of video clamping pulses during vertical sync with serration pulses.
handbook, full pagewidth
composite sync (TTL)
internal integration of
composite sync
internal vertical
trigger pulse
PLL1 control voltage
at HPLL1 (pin 26)
at HSYNC (pin 15)
pulses at CLBL (pin 16)
clamping and blanking
MGC947
handbook, full pagewidth
composite sync (TTL)
at HSYNC (pin 15)
clamping and blanking
pulses at CLBL (pin 16)
MBG596
Page 33
1999 Jul 13 33
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
I2C-BUS PROTOCOL Data format Table 4 Data format
Notes
1. S = START condition.
2. SLAVE ADDRESS (MAD) = 1000 1100.
3. A = acknowledge, generatedbythe slave. No acknowledge, ifthesupply voltage is below 8.2 V forstart-upand 8.0 V for shut-down procedure.
4. SUBADDRESS (SAD).
5. DATA byte. If more than 1 byte of DATA is transmitted, then no auto-increment of the significant subaddress is performed.
6. P = STOP condition.
S
(1)
SLAVE ADDRESS
(2)
A
(3)
SUB-ADDRESS
(4)
A
(3)
DA TA
(5)
A
(3)
P
(6)
It should be noted that clock pulses according to the 400 kHz specification are accepted for 3.3 and 5 V applications (reference level = 1.8 V).
Default register values after power-up are random. All registers have to be preset via software before the soft start is enabled.
Important: If register contents are changed during the vertical scan, this might result in a visible interference on the screen. The cause for this interference is the abrupt change of picture geometry which takes effect at random locations within the visible picture. To avoid this kind of interference, at least the adjustment of some critical geometry parameters should be synchronized with the vertical flyback. The TDA4856 offers a feature to synchronize any I2C-bus adjustment with the internal vertical flyback pulse. For this purpose the IC offers two different modes for the handling of I2C-bus data:
Direct mode
Buffered mode.
Direct mode
The direct mode is selected by setting the MSB of the I2C-bus register subaddress to logic 0.
Any I2C-bus command is executed immediately after it was received, so the adjustment takes effect immediately after the end of I2C-bus transmission.
This mode should be used if many register values have to be changed subsequently, i.e. during start-up, mode change, etc., and while there is no picture visible on the screen (blanked). The number of transmissions per V-period is not limited.
Buffered mode
The buffered mode is selected by setting the MSB of the I2C-bus register subaddress to logic 1.
Thismode is designed to avoidvisibleinterferences on the screen during the I2C-bus adjustments. This mode should be used, if a single register has to be changed while the picture is visible, so i.e. for user adjustments.
One received I2C-bus data byte is stored in an internal 8-bit buffer before itis passed tothe DAC section. The first internal vertical blanking pulse (VBL) after end of transmission is used to synchronize the adjustment change with the vertical flyback. So the actual change of the picture size, position, geometry, etc. will take place during the vertical flyback period, and will thus be invisible.
The IC gives acknowledge for chip address, subaddress and data of a buffered transmission. Only one I2C-bus transmission is accepted after each vertical blank. After one buffered transmission, the IC gives no acknowledge for further transmissions until next VBL pulse has occurred. The buffered mode is disabled while the IC is in standby mode.
Page 34
1999 Jul 13 34
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
List of I2C-bus controlled switches
I2C-bus data can be transmitted in direct or buffered mode and is defined by the MSB of the register subaddress:
SAD1 is the register subaddress to be used for transmissions in direct mode
SAD2 is the register subaddress to be used for transmissions in buffered mode.
Table 5 Controlled switches; notes 1 and 2
Notes
1. X = don’t care.
2. # = this bit is occupied by another function. If the register is addressed, the bit values for both functions must be transferred.
3. Bits STDBY and SOFTST can be reset by the internal protection circuit.
CONTROL
BIT
FUNCTION
SAD1 (HEX)
SAD2 (HEX)
REGISTER ASSIGNMENT
D7 D6 D5 D4 D3 D2 D1 D0
BLKDIS 0: vertical, protection and horizontal unlock
blanking available on pins CLBL and HUNLOCK
0A 8A XD6######
1: only vertical and protection blanking available on pins CLBL and HUNLOCK
AGCDIS 0: AGC in vertical oscillator active 0B 8B # D6 ######
1: AGC in vertical oscillator inhibited
FHMULT 0: EW output independent of horizontal frequency 0B 8B D7 #######
1: EW output tracks with horizontal frequency
VSC 0: VLIN, HCORT and HCORB adjustments
enabled
02 82 XD6######
1: VLIN, HCORT and HCORB adjustments forced to centre value
MOD 0: horizontal and vertical moire cancellation
enabled
08 88D7#######
1: horizontal and vertical moire cancellation disabled
VOVSCN 0: vertical size 100% 0F 8F X D6 ######
1: vertical size 116.8% for VGA350
CLAMP 0: trailing edge for horizontal clamp 09 89 # D6 ######
1: leading edge for horizontal clamp
VBLK 0: vertical blanking = 260 µs 09 89D7#######
1: vertical blanking = 340 µs
ACD 0: ASCOR disconnected from PLL2 04 84 X D6 ######
1: ASCOR internally connected with PLL2
STDBY
(3)
0: internal power supply enabled 1A 9A # XXXXX#D0 1: internal power supply disabled
SOFTST
(3)
0: soft start not released (pin HPLL2 pulled to ground)
1A 9A #XXXXXD1#
1: soft start is released (power-up via pin HPLL2)
Page 35
1999 Jul 13 35
Philips Semiconductors Product specification
I
2
C-bus autosync deflection controller for
PC monitors
TDA4856
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List of I
2
C-bus controlled functions
I2C-bus data can be transmitted in direct or buffered mode and is defined by the MSB of the register subaddress:
SAD1 is the register subaddress to be used for transmissions in direct mode
SAD2 is the register subaddress to be used for transmissions in buffered mode.
Table 6 Controlled functions; notes 1 and 2
FUNCTION NAME BITS
SAD1 (HEX)
SAD2 (HEX)
REGISTER ASSIGNMENT
CONTROL
BIT
RANGE
FUNCTION
TRACKS WITH
D7 D6 D5 D4 D3 D2 D1 D0
Horizontal size HSIZE 8 01 81 D7 D6 D5 D4 D3 D2 D1 D0 0.1 to 3.6 V Horizontal
position
HPOS 8 07 87 D7 D6 D5 D4 D3 D2 D1 D0 −±13% of horizontal
period
Horizontal pincushion
HPIN 6 0F 8F X # D5 D4 D3 D2 D1 D0 0 to 1.42 V VSIZE, VOVSCN,
VPOS, HSIZE and HSMOD
Horizontal trapezium correction
HTRAP 6 03 83 X X D5 D4 D3 D2 D1 D0 −±500 mV (p-p) VSIZE, VOVSCN,
VPOS, HSIZE and HSMOD
Horizontal cornercorrection at top of picture
HCORT 6 04 84 X # D5 D4 D3 D2 D1 D0 VSC +15 to 46% of
parabola amplitude
VSIZE, VOVSCN, VPOS, HSIZE and HSMOD
Horizontal cornercorrection at bottom of picture
HCORB 6 02 82 X # D5 D4 D3 D2 D1 D0 VSC +15 to 46% of
parabola amplitude
VSIZE, VOVSCN, VPOS, HSIZE and HSMOD
Horizontal parallelogram
HPARAL 6 09 89 # # D5 D4 D3 D2 D1 D0 ACD ±1.2% of horizontal
period
VSIZE, VOVSCN and VPOS
EW pin balance HPINBAL 6 0B 8B # # D5 D4 D3 D2 D1 D0 ACD ±1.2% of horizontal
period
VSIZE, VOVSCN
and VPOS Vertical size VSIZE 7 08 88 # D6 D5 D4 D3 D2 D1 D0 60 to 100% VSMOD Vertical position VPOS 7 0D 8D X D6 D5 D4 D3 D2 D1 D0 −±11.5% VSMOD Vertical gain VGAIN 6 0A 8A X # D5 D4 D3 D2 D1 D0 70 to 100% Vertical offset VOFFS 4 0E 8E ####D3D2D1D0 −±4% Vertical linearity VLIN 4 05 85 D7 D6 D5 D4 #### VSC 2to−46% VSIZE, VOVSCN,
VPOS and VSMOD Vertical linearity
balance
VLINBAL 4 05 85 ####D3D2D1D0 −±1.4% of 100%
vertical size
VSIZE, VOVSCN,
VPOS and VSMOD
Page 36
1999 Jul 13 36
Philips Semiconductors Product specification
I
2
C-bus autosync deflection controller for
PC monitors
TDA4856
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Notes
1. X = don’t care.
2. # = this bit is occupied by another function. If the register is addressed, the bit values for both functions must be transferred.
Moire cancellation via vertical position
VMOIRE 6 00 80 X X D5 D4 D3 D2 D1 D0 MOD 0 to 0.08% of
vertical amplitude
Moire cancellation via horizontal position
HMOIRE 6 06 86 X X D5 D4 D3 D2 D1 D0 MOD 0.07% of horizontal
period
Vertical focus VFOCUS 4 0E 8E D7 D6 D5 D4 #### 0 to 1.1 V VSIZE, VOVSCN
and VPOS Horizontal focus HFOCUS 5 0C 8C # # X D4 D3 D2 D1 D0 0 to 3.3 V Horizontal focus
pre-correction
HFOCAD 2 0C 8C D7 D6 X ##### 300 to 450 ns
FUNCTION NAME BITS
SAD1 (HEX)
SAD2 (HEX)
REGISTER ASSIGNMENT
CONTROL
BIT
RANGE
FUNCTION
TRACKS WITH
D7 D6 D5 D4 D3 D2 D1 D0
Page 37
1999 Jul 13 37
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Start-up procedure
VCC< 8.3 V:
As long as the supply voltage is too low for correct operation, the IC will give no acknowledge due to internal Power-on reset (POR)
Supply current is 9 mA or less.
VCC> 8.3 V:
The internal POR has ended and the IC is in standby mode
Control bits STDBY and SOFTST are reset to their start values
All other register contents are random
Pin HUNLOCK is at HIGH-level.
Setting control bit STDBY = 0:
Enables internal power supply
Supply current increases from 9 to 70 mA
When VCC< 8.6 V register SOFTST cannot be set by
the I2C-bus
Output stages are disabled, except the vertical output
Pin HUNLOCK is at HIGH-level.
Setting all registers to defined values:
Due to the hardware configuration of the IC (no auto-increment) any register setting needs a complete 3-byte I2C-bus data transfer as follows: START - IC address - subaddress - data - STOP.
Setting control bit SOFTST = 1:
Before starting the soft-start sequence a delay of minimum 80 ms is necessary to obtain correct function of the horizontal drive
HDRV duty cycle increases
BDRV duty cycle increases
PLL1 and PLL2 are enabled.
IC in full operation:
Pin HUNLOCK is at LOW-level when PLL1 is locked
Any change of the register content will result in
immediate change of the output behaviour
Setting control bit SOFTST = 0 is the only way (except power-down via pin VCC) to leave the operating mode.
Soft-down sequence:
See L4 of Fig.19 for starting the soft-down sequence.
Fig.18 I2C-bus flow for start-up.
(1) See Fig.19.
MGL791
START
Standby mode (XXXX XX01)
STDBY = 1
SOFTST = 0
all other register contents are random
Protection mode (XXXX XX00)
STDBY = 0
SOFTST = 0
all other register contents are random
Protection mode (XXXX XX00)
STDBY = 0
SOFTST = 0
registers are pre-set
change/refresh of data?
S 8CH A 1AH A 00H A P
S 8CH A 1AH A 02H A P
S 8CH A SAD A DATA A P
S 8CH A SAD A DATA A P
Operating mode (XXXX XX10)
STDBY = 0
SOFTST = 1
Soft-start sequence (XXXX XX10)
STDBY = 0
SOFTST = 1
Power-down mode (XXXX XXXX)
no acknowledge is given by IC
all register contents are random
L1
L2
L3
L4
(1)
VCC > 8.3 V
yes
SOFTST = 0?
yes
all registers defined?
yes
Page 38
1999 Jul 13 38
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Protection and standby mode
Soft-down sequence:
Start the sequence by setting control bit SOFTST = 0
BDRV duty cycle decreases
HDRV duty cycle decreases.
Protection mode:
Pins HDRV and BDRV are floating
Continuous blanking at pin CLBL is active
Pin HUNLOCK is floating
PLL1 and PLL2 are disabled
Register contents are kept in internal memory.
Protection mode can be left by 3 ways:
1. Entering standby mode by setting control
bit SOFTST = 0 and control bit STDBY = 1
2. Starting the soft-start sequence by setting control
bit SOFTST = 1 (bit STDBY = don’t care); see L3 of Fig.18 for continuation
3. Decreasing the supply voltage below 8.1 V.
Standby mode:
Set control bit STDBY = 1
Driver outputs are floating (same as protection mode)
Supply current is 9 mA
Only the I2C-bus section and protection circuits are
operative
Contents of all registers except the value of bit STDBY and bit SOFTST are lost
See L2 of Fig.18 for continuation.
Fig.19 I2C-bus flow for protection and standby
mode.
(1) See Fig.18.
MGL790
Standby mode (XXXX XX01)
STDBY = 1
SOFTST = 0
all other register contents are random
Soft-down sequence (XXXX XX00)
STDBY = 0
SOFTST = 0
L4
L3
(1)
yes
SOFTST = 1?
yes
L2
(1)
Protection mode (XXXX XX00)
STDBY = 0
SOFTST = 0
registers are set
STDBY = 1?
S 8CH A 1AH A 00H A P
S 8CH A 1AH A 01H A P
Page 39
1999 Jul 13 39
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.20 I2C-bus flow for any mode.
(1) See Fig.18.
handbook, full pagewidth
MGM079
(ANY Mode)
Power-Down Mode
no acknowledge is given by IC
all register contents are random
L1
(1)
VCC < 8.1 V
V
CC
a soft-down sequency followed by a soft start sequence is generated internally.
8.6 V
8.1 V V
CC
IC enters standby mode.
8.6 V
8.1 V
Power-down mode
Power dip of VCC< 8.6 V:
The soft-down sequence is started first.
Then the soft-start sequence is generated internally.
Power dip of VCC< 8.1 V or VCC shut-down:
This function is independent from the operating mode, so it works under any condition.
All driver outputs are immediately disabled
IC enters standby mode.
Standby mode detection
Execute data transmission twice to assure that there was no data transfer error.
MGS276
yes
no
chip address
8CHS 0XHAAAPXXH
subaddress data
I
2
C-bus transmission
Normal operation
acknowledge was
given on data?
yes
no
chip address
8CHS 0XHAAAPXXH
subaddress data
I
2
C-bus transmission
acknowledge was
given on data?
Standby mode
Fig.21 Possible standby mode detection.
Page 40
1999 Jul 13 40
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
APPLICATION INFORMATION
Fig.22 Application and timing for feedback mode.
For f < 50 kHz and C2 < 47 nF calculation formulas and behaviour of the OTA are the same as for an OP. An exception is the limited output current at BOP (pin 3). See Chapter “Characteristics”, Row Head “B+ control section; see Figs 22 and 23”.
(1) The recommended value for R6 is 1 k.
a. Feedback mode application.
b. Waveforms for normal operation. c. Waveforms for fault condition.
handbook, full pagewidth
V
HDRV
V
BSENS
V
BSENS
= V
BOP
V
BDRV
t
off(min)
t
horizontal flyback pulse
V
RESTART(BSENS)
V
STOP(BSENS)
2
3
4
1
MBG600
t
d(BDRV)
handbook, full pagewidth
SOFT START
SRQ
Q
HORIZONTAL
OUTPUT
STAGE
V
HDRV
V
CC
V
i
6
D2
TR1
R5
C4
R4
R6
(1)
L
OTA
2.5 V
V
HPLL2
5 V
BIN
V
BOP
V
BSENS
V
BDRV
C
BOP
D1
R1
R3
EWDRV
C1
R2
C2
34
>10 nF
horizontal flyback pulse
INVERTING
BUFFER
3
2
4
1
MGM080
DISCHARGE
Page 41
1999 Jul 13 41
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.23 Application and timing for feed forward mode.
a. Forward mode application.
b. Waveforms for normal operation. c. Waveforms for fault condition.
handbook, full pagewidth
V
BOP
V
BOP
V
STOP(BSENS)
t
off
V
RESTART(BSENS)
V
HDRV
V
BSENS
V
BDRV
horizontal flyback pulse
2
3
4
I
MOSFET
5
1
t
on
(discharge time of C
BSENS
)
MBG602
t
d(BDRV)
SOFT START
SRQ
Q
V
HDRV
V
CC
6
R4
(1)
OTA
2.5 V
V
HPLL2
5
V
BOP
V
BSENS
V
BDRV
34
INVERTING
BUFFER
3
2
4
DISCHARGE
HORIZONTAL
OUTPUT
STAGE
D2
TR1
R3
V
BIN
C
BSENS
C
BOP
R1 R2
C1
D1
TR2
> 10 nF
>2 nF
horizontal
flyback pulse
1
I
MOSFET
5
EHT
transformer
EHT adjustment
power-down
MGM081
(1) The recommended value for R4 is 1 k.
Page 42
1999 Jul 13 42
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Start-up sequence and shut-down sequence
Fig.24 Activation of start-up sequence and shut-down sequence via supply voltage.
a. Start-up sequence.
b. Shut-down sequence.
(1) See Fig.25a. (2) See Fig.25b.
handbook, full pagewidth
V
CC
MGS278
continuous blanking activated on pins CLBL and HUNLOCK PLL2 soft-down sequence is triggered
(2)
8.6 V
8.1 V
3.5 V continuous blanking disappears
time
no data accepted from I
2
C-bus
video clamping pulse and vertical outputs disabled
handbook, full pagewidth
V
CC
continuous blanking off PLL2 soft start/soft-down enabled
(1)
8.6 V
3.5 V continuous blanking activated on pins CLBL and HUNLOCK
time
8.3 V data accepted from I
2
C-bus video clamping pulse and vertical outputs enabled if control bit STDBY = 0
MGS277
Page 43
1999 Jul 13 43
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
PLL2 soft start sequence and PLL2 soft-down sequence
Fig.25 Activation of PLL2 soft-start sequence and PLL2 soft-down sequence via the I2C-bus.
a. PLL2 soft start sequence, if VCC> 8.6 V.
b. PLL2 soft-down sequence, if VCC> 8.6 V.
(1) HDRV and BDRV are floating for VCC< 8.6 V.
handbook, full pagewidth
V
HPLL2
continuous blanking off PLL2 enabled frequency detector enabled HDRV/HFLB protection enabled
4.6 V
4.0 V
1.8 V
time
HDRV duty cycle begins to increase
BDRV duty cycle begins to increase HDRV duty cycle has reached nominal value
3.2 V
BDRV duty cycle has reached nominal value
duty cycle increases
MGS279
handbook, full pagewidth
V
HPLL2
continuous blanking activated on pins CLBL and HUNLOCK PLL2 disabled frequency detector disabled HDRV/HFLB protection disabled
4.6 V
4.0 V
1.8 V
time
HDRV floating
BDRV duty cycle begins to decrease
(1)
2.8 V BDRV floating HDRV duty cycle begins to decrease
(1)
duty cycle decreases
MGS280
Page 44
1999 Jul 13 44
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Fig.26 Activation of soft-down sequence via pin XRAY.
handbook, full pagewidth
MGS281
floating
floating
X-ray latch triggered
V
XRAY
V
HUNLOCK
BDRV duty cycle
HDRV duty cycle
Vertical linearity error Horizontal focus pre-correction
Fig.27 Definition of vertical linearity error.
(1) I
VOUT=IVOUT1
I
VOUT2
.
(2) I1=I
VOUT
at V
VCAP
= 1.9 V.
(3) I2=I
VOUT
at V
VCAP
= 2.6 V.
(4) I3=I
VOUT
at V
VCAP
= 3.3 V.
Which means:
Vertical linearity error =
I
0
I1I3–
2
--------------
=
1 max
I
1I2
I
0
--------------
or
I
2I3
I
0
--------------


handbook, halfpage
I
1
(2)
I
2
(3)
I
3
(4)
I
VOUT
(1)
(µA)
+415
415
0
V
VCAP
MBG551
Fig.28 Definition of horizontal focus pre-correction.
handbook, halfpage
MGS282
(1)
(2)
t
precor
= 450 ns
t
precor
= 300 ns
(1) Line flyback pulse at HFLB (pin 1). (2) Horizontal focus parabola at FOCUS (pin 32).
Page 45
1999 Jul 13 45
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
Printed-circuit board layout
Fig.29 Hints for printed-circuit board (PCB) layout.
handbook, full pagewidth
TDA4856
1
2
3
5
6
7
8
9
external components of horizontal section
external components of horizontal section
B-drive line in parallel to ground
47 pF
2.2 nF47 nF
100 µF
12 V
external components of vertical section
further connections to other components
or ground paths are not allowed
only this path may be connected
to general ground of PCB
external components of driver stages
For optimum performance of the TDA4856 the ground paths must be routed as shown. Only one connection to other grounds on the PCB is allowed. Note: The tracks for HDRV and BDRV should be kept separate.
pin 25 should be the 'star point' for all small signal components
no external ground tracks connected here
MGS283
SMD
4
Page 46
1999 Jul 13 46
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
INTERNAL PIN CONFIGURATION
PIN SYMBOL INTERNAL CIRCUIT
1 HFLB
2 XRAY
3 BOP
4 BSENS
1.5 k
7 x
1
MBG561
5 k
6.25 V
2
MBG562
5.3 V
3
MBG563
4
MBG564
Page 47
1999 Jul 13 47
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
5 BIN
6 BDRV
7 PGND power ground, connected to substrate 8 HDRV
9 XSEL
10 V
CC
11 EWDRV
PIN SYMBOL INTERNAL CIRCUIT
5
MBG565
6
MBG566
8
MGM089
9
MBK381
4 k
MGM090
108
108
MBG570
Page 48
1999 Jul 13 48
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
12 VOUT2
13 VOUT1
14 VSYNC
15 HSYNC
16 CLBL
PIN SYMBOL INTERNAL CIRCUIT
MBG571
MBG572
100
2 k
7.3 V
1.4 V
MBG573
85
1.4 V
1.28 V
7.3 V
MBG574
MBG575
Page 49
1999 Jul 13 49
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
17 HUNLOCK
18 SCL
19 SDA
20 ASCOR
21 VSMOD
PIN SYMBOL INTERNAL CIRCUIT
MGM091
MGM092
MGM093
480
MGM094
250
5 V
MGM095
Page 50
1999 Jul 13 50
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
22 VAGC
23 VREF
24 VCAP
25 SGND signal ground 26 HPLL1
PIN SYMBOL INTERNAL CIRCUIT
MBG581
3 V
MBG582
MBG583
4.3 V
MGM096
Page 51
1999 Jul 13 51
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
27 HBUF
28 HREF 29 HCAP
30 HPLL2
PIN SYMBOL INTERNAL CIRCUIT
MGM097
5 V
76
2.525 V
7.7 V
MBG585
7.7 V
6.25 V
HFLB
MGM098
Page 52
1999 Jul 13 52
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
31 HSMOD
32 FOCUS
PIN SYMBOL INTERNAL CIRCUIT
250
5 V
MGM099
200
120
120
MGM100
Electrostatic discharge (ESD) protection
Fig.30 ESD protection for pins 4, 11 to 13,
16 and 17.
pin
MBG559
Fig.31 ESD protection for pins 2, 3, 5, 18 to 24
and 26 to 32.
pin
7.3 V
7.3 V
MBG560
Page 53
1999 Jul 13 53
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
PACKAGE OUTLINE
UNIT b
1
cEe M
H
L
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
DIMENSIONS (mm are the original dimensions)
SOT232-1
92-11-17 95-02-04
b
max.
w
M
E
e
1
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
3.2
2.8
0.181.778 10.16
10.7
10.2
12.2
10.5
1.6
4.7 0.51 3.8
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
1
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D
(1)
Z
A
max.
12
A
min.
A
max.
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
Page 54
1999 Jul 13 54
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
SOLDERING Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual soldering.Amore in-depth account of soldering ICs canbe found in our
“Data Handbook IC26; Integrated Circuit
Packages”
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg(max)
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable
(1)
Page 55
1999 Jul 13 55
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
TDA4856
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I
2
C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
Page 56
© Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999
Philips Semiconductors – a w orldwide compan y
For all other countries apply to: Philips Semiconductors,
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Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
Printed in The Netherlands 545004/02/pp56 Date of release: 1999 Jul 13 Document order number: 9397 750 04963
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