Datasheet tda4856 DATASHEETS (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA4856
I
C-bus autosync deflection
controller for PC monitors
Product specification Supersedes data of 1998 Oct 02 File under Integrated Circuits, IC02
1999 Jul 13
Page 2
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
FEATURES Concept features
• Full horizontal plus vertical autosync capability
• Extended horizontal frequency range from
15 to 130 kHz
• Comprehensive set of I2C-bus driven geometry adjustments and functions, including standby mode
• Very good vertical linearity
• Moire cancellation
• Start-up and switch-off sequence for safe operation of
all power components
• X-ray protection
• Power dip recognition
• Flexible switched mode B+ supply function block for
feedback and feed forward converter
• Internally stabilized voltage reference
• Drive signal for focus amplifiers with combined
horizontal and vertical parabola waveforms
• DC controllable inputs for Extremely High Tension (EHT) compensation
• SDIP32 package.

Synchronization

• Can handle all sync signals (horizontal, vertical, composite and sync-on-video)
• Output for video clamping (leading/trailing edge selectable by the I2C-bus), vertical blanking and protection blanking
• Output for fast unlock status of horizontal synchronization and blanking on grid 1 of picture tube.

Vertical section

• I2C-bus controllable vertical picture size, picture
• Outputfor the I2C-buscontrollable vertical sawtooth and
• Vertical picture size independent of frequency
• Differential current outputs for DC coupling to vertical
• 50 to 160 Hz vertical autosync range.

East-West (EW) section

• I2C-bus controllable output for horizontal pincushion,
• Optional tracking of EW drive waveform with line

Focus section

• I2C-bus controllable output for horizontal and vertical
• Verticalparabolaisindependentoffrequencyandtracks
• Horizontal parabola independent of frequency
• Adjustable pre-correction of delay in focus output stage.
TDA4856
position, linearity (S-correction) and linearity balance
parabola (for pin unbalance and parallelogram)
booster
horizontal size, corner and trapezium correction
frequency selectable by the I2C-bus.
parabolas
with vertical adjustments

Horizontal section

• I2C-bus controllable wide range linear picture position, pin unbalance and parallelogram correction via horizontal phase
• Frequency-lockedloopforsmoothcatchingofhorizontal frequency
• Simple frequency preset of f resistors
• Low jitter
• Soft start for horizontal and B+ control drive signals.
1999 Jul 13 2
min
and f
by external
max
Page 3
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors

GENERAL DESCRIPTION

The TDA4856 is a high performance and efficient solution for autosync monitors. All functions are controllable by the I2C-bus.
The TDA4856 provides synchronization processing, horizontal and vertical synchronization with full autosync capability and very short settling times after mode changes. External power components are given a great deal of protection. The IC generates the drive waveforms for DC-coupled vertical boosters such as the TDA486x and TDA835x.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
CC
I
CC
I
CC(stb)
supply voltage 9.2 − 16 V supply current − 70 − mA
supply current during standby mode − 9 − mA VSIZE vertical size 60 − 100 % VGA VGA overscan for vertical size − 16.8 − % VPOS vertical position −±11.5 − % VLIN vertical linearity (S-correction) −2 −−46 % VLINBAL vertical linearity balance −±1.25 − % V
HSIZE
V
HPIN
V
HEHT
V
HTRAP
V
HCORT
V
HCORB
horizontal size 0.13 − 3.6 V
horizontal pincushion (EW parabola) 0.04 − 1.42 V
horizontal size modulation 0.02 − 0.69 V
horizontal trapezium correction −±0.5 − V
horizontal corner correction at top of picture −0.64 − +0.2 V
horizontal corner correction at bottom of picture −0.64 − +0.2 V HPOS horizontal position −±13 − % HPARAL horizontal parallelogram −±1.5 − % HPINBAL EW pin unbalance −±1.5 − % T
amb
operating ambient temperature −20 − +70 °C
The TDA4856 provides extended functions e.g. as a flexible B+ control, an extensive set of geometry control facilities, and a combined output for horizontal and vertical focus signals.
Together with the I2C-bus driven Philips TDA488x video processor family, a very advanced system solution is offered.

ORDERING INFORMATION

TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA4856 SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
1999 Jul 13 3
Page 4
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
o
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1999 Jul 13 4
ok, full pagewidth

BLOCK DIAGRAM

Philips Semiconductors Product specification
PC monitors
I
2
C-bus autosync deflection controller for
clamping
blanking
9.2 to 16 V
(TTL level)
HUNLOCK
(TTL level)
VSYNC
CLBL
SDA SCL
V
CC
PGND
SGND
HSYNC
14
VIDEO CLAMPING
16
VERTICAL BLANK
17
HUNLOCK
OUTPUT
19 18
RECEIVER
10
7
25
H/C SYNC INPUT
15
VERTICAL
SYNC INPUT
AND POLARITY
CORRECTION
AND
I2C-BUS
SUPPLY
AND
REFERENCE
AND POLARITY
CORRECTION
VERTICAL
SYNC
INTEGRATOR
HORIZONTAL
VERTICAL POSITION VERTICAL SIZE AND
VERTICAL OVERSCAN
PROTECTION
AND SOFT START
I2C-BUS REGISTERS
COINCIDENCE DETECTOR
FREQUENCY DETECTOR
PLL1 AND
POSITION
22
100
kΩ (1%)
(5%)
23 22 21 31
24
VERTICAL
OSCILLATOR
AND AGC
nF
EHT compensation
via vertical size
150
nF
EHT COMPENSATION
EHT compensation
via horizontal size
VSMODVAGCVCAPVREF HSMOD
HORIZONTAL AND
VERTICAL SIZE
TDA4856
PROTECTION
HORIZONTAL OSCILLATOR
PLL2, PARALLELOGRAM,
PIN UNBALANCE AND
HORIZONTAL PINCUSHION HORIZONTAL CORNER HORIZONTAL TRAPEZIUM HORIZONTAL SIZE
X-RAY
SOFT START
EWDRV 11
EW OUTPUT
7 V
1.2 V
VERTICAL OUTPUT
VERTICAL LINEARITY VERTICAL LINEARITY
BALANCE
ASYMMETRIC
EW-CORRECTION
OUTPUT
FOCUS
HORIZONTAL
AND VERTICAL
B+
CONTROL
HORIZONTAL
OUTPUT
VOUT2
12
VOUT1
13
20
ASCOR
32 FOCUS
BDRV
6
BSENS
4
BOP
3
BIN
5
HDRV
8
or
B+ CONTROL APPLICATION
(2)
(video)
3.3 kΩ
100 nF
26
R
8.2 nF
HBUF
R
HREF
(1%)
28 29
(1)
27
(1) For the calculation of fH range see Section “Calculation of line frequency range”. (2) See Figs 22 and 23.
Fig.1 Block diagram and application circuit.
10 nF
(2%)
30 1
HPLL2HCAPHREFHBUFHPLL1
12 nF
HFLB
29
XSEL XRAY
MGS272
TDA4856
Page 5
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

PINNING

SYMBOL PIN DESCRIPTION
HFLB 1 horizontal flyback input XRAY 2 X-ray protection input BOP 3 B+ control OTA output BSENS 4 B+ control comparator input BIN 5 B+ control OTA input BDRV 6 B+ control driver output PGND 7 power ground HDRV 8 horizontal driver output XSEL 9 select input for X-ray reset V
CC
EWDRV 11 EW waveform output VOUT2 12 vertical output 2 (ascending sawtooth) VOUT1 13 vertical output 1 (descending sawtooth) VSYNC 14 vertical synchronization input HSYNC 15 horizontal/composite synchronization input CLBL 16 video clamping pulse/vertical blanking output HUNLOCK 17 horizontal synchronization unlock/protection/vertical blanking output SCL 18 I2C-bus clock input SDA 19 I2C-bus data input/output ASCOR 20 output for asymmetric EW corrections VSMOD 21 input for EHT compensation (via vertical size) VAGC 22 external capacitor for vertical amplitude control VREF 23 external resistor for vertical oscillator VCAP 24 external capacitor for vertical oscillator SGND 25 signal ground HPLL1 26 external filter for PLL1 HBUF 27 buffered f/v voltage output HREF 28 reference current for horizontal oscillator HCAP 29 external capacitor for horizontal oscillator HPLL2 30 external filter for PLL2/soft start HSMOD 31 input for EHT compensation (via horizontal size) FOCUS 32 output for horizontal and vertical focus
10 supply voltage
TDA4856
1999 Jul 13 5
Page 6
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, halfpage
HFLB
1
XRAY
2
BOP
3
BSENS
EWDRV
VOUT2 VOUT1 VSYNC
HSYNC
BIN
BDRV PGND HDRV
XSEL
V
CC
CLBL
4 5 6 7 8
9 10 11 12 13 14 15 16
TDA4856
MGS273
Fig.2 Pin configuration.
FOCUS
32
HSMOD
31
HPLL2
30
HCAP
29
HREF
28
HBUF
27
HPLL1
26
SGND
25
VCAP
24
VREF
23
VAGC
22
VSMOD
21
ASCOR
20
SDA
19
SCL
18
HUNLOCK
17
TDA4856

Vertical sync integrator

Normalized composite sync signals from HSYNC are integrated on an internal capacitor in order to extract vertical sync pulses. The integration time is dependent on the horizontal oscillator reference current at HREF (pin 28). The integrator output directly triggers the vertical oscillator.

Vertical sync slicer and polarity correction

Vertical sync signals (TTL) applied to VSYNC (pin 14) are sliced at 1.4 V. The output signal of the sync slicer is integrated on an internalcapacitor to detect and normalize the sync polarity. The output signals of vertical sync integrator and sync normalizer are disjuncted before they are fed to the vertical oscillator.

Video clamping/vertical blanking generator

The video clamping/vertical blanking signal at CLBL (pin 16) is a two-level sandcastle pulse which is especially suitableforvideoICs such as the TDA488x family, but also for direct applications in video output stages.
The upper level is the video clamping pulse, which is triggeredbythehorizontalsyncpulse.Either the leading or trailing edge can be selected by setting control bit CLAMP via the I2C-bus. The width of the video clamping pulse is determined by an internal single-shot multivibrator.
FUNCTIONAL DESCRIPTION Horizontal sync separator and polarity correction
HSYNC (pin 15) is the input for horizontal synchronization signals, which can be DC-coupled TTL signals (horizontal or composite sync) and AC-coupled negative-going video sync signals. Video syncs are clamped to 1.28 V and sliced at 1.4 V. This results in a fixed absolute slicing level of 120 mV related to top sync.
For DC-coupled TTL signals the input clamping current is limited. The slicing level for TTL signals is 1.4 V.
The separated sync signal (either video or TTL) is integrated on an internalcapacitor to detect and normalize the sync polarity.
Normalized horizontal sync pulses are used as input signals for the vertical sync integrator, the PLL1 phase detector and the frequency-locked loop.
The lower level of the sandcastle pulse is the vertical blanking pulse, which is derived directly from the internal oscillator waveform. It is started by the vertical sync and stopped with the start of the vertical scan. This results in optimum vertical blanking. Two different vertical blanking times are accessible, by control bit VBLK, via the I2C-bus.
Blanking will be activated continuously if one of the following conditions is true:
Soft start of horizontal and B+ drive [voltage at HPLL2 (pin 30) pulled down externally or by the I2C-bus]
PLL1 is unlocked while frequency-locked loop is in search mode
No horizontal flyback pulses at HFLB (pin 1) X-ray protection is activated Supply voltage at VCC (pin 10) is low (see Fig.24).
Horizontal unlock blanking can be switched off, by control bit BLKDIS, via the I2C-bus while vertical blanking is maintained.
1999 Jul 13 6
Page 7
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Frequency-locked loop

The frequency-locked loop can lock the horizontal oscillatorover a wide frequencyrange. This is achievedby a combined search and PLL operation. The frequency range is preset by two external resistors and the
recommended maximum ratio is
f
---------­f
This can, for instance, be a range from 15.625 to 90 kHz with all tolerances included.
Without a horizontal sync signal the oscillator will be free-running at f
. Any change of sync conditions is
min
detected by the internal coincidence detector. A deviation of more than 4% between horizontal sync and oscillator frequency switches the horizontal section into search mode.This means that PLL1control currents are switched off immediately. The internal frequency detector then starts tuning the oscillator. Very small DC currents at HPLL1 (pin 26) are used to perform this tuning with a well defined change rate. When coincidence between horizontal sync and oscillator frequency is detected, the search mode is first replaced by a soft-lock mode which lasts for the first part of the next vertical period. The soft-lock mode is then replaced by a normal PLL operation. This operation ensures smooth tuning and avoids fast changes of horizontal frequency during catching.
In this concept it is not allowed to load HPLL1. The frequency dependent voltage at this pin is fed internally to HBUF (pin 27) via a sample-and-hold and buffer stage. The sample-and-hold stage removes all disturbances caused by horizontal sync or composite vertical sync from the buffered voltage. An external resistorconnectedbetweenpins HBUFand HREF defines the frequency range.
Out-of-lock indication (pin HUNLOCK)
Pin HUNLOCK is floating during search mode, or if a protection condition is true. All this can be detected by the microcontroller if a pull-up resistor is connected to its own supply voltage.
For an additional fast vertical blanking at grid 1 of the picture tube a 1 V signal referenced to ground is available at this output. The continuous protection blanking (see Section“Videoclamping/verticalblankinggenerator”) is also available at this pin. Horizontal unlock blanking can be switched off, by control bit BLKDIS via the I2C-bus while vertical blanking is maintained.
max
min
6.5
=
------- ­1
TDA4856

Horizontal oscillator

The horizontal oscillator is of the relaxation type and requires a capacitor of 10 nF at HCAP (pin 29). For optimum jitter performance the value of 10 nF must not be changed.
The minimum oscillator frequency is determined by a resistor from HREF to ground. A resistor connected between pins HREF and HBUF defines the frequency range.
The reference current at pin HREF also defines the integration time constant of the vertical sync integration.

Calculation of line frequency range

The oscillator frequencies f calculated. This is achieved by adding the spread of the relevant components to the highest and lowest sync frequencies f
sync(min)
by the currents in R
and f
HREF
The following example is a 31.45 to 90 kHz application:
Table 1 Calculation of total spread
spread of for f
IC ±3% ±5% C
HCAP
R
, R
HREF
HBUF
Total ±7% ±9%
Thus the typical frequency range of the oscillator in this example is:
f
maxfsync max()
f
min
sync min()
-----------------------
1.09
f
The resistors R
1.07× 96.3 kHz==
28.4 kHz==
and R
HREF
the following formulae:
R
HREF
R
HBUFpar
The resistor R and R
HBUF
78 kHz k××Ω
----------------------------------------------------------------­f
0.0012 f
min
78 kHz k××Ω
-------------------------------------------------------------------­f
0.0012 f
max
is calculated as the value of R
HBUFpar
in parallel.
min
sync(max)
and R
and f
HBUF
max
must first be
max
. The oscillator is driven
.
±2% ±2% ±2% ±2%
HBUFpar
2
×+ kHz[]
min
can be calculated using
2.61 kΩ==
2
×+ kHz[]
max
726 Ω==
for f
min
.
HREF
1999 Jul 13 7
Page 8
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
Theformulae for R swing across this resistor:
R
R
HBUF

PLL1 phase detector

The phase detector is a standard type using switched current sources, which are independent of horizontal frequency. It compares the middle of horizontal sync with a fixed point on the oscillator sawtooth voltage. The PLL1 loop filter is connected to HPLL1 (pin 26).
See also Section “Horizontal position adjustment and corrections”.

Horizontal position adjustment and corrections

A linear adjustment of the relative phase between the horizontal sync and the oscillator sawtooth (in PLL1 loop) is achieved via register HPOS.Once adjusted, the relative phase remains constant over the whole frequency range.
Correctionof pin unbalance and parallelogramis achieved by modulating the phase between oscillator sawtooth and horizontal flyback (in loop PLL2) via registers HPARAL and HPINBAL. If those asymmetric EW corrections are performed in the deflection stage, both registers can be disconnected from the horizontal phase via control bit ACD. This does not change the output at pin ASCOR.

Horizontal moire cancellation

To achieve a cancellation of horizontal moire (also known as ‘video moire’), the horizontal frequency is divided-by-two to achieve a modulation of the horizontal phase via PLL2. The amplitude is controlled by register HMOIRE. To avoid a visible structure on screen the polarity changes with half of the vertical frequency. Control bit MOD disables the moire cancellation function.

PLL2 phase detector

The PLL2 phase detector is similar to the PLL1 detector and compares the line flyback pulse at HFLB (pin 1) with the oscillator sawtooth voltage. The control currents are independent of the horizontal frequency. The PLL2 detector thus compensates for the delay in the external horizontal deflection circuit by adjusting the phase of the HDRV (pin 8) output pulse.
HREFRHBUFpar
---------------------------------------------­R
HREFRHBUFpar
alsotakesinto account the voltage
HBUF
×
–
0.8×= 805 Ω=
TDA4856
An external modulation of the PLL2 phase is not allowed, because this would disturb the pre-correction of the horizontal focus parabola.

Soft start and standby

If HPLL2 is pulled to ground, either by an external DC current or by resetting register SOFTST, the horizontal outputpulses and B+ control driver pulseswillbeinhibited. This means that HDRV (pin 8) and BDRV (pin 6) are floating in this state. In both cases PLL2 and the frequency-locked loop are disabled, and CLBL (pin 16) provides a continuous blanking signal and HUNLOCK (pin 17) is floating.
This option can be used for soft start, protection and power-down modes. When pin HPLL2 is released again, anautomatic soft start sequenceon the horizontal driveas well as on the B-drive output will be performed (see Fig.24).
A soft start can only be performed if the supply voltage for the IC is a minimum of 8.6 V.
The soft start timing is determined by the filter capacitor at HPLL2 (pin 30), which is charged with a constant current during soft start. In the beginning the horizontal driver stage generates very small output pulses. The width of these pulses increases with the voltage at HPLL2 until the final duty cycle is reached. The voltage at HPLL2 increases further and performsa soft start at BDRV (pin 6) as well. After BDRV has reached full duty cycle, the voltage at HPLL2 continues to rise until HPLL2 enters its normaloperatingrange.Theinternalchargecurrentisnow disabled. Finally PLL2 and the frequency-locked loop are activated. If both functions reach normal operation, HUNLOCK (pin 17) switches from the floating status to normal vertical blanking, andcontinuous blanking at CLBL (pin 16) is removed.
Output stage for line drive pulses [HDRV (pin 8)]
An open-collector output stage allows direct drive of an inverting driver transistor because of a low saturation voltage of 0.3 V at 20 mA. To protect the line deflection transistor, the output stage is disabled (floating) for a low supply voltage at V
The duty cycle of line drive pulses is slightly dependent on the actual horizontal frequency. This ensures optimum drive conditions over the whole frequency range.
(see Fig.23).
CC
1999 Jul 13 8
Page 9
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

X-ray protection

TheX-rayprotectioninputXRAY(pin 2)providesavoltage detector with a precise threshold. If the input voltage at XRAY exceeds this threshold for a certain time, then control bit SOFTST is reset, which switches the IC into protection mode. In this mode several pins are forced into defined states:
HUNLOCK (pin 17) is floating The capacitor connected to HPLL2 (pin 30) is
discharged Horizontal output stage (HDRV) is floating B+ control driver stage (BDRV) is floating CLBL provides a continuous blanking signal.
There are two different methods of restarting ways the IC:
1. XSEL (pin 9) is open-circuit or connected to ground. The control bit SOFTST must be set to logic 1 via the I2C-bus. Then the IC returns to normal operation via soft start.
2. XSEL (pin 9) is connected to VCC via an external resistor.Thesupplyvoltage of the IC must be switched off for a certain period of time, before the IC can be restarted again using the standard power-on procedure.

Vertical oscillator and amplitude control

This stage is designed for fast stabilization of vertical size after changes in sync frequency conditions. The free-running frequency f resistor R
connected to pin 24. The value of R
C
VCAP
connected to pin 23 and the capacitor
VREF
optimized for noise and linearity performance in the whole vertical and EW section, but also influences several internal references. Therefore the value of R be changed. Capacitor C free-running frequency of the vertical oscillator in accordance with the following formula:
f
=
-----------------------------------------------------------
fr(V)
10.8 R
1
× C
VREF
×
To achieve a stabilized amplitude the free-running frequencyf
,withoutadjustment,shouldbe at least 10%
fr(V)
lower than the minimum trigger frequency. The contributions shown in Table 2 can be assumed.
is determined by the
fr(V)
VREF
VREF
should be used toselect the
VCAP
VCAP
is not only
must not
TDA4856
Table 2 Calculation of f
Contributing elements
Minimum frequency offset between f lowest trigger frequency
Spread of IC ±3% Spread of R Spread of C
VREF VCAP
Total 19%
Result for 50 to 160 Hz application:
f
fr(V)
50 Hz
---------------
1.19
42 Hz==
The AGC of the vertical oscillator can be disabled by setting control bit AGCDIS via the I external current has to be injected into VCAP (pin 24) to obtain the correct vertical size. This special application mode can be used when the vertical sync pulses are serrated (shifted); this condition is found in some display modes, e.g. when using a 100 Hz up converter for video signals.
Application hint: VAGC (pin 22) has a high input impedance during scan. Therefore, the pin must not be loaded externally otherwise non-linearities in the vertical output currents may occur due to the changing charge current during scan.

Adjustment of vertical size, VGA overscan and EHT compensation

There are four differentways to adjust the amplitude of the differential output currents at VOUT1 and VOUT2.
1. Register VGAIN changes the vertical size without affecting any other output signal of the IC. This adjustment is meant for factory alignments.
2. Register VSIZE changes not only the vertical size, but also provides the correct tracking of all other related waveforms (see Section “Tracking of vertical adjustments”). This register should be used for user adjustments.
3. For the VGA350 mode register VOVSCN can activate a +17% step in vertical size.
4. VSMOD(pin 21) can be used for a DC controlled EHT compensation of vertical size by correcting the differential output currents at VOUT1 and VOUT2. The EW waveforms, verticalfocus, pin unbalance and parallelogram corrections are not affected by VSMOD.
total spread
fr(V)
and
fr(V)
10%
±1% ±5%
2
C-bus. A precise
1999 Jul 13 9
Page 10
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Adjustment of vertical position, vertical linearity and vertical linearity balance

Register VOFFS provides a DC shift at the sawtooth outputs VOUT1 and VOUT2 (pins 13 and 12) without affecting any other output waveform. This adjustment is meant for factory alignments.
Register VPOS provides a DC shift at the sawtooth output VOUT1 and VOUT2 with correct tracking of all other related waveforms (see Section “Tracking of vertical adjustments”). This register should be used for user adjustments. Due to the tracking the whole picture moves vertically while maintaining the correct geometry.
Register VLIN is used to adjust the amount of the vertical S-correction in the output signal. This function can be switched off by control bit VSC.
Register VLINBAL is used to correct the unbalance of vertical S-correction in the output signal.

Tracking of vertical adjustments

The adjustments via registers VSIZE, VOVSCN and VPOS also affect the waveforms of horizontal pincushion, vertical linearity (S-correction), vertical linearity balance, focus parabola, pin unbalance and parallelogram correction. The result of this interaction is that no readjustment of these parameters is necessary after an user adjustment of vertical picture size and vertical picture position.

Adjustment of vertical moire cancellation

To achieve a cancellation of vertical moire (also known as ‘scanmoire’)theverticalpicturepositioncanbemodulated by half the vertical frequency. The amplitude of the modulation is controlled by register VMOIRE and can be switched off via control bit MOD.
TDA4856
The pincushion (EW parabola) amplitude, corner and trapezium correction track with the vertical picture size (VSIZE) and also with the adjustment for vertical picture position(VPOS). The corner correctiondoes not track with the horizontal pincushion (HPIN).
Further the horizontal pincushion amplitude, corner and trapezium correction track with the horizontal picture size, which is adjusted via register HSIZE and the analog modulation input HSMOD. If the DC component in the EWDRV output signal is increased via HSIZE or I the pincushion, corner and trapezium component of the EWDRV output will be reduced by a factor of
V
HSIZE
V
+
HSIZEVHEHT
–
1
-------------------------------------------------------------------------

1
–
-----------------

14.4 V
14.4 V
The value 14.4 V is a virtual voltage for calculation only. The output pin can not reach this value, but the gain (and DCbias)oftheexternalapplicationshouldbesuchthatthe horizontal deflection is reduced to zero when EWDRV reaches 14.4 V.
HSMOD (pin 31) can be used for a DC controlled EHT compensation by correcting horizontal size, horizontal pincushion, corner and trapezium. The control range at this pin tracks with the actual value of HSIZE. For an increasing DC component V signal, the DC component V
V
1
reducedbyafactorof asshownintheequation
–
-----------------
14.4 V
in the EWDRV output
HSIZE
caused by I
HEHT
HSIZE
above. The whole EWDRV voltage is calculated as follows:
V V
= 1.2 V + [V
EWDRV HCOR+VHTRAP
HSIZE+VHEHT
) × g(HSIZE, HSMOD)] × h(I
× f(HSIZE) + (V
Where:
HSMOD
HREF
HSMOD
will be
HPIN
)
+
,
Horizontal pincushion (including horizontal size, corner correction and trapezium correction)
EWDRV(pin 11) provides a complete EW drive waveform. The components horizontal pincushion, horizontal size, corner correction and trapezium correction are controlled by the registers HPIN, HSIZE, HCORT, HCORB and HTRAP.
The corner correction can be adjusted separately for the top (HCORT) and bottom (HCORB) part of the picture.
1999 Jul 13 10
I
V
HEHT
f(HSIZE) 1
HSMOD
------------------- ­120 µA
–=
0.69×=
V
HSIZE
-----------------
14.4 V
g(HSIZE, HSMOD) 1
I
hI
()
HREF
HREF
=
-------------------------------­I
HREF
f70kHz=
V
V
+
HSIZEVHEHT
–=
--------------------------------------------------------------------------

1
–
-----------------

14.4 V
14.4 V
HSIZE
Page 11
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
Two different modes of operation can be chosen for the EW output waveform via control bit FHMULT:
1. Mode 1 Horizontal size is controlled via register HSIZE and
causesaDCshift at the EWDRV output. The complete waveform is also multiplied internally by a signal proportional to the line frequency [which is detected via the current at HREF (pin 28)]. This mode is to be used for driving EW diode modulator stages which require a voltage proportional to the line frequency.
2. Mode 2 The EW drive waveform does not track with the line
frequency. This mode is to be used for driving EW modulatorswhich require a voltage independent ofthe line frequency.
Output stage for asymmetric correction waveforms [ASCOR (pin 20)]
This output is designed as a voltage output for superimposed waveforms of vertical parabola and sawtooth. The amplitude and polarity of both signals can be changed by registers HPARAL and HPINBAL via the I2C-bus.
Application hint: The TDA4856 offers two possibilities to control registers HPINBAL and HPARAL.
1. Control bit ACD = 1 The two registers now control the horizontal phase by
means of internal modulation of the PLL2 horizontal phase control. The ASCOR output (pin 20) can be left unused, but it will always provide an output signal because the ASCOR output stage is not influenced by the control bit ACD.
2. Control bit ACD = 0 The internal modulation via PLL2 is disconnected.
In order to obtain the required effect on the screen, pin ASCORmust now be fedtothe DC amplifier which controls the DC shift of the horizontal deflection. This option is useful for applications which already use a DC shift transformer.
If the tube does not need HPINBAL and HPARAL, then pin ASCOR can be used for other purposes, i.e. for a simple dynamic convergence.
TDA4856
Dynamic focus section [FOCUS (pin 32)]
Thissectiongeneratesacompletedrivesignalfordynamic focus applications. The amplitude of the horizontal parabola is internally stabilized, thus it is independent of the horizontal frequency. The amplitude can be adjusted via register HFOCUS. Changing horizontal size may require a correction of HFOCUS. To compensate for the delay in external focus amplifiers a ‘pre-correction’ for the phase of the horizontal parabola has been implemented (see Fig.28). The amount of this pre-correction can be adjusted via register HFOCAD. The amplitude of the vertical parabola is independent of frequency and tracks with all vertical adjustments. The amplitude can be adjusted via register VFOCUS.
FOCUS (pin 32) is designed as a voltage output for the superimposed vertical and horizontal parabolas.

B+ control function block

The B+ control function block of the TDA4856 consists of an Operational Transconductance Amplifier (OTA), a voltagecomparator, a flip-flop and a dischargecircuit.This configuration allows easy applications for different B+ control concepts. See also Application Note AN96052:
“B+ converter Topologies for Horizontal Deflection and EHT with TDA4855/58”
GENERAL DESCRIPTION The non-inverting input of the OTA is connected internally
toa high precision referencevoltage. The inverting inputis connectedto BIN (pin 5). Aninternal clamping circuit limits the maximum positive output voltage of the OTA. The output itself is connected to BOP (pin 3) and to the inverting input of the voltage comparator. The non-inverting input of the voltage comparator can be accessed via BSENS (pin 4).
B+ drive pulses are generated by an internal flip-flop and fed to BDRV (pin 6) via an open-collector output stage. This flip-flop is set at the rising edge of the signal at HDRV (pin 8). The falling edge of the output signal at BDRV has a defined delay of t pulse. When the voltage at BSENS exceeds the voltageat BOP, the voltage comparator output resets the flip-flop and, therefore, the open-collector stage at BDRV is floating again.
.
d(BDRV)
to the rising edge of the HDRV
1999 Jul 13 11
Page 12
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
An internal discharge circuit allows a well defined discharge of capacitors at BSENS. BDRV is active at a LOW-level output voltage (see Figs 22 and 23), thus it requires an external inverting driver stage.
The B+ function block can be used for B+ deflection modulators in many different ways. Two popular application combinations are as follows:
• Boost converter in feedback mode (see Fig.22)
In this application the OTA is used as an error amplifier witha limited output voltagerange. The flip-flop isset on the rising edge of the signal at HDRV. A reset will be generated when the voltage at BSENS, taken from the current sense resistor, exceeds the voltage at BOP.
If no reset is generated within a line period, the rising edgeof the next HDRV pulseforces the flip-flop to reset. The flip-flop is set immediately after the voltage at BSENS has dropped below the threshold voltage V
RESTART(BSENS)
• Buck converter in feed forward mode (see Fig.23)
This application uses an external RC combination at BSENS to provide a pulse width which is independent from the horizontal frequency. The capacitor is charged via an external resistor and discharged by the internal discharge circuit. For normal operation the discharge circuit is activated when the flip-flop is reset by the internal voltage comparator. The capacitor will now be discharged with a constant current until the internally controlled stop level V willbe maintained until therising edge of thenext HDRV pulse sets the flip-flop again and disables the discharge circuit.
If no reset is generated within a line period, the rising edge of the next HDRV pulse automatically starts the discharge sequence and resets the flip-flop. When the voltage at BSENS reaches the threshold voltage V
RESTART(BSENS)
automatically and the flip-flop will be set immediately. This behaviour allows a definition of the maximum duty cycle of the B+ control drive pulse by the relationship of charge current to discharge current.
.
STOP(BSENS)
, the discharge circuit will be disabled
is reached. This level
TDA4856

Supply voltage stabilizer, references, start-up procedures and protection functions

The TDA4856 provides an internal supply voltage stabilizer for excellent stabilization of all internal references.Aninternalgap reference, especially designed for low-noise, is the reference for the internal horizontal andverticalsupplyvoltages.Allinternalreference currents and drive current for the vertical output stage are derived from this voltage via external resistors.
If either the supply voltage is below 8.3 V or no data from the I2C-bus has been received after power-up, the internal softstart and protection functions do not allowanyof those outputs [HDRV, BDRV, VOUT1, VOUT2 and HUNLOCK (see Fig.24)] to be active.
For supply voltages below 8.3 V the internal I2C-bus will not generate an acknowledge and the IC is in standby mode. This is because the internal protection circuit has generated a reset signal for the soft start register SOFTST. Above 8.3 V data is accepted and all registers can be loaded. If the register SOFTST has received a set from the I2C-bus, the internal soft start procedure is released, which activates all above mentioned outputs.
If during normal operation the supply voltage has dropped below 8.1 V, the protection mode is activated and HUNLOCK(pin 17)changesto the protection status and is floating. This can be detected by the microcontroller.
This protection mode has been implemented in order to protect the deflection stages and the picture tube during start-up, shut-down and fault conditions. This protection mode can be activated as shown in Table 3.
1999 Jul 13 12
Page 13
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
Table 3 Activation of protection mode
ACTIVATION RESET
Low supply voltage at pin 10 increase supply voltage;
reload registers; soft start via I2C-bus
Power dip, below 8.1 V reload registers;
soft start via I2C-bus or via supply voltage
X-ray protection XRAY (pin 2) triggered
HPLL2 (pin 30) externally pulled to ground
When the protection mode is active, several pins of the TDA4856 are forced into a defined state:
HDRV (horizontal driver output) is floating BDRV (B+ control driver output) is floating HUNLOCK (indicates, that the frequency-to-voltage
converter is out of lock) is floating (HIGH-level via external pull-up resistor)
CLBL provides a continuous blanking signal The capacitor at HPLL2 is discharged.
reload registers; soft start via I2C-bus
release pin 30
TDA4856

Power dip recognition

In standby mode the I2C-bus will only answer with an acknowledge, when data is sent to control register with subaddress 1AH. This register contains the standby and soft start control bit.
If the I2C-bus master transmits data to another register, an aknowledge is given after the chip address and the subaddress; an acknowledge is not given after the data. This indicates that only in soft start mode data can be stored into normal registers.
If the supply voltage dips under 8.1 V the TDA4856leaves normal operation mode and changes into standby mode. The microcontroller can check this state by sending data intoaregister with the subaddress 0XH. The acknowledge will only be given on the data if the TDA4856 is active.
Due to this behaviour the start-up of the TDA4856 is defined as follows. The first data that is transferred to the TDA4856 must be sent to the control register with subaddress 1AH. Any other subaddress will not lead to an acknowledge. This is a limitation in checking the I2C-busses of the monitor during start-up.
If the soft start procedure is activated via the I2C-bus, all of these actions will beperformed in a well defined sequence (see Figs 24 and 25).
1999 Jul 13 13
Page 14
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
V
i(n)
V
o(n)
V
I/O(n)
I
o(HDRV)
I
i(HFLB)
I
o(CLBL)
I
o(BOP)
I
o(BDRV)
I
o(EWDRV)
I
o(FOCUS)
T
amb
T
j
T
stg
V
ESD
supply voltage −0.5 +16 V input voltage on pins:
BIN −0.5 +6.0 V HSYNC, VSYNC, VREF, HREF, VSMOD and HSMOD −0.5 +6.5 V SDA and SCL −0.5 +8.0 V XRAY −0.5 +8.0 V
output voltage on pins:
VOUT2, VOUT1 and HUNLOCK −0.5 +6.5 V
BDRV and HDRV −0.5 +16 V input/output voltages at pins BOP and BSENS −0.5 +6.0 V horizontal driver output current − 100 mA horizontal flyback input current −10 +10 mA video clamping pulse/vertical blanking output current −−10 mA B+ control OTA output current − 1mA B+ control driver output current − 50 mA EW driver output current −−5mA focus driver output current −−5mA operating ambient temperature −20 +70 °C junction temperature − 150 °C storage temperature −55 +150 °C electrostatic discharge for all pins note 1 −150 +150 V
note 2 −2000 +2000 V
Notes
1. Machine model: 200 pF; 0.75 µH; 10 Ω.
2. Human body model: 100 pF; 7.5 µH; 1500 Ω.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 55 K/W

QUALITY SPECIFICATION

In accordance with
“URF-4-2-59/601”
; EMC emission/immunity test in accordance with
“DIS 1000 4.6”
(IEC 801.6).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
EMC
emission test note 1 − 1.5 − mV immunity test note 1 − 2.0 − V
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
1999 Jul 13 14
Page 15
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors

CHARACTERISTICS

VCC= 12 V; T
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Horizontal sync separator
I
NPUT CHARACTERISTICS FOR DC-COUPLED TTL SIGNALS: PIN HSYNC
V
i(HSYNC)
V
HSYNC(sl)
t
r(HSYNC)
t
f(HSYNC)
t
W(HSYNC)(min)
I
i(HSYNC)
INPUT CHARACTERISTICS FOR AC-COUPLED VIDEO SIGNALS (SYNC-ON-VIDEO, NEGATIVE SYNC POLARITY) V
HSYNC
V
HSYNC(sl)
V
clamp(HSYNC)
I
ch(HSYNC)
t
W(HSYNC)(min)
R
source(max)
R
i(diff)(HSYNC)
Automatic polarity correction for horizontal sync
t
P(H)
---------- ­t
H
t
d(HPOL)
Vertical sync integrator
t
int(V)
Vertical sync slicer (DC-coupled, TTL compatible): pin VSYNC
V
i(VSYNC)
V
VSYNC(sl)
I
i(VSYNC)
=25°C; peripheral components in accordance with Fig.1; unless otherwise specified.
amb
sync input signal voltage 1.7 −−V slicing voltage level 1.2 1.4 1.6 V rise time of sync pulse 10 − 500 ns fall time of sync pulse 10 − 500 ns minimum width of sync pulse 0.7 −−µs input current V
sync amplitude of video input
V
R
= 0.8 V −−−200 µA
HSYNC
= 5.5 V −−10 µA
HSYNC
=50Ω−300 − mV
source
signal voltage slicing voltage level
R
source
=50Ω 90 120 150 mV
(measured from top sync) top sync clamping voltage
R
source
=50Ω 1.1 1.28 1.5 V
level charge current for coupling
V
HSYNC>Vclamp(HSYNC)
1.7 2.4 3.4 µA
capacitor minimum width of sync pulse 0.7 −−µs maximum source resistance duty cycle = 7% −−1500 Ω differential input resistance during sync − 80 −Ω
horizontal sync pulse width
−−25 %
related to line period delay time for changing
0.3 − 1.8 ms
polarity
integration time for generation of a vertical trigger pulse
fH= 15.625 kHz; I
= 0.52 mA
HREF
fH= 31.45 kHz; I
= 1.052 mA
HREF
fH= 64 kHz; I
= 2.141 mA
HREF
fH= 100 kHz; I
= 3.345 mA
HREF
14 20 26 µs
71013µs
3.9 5.7 6.5 µs
2.5 3.8 4.5 µs
sync input signal voltage 1.7 −−V slicing voltage level 1.2 1.4 1.6 V input current 0 V < V
< 5.5 V −−±10 µA
SYNC
1999 Jul 13 15
Page 16
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Automatic polarity correction for vertical sync
t
W(VSYNC)(max)
t
d(VPOL)
Video clamping/vertical blanking output: pin CLBL
t
clamp(CLBL)
V
clamp(CLBL)
TC
clamp
STPS
clamp
t
d(HSYNCt-CLBL)
t
clamp1(max)
t
d(HSYNCl-CLBL)
t
clamp2(max)
V
blank(CLBL)
t
blank(CLBL)
TC
blank
V
scan(CLBL)
TC
scan
I
sink(CLBL)
I
L(CLBL)
maximum width of vertical
−−400 µs
sync pulse delay for changing polarity 0.45 − 1.8 ms
width of video clamping pulse measured at V top voltage level of video
= 3 V 0.6 0.7 0.8 µs
CLBL
4.32 4.75 5.23 V
clamping pulse temperature coefficient of
V
clamp(CLBL)
steepness of slopes for
RL=1MΩ; CL=20pF − 50 − ns/V
− 4 − mV/K
clamping pulse delay between trailing edge of
horizontal sync and start of video clamping pulse
maximum duration of video clamping pulse referenced to
clamping pulse triggered on trailing edge of horizontal sync; control bit CLAMP = 0; measured at V
CLBL
=3V
− 130 − ns
−−1.0 µs
end of horizontal sync delay between leading edge of
horizontal sync and start of video clamping pulse
maximum duration of video clamping pulse referenced to
clamping pulse triggered on leading edge of horizontal sync; control bit CLAMP = 1; measured at V
CLBL
=3V
− 300 − ns
−−0.15 µs
end of horizontal sync top voltage level of vertical
notes 1 and 2 1.7 1.9 2.1 V
blanking pulse width of vertical blanking pulse
at pins CLBL and HUNLOCK temperature coefficient of
V
blank(CLBL)
output voltage during vertical
control bit VBLK = 0 220 260 300 µs control bit VBLK = 1 305 350 395 µs
− 2 − mV/K
I
= 0 0.59 0.63 0.67 V
CLBL
scan temperature coefficient of
V
scan(CLBL)
−−2 − mV/K
internal sink current 2.4 −−mA external load current −−−3.0 mA
1999 Jul 13 16
Page 17
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Horizontal oscillator: pins HCAP and HREF
f
fr(H)
∆f
fr(H)
TC
fr
f
H(max)
V
HREF
Unlock blanking detection: pin HUNLOCK
V
scan(HUNLOCK)
V
blank(HUNLOCK)
TC
blank
TC
sink
I
sink(int)
I
L(HUNLOCK)
I
L
PLL1 phase comparator and frequency-locked loop: pins HPLL1 and HBUF
t
W(HSYNC)(max)
t
lock(HPLL1)
I
ctrl(HPLL1)
V
HBUF
free-running frequency without PLL1 action (for testing only)
spread of free-running
R R C
HBUF HREF HCAP
= ∞; = 2.4 kΩ; = 10 nF; note 3
30.53 31.45 32.39 kHz
−−±3.0 % frequency(excludingspreadof external components)
temperature coefficient of
−100 0 +100 10−6/K free-running frequency
maximum oscillator frequency −−130 kHz voltage at input for reference
2.43 2.55 2.68 V current
low level of HUNLOCK saturation voltage in case
−−250 mV
of locked PLL1; internal
sink current = 1 mA blanking level of HUNLOCK external load current = 0 0.9 1 1.1 V temperature coefficient of
V
blank(HUNLOCK)
temperature coefficient of I
sink(HUNLOCK)
internal sink current for blanking pulses;
−−0.9 − mV/K
− 0.15 − %/K
1.4 2.0 2.6 mA
PLL1 locked maximum external load
V
HUNLOCK
=1V −−−2mA
current leakage current V
HUNLOCK
= 5 V in case of
−−±5 µA unlocked PLL1 and/or protection active
maximum width of horizontal
−−25 %
sync pulse (referenced to line period)
total lock-in time of PLL1 − 40 80 ms control currents notes 4 and 5
locked mode; level 1 − 15 −µA locked mode; level 2 − 145 −µA
buffered f/v voltage at HBUF (pin 27)
minimum horizontal frequency
maximum horizontal
− 2.55 − V
− 0.5 − V
frequency
1999 Jul 13 17
Page 18
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Phase adjustments and corrections via PLL1 and PLL2
HPOS horizontal position (referenced
to horizontal period)
HPINBAL horizontal pin unbalance
correction via HPLL2 (referenced to horizontal period)
HPARAL horizontal parallelogram
correction (referenced to horizontal period)
HMOIRE relative modulation of
horizontal position by 0.5fH; phase alternates with 0.5f
HMOIRE
off
moire cancellation off control bit MOD = 1 − 0 − %
PLL2 phase detector: pins HFLB and HPLL2
φ
PLL2
PLL2 control (advance of horizontal drive with respect to middle of horizontal flyback)
I
ctrl(PLL2)
Φ
PLL2
PLL2 control current − 75 −µA relative sensitivity of PLL2
phase shift related to horizontal period
V
PROT(HPLL2)(max)
maximum voltage for PLL2 protection mode/soft start
I
ch(HPLL2)
charge current for external capacitor during soft start
I
dch(HPLL2)
discharge current for external capacitor during soft down
register HPOS = 0 −−13 − % register HPOS = 127 − 0 − % register HPOS = 255 − 13 − % register HPINBAL = 0;
−−1.2 − % note 6
register HPINBAL = 63;
− 1.2 − % note 6
register HPINBAL = 32;
− 0.02 − % note 6
register HPARAL = 0;
−−1.2 − % note 6
register HPARAL = 63;
− 1.2 − % note 6
register HPARAL = 32;
− 0.02 − % note 6
register HMOIRE = 0;
− 0 − % control bit MOD = 0
V
register HMOIRE = 63;
− 0.07 − % control bit MOD = 0
maximum advance;
36 −−% register HPINBAL = 32; register HPARAL = 32
minimum advance;
− 7 − % register HPINBAL = 32; register HPARAL = 32
− 28 − mV/%
− 4.6 − V
V
V
< 3.7 V − 1 −µA
HPLL2
< 3.7 V −−1 −µA
HPLL2
1999 Jul 13 18
Page 19
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
HORIZONTAL FLYBACK INPUT: PIN HFLB V
pos(HFLB)
V
neg(HFLB)
I
pos(HFLB)
I
neg(HFLB)
V
sl(HFLB)
Output stage for line driver pulses: pin HDRV
OPEN-COLLECTOR OUTPUT STAGE V
sat(HDRV)
I
LO(HDRV)
AUTOMATIC VARIATION OF DUTY CYCLE t
HDRV(OFF)/tH
X-ray protection: pin XRAY
V
XRAY(sl)
t
W(XRAY)(min)
R
i(XRAY)
XRAY
rst
V
CC(XRAY)(min)
V
CC(XRAY)(max)
R
XSEL
positive clamping level I negative clamping level I
=5mA − 5.5 − V
HFLB
= −1mA −−0.75 − V
HFLB
positive clamping current −−6mA negative clamping current −−−2mA slicing level − 2.8 − V
saturation voltage I
output leakage current V
relative t
time of HDRV
OFF
output; measured at V
= 3 V; HDRV duty cycle
HDRV
is modulated by the relation I
HREF/IVREF
=20mA −−0.3 V
HDRV
I
=60mA −−0.8 V
HDRV
=16V −−10 µA
HDRV
I
HDRV
=20mA;
42 45 48 %
fH= 31.45 kHz; see Fig.16 I
HDRV
=20mA;
45.5 48.5 51.5 % fH= 58 kHz; see Fig.16
I
HDRV
=20mA;
49 52 55 %
fH= 110 kHz; see Fig.16
slicing voltage level for latch 6.22 6.39 6.56 V minimum width of trigger pulse −−30 µs input resistance at XRAY
(pin 2)
V V
XRAY XRAY
<6.38V+V >6.38V+V
BE BE
500 −−kΩ
− 5 − kΩ standby mode − 5 − kΩ
reset of X-ray latch pin 9 open-circuit or
set control bit SOFTST via I2C-bus
connected to GND
minimum supply voltage for correct function of the X-ray
pin 9 connected to VCCvia R
XSEL
pin 9 connected to VCCvia R
XSEL
switch off VCC, then re-apply V
−−4V
latch maximum supply voltage for
reset of the X-ray latch
pin 9 connected to VCCvia R
XSEL
2 −−V
external resistor at pin 9 no reset via I2C-bus 56 − 130 kΩ
CC
1999 Jul 13 19
Page 20
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Vertical oscillator [oscillator frequency in application without adjustment of free-running frequency f
f
fr(V)
f
cr(V)
free-running frequency R
vertical frequency catching range
V
VREF
voltage at reference input for vertical oscillator
t
d(scan)
delay between trigger pulse and start of ramp at VCAP (pin 24) (width of vertical blanking pulse)
I
VAGC
C
VAGC
currents of amplitude control control bit AGCDIS = 0 ±120 ±200 ±300 µA
external capacitor at VAGC (pin 22)
Differential vertical current outputs
C
VREF VCAP
=22kΩ; = 100 nF
40 42 43.3 Hz
constant amplitude; note 7 50 − 160 Hz
− 3.0 − V
control bit VBLK = 0 220 260 300 µs control bit VBLK = 1 305 350 395 µs
control bit AGCDIS = 1 − 0 −µA
150 − 220 nF
fr(V)
]
ADJUSTMENT OF VERTICAL SIZE INCLUDING VGA AND EHT COMPENSATION; see Figs 3 and 4 VGAIN vertical size (gain) without
VGA overscan (referenced to nominal vertical size)
register VGAIN = 0; register VSIZE = 127; bit VOVSCN = 0; note 8
register VGAIN = 63;
− 70 − %
− 100 − %
register VSIZE = 127; bit VOVSCN = 0; note 8
VSIZE vertical size (size) without VGA
overscan (referenced to nominal vertical size)
register VSIZE = 0; register VGAIN = 63; bit VOVSCN = 0; note 8
register VSIZE = 127;
− 60 − %
− 100 − %
register VGAIN = 63; bit VOVSCN = 0; note 8
VSIZE
VGA
vertical size with VGA overscan (referenced to nominal vertical size)
register VSIZE = 0; register VGAIN = 63; bit VOVSCN = 1; note 8
register VSIZE = 127;
− 70 − %
115.9 116.8 117.7 % register VGAIN = 63; bit VOVSCN = 1; note 8
VSMOD
EHT
EHT compensation on vertical size via VSMOD (pin 21) (referenced to 100% vertical
I
VSMOD
I
VSMOD
=0 − 0 − % = −120 µA −−7 − %
size)
I
i(VSMOD)
input current (pin 21) VSMOD = 0 − 0 −µA
VSMOD = −7% −−120 −µA
R
i(VSMOD)
V
ref(VSMOD)
input resistance 300 − 500 Ω reference voltage at input − 5.0 − V
1999 Jul 13 20
Page 21
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
f
ro(VSMOD)
ADJUSTMENT OF VERTICAL POSITION (see Fig.5) VOFFS vertical position (referenced to
VPOS vertical position (referenced to
ADJUSTMENT OF VERTICAL LINEARITY; see Fig.6 VLIN vertical linearity (S-correction) register VLIN = 0; control
δVLIN symmetry error of S-correction maximum VLIN −−±0.7 % ADJUSTMENT OF VERTICAL LINEARITY BALANCE; see Fig.7 VLINBAL vertical linearity balance
VMOIRE modulation of vertical picture
Vertical output stage: pins VOUT1 and VOUT2; see Fig.27 ∆I
VOUT(nom)(p-p)
I
o(VOUT)(max)
V
VOUT
δI
os(vert)(max)
δI
lin(vert)(max)
roll-off frequency (−3 dB) I
VSMOD
= −60 µA
1 −−MHz
+15µA (RMS value)
register VOFFS = 0 −−4 − %
100% vertical size)
register VOFFS = 15 − 4 − % register VOFFS = 8 − 0.25 − % register VPOS = 0 −−11.5 − %
100% vertical size)
register VPOS = 127 − 11.5 − % register VPOS = 64 − 0.09 − %
− 2 − % bit VSC = 0; note 8
register VLIN = 15;control
− 46 − % bit VSC = 0; note 8
register VLIN = X; control
− 0 − % bit VSC = 1; note 8
(referenced to 100% vertical size)
register VLINBAL = 0; note 8
register VLINBAL = 15;
−1.85 −1.40 −0.95 %
0.95 1.40 1.85 % note 8
register VLINBAL = 8;
− 0.08 − % note 8
position by1⁄2vertical frequency (related to 100% vertical size)
register VMOIRE = 0; control bit MOD = 0
register VMOIRE = 63; control bit MOD = 0
− 0 − %
− 0.08 − %
moire cancellation off control bit MOD = 1 − 0 − %
nominal differential output current (peak-to-peak value)
maximum output current at
∆I
VOUT=IVOUT1
− I
VOUT2
;
0.76 0.85 0.94 mA nominal settings; note 8
control bit VOVSCN = 1 0.54 0.6 0.66 mA
pins VOUT1 and VOUT2 allowed voltage at outputs 0 − 4.2 V maximum offset error of
nominal settings; note 8 −−±2.5 %
vertical output currents maximum linearity error of
nominal settings; note 8 −−±1.5 %
vertical output currents
1999 Jul 13 21
Page 22
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
EW drive output
EW DRIVE OUTPUT STAGE: pin EWDRV; see Figs 8 to 11 V
const(EWDRV)
V
o(EWDRV)(max)
I
L(EWDRV)
TC
EWDRV
V
HPIN(EWDRV)
V
HCORT(EWDRV)
V
HCORB(EWDRV)
V
HTRAP(EWDRV)
V
HSIZE(EWDRV)
V
HEHT(EWDRV)
I
i(HSMOD)
R
i(HSMOD)
V
ref(HSMOD)
f
ro(HSMOD)
bottom output voltage at pin EWDRV (internally stabilized)
register HPIN = 0; register HTRAP = 32; register HSIZE = 255;
1.05 1.2 1.35 V
control bit VSC = 1
maximum output voltage note 9 7.0 −−V load current −−±2mA temperature coefficient of
−−600 10−6/K
output signal horizontal pincushion register HPIN = 0; control
− 0.04 − V bit VSC = 1; note 8
register HPIN = 63;
− 1.42 − V control bit VSC = 1; note 8
horizontal corner correction at top of picture
register HCORT = 0; control bit VSC = 0; note 8
register HCORT = 63;
− 0.2 − V
−−0.64 − V
control bit VSC = 0; note 8 register HCORT = X;
− 0 − V control bit VSC = 1; note 8
horizontal corner correction at bottom of picture
register HCORB = 0; control bit VSC = 0; note 8
register HCORB = 63;
− 0.2 − V
−−0.64 − V
control bit VSC = 0; note 8 register HCORB = X;
− 0 − V control bit VSC = 1; note 8
horizontal trapezium correction register HTRAP = 63;
−−0.5 − V note 8
register HTRAP = 0;
− 0.5 − V note 8
register HTRAP = 32;
−−0.01 − V note 8
horizontal size register HSIZE = 255;
− 0.13 − V note 8
register HSIZE = 0; note 8 − 3.6 − V
EHT compensation on horizontal size via HSMOD (pin 31)
input current (pin 31) V
I I
V
= 0; note 8 − 0.02 − V
HSMOD
= −120 µA; note 8 − 0.69 − V
HSMOD
= 0.02 V − 0 −µA
HEHT
= 0.69 V −−120 −µA
HEHT
input resistance 300 − 500 Ω reference voltage at input I roll-off frequency (−3 dB) I
=0 − 5.0 − V
HSMOD HSMOD
= −60 µA
1 −−MHz
+15µA (RMS)
1999 Jul 13 22
Page 23
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
TRACKING OF EWDRV OUTPUT SIGNAL WITH HORIZONTAL FREQUENCY PROPORTIONAL VOLTAGE f
H(MULTI)
V
PAR(EWDRV)
LE
EWDRV
Output for asymmetric EW corrections: pin ASCOR
V
HPARAL(ASCOR)
V
HPINBAL(ASCOR)
V
o(ASCOR)(max)(p-p)
V
o(ASCOR)(max)
V
c(ASCOR)
V
o(ASCOR)(min)
I
o(ASCOR)(max)
I
o(sink)(ASCOR)(max)
Focus section: pin FOCUS; see Figs 15 and 28 t
precor
t
W(hfb)(min)
t
W(hfb)(max)
horizontal frequency range for
15 − 80 kHz
tracking parabola amplitude at EWDRV
(pin 11)
I
= 1.052 mA;
HREF
fH= 31.45 kHz; control
− 0.72 − V
bit FHMULT = 1; note 10 I
HREF
= 2.341 mA;
− 1.42 − V fH= 70 kHz; control bit FHMULT = 1; note 10
function disabled; control
− 1.42 − V bit FHMULT = 0; note 10
linearity error of horizontal
−−8%
frequency tracking
vertical sawtooth voltage for EW parallelogram correction
register HPARAL = 0; note 8
register HPARAL = 63;
−−0.825 − V
− 0.825 − V
note 8 register HPARAL = 32;
− 0.05 − V note 8
vertical parabola for pin unbalance correction
register HPINBAL = 0; note 8
register HPINBAL = 63;
−−1.0 − V
− 1.0 − V
note 8 register HPINBAL = 32;
− 0.05 − V note 8
maximumoutputvoltageswing
− 4 − V
(peak-to-peak value) maximum output voltage − 6.5 − V centre voltage − 4.0 − V minimum output voltage − 1.9 − V maximum output current V maximum output sink current V
pre-correction of phase for horizontal focus parabola
register HFOCAD = 0 − 300 − ns register HFOCAD = 1 − 350 − ns
≥ 1.9 V −−1.5 − mA
ASCOR
≥ 1.9 V − 50 −µA
ASCOR
register HFOCAD = 2 − 400 − ns register HFOCAD = 3 − 450 − ns
minimum horizontal flyback
1.9 −−µs
pulse width maximum horizontal flyback
−−5.5 µs
pulse width
1999 Jul 13 23
Page 24
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
t
W(hfb)(off)
V
HFOCUS(p-p)
V
VFOCUS(p-p)
V
o(FOCUS)(max)
V
o(FOCUS)(min)
I
o(FOCUS)(max)
C
L(FOCUS)(max)
B+ control section; see Figs 22 and 23 TRANSCONDUCTANCE AMPLIFIER: PINS BIN AND BOP
V
i(BIN)
I
i(BIN)(max)
V
ref(int)
V
o(BOP)(min)
V
o(BOP)(max)
I
o(BOP)(max)
g
m(OTA)
G
v(ol)
C
BOP(min)
VOLTAGE COMPARATOR: PIN BSENS V
i(BSENS)
V
i(BOP)
I
L(BSENS)(max)
OPEN-COLLECTOR OUTPUT STAGE: PIN BDRV I
o(BDRV)(max)
I
LO(BDRV)
V
sat(BDRV)
t
off(BDRV)(min)
t
d(BDRV-HDRV)
minimum width of horizontal
− 7.5 −µs
flyback pulse for operation without pre-correction
amplitude of horizontal focus parabola (peak-to-peak value)
amplitude of vertical parabola (peak-to-peak value)
register HFOCUS = 0 − 0.06 − V register HFOCUS = 31 − 3.3 − V register VFOCUS = 0;
− 0.02 − V note 8
register VFOCUS = 15;
− 1.1 − V note 8
maximum output voltage I minimum output voltage I
= 0 6.15 6.4 6.65 V
FOCUS
= 0 1.0 1.3 1.6 V
FOCUS
maximum output current ±1.5 −−mA maximum capacitive load −−20 pF
input voltage 0 − 5.25 V maximum input current −−±1 µA reference voltage at internal
2.37 2.5 2.58 V
non-inverting input of OTA minimum output voltage −−0.5 V maximum output voltage I
< 1 mA 5.0 5.3 5.6 V
BOP
maximum output current −±500 −µA transconductance of OTA note 11 30 50 70 mS open-loop voltage gain note 12 − 86 − dB minimum value of capacitor at
10 −−nF
BOP
voltage range of positive
0 − 5V
comparator input voltage range of negative
0 − 5V
comparator input maximum leakage current discharge disabled −−−2 µA
maximum output current note 13 20 −−mA output leakage current V saturation voltage I
=16V −−3 µA
BDRV
<20mA −−300 mV
BDRV
minimum off-time − 250 − ns delay between BDRV pulse
and HDRV pulse
measured at V
HDRV=VBDRV
− 500 − ns
=3V
1999 Jul 13 24
Page 25
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BSENS DISCHARGE CIRCUIT: PIN BSENS V
STOP(BSENS)
I
dch(BSENS)
V
th(BSENS)(restart)
C
BSENS(min)
Internal reference, supply voltage, soft start and protection
V
CC(stab)
I
CC
I
CC(stb)
PSRR power supply rejection ratio of
V
CC(blank)
V
CC(blank)(min)
V
on(VCC)
V
off(VCC)
THRESHOLDS DERIVED FROM HPLL2 VOLTAGE V
HPLL2(blank)(ul)
V
HPLL2(bduty)(ul)
V
HPLL2(bduty)(ll)
V
HPLL2(hduty)(ul)
V
HPLL2(hduty)(ll)
V
HPLL2(stb)(ul)
discharge stop level capacitive load;
I
= 0.5 mA
BSENS
discharge current V
> 2.5 V 4.5 6.0 7.5 mA
BSENS
0.85 1.0 1.15 V
threshold voltage for restart fault condition 1.2 1.3 1.4 V minimum value of capacitor at
2 −−nF
BSENS (pin 4)
external supply voltage for
9.2 − 16 V
complete stabilization of all internal references
supply current − 70 − mA standby supply current STDBY = 1; V
PLL2
<1V;
− 9 − mA
3.5V<VCC<16V f = 1 kHz 50 −−dB
internal supply voltage supply voltage level for
VCC decreasing from 12 V 8.2 8.6 9.0 V
activation of continuous blanking
minimum supply voltage level
VCC decreasing from 12 V 2.5 3.5 4.0 V
for function of continuous blanking
supply voltage level for activation of HDRV, BDRV,
VCCincreasing from below typical 8.1 V
7.9 8.3 8.7 V
VOUT1, VOUT2 and HUNLOCK
supply voltage level for deactivation of BDRV, VOUT1,
VCC decreasing from above typical 8.3 V
7.7 8.1 8.5 V
VOUT2 and HUNLOCK; also sets register SOFTST
upper limit voltage for
− 4.6 − V
continuous blanking upper limit voltage for variation
− 4.0 − V
of BDRV duty cycle lower limit voltage for variation
− 3.2 − V
of BDRV duty cycle upper limit voltage for variation
− 3.2 − V
of HDRV duty cycle lower limit voltage for variation
− 1.8 − V
of HDRV duty cycle upper limit voltage for standby
− 1 − V
voltage
1999 Jul 13 25
Page 26
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors
Notes
1. For duration of vertical blanking pulse see subheading ‘Vertical oscillator [oscillator frequency in application without adjustment of free-running frequency f
2. Continuous blanking at CLBL (pin 16) will be activated, if one of the following conditions is true: a) No horizontal flyback pulses at HFLB (pin 1) within a line b) X-ray protection is triggered c) Voltage at HPLL2 (pin 30) is low during soft start d) Supply voltage at VCC (pin 10) is low e) PLL1 unlocked while frequency-locked loop is in search mode.
3. Oscillator frequency is f
4. Loading of HPLL1 (pin 26) is not allowed.
5. Voltage at HPLL1 (pin 26) is fed to HBUF (pin 27) via a buffer. Disturbances caused by horizontal sync are removed by an internal sample-and-hold circuit.
6. All vertical and EW adjustments according note 8, but VSIZE = 80% (register VSIZE = 63, VGAIN = 63 and control bit VOVSCN = 0).
7. Value of resistor at VREF (pin 23) may not be changed.
8. All vertical and EW adjustments are specified at nominal vertical settings; unless otherwise specified, which means: a) VSIZE = 100% (register VSIZE = 127, VGAIN = 63 and control bit VOVSCN = 0) b) VSMOD = 0 (no EHT compensation) c) VPOS centred (register VPOS = 64) d) VLIN = 0 (register VLIN = X and control bit VSC = 1) e) VLINBAL = 0 (register VLINBAL = 8) f) FHMULT = 0 g) HPARAL = 0 (register HPARAL = 32) h) HPINBAL = 0 (register HPINBAL = 32) i) Vertical oscillator synchronized.
9. The output signal at EWDRV (pin 11) may consist of horizontal pincushion + corner correction + DC shift + trapezium correction. If the control bit VOVSCN is set, and the VPOS adjustment is set to an extreme value, the tip of the parabola may be clipped at the upper limit of the EWDRV output voltage range. The waveform of corner correction will clip if the vertical sawtooth adjustment exceeds 110% of the nominal setting.
10. If fH tracking is enabled, the amplitude of the complete EWDRV output signal (horizontal pincushion + corner correction + DC shift + trapezium) will be changed proportional to I
11. First pole of transconductance amplifier is5 MHz without external capacitor (will become the second pole, if the OTA operates as an integrator).
when no sync input signal is present (continuous blanking at pins 16 and 17).
min
fr(V)
]’.
. The EWDRV low level of 1.2 V remains fixed.
HREF
V
12. Open-loop gain is at f = 0 with no resistive load and C
13. The recommended value for the pull-up resistor BDRV (pin 6) is 1 kΩ.
1999 Jul 13 26
BOP
-------------­V
BIN
= 10 nF [from BOP (pin 3) to GND].
BOP
Page 27
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Vertical and EW adjustments

handbook, halfpage
I
VOUT1
I
VOUT2
(1) ∆I1 is the maximum amplitude setting at register VSIZE = 127,
register VGAIN = 63, control bit VOVSCN = 0.
I∆
2
100%×= VSMOD
------- ­I∆
1
,VSIZE
------- -
I∆
2
100%×=
I∆
1
MBG590
∆l
(1)
∆l
2
1
t
TDA4856
handbook, halfpage
I
VOUT1
I
VOUT2
(1) ∆I1 is the maximum amplitude setting at register VSIZE = 127,
register VGAIN = 63, control bit VOVSCN = 0.
I∆
2
VGAIN
------- -
100%×=
I∆
1
MGS274
∆I
∆I
2
t
(1)
1

Fig.3 Adjustment of vertical size (VSIZE).

handbook, halfpage
I
VOUT1
I
VOUT2
(1)
∆l
1
(1) ∆I1 is the maximum amplitude setting at register VSIZE = 127
and register VGAIN = 63.
∆ I1∆–
I
2
--------------------- -
∆×
2I
100%×= VOFFS
1
,VPOS
I
∆ I1∆–
2
--------------------- -
∆×
2I
100%×=
1

Fig.5 Adjustment of vertical position.

∆l
2
t
MBG592

Fig.4 Adjustment of vertical size (VGAIN).

handbook, halfpage
I
VOUT1
I
VOUT2
(1)
∆l
1
(1) ∆I1 is the maximum amplitude setting at register VSIZE = 127
and VLIN = 0%.
–
I∆
1I∆2
VLIN
--------------------- -
100%×=
∆
I
1
∆l2/∆t
/∆t
Fig.6 Adjustment of vertical linearity (vertical
S-correction).
MBG594
t
1999 Jul 13 27
Page 28
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, halfpage
I
VOUT1
I
VOUT2
(1) ∆I1 is the maximum amplitude setting at register VSIZE = 127
and register VOVSCN = 0.
–
I∆
1I∆2
VLINBAL
--------------------- ­2I
100%×=
∆×
1

Fig.7 Adjustment of vertical linearity balance.

MGM068
(1)
∆I
∆I
2
1
t
handbook, halfpage
V
EWDRV
Fig.8 Adjustment of parabola amplitude at
pin EWDRV.
TDA4856
MGM069
V
HPIN(EWDRV)
t
handbook, halfpage
V
EWDRV
V
HCOR(EWDRV)
MGM070
t
Fig.9 Influence of corner correction at pin EWDRV.
1999 Jul 13 28
handbook, halfpage
V
EWDRV
Fig.10 Influence of trapezium at pin EWDRV.
MGM071
V
HTRAP(EWDRV)
t
Page 29
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, halfpage
V
EWDRV
MGM072
V
HSIZE(EWDRV)
+
V
HEHT(EWDRV)
t
handbook, halfpage
V
ASCOR
V
c(ASCOR)
TDA4856
MGM073
V
HPARAL(ASCOR)
t
Fig.11 Influence of HSIZE and EHT compensation
at pin EWDRV.
handbook, halfpage
V
ASCOR
V
c(ASCOR)
V
HPINBAL(ASCOR)
Fig.12 Adjustment of parallelogram at pin ASCOR.
MGM074
t
Fig.13 Adjustment of pin balance at pin ASCOR.
1999 Jul 13 29
Page 30
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Pulse diagrams

4.0 V
handbook, full pagewidth
vertical oscillator sawtooth
at VCAP (pin 24)
vertical sync pulse
automatic trigger level synchronized trigger level
3.8 V
1.4 V
inhibited
TDA4856
internal trigger
inhibit window
(typical 4 ms)
vertical blanking pulse
at CLBL (pin 16)
vertical blanking pulse
at HUNLOCK (pin 17)
differential output currents
VOUT1 (pin 13) and
VOUT2 (pin 12)
EW drive waveform at EWDRV (pin 11)
I
VOUT1
I
VOUT2
7.0 V maximum
DC shift 3.6 V maximum
low-level 1.2 V fixed
MGM075

Fig.14 Pulse diagram for vertical part.

1999 Jul 13 30
Page 31
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, full pagewidth
horizontal oscillator sawtooth
at HCAP (pin 29)
horizontal sync pulse
PLL1 control current
at HPLL1 (pin 26)
TDA4856
-
+
video clamping pulse
at CLBL (pin 16)
triggered on trailing edge
of horizontal sync
line flyback pulse
at HFLB (pin 1)
PLL2 control current
at HPLL2 (pin 30)
line drive pulse
at HDRV (pin 8)
horizontal focus parabola
at FOCUS (pin 32)
PLL2
control range
+
45 to 52% of line period
–
vertical blanking level
MGS275

Fig.15 Pulse diagram for horizontal part.

1999 Jul 13 31
Page 32
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, full pagewidth
handbook, full pagewidth
composite sync (TTL)
at HSYNC (pin 15)
relative t
HDRV(OFF)/tH
(%)
52
45
Fig.16 Relative t
15 30 110 130
time of HDRV versus H-frequency.
OFF
TDA4856
MGM077
fH (kHz)
internal integration of
composite sync
internal vertical
PLL1 control voltage
at HPLL1 (pin 26)
clamping and blanking
pulses at CLBL (pin 16)
handbook, full pagewidth
composite sync (TTL)
at HSYNC (pin 15)
clamping and blanking
pulses at CLBL (pin 16)
trigger pulse
MGC947
a. Reduced influence of vertical sync on horizontal phase.
MBG596
b. Generation of video clamping pulses during vertical sync with serration pulses.

Fig.17 Pulse diagrams for composite sync applications.

1999 Jul 13 32
Page 33
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors

I2C-BUS PROTOCOL Data format Table 4 Data format

(1)
S
SLAVE ADDRESS
Notes
1. S = START condition.
2. SLAVE ADDRESS (MAD) = 1000 1100.
3. A = acknowledge, generatedbythe slave. No acknowledge, ifthesupply voltage is below 8.2 V forstart-upand 8.0 V for shut-down procedure.
4. SUBADDRESS (SAD).
5. DATA byte. If more than 1 byte of DATA is transmitted, then no auto-increment of the significant subaddress is performed.
6. P = STOP condition.
It should be noted that clock pulses according to the 400 kHz specification are accepted for 3.3 and 5 V applications (reference level = 1.8 V).
Default register values after power-up are random. All registers have to be preset via software before the soft start is enabled.
Important: If register contents are changed during the vertical scan, this might result in a visible interference on the screen. The cause for this interference is the abrupt change of picture geometry which takes effect at random locations within the visible picture. To avoid this kind of interference, at least the adjustment of some critical geometry parameters should be synchronized with the vertical flyback. The TDA4856 offers a feature to synchronize any I2C-bus adjustment with the internal vertical flyback pulse. For this purpose the IC offers two different modes for the handling of I2C-bus data:
• Direct mode
• Buffered mode.
Direct mode
The direct mode is selected by setting the MSB of the I2C-bus register subaddress to logic 0.
Any I2C-bus command is executed immediately after it was received, so the adjustment takes effect immediately after the end of I2C-bus transmission.
(2)
(3)
A
SUB-ADDRESS
(4)
(3)
A
DA TA
(5)
(3)
A
(6)
P
This mode should be used if many register values have to be changed subsequently, i.e. during start-up, mode change, etc., and while there is no picture visible on the screen (blanked). The number of transmissions per V-period is not limited.
Buffered mode
The buffered mode is selected by setting the MSB of the I2C-bus register subaddress to logic 1.
Thismode is designed to avoidvisibleinterferences on the screen during the I2C-bus adjustments. This mode should be used, if a single register has to be changed while the picture is visible, so i.e. for user adjustments.
One received I2C-bus data byte is stored in an internal 8-bit buffer before itis passed tothe DAC section. The first internal vertical blanking pulse (VBL) after end of transmission is used to synchronize the adjustment change with the vertical flyback. So the actual change of the picture size, position, geometry, etc. will take place during the vertical flyback period, and will thus be invisible.
The IC gives acknowledge for chip address, subaddress and data of a buffered transmission. Only one I2C-bus transmission is accepted after each vertical blank. After one buffered transmission, the IC gives no acknowledge for further transmissions until next VBL pulse has occurred. The buffered mode is disabled while the IC is in standby mode.
1999 Jul 13 33
Page 34
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors

List of I2C-bus controlled switches

I2C-bus data can be transmitted in direct or buffered mode and is defined by the MSB of the register subaddress:
• SAD1 is the register subaddress to be used for transmissions in direct mode
• SAD2 is the register subaddress to be used for transmissions in buffered mode.
Table 5 Controlled switches; notes 1 and 2
CONTROL
BIT
BLKDIS 0: vertical, protection and horizontal unlock
blanking available on pins CLBL and HUNLOCK 1: only vertical and protection blanking available
on pins CLBL and HUNLOCK
AGCDIS 0: AGC in vertical oscillator active 0B 8B # D6 ######
1: AGC in vertical oscillator inhibited
FHMULT 0: EW output independent of horizontal frequency 0B 8B D7 #######
1: EW output tracks with horizontal frequency
VSC 0: VLIN, HCORT and HCORB adjustments
enabled 1: VLIN, HCORT and HCORB adjustments forced
to centre value
MOD 0: horizontal and vertical moire cancellation
enabled 1: horizontal and vertical moire cancellation
disabled
VOVSCN 0: vertical size 100% 0F 8F X D6 ######
1: vertical size 116.8% for VGA350
CLAMP 0: trailing edge for horizontal clamp 09 89 # D6 ######
1: leading edge for horizontal clamp
VBLK 0: vertical blanking = 260 µs 09 89D7#######
1: vertical blanking = 340 µs
ACD 0: ASCOR disconnected from PLL2 04 84 X D6 ######
1: ASCOR internally connected with PLL2
STDBY
SOFTST
(3)
0: internal power supply enabled 1A 9A # XXXXX#D0 1: internal power supply disabled
(3)
0: soft start not released (pin HPLL2 pulled to ground)
1: soft start is released (power-up via pin HPLL2)
FUNCTION
SAD1 (HEX)
SAD2
(HEX)
0A 8A XD6######
02 82 XD6######
08 88D7#######
1A 9A #XXXXXD1#
REGISTER ASSIGNMENT
D7 D6 D5 D4 D3 D2 D1 D0
Notes
1. X = don’t care.
2. # = this bit is occupied by another function. If the register is addressed, the bit values for both functions must be transferred.
3. Bits STDBY and SOFTST can be reset by the internal protection circuit.
1999 Jul 13 34
Page 35
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1999 Jul 13 35
List of I
I2C-bus data can be transmitted in direct or buffered mode and is defined by the MSB of the register subaddress:
• SAD1 is the register subaddress to be used for transmissions in direct mode
• SAD2 is the register subaddress to be used for transmissions in buffered mode.
Table 6 Controlled functions; notes 1 and 2
2
C-bus controlled functions
Philips Semiconductors Product specification
PC monitors
I
2
C-bus autosync deflection controller for
FUNCTION NAME BITS
Horizontal size HSIZE 8 01 81 D7 D6 D5 D4 D3 D2 D1 D0 − 0.1 to 3.6 V − Horizontal
position Horizontal
pincushion
Horizontal trapezium correction
Horizontal cornercorrection at top of picture
Horizontal cornercorrection at bottom of picture
Horizontal parallelogram
EW pin balance HPINBAL 6 0B 8B # # D5 D4 D3 D2 D1 D0 ACD ±1.2% of horizontal
Vertical size VSIZE 7 08 88 # D6 D5 D4 D3 D2 D1 D0 − 60 to 100% VSMOD Vertical position VPOS 7 0D 8D X D6 D5 D4 D3 D2 D1 D0 −±11.5% VSMOD Vertical gain VGAIN 6 0A 8A X # D5 D4 D3 D2 D1 D0 − 70 to 100% − Vertical offset VOFFS 4 0E 8E ####D3D2D1D0 −±4% − Vertical linearity VLIN 4 05 85 D7 D6 D5 D4 #### VSC −2to−46% VSIZE, VOVSCN,
Vertical linearity balance
HPOS 8 07 87 D7 D6 D5 D4 D3 D2 D1 D0 −±13% of horizontal
HPIN 6 0F 8F X # D5 D4 D3 D2 D1 D0 − 0 to 1.42 V VSIZE, VOVSCN,
HTRAP 6 03 83 X X D5 D4 D3 D2 D1 D0 −±500 mV (p-p) VSIZE, VOVSCN,
HCORT 6 04 84 X # D5 D4 D3 D2 D1 D0 VSC +15 to −46% of
HCORB 6 02 82 X # D5 D4 D3 D2 D1 D0 VSC +15 to −46% of
HPARAL 6 09 89 # # D5 D4 D3 D2 D1 D0 ACD ±1.2% of horizontal
VLINBAL 4 05 85 ####D3D2D1D0 −±1.4% of 100%
SAD1 (HEX)
SAD2 (HEX)
REGISTER ASSIGNMENT
D7 D6 D5 D4 D3 D2 D1 D0
CONTROL
BIT
RANGE
period
parabola amplitude
parabola amplitude
period
period
vertical size
FUNCTION
TRACKS WITH
−
VPOS, HSIZE and HSMOD
VPOS, HSIZE and HSMOD
VSIZE, VOVSCN, VPOS, HSIZE and HSMOD
VSIZE, VOVSCN, VPOS, HSIZE and HSMOD
VSIZE, VOVSCN and VPOS
VSIZE, VOVSCN and VPOS
VPOS and VSMOD VSIZE, VOVSCN,
VPOS and VSMOD
TDA4856
Page 36
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1999 Jul 13 36
FUNCTION NAME BITS
Moire cancellation via vertical position
Moire cancellation via horizontal position
Vertical focus VFOCUS 4 0E 8E D7 D6 D5 D4 #### − 0 to 1.1 V VSIZE, VOVSCN
Horizontal focus HFOCUS 5 0C 8C # # X D4 D3 D2 D1 D0 − 0 to 3.3 V − Horizontal focus
pre-correction
Notes
1. X = don’t care.
2. # = this bit is occupied by another function. If the register is addressed, the bit values for both functions must be transferred.
VMOIRE 6 00 80 X X D5 D4 D3 D2 D1 D0 MOD 0 to 0.08% of
HMOIRE 6 06 86 X X D5 D4 D3 D2 D1 D0 MOD 0.07% of horizontal
HFOCAD 2 0C 8C D7 D6 X ##### − 300 to 450 ns −
SAD1 (HEX)
SAD2 (HEX)
REGISTER ASSIGNMENT
D7 D6 D5 D4 D3 D2 D1 D0
CONTROL
BIT
RANGE
vertical amplitude
period
FUNCTION
TRACKS WITH
−
−
and VPOS
Philips Semiconductors Product specification
PC monitors
I
2
C-bus autosync deflection controller for
TDA4856
Page 37
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Start-up procedure

START
Power-down mode (XXXX XXXX)
no acknowledge is given by IC
all register contents are random
VCC > 8.3 V
Standby mode (XXXX XX01)
STDBY = 1
all other register contents are random
S 8CH A 1AH A 00H A P
Protection mode (XXXX XX00)
all other register contents are random
S 8CH A SAD A DATA A P
Protection mode (XXXX XX00)
no
S 8CH A 1AH A 02H A P
Soft-start sequence (XXXX XX10)
no
change/refresh of data?
S 8CH A SAD A DATA A P
(1) See Fig.19.
SOFTST = 0
STDBY = 0
SOFTST = 0
STDBY = 0
SOFTST = 0
registers are pre-set
all registers defined?
yes
STDBY = 0
SOFTST = 1
Operating mode (XXXX XX10)
STDBY = 0
SOFTST = 1
yes
L1
L2
L3
SOFTST = 0?
yes
(1)
L4
no
MGL791
VCC< 8.3 V:
• As long as the supply voltage is too low for correct
• Supply current is 9 mA or less.
VCC> 8.3 V:
• The internal POR has ended and the IC is in standby
• Control bits STDBY and SOFTST are reset to their start
• All other register contents are random
• Pin HUNLOCK is at HIGH-level.
Setting control bit STDBY = 0:
• Enables internal power supply
• Supply current increases from 9 to 70 mA
• When VCC< 8.6 V register SOFTST cannot be set by
• Output stages are disabled, except the vertical output
• Pin HUNLOCK is at HIGH-level.
Setting all registers to defined values:
• Due to the hardware configuration of the IC
Setting control bit SOFTST = 1:
• Before starting the soft-start sequence a delay of
• HDRV duty cycle increases
• BDRV duty cycle increases
• PLL1 and PLL2 are enabled.
IC in full operation:
• Pin HUNLOCK is at LOW-level when PLL1 is locked
• Any change of the register content will result in
• Setting control bit SOFTST = 0 is the only way (except
Soft-down sequence:
• See L4 of Fig.19 for starting the soft-down sequence.
TDA4856
operation, the IC will give no acknowledge due to internal Power-on reset (POR)
mode
values
the I2C-bus
(no auto-increment) any register setting needs a complete 3-byte I2C-bus data transfer as follows: START - IC address - subaddress - data - STOP.
minimum 80 ms is necessary to obtain correct function of the horizontal drive
immediate change of the output behaviour
power-down via pin VCC) to leave the operating mode.
Fig.18 I2C-bus flow for start-up.
1999 Jul 13 37
Page 38
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Protection and standby mode

L4
S 8CH A 1AH A 00H A P
Soft-down sequence (XXXX XX00)
STDBY = 0
SOFTST = 0
Protection mode (XXXX XX00)
STDBY = 0
SOFTST = 0
registers are set
no
S 8CH A 1AH A 01H A P
(1) See Fig.18.
L2
(1)
SOFTST = 1?
L3
STDBY = 1?
yes
Standby mode (XXXX XX01)
STDBY = 1
SOFTST = 0
all other register contents are random
no
yes
(1)
MGL790
Fig.19 I2C-bus flow for protection and standby
mode.
Soft-down sequence:
• Start the sequence by setting control bit SOFTST = 0
• BDRV duty cycle decreases
• HDRV duty cycle decreases.
Protection mode:
• Pins HDRV and BDRV are floating
• Continuous blanking at pin CLBL is active
• Pin HUNLOCK is floating
• PLL1 and PLL2 are disabled
• Register contents are kept in internal memory.
Protection mode can be left by 3 ways:
1. Entering standby mode by setting control
2. Starting the soft-start sequence by setting control
3. Decreasing the supply voltage below 8.1 V. Standby mode:
• Set control bit STDBY = 1
• Driver outputs are floating (same as protection mode)
• Supply current is 9 mA
• Only the I2C-bus section and protection circuits are
• Contents of all registers except the value of bit STDBY
• See L2 of Fig.18 for continuation.
TDA4856
bit SOFTST = 0 and control bit STDBY = 1
bit SOFTST = 1 (bit STDBY = don’t care); see L3 of Fig.18 for continuation
operative
and bit SOFTST are lost
1999 Jul 13 38
Page 39
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, full pagewidth
all register contents are random
(1) See Fig.18.
(ANY Mode)
VCC < 8.1 V

Power-Down Mode

no acknowledge is given by IC
(1)
L1

Fig.20 I2C-bus flow for any mode.

MGM079
V
a soft-down sequency followed by a
CC
soft start sequence is generated
8.6 V
internally.
8.1 V V
IC enters standby mode.
CC
8.6 V
8.1 V
TDA4856
Power-down mode
Power dip of VCC< 8.6 V:
• The soft-down sequence is started first.
• Then the soft-start sequence is generated internally.
Power dip of VCC< 8.1 V or VCC shut-down:
• This function is independent from the operating mode,
so it works under any condition.
• All driver outputs are immediately disabled
• IC enters standby mode.

Standby mode detection

Execute data transmission twice to assure that there was no data transfer error.
yes
yes
Normal operation
2
C-bus transmission
I
chip address
8CHS 0XHAAAPXXH
chip address
8CHS 0XHAAAPXXH
subaddress data
acknowledge was
given on data?
no
2
C-bus transmission
I
subaddress data
acknowledge was
given on data?
no
Standby mode
MGS276
1999 Jul 13 39

Fig.21 Possible standby mode detection.

Page 40
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

APPLICATION INFORMATION

handbook, full pagewidth
2
1
horizontal flyback pulse
D1
C1
R1
R3
V
HPLL2
2.5 V
5 V
BIN
SOFT START
OTA
R2
34 V
C2
V
HDRV
BOP
C
BOP
>10 nF
4 C4
V
BSENS
SRQ
Q
DISCHARGE
6
V
CC
(1)
R6
3
INVERTING
BUFFER
V
BDRV
R5
V
i
L
TR1
R4
TDA4856
D2
HORIZONTAL
OUTPUT
STAGE
MGM080
EWDRV
For f < 50 kHz and C2 < 47 nF calculation formulas and behaviour of the OTA are the same as for an OP. An exception is the limited output current at BOP (pin 3). See Chapter “Characteristics”, Row Head “B+ control section; see Figs 22 and 23”.
(1) The recommended value for R6 is 1 kΩ.
a. Feedback mode application.
handbook, full pagewidth
1
horizontal flyback pulse
2
V
3
V
V
BSENS
4
V
HDRV
BDRV
BSENS
= V
BOP
t
on
t
d(BDRV)
t
off(min)
MBG600
V
RESTART(BSENS)
V
STOP(BSENS)
b. Waveforms for normal operation. c. Waveforms for fault condition.

Fig.22 Application and timing for feedback mode.

1999 Jul 13 40
Page 41
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
2
V
HDRV
34 V
BOP
D1
C1
4
V
C
BSENS
>2 nF
SRQ
DISCHARGE
BSENS
EHT adjustment
V
HPLL2
2.5 V
R1 R2
V
BIN
power-down
SOFT START
OTA
5
TR2
Q
R3
6
V
CC
R4
INVERTING
V
3
(1)
BUFFER
BDRV
HORIZONTAL
OUTPUT
STAGE
EHT
transformer
TR1
TDA4856
horizontal
flyback pulse
1
D2
I
5
MOSFET
MGM081
(1) The recommended value for R4 is 1 kΩ.
handbook, full pagewidth
1
horizontal flyback pulse
2
V
HDRV
t
on
3
V
BDRV
t
d(BDRV)
4
V
5
I
BSENS
MOSFET
V
BOP
b. Waveforms for normal operation. c. Waveforms for fault condition.
> 10 nF
C
BOP
a. Forward mode application.
V
BOP
t
(discharge time of C
off
BSENS
)
V
RESTART(BSENS)
V
STOP(BSENS)
MBG602

Fig.23 Application and timing for feed forward mode.

1999 Jul 13 41
Page 42
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Start-up sequence and shut-down sequence

handbook, full pagewidth
V
CC
8.3 V data accepted from I
3.5 V continuous blanking activated on pins CLBL and HUNLOCK
continuous blanking off
8.6 V PLL2 soft start/soft-down enabled
2
video clamping pulse and vertical outputs enabled if control bit STDBY = 0
C-bus
TDA4856
MGS277
(1)
handbook, full pagewidth
V
CC
a. Start-up sequence.
continuous blanking activated on pins CLBL and HUNLOCK
8.6 V PLL2 soft-down sequence is triggered
8.1 V
no data accepted from I video clamping pulse and vertical outputs disabled
(2)
2
C-bus
3.5 V continuous blanking disappears
time
MGS278
time
b. Shut-down sequence.
(1) See Fig.25a. (2) See Fig.25b.

Fig.24 Activation of start-up sequence and shut-down sequence via supply voltage.

1999 Jul 13 42
Page 43
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

PLL2 soft start sequence and PLL2 soft-down sequence

handbook, full pagewidth
V
HPLL2
4.0 V
BDRV duty cycle begins to increase
3.2 V HDRV duty cycle has reached nominal value
duty cycle increases
1.8 V
HDRV duty cycle begins to increase
MGS279
continuous blanking off
4.6 V PLL2 enabled frequency detector enabled HDRV/HFLB protection enabled
BDRV duty cycle has reached nominal value
time
TDA4856
handbook, full pagewidth
V
HPLL2
a. PLL2 soft start sequence, if VCC> 8.6 V.
continuous blanking activated on pins CLBL and HUNLOCK
4.6 V PLL2 disabled frequency detector disabled HDRV/HFLB protection disabled
4.0 V
BDRV duty cycle begins to decrease
duty cycle decreases
2.8 V BDRV floating HDRV duty cycle begins to decrease
1.8 V
HDRV floating
b. PLL2 soft-down sequence, if VCC> 8.6 V.
MGS280
(1)
(1)
time
(1) HDRV and BDRV are floating for VCC< 8.6 V.

Fig.25 Activation of PLL2 soft-start sequence and PLL2 soft-down sequence via the I2C-bus.

1999 Jul 13 43
Page 44
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
handbook, full pagewidth
V
XRAY
V
HUNLOCK
BDRV duty cycle
HDRV duty cycle
Fig.26 Activation of soft-down sequence via pin XRAY.
X-ray latch triggered
TDA4856
floating
floating
MGS281

Vertical linearity error Horizontal focus pre-correction

handbook, halfpage
handbook, halfpage
(1) I
VOUT=IVOUT1
(2) I1=I (3) I2=I (4) I3=I
Which means:
Vertical linearity error =
I
VOUT
(µA)
VOUT VOUT VOUT
+415
−415
at V at V at V
(1)
(2)
I
1
(3)
I
0
− I
.
VOUT2
= 1.9 V.
VCAP
= 2.6 V.
VCAP
= 3.3 V.
VCAP
I1I3–
I
=
--------------
0
2
–
1 max
2
–
I
1I2

or
--------------

I
0
I
–
2I3
-------------­I
0
(4)
I
3
V
MBG551
(1)
(2)
VCAP
(1) Line flyback pulse at HFLB (pin 1). (2) Horizontal focus parabola at FOCUS (pin 32).
t
precor
t
precor
MGS282
= 450 ns = 300 ns

Fig.27 Definition of vertical linearity error.

1999 Jul 13 44

Fig.28 Definition of horizontal focus pre-correction.

Page 45
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

Printed-circuit board layout

handbook, full pagewidth
external components of horizontal section
32
31
external components of horizontal section
further connections to other components
or ground paths are not allowed
30
29
28
27
26
TDA4856
external components of vertical section
25
24
23
22
21
20
19
18
17
pin 25 should be the 'star point' for all small signal components
no external ground tracks connected here
9
TDA4856
10
11
12 V
external components of driver stages
12
13
14
15
MGS283
2.2 nF47 nF
1
2
3
47 pF
B-drive line in parallel to ground
SMD
For optimum performance of the TDA4856 the ground paths must be routed as shown. Only one connection to other grounds on the PCB is allowed. Note: The tracks for HDRV and BDRV should be kept separate.
5
6
7
4
only this path may be connected
8
100 µF
to general ground of PCB
16

Fig.29 Hints for printed-circuit board (PCB) layout.

1999 Jul 13 45
Page 46
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

INTERNAL PIN CONFIGURATION

PIN SYMBOL INTERNAL CIRCUIT
1 HFLB
1.5 kΩ
1
7 x
2 XRAY
5 kΩ
2
TDA4856
MBG561
3 BOP
4 BSENS
6.25 V
MBG562
3
5.3 V
MBG563
4
1999 Jul 13 46
MBG564
Page 47
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
PIN SYMBOL INTERNAL CIRCUIT
5 BIN
5
MBG565
6 BDRV
6
7 PGND power ground, connected to substrate 8 HDRV
8
TDA4856
MBG566
9 XSEL
10 V
CC
11 EWDRV
MGM089
4 kΩ
9
MBK381
10
MGM090
108 Ω
11
108 Ω
MBG570
1999 Jul 13 47
Page 48
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
PIN SYMBOL INTERNAL CIRCUIT
12 VOUT2
12
13 VOUT1
13
14 VSYNC
TDA4856
MBG571
MBG572
15 HSYNC
16 CLBL
100 Ω
14
7.3 V
15
2 kΩ
1.28 V
85 Ω
7.3 V
16
1.4 V
MBG573
1.4 V
MBG574
MBG575
1999 Jul 13 48
Page 49
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
PIN SYMBOL INTERNAL CIRCUIT
17 HUNLOCK
17
18 SCL
18
19 SDA
19
TDA4856
MGM091
MGM092
20 ASCOR
21 VSMOD
MGM093
480 Ω
20
MGM094
250 Ω
21
5 V
MGM095
1999 Jul 13 49
Page 50
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
PIN SYMBOL INTERNAL CIRCUIT
22 VAGC
22
23 VREF
23
TDA4856
MBG581
3 V
24 VCAP
25 SGND signal ground 26 HPLL1
MBG582
24
MBG583
26
4.3 V
MGM096
1999 Jul 13 50
Page 51
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
PIN SYMBOL INTERNAL CIRCUIT
27 HBUF
27
28 HREF 29 HCAP
76 Ω
28
7.7 V
TDA4856
5 V
MGM097
2.525 V
30 HPLL2
29
MBG585
7.7 V
30
HFLB
6.25 V
MGM098
1999 Jul 13 51
Page 52
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
PIN SYMBOL INTERNAL CIRCUIT
31 HSMOD
250 Ω
31
32 FOCUS
32
TDA4856
5 V
MGM099
120 Ω
200 Ω
120 Ω

Electrostatic discharge (ESD) protection

pin
MBG559
Fig.30 ESD protection for pins 4, 11 to 13,
16 and 17.
MGM100
pin
7.3 V
7.3 V
MBG560
Fig.31 ESD protection for pins 2, 3, 5, 18 to 24
and 26 to 32.
1999 Jul 13 52
Page 53
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors

PACKAGE OUTLINE

SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
D
seating plane
L
Z
32
e
b
TDA4856

SOT232-1

M
E
A
2
A
A
1
w M
b
1
17
c
(e )
M
1
H
pin 1 index
1
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
A
A
UNIT b
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
mm
OUTLINE VERSION
SOT232-1
max.
4.7 0.51 3.8
12
min.
max.
IEC JEDEC EIAJ
1.3
0.8
b
1
0.53
0.40
REFERENCES
0.32
0.23
cEe M
(1) (1)
D
29.4
28.5
9.1
8.7
E
16
(1)
L
3.2
2.8
EUROPEAN
PROJECTION
M
10.7
10.2
E
12.2
10.5
e
1
H
ISSUE DATE
w
0.181.778 10.16
92-11-17 95-02-04
Z
max.
1.6
1999 Jul 13 53
Page 54
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for PC monitors
SOLDERING Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual soldering.Amore in-depth account of soldering ICs canbe found in our
Packages”
Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

DBS, DIP, HDIP, SDIP, SIL suitable suitable
“Data Handbook IC26; Integrated Circuit
(document order number 9398 652 90011).
PACKAGE
Thetotalcontacttimeofsuccessive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
SOLDERING METHOD
DIPPING WAVE
(1)
TDA4856
). If the
stg(max)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
1999 Jul 13 54
Page 55
Philips Semiconductors Product specification
I2C-bus autosync deflection controller for
TDA4856
PC monitors

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
PURCHASE OF PHILIPS I
Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
1999 Jul 13 55
Page 56
Philips Semiconductors – a w orldwide compan y
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PTPhilips Development Corporation,Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, ViaCasati,23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
1999
Internet: http://www.semiconductors.philips.com
67
SCA
Printed in The Netherlands 545004/02/pp56 Date of release: 1999 Jul 13 Document order number: 9397 750 04963
Loading...