Multistandard colour decoder, with
negative colour difference output
signals
Preliminary specification
File under Integrated Circuits, IC02
March 1991
Page 2
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with negative
colour difference output signals
FEATURES
Identifies and demodulates PAL,
SECAM, NTSC 3.58 and NTSC 4.43
chrominance signals with:
• Identification
– automatic standard identification
by sequential inquiry
– secure SECAM identification at
50 Hz only, with PAL priority
– four switched outputs for
chrominance filter selection and
display control
– external service switch for
oscillator adjustment
• PAL / NTSC demodulation
– H (burst) and V blanking
– PAL switch (disabled for NTSC)
– NTSC phase shift (disabled for
PAL)
– PLL-controlled reference
oscillator
– two reference oscillator crystals
on separate pins with automatic
switching
– quadrature demodulator with
subcarrier reference
• SECAM demodulation
– limiter-amplifier
– quadrature-demodulator with a
single external reference tuned
circuit
– alternate line blanking, H and V
blanking
– de-emphasis
TDA4650
• Gain controlled chrominance
amplifier
• ACC demodulation controlled by
system scanning
• Internal colour-difference signal
output filters to remove the residual
subcarrier
GENERAL DESCRIPTION
The TDA4650 is a monolitic
integrated multistandard colour
decoder for PAL, SECAM and NTSC
(3.58 and 4.43 MHz) with negative
colour difference output signals. The
colour-difference output signals are
fed to the TDA4660/TDA4661,
Switched capacitor delay line.
Multistandard colour decoder, with
negative colour difference output signals
TDA4650
Fig.4 Internal circuits (continued in Fig.5)
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOLPARAMETERMIN.MAX.UNIT
V
P
V
I
I
o
I
i/o
T
stg
T
amb
R
th j-a
supply voltage (pin 13) −13.2V
voltage range at pins 1, 3, 17 and 24 to 280V
P
output current (pins 1 and 3)−−5mA
input/output current (pins 25 to 28)−−5µA
storage temperature range−25+ 150°C
operating ambient temperature range0+ 70°C
from junction to ambient in free air:
SOT117−37K/W
SOT261−70K/W
P
tot
total power dissipation (SOT117)−1.4W
total power dissipation (SOT261)−1.1W
V
March 19915
Page 6
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
negative colour difference output signals
TDA4650
Fig.5 Internal circuits (continued from Fig.4)
March 19916
Page 7
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
TDA4650
negative colour difference output signals
CHARACTERISTICS
All voltages are measured to GND (pin 1 1); V
= 12 V; chrominance input signal V
P
signal); 4 µs burst-blanking pulse and vertical blanking superimposed on super sandcastle pulse; T
measured in test circuit of Fig.1; unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
I
P
supply voltage range10.812.013.2V
supply current506080mA
colour difference −(R−Y) output
signal (peak-to-peak value)
colour difference −(B−Y) output
signal (peak-to-peak value)
ratio of colour difference signals
(R−Y)/(B−Y) for NTSC
ratio of PAL/NTSC signals
(R−Y)
PAL
/(R−Y)
NTSC
at nominal phase of hue
control
at nominal phase of hue
control
at nominal phase of hue
control
at nominal phase of
hue control
= 0.8 V − (R−Y)0.8−−
1(p-p)
= 1.0 V − (B−Y)0.8−−
V
3(p-p)
DC output levelproportional to V
0.420.5250.66V
0.530.6650.84V
0.750.790.83
−−1dB
P
6.36.87.3V
H/2 ripple at CD outputswithout colour bars−−10mV
V
1,3(p-p)
Z
1,3
residual carrier at CD outputs
(peak-to-peak value)
4.43 MHz−−10mV
8.87 MHz−−30mV
output impedance−−200ΩDemodulator part (SECAM); note 1
V
1(p-p)
colour difference −(R−Y) output
every second line blanked0.831.051.32V
signal (peak-to-peak value)
V
3(p-p)
colour difference −(B−Y) output
every second line blanked1.061.331.67V
signal (peak-to-peak value)
V
1,3
DC output levelproportional to V
P
H/2 ripple at CD outputswithout colour bars every
6.36.87.3V
−−10mV
second line blanked
V
1,3(p−p)
residual carrier at CD outputs
(peak-to-peak value)
4.43 MHz−−30mV
8.87 MHz−−30mV
= 100 mV (with 75 % colour bar
15(p-p)
=25°C;
amb
March 19917
Page 8
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
TDA4650
negative colour difference output signals
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Demodulator part (SECAM) (continued); note 1
/∆V
∆V
1,3
∆V
/∆T−0.16−mV/K
1
∆V
/∆T−−0.25−mV/K
3
Hue control part
φphase shift of reference carrier
V
17
R
17
Reference oscillator (PLL); note 2
R
19,21
C
19,21
f
c
shift of blanking levels relative to
P
−−3mV/V
demodulated fo levels
V17=2V−30−40−deg
relative to phase at V17=3V
phase shift of reference carrierV
phase shift of reference carrier
relative to phase at V
17
=3V
=3V−0±5deg
17
V17= 4 V3040−deg
internal bias voltage−3−V
switching voltage for oscillator
burst OFF; colour ON0−0.5V
adjustment
switching voltage for forced
burst ON; colour ON5.5−V
P
colour ON
input resistance3.85.06.2kΩ
input resistance−350−Ω
input resistance−−10pF
catching rangeat 4.43 MHz± 400−−Hz
at 3.57 MHz± 330−−Hz
V
Identification part
switching voltages for chrominance filters and crystals:
at pin 28 for PAL
at pin 27 for SECAM
at pin 26 for NTSC (3.58 MHz)
at pin 25 for NTSC (4.43 MHz)
V
28 to 25
switching voltagescontrol voltage OFF state−0.050.5V
control voltage ON state;
during scanning
control voltage ON state;
internal forced
control voltage ON state;
external forced
I
28 to 25
t
d
output currents−−−3mA
delay time for system hold2−3cycles
delay time for colour ON2−3cycles
delay time for colour OFF0−1cycles
t
s
scanning time for each standardnote 3−4−cycles
2.352.452.55V
5.65.86.0V
9.0-V
P
V
March 19918
Page 9
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
TDA4650
negative colour difference output signals
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Super sandcastle pulse detector (note 4)
V
24
I
24
Notes to the characteristics
1. For the SECAM standard, amplitude and H/2 ripple content of the CD signals (R−Y) and (B−Y) depend on the
characteristics of the external tuned circuit at pins 7 to 10. The resonant frequency of the external tuned circuit must
be adjusted such that the demodulated fo voltage level is zero in the −(B−Y) output channel at pin 3.
Now it is possible to adjust the quality of the external circuit such that the demodulated fo voltage level is zero in the
−(R−Y) output channel at pin 1. If necessary, the fo voltage level in the −(B−Y) output channel must be readjusted to
zero by the coil of the tuned circuit.
The external capacitors at the pins 2 and 4 (220 pF each) are matched to the internal resistances of the de-emphasis
network such that every alternate scanned line is blanked.
2. The fo frequencies of the 8.8 MHz crystal at pin 21, and the 7.2 MHz crystal at pin 19, can be adjusted when the
voltage at pin 17 is less than 0.5 V (burst OFF), thus providing double subcarrier frequencies of the chrominance
signal.
3. The inquiry sequence for the standard is: PAL − SECAM − NTSC (3.58 MHz) −NTSC (4.43 MHz).
PAL has priority with respect to SECAM, etc.
4. The super sandcastle pulse is compared with three internal threshold levels which are proportional to VP.
input voltage pulse levels to
separate V and H blanking pulses
voltage pulse amplitude2.02.53.0V
input voltage pulse levels to
separate H blanking pulse
voltage pulse amplitude4.14.54.9V
input voltage pulse levels to
separate burst gating pulse
voltage pulse amplitude7.7−V
input voltageduring line scan−−1.0V
input currentduring line scan−−−100µA
pulse ON1.31.61.9V
pulse OFF1.11.41.7V
pulse ON3.33.63.9V
pulse OFF3.13.43.7V
pulse ON6.26.67.0V
pulse OFF6.06.46.8V
P
V
March 19919
Page 10
March 199110
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
negative colour difference output signals
Fig.6 Application diagram with the switched capacitor delay line TDA4660/1.
TDA4650
Page 11
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
negative colour difference output signals
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
12
min.
max.
b
1.7
1.3
0.066
0.051
b
0.53
0.38
0.020
0.014
cD EweM
1
0.32
0.23
0.013
0.009
(1)(1)
36.0
35.0
1.41
1.34
14.1
13.7
0.56
0.54
E
14
(1)
L
3.9
3.4
M
15.80
15.24
0.62
0.60
H
E
17.15
15.90
0.68
0.63
0.252.5415.24
0.010.100.60
e
1
0.15
0.13
Z
max.
1.75.10.514.0
0.0670.200.0200.16
OUTLINE
VERSION
SOT117-1
IEC JEDEC EIAJ
051G05MO-015AH
REFERENCES
March 199111
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
Page 12
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
negative colour difference output signals
PLCC28: plastic leaded chip carrier; 28 leads
e
y
25
26
28
1
pin 1 index
4
β
k
511
E
X
19
Z
E
18
e
12
k
1
v M
e
D
H
D
Z
D
B
v M
TDA4650
SOT261-2
e
E
A
H
E
E
A
A
1
A
4
A
B
w M
detail X
b
p
b
1
(A )
3
L
p
0510 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
mm
0.180
inches
0.165
A
1
min.max.max.max. max.
4.57
0.51
4.19
0.020
A
0.25
0.01
A
4
3
3.05
0.12
b
0.53
0.33
0.021
0.013
b
p
1
0.81
0.66
0.032
0.026
(1)
D
11.58
11.43
0.456
0.450
(1)
E
eH
11.58
1.27
11.43
0.456
0.05
0.450
e
D
10.92
9.91
0.430
0.390
e
10.92
9.91
0.430
0.390
E
12.57
12.32
0.495
0.485
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT261-2
March 199112
H
E
D
12.57
12.32
0.495
0.485
k
1.22
1.07
0.048
0.042
k
0.51
0.020
1
0.057
0.040
L
p
1.44
1.02
EUROPEAN
PROJECTION
(1)(1)
Z
Z
E
D
ywvβ
0.18 0.100.18
0.007 0.0040.007
2.16
0.085
2.16
0.085
o
45
ISSUE DATE
92-11-17
95-02-25
Page 13
Philips SemiconductorsPreliminary specification
Multistandard colour decoder, with
TDA4650
negative colour difference output signals
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 199113
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