Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA4570
NTSC decoder
Product specification
File under Integrated Circuits, IC02
August 1986
Page 2
Philips Semiconductors Product specification
NTSC decoder TDA4570
GENERAL DESCRIPTION
The TDA4570 is an integrated 3,58 MHz or 4,43 MHz NTSC decoder. It is pin sequence compatible with multi-standard
decoder TDA4555 and pin compatible with the PAL decoder TDA4510.
Features
Chrominance part
• Gain controlled amplifier with operating point control stage
• ACC (automatic chrominance control) with sampled rectification during burst-key signal
• Blanking circuit for the colour burst signal
Oscillator and control voltage part
• Voltage controlled reference oscillator for double subcarrier frequency
• Divider stages which provide the correct 90° phase between −(R-Y) and−(B-Y) reference signals for the demodulators
• Phase comparator which controls the frequency and phase of the reference oscillator and compares the (R-Y)
reference with the burst pulse
• HUE control stage provides phase shifting via the combined service and hue control input (pin 11)
• Identification demodulator provides a positive-going identification signal at pin 14 for NTSC signals and acts as the
automatic colour killer
• Two-function service switch:
– position one (V
oscillator-OFF, allowing the adjustment of the reference oscillator
– position two (V
• Sandcastle pulse detector for burst-gate, horizontal and horizontal/vertical blanking pulse detection. The vertical part
of the sandcastle pulse is used for the internal colour-ON and colour-OFF delay
• Pulse processing part for the prevention of premature switching ON of the colour. The colour-ON delay, two or three
field periods after identification of the NTSC signal, is achieved by a counter.
When there is no identification voltage present the colour is switched OFF immediately or, at the most, one field period
later.
< 1 V): switches the colour-ON and switches the hue control and burst for the PLL
14-3
> 5 V): switches the colour-ON, the hue control OFF and allows the output signal to be observed
14-3
Demodulator part
• Two synchronous demodulators for the (R-Y) and (B-Y) signals, which incorporate stages for the blanking during line
and field flyback
• Internal filtering of the residual carrier in the demodulated colour difference signals
• Colour switching stages controlled by the pulse processing part in front of the output stages
• The output stages for (R-Y) and (B-Y) signals are low resistance n-p-n emitter followers
• Separate colour switching output
PACKAGE OUTLINE
16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 28.
August 1986 2
Page 3
Philips Semiconductors Product specification
NTSC decoder TDA4570
August 1986 3
Fig.1 Block diagram.
Page 4
Philips Semiconductors Product specification
NTSC decoder TDA4570
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage range VP=V
Currents at:
pins 1 and 2 −I
pin 16 −I
Total power dissipation P
Storage temperature range T
Operating ambient temperature range T
1, 2
16
tot
stg
amb
THERMAL RESISTANCE
7-3
10,8 to 13,2 V
max. 5 mA
max. 5 mA
max. 800 mW
−25 to 150 °C
0 to +70 °C
From junction to ambient in free air R
CHARACTERISTICS
= 12 V; T
V
P
=25°C; measured in Fig.2 unless otherwise specified
amb
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply current I
P=I7
− 50 − mA
Chrominance part
Input voltage range
(peak-to-peak value) V
9-3(p-p)
10 − 400 mV
Nominal input voltage
(peak-to-peak value)
V
9-3(p-p)
− 100 − mV
with 75% colour bar signal
Input impedance Z
Input capacitance C
− 3,3 − kΩ
9-3
9-3
− 4,0 − pF
Oscillator and control voltage part
Oscillator frequency for
subcarrier frequency
3,58 MHz f
4,43 MHz f
Input resistance R
osc
osc
13-3
− 7,16 − MHz
− 8,86 − MHz
− 350 −Ω
Catching range
(depending on RC network
∆f ± 300 −−Hz
between pins 12 and 3)
Control voltage
without burst signal V
colour switching threshold V
hysteresis of colour switching V
Colour-ON delay t
Colour-OFF delay t
14-3
14-3
14-3
d on
d off
− 6,0 − V
− 6,6 − V
− 150 − mV
−−3 (note 1)
−−1 (note 1)
th j-a
max. 80 K/W
August 1986 4
Page 5
Philips Semiconductors Product specification
NTSC decoder TDA4570
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Colour switching output
(open n-p-n emitter)
output current −I
colour-ON voltage V
colour-OFF voltage V
16
16-3
16-3
HUE control and service switches
Phase shift of reference carrier
relative to the input signal
V
=3 V φ−50+5 deg
11−3
Phase shift of reference carrier
relative to phase at V
V
=2 V −φ 30 −−deg
11−3
V
=4 V +φ 30 −−deg
11−3
11−3
=3 V
Internal source (open pin) − 3 − V
First service position
(PLL is inactive for oscillator
V
11-3
adjustment, colour ON, HUE OFF)
Second service position
(colour ON, HUE OFF) V
11-3
Demodulator part
Colour difference signals output
voltage (peak-to-peak value)
−(R-Y) signal V
−(B-Y) signal V
1−3(p-p)
2-3(p-p)
Ratio of colour difference
output signals (R-Y)/(B-Y) 0,71 0,79 0,87
V
13–
------------V
23–
D.C. voltage at colour
difference outputs V
1,2-3
Residual carrier at colour difference
outputs (peak-to-peak value)
(1 x subcarrier frequency) V
(2 x subcarrier frequency) V
1, 2-3(p-p)
1, 2-3(p-p)
−−5, 0 mA
− 6,0 − V
− 0 − V
0 − 1V
5 − V
P
V
0,84 1,05 1,32 V
1,06 1,33 1,67 V
− 7,7 − V
−−20 mV
−−30 mV
August 1986 5
Page 6
Philips Semiconductors Product specification
NTSC decoder TDA4570
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Sandcastle pulse detector (note 2)
Input voltage level (pin 15)
to separate vertical and
horizontal blanking pulses V
required pulse amplitude V
15-3
15-3
to separate horizontal
blanking pulse V
required pulse amplitude V
to separate burst gating pulse V
required pulse amplitude V
15-3
15-3
15-3
15-3
Input voltage during
horizontal scanning V
Input current −I
15-3
15
Notes
1. Expressed as field periods.
2. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage.
1,3 1,6 1,9 V
2,0 2,5 3,0 V
3,3 3,6 3,9 V
4,1 4,5 4,9 V
6,6 7,1 7,6 V
7,7 −−V
−−1,1 V
−−100 µA
August 1986 6
Page 7
Philips Semiconductors Product specification
NTSC decoder TDA4570
APPLICATION INFORMATION
August 1986 7
Fig.2 Application diagram.
Crystal frequency 7, 16 or 8,86 MHz; resonance resistance 60 Ω; load capacitance 20 pF;
dynamic capacitance 22 fF and static capacitance 5,5 pF.
Page 8
Philips Semiconductors Product specification
NTSC decoder TDA4570
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
1
w M
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
E
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.7 0.51 3.7
OUTLINE
VERSION
SOT38-1
min.
A
1 2
max.
0.15
IEC JEDEC EIAJ
050G09 MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEe M
0.32
0.23
0.013
0.009
REFERENCES
(1) (1)
D
21.8
21.4
0.86
0.84
August 1986 8
8
6.48
6.20
0.26
0.24
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.54 7.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02
95-01-19
Z
max.
2.2
0.087
(1)
Page 9
Philips Semiconductors Product specification
NTSC decoder TDA4570
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1986 9
Loading...