Datasheet TDA4566 Specification

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INTEGRATED CIRCUITS

DATA SH EET

TDA4566

Colour transient improvement circuit

Preliminary speciﬁcation File under Integrated Circuits, IC02

March 1991

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

GENERAL DESCRIPTION

The TDA4566 is a monolithic integrated circuit for colour-transient improvement (CTI) and luminance delay line in gyrator technique in colour television receivers.

Features

• Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and switching stages resulting in high transients of colour difference output signals

• A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line

• Switchable delay time from 550 ns to 820 ns in steps of 90 ns and additional fine adjustment of 37 ns

• Two Y output signals; one of 180 ns less delay

QUICK REFERENCE DATA

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage (pin 10) V Supply current (pin 10) I Y-signal delay at pin 12 S1 open;

= 1.2 kΩ;

14-18

note 1

= 0 to 2.5 V t

15-18

= 3.5 to 5.5 V t

15-18

= 6.5 to 8.5 V t

15-18

= 9.5 to12 V t

15-18

Y-signal ampliﬁcation 0.5 MHz α (R-Y) and (B-Y) signal

attenuation α output transient time t

17-12 17-12 17-12 17-12

10.8 12 13.2 V

− 35 50 mA

490 550 610 ns 580 640 700 ns 670 730 790 ns 760 820 880 ns 012dB

−10 +1dB

− 100 200 ns

Note

1. Delay time is proportional to resistor R

also influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.).

14-18

PACKAGE OUTLINE

18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27.

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

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Fig.1 Block diagram.

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

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Fig.2 Internal pin circuit diagram.

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

PARAMETER SYMBOL MIN. MAX. UNIT

Supply voltage range (pin 10) V Voltage ranges to pin 18 (ground)

at pins 1, 2, 12 and 15 V at pin 11 V at pin 17 V

Voltage ranges

at pin 7 to pin 6 V at pin 8 to pin 9 V

Currents

at pins 6, 9 I at pins 7, 8, 11 and 12 I

Total power dissipation

= 150 °C; T

=70°CP

amb

Storage temperature range T Operating ambient temperature range T

P=V10-18

n-18 11-18 17-18

7-6 8-9

6, 9 7, 8, 11, 12

tot stg amb

0 13.2 V

0V 0(V

−3 V) V

07V

05V 05V

−10 +10 mA internally limited

− 1.1 W

−25 + 150 °C

0 + 70 °C

THERMAL RESISTANCE

From junction to ambient (in free air) R

Note

1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published.

th j−a

= 70 K/W

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Colour transient improvement circuit TDA4566

CHARACTERISTICS

P=V10-18

= 12 V; T

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply (pin 10)

Supply voltage V Supply current I

Colour difference paths

(R-Y) input voltage (75% colour bar signal)

(peak-to-peak value) V (B-Y) input voltage (75% colour bar signal)

(peak-to-peak value) V Input resistance

(R-Y) R

(B-Y) R Internal bias voltage

(R-Y) V

(B-Y) V Signal attenuation

(R-Y) V

(B-Y) V Output transient time note 1 t Output resistance

(B-Y) R

(R-Y) R DC output voltage

(B-Y) V

(R-Y) V Output current note 2

source I

sink −I

=25°C; measured in application circuit Fig.3; unless otherwise speciﬁed

amb

1(p-p)

2(p-p)

1-18 2-18

1-18 1-18

8 7

7-18 8-18

7, 8

/ V / V

1 2

10.8 12 13.2 V

− 35 50 mA

− 0.63 1.5 V

− 0.8 1.9 V

81216kΩ 81216kΩ

3.8 4.3 4.8 V

−10 +1dB

− 100 200 ns

− 100 −Ω

3.8 4.3 4.8 V

0.4 −− mA

1.0 −− mA

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Y-signal path

Y-input voltage (composite signal) capacitive

(peak-to-peak value) coupling V Internal bias voltage during clamping V

17(p-p) 17-18

Input current

during picture content I

during sync. pulse −I

Y-signal delay at pin 12 S1 open;

= 1.2 kΩ;

notes 3 and 4 at V at V at V at V

= 0 to 2.5 V t

15−18

= 3.5 to 5.5 V t

15-18

= 6.5 to 8.5 V t

15−18

= 9.5 to12 V t

15-18

17-18 17-18 17-18 17-18

Fine adjustment of Y-signal delay for all 4 steps S1 closed t

17-12

Signal delay between pin 11 and pin 12 S1 open t

11-12

Dependency of delay time

on temperature − 0.001 − K

on supply voltage −−0.03 − V

Input switching current −I

∆

17 12–

-----------------------------t

17 12–

∆

17 12–

----------------------------t

17 12–

Tj∆•

V∆•

Y-signal attenuation f = 0.5 MHz

pin 11 from pin 17 V11/V pin 12 from pin 17 V

12/V17

Frequency response at 3 MHz referred to 0.5 MHz note 5

pin 11 0 − 3.0 dB

pin 12 0 − 3.0 dB

V11(3 MHz)

------------------------------------(0.5 MHz)

V12(3 MHz)

------------------------------------(0.5 MHz)

− 0.45 0.62 V

2.1 2.4 2.7 V

− 812µA

− 100 150 µA

490 550 610 ns 580 640 700 ns 670 730 790 ns 760 820 880 ns

− 37 − ns

160 180 200 ns

−1

− 15 25 µA

−10 +1dB

0 +1 +2dB

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Frequency response at 5 MHz referred to 0.5 MHz note 5

pin 11 −3.0 − 2.0 dB

pin 12 −3.0 − 2.0 dB

DC output voltage

pin 11 V pin 12 V

Output current note 2

source I sink −I

Notes

1. Output signal transient time measured with C

6-18=C9-18

2. Output current measured with emitter follower with constant current source of 0.6 mA.

3. R

4. Delay time is proportional to resistor R

5. Frequency response measured with V

influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.).

14-18

. Devices with suffix “A” require the value of the resistor to be 1.15 kΩ;

14-18

a 27 kΩ; resistor connected in parallel with R

14-18

= 9.5 V and switch S1 open.

15-18

V11(5 MHz)

------------------------------------(0.5 MHz)

V12(5 MHz)

------------------------------------(0.5 MHz)

11-18 12-18

11, 12

1.8 2.3 2.6 V

9.8 10.3 10.8 V

−−0.4 mA

−−1.0 mA

= 220 pF without resistor (see Fig. 3).

= 1.2 kΩ.;

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

APPLICATION INFORMATION

(1) Residual carrier reduced to 20 mV peak-to-peak (R = 1 kΩ, C = 100 pF). (2) Switching sequence for delay times shown in Table 1. (3) R

= 1.2 kΩfor TDA4566.

14−18

= 1.15 kΩ for TDA4566A (27 kΩresistor connected in parallel to 1.2 kΩ).

14−18

Fig.3 Application diagram and test circuit.

Table 1 Switching sequence for delay times.

CONNECTION

(2)

VOLTAGE AT PIN 15 DELAY TIME (ns)

(a) (b) (c)

0 0 0 0 to 2.5 V 550 0 0 X 3.5 to 5.5 V 640 0 X X 6.5 to 8.5 V 730 X X X 9.5 to 12 V 820

Notes

1. When switch (S1) is closed the delay time is increased by 37 ns.

2. Where: X = connection closed; 0 = connection open.

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Colour transient improvement circuit TDA4566

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil)

seating plane

pin 1 index

SOT102-1

w M

(e )

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

max.

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT102-1

min.

max.

IEC JEDEC EIAJ

1.40

1.14

0.055

0.044

0.53

0.38

0.021

0.015

cD E e M

0.32

1.40

0.23

1.14

0.013

0.055

0.009

0.044

REFERENCES

21.8

21.4

0.86

0.84

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(1) (1)

6.48

6.20

0.26

0.24

3.9

8.25

3.4

7.80

0.15

0.32

0.13

0.31

EUROPEAN

PROJECTION

0.37

0.33

9.5

8.3

max.

0.2542.54 7.62

0.854.7 0.51 3.7

0.010.10 0.30

0.0330.19 0.020 0.15

ISSUE DATE

93-10-14 95-01-23

(1)

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Philips Semiconductors Preliminary speciﬁcation

Colour transient improvement circuit TDA4566

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

(order code 9398 652 90011).

with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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