Datasheet TDA4556, TDA4555 Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA4555 TDA4556

Multistandard decoder

Product speciﬁcation File under Integrated Circuits, IC02

November 1984

Page 2

Philips Semiconductors Product speciﬁcation

Multistandard decoder

GENERAL DESCRIPTION

The TDA4555 and TDA4556 are monolithic integrated multistandard colour decoders for the PAL, SECAM, NTSC 3,58 MHz and NTSC 4,43 MHz standards. The difference between the TDA4555 and TDA4556 is the polarity of the colour difference output signals (B-Y) and (R-Y).

Features Chrominance part

• Gain controlled chrominance amplifier for PAL, SECAM and NTSC

• ACC rectifier circuits (PAL/NTSC, SECAM)

• Burst blanking (PAL) in front of 64 µs glass delay line

• Chrominance output stage for driving the 64 µs glass

delay line (PAL, SECAM)

• Limiter stages for direct and delayed SECAM signal

• SECAM permutator

Demodulator part

• Flyback blanking incorporated in the two synchronous demodulators (PAL, NTSC)

• PAL switch

• Internal PAL matrix

TDA4555 TDA4556

• Two quadrature demodulators with external reference tuned circuits (SECAM)

• Internal filtering of residual carrier

• De-emphasis (SECAM)

• Insertion of reference voltages as achromatic value

(SECAM) in the (B-Y) and (R-Y) colour difference output stages (blanking)

Identiﬁcation part

• Automatic standard recognition by sequential inquiry

• Delay for colour-on and scanning-on

• Reliable SECAM identification by PAL priority circuit

• Forced switch-on of a standard

• Four switching voltages for chrominance filters, traps

and crystals

• Two identification circuits for PAL/SECAM (H/2) and NTSC

• PAL/SECAM flip-flop

• SECAM identification mode switch (horizontal, vertical

or combined horizontal and vertical)

• Crystal oscillator with divider stages and PLL circuitry (PAL, NTSC) for double colour subcarrier frequency

• HUE control (NTSC)

• Service switch

QUICK REFERENCE DATA

Supply voltage (pin 13) V Supply current (pin 13) I Chrominance input signal (peak-to-peak) V Chrominance output signal (peak-to-peak) V Colour difference output signals (peak-to-peak values)

TDA4555: −(R-Y); TDA4556: + (R-Y) V TDA4555: −(B-Y); TDA4556: + (B-Y) V

Sandcastle pulse; required amplitude for

vertical and horizontal pulse separation V horizontal pulse separation V burst gating V

PACKAGE OUTLINE

28-lead DIL; plastic (SOT117); SOT 117-1; 1996 November 27.

November 1984 2

= V

= I

15-9(p-p) 12-9(p-p)

1-9(p-p) 3-9(p-p)

24-9 24-9 24-9

typ. 12 V

13-9

typ. 65 mA 20 to 200 mV typ. 1,6 V

typ. 1,05 V ± 2dB typ. 1,33 V ± 2dB

typ. 2,5 V typ. 4,5 V typ. 7,7 V

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

TDA4555 TDA4556

November 1984 3

Fig.1 Block diagram.

(1) TDA4555: -(R-Y); TDA4556: + (R-Y)

(2) TDA4555: -(B-Y); TDA4556: + (B-Y)

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 13) V Voltage range at pins 10, 11, 17, 23, 24, 25, 26, 27,

28 to pin 9 (ground) V Current at pin 12 I Peak value I Total power dissipation P Storage temperature range T Operating ambient temperature range T

n-9 12 12M

tot

stg

amb

= V

13-9

TDA4555 TDA4556

max. 13,2 V

0 to V

max. 8 mA max. 15 mA max. 1,4 W

−25 to + 150 °C 0 to + 70 °C

November 1984 4

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

CHARACTERISTICS

= V

Supply (pin 13)

Supply voltage range V Supply current I

Chrominance part

Chrominance input signal (pin 15)

Chrominance output signal (pin 12)

Input for delayed signal (pin 10)

Demodulator part (PAL/NTSC)

Colour difference output signals

Ratio of colour difference output signals

Residual carrier (subcarrier frequency)

Residual carrier (PAL only)

H/2 ripple at (R-Y) output (pin 1)

D.C. output voltage

= 12 V; T

13-9

= 25 °C; measured in Fig.1; unless otherwise speciﬁed

amb

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

input voltage with 75% colour bar signal (peak-to-peak value)

input impedance Z

output voltage (peak-to-peak value)

output impedance (n-p-n emitter follower)

d.c. output voltage V

d.c. input current I input resistance R

output voltage (proportional to V

) (peak-to-peak value)

13-9

TDA4555

− (R-Y) signal (pin 1) V

−(B-Y) signal (pin 3) V

TDA4556

+ (R-Y) signal (pin 1) V +(B-Y) signal (pin 3) V

(R-Y)/(B-Y) V

(peak-to-peak value) V

(peak-to-peak value) without input signal

n-p-n emitter follower with internal current source of 0,3 mA V output impedance Z

= V

13-9

= I

15-9(p-p)

 2,3 3,3 − kΩ

15-9

12-9(p-p)

−− 20 Ω

Z

12-9

10-9

1-9(p-p) 3-9(p-p)

1/3-9

1,3-9(p-p)

1-9(p-p)

1,3-9

−− 150 Ω

1, 3-9

10,8 − 13,2 V

− 65 − mA

20 100 200 mV

− 1,6 − V

− 8,2 − V

−− 10 µA 10 −−kΩ

− 1,05 V ± 2dB − V

− 1,33 V ± 2dB − V

− 1,05 V ± 2dB − V

− 1,33 V ± 2dB − V

− 0,79 ± 10% −

−− 30 mV

− 10 − mV

−− 10 mV

− 7,7 − V

TDA4555 TDA4556

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Demodulator part (SECAM)

Colour difference signals (see note 4)

output voltage (proportional to V TDA4555

−(R-Y) signal (pin 1) V

− (B-Y) signal (pin 3) V

TDA4556 + (R-Y) signal (pin 1) V + (B-Y) signal (pin 3) V

Ratio of colour difference output signals

(R-Y)/(B-Y) V

Residual carrier (4 to 5 MHz)

(peak-to-peak value) V

Residual carrier (8 to 10 MHz)

(peak-to-peak value) V

H/2 ripple

at (R-Y) (B-Y) outputs (pins 1 and 3) (peak-to-peak value) with f

signals

D.C. output voltage V Shift of inserted levels relative to levels

of demodulated f

frequencies (IC only) ∆V/∆T(R-Y) −−0,55 − mV/K

) (peak-to-peak value)

13-9

TDA4555 TDA4556

1-9(p-p) 3-9(p-p)

1/3-9

1,3-9(p-p)

1,3-9

∆V/∆T(B-Y) −+0,25 − mV/K

− 1,05 − V

− 1,33 − V

− 1,05 − V

− 1,33 − V

− 0,79

(1)

± 10% −

− 20 30 mV

−− 20 mV

− 7,7 − V

HUE control (NTSC)/service switch

Phase shift of reference carrier

at V at V at V

= 2 V −φ − 30 (note 2) − deg

17-9

=3V φ−0−deg

17-9

= 4 V +φ − 30 (note 2) − deg

17-9

Input resistance R Service position Switching voltage (pin 17)

burst OFF; colour ON (for oscillator adjustment)

HUE control OFF; colour ON

(for forced colour ON) Crystal oscillator (pin 19) For double colour subcarrier frequency

input resistance R

lock-in-range

referred to subcarrier frequency

November 1984 6

17-9

19-9

− 5 − kΩ

−− 0,5 V

6 −−V

− 350 −Ω

∆f ±400 −−Hz

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Identiﬁcation part

Switching voltages for chrominance ﬁlters and crystals

at pin 28 (PAL)

at pin 27 (SECAM)

at pin 26 (NTSC 3,58 MHz)

at pin 25 (NTSC 4,43 MHz) Control voltage OFF state V Control voltage ON state

during scanning; colour OFF V

colour ON V Output current −I Voltage for forced switching ON

PAL V

SECAM V

NTSC 3,58 MHz V

NTSC 4,43 MHz V Delay time for

restart of scanning t

colour ON t

colour OFF t SECAM identiﬁcation (pin 23) Input voltage for

horizontal identification (H) V

vertical identification (V) V

combined (H) and (V) identification V Sequence of standard inquiry

PAL-SECAM-NTSC 3,58 MHz-NTSC 4,43 MHz

Reliable SECAM identification by PAL priority circuit Scanning time for each standard t

25,26,27,28-9

25,26,27,28-9 25,26,27,28-9

25,26,27,28-9

28-9 27-9 26-9 25-9

dS dC1 dC2

23-9 23-9 23-9

TDA4555 TDA4556

−− 0,5 V

− 2,45 − V

− 5,8 − V

−− 3mA

9 −−V 9 −−V 9 −−V 9 −−V

2 to 3 vertical periods 2 to 3 vertical periods 0 to 1 vertical periods

−− 2V 10 −−V

− 6 (note 3) − V

4 vertical periods

November 1984 7

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

TDA4555 TDA4556

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Sandcastle pulse detector (see note 5)

Input voltage pulse levels (pin 24)

to separate vertical and horizontal blanking pulses V

required pulse amplitude V

to separate horizontal blanking pulse V

required pulse amplitude V

to separate burst gating pulse V

required pulse amplitude V Input voltage during horizontal scanning V Input current −I

24-9 24-9(p-p) 24-9 24-9(p-p) 24-9 24-9(p-p) 24-9

Notes

1. Value measured without influence of external circuitry.

2. Relative to phase at V

17-9

= 3 V.

3. Or not connected.

4. The signal amplitude of the colour difference signals (R-Y) and (B-Y) is dependent on the characteristics of the external tuned circuits at pins 7, 8 and 4, 5 respectively. Adjustment of the amplitude is achieved by varying the Q-factor of these tuned circuits. The resonant frequency must be adjusted such that the demodulated output frequency (fo) provides the same output level as the internally inserted reference voltage (achromatic value).

5. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage.

1,2 − 2,0 V 2,0 − 3,0 V 3,2 − 4,0 V 4,0 − 5,0 V 6,5 − 7,7 V 7,7 − V

−− 1,0 V

−− 100 µA

November 1984 8

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Philips Semiconductors Product speciﬁcation

Multistandard decoder

APPLICATION INFORMATION

TDA4555 TDA4556

November 1984 9

Fig.2 Application diagram.

Service switch

(a) colour ON; hue OFF

Page 10

Philips Semiconductors Product speciﬁcation

Multistandard decoder

PACKAGE OUTLINE

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

seating plane

TDA4555 TDA4556

SOT117-1

w M

(e )

pin 1 index

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

1 2

min.

max.

1.7

1.3

0.066

0.051

0.53

0.38

0.020

0.014

cD E weM

0.32

0.23

0.013

0.009

(1) (1)

36.0

35.0

1.41

1.34

14.1

13.7

0.56

0.54

(1)

3.9

3.4

15.80

15.24

0.62

0.60

17.15

15.90

0.68

0.63

0.252.54 15.24

0.010.10 0.60

0.15

0.13

max.

1.75.1 0.51 4.0

0.0670.20 0.020 0.16

OUTLINE

VERSION

SOT117-1

IEC JEDEC EIAJ

051G05 MO-015AH

REFERENCES

November 1984 10

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17 95-01-14

Page 11

Philips Semiconductors Product speciﬁcation

Multistandard decoder

TDA4555 TDA4556

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

November 1984 11