Datasheet TDA4510-V9 Datasheet (Philips)

Page 1
DATA SH EET
Product specification File under Integrated Circuits, IC02
March 1986
INTEGRATED CIRCUITS
TDA4510
PAL decoder
Page 2
Philips Semiconductors Product specification
PAL decoder TDA4510
GENERAL DESCRIPTION
The TDA4510 is a colour decoder for the PAL standard, which is pin sequent compatible with multistandard decoder TDA4555 and also pin compatible with NTSC decoder TDA4570. It incorporates the following functions:
Chrominance part
Gain controlled chrominance amplifier with operating point control stage
Chrominance output stage for driving the 64 µs delay line
Blanking circuit for the colour burst signal
Automatic chrominance control (ACC) with sampled rectifier during burst-key
Oscillator and control voltage part
Reference oscillator for double subcarrier frequency
Gated phase comparison
Identification demodulator and automatic colour killer
Sandcastle pulse detector
Service switch
Demodulator part
Two synchronous demodulators for the (B-Y) and (R-Y) signals
PAL flip-flop and PAL switch
Colour switching stages
Separate colour switching output
(B-Y) and (R-Y) signal output stages
Internal filtering of residual carrier
QUICK REFERENCE DATA
PACKAGE OUTLINE
16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 26.
Supply voltage V
P
= V
7-3
typ. 12 V
Supply current I
P
= I
7
typ. 50 mA
Chrominance input signal (peak-to-peak) V
9-3(p-p)
10 to 400 mV
Chrominance output signal (peak-to-peak) V
6-3(p-p)
typ. 1,6 V
Colour difference output signals (peak-to-peak values)
(R-Y) signal V
1-3(p-p)
typ. 1,05 V ± 2dB
(B-Y) signal V
2-3(p-p)
typ. 1,33 V ± 2dB
Sandcastle pulse, required amplitude for
burst gating level V
15-3
typ. 7,7 V
horizontal pulse separation V
15-3
typ. 4,5 V
vertical and horizontal pulse separation V
15-3
typ. 2,5 V
Page 3
March 1986 3
Philips Semiconductors Product specification
PAL decoder TDA4510
Fig.1 Block diagram.
External capacitors in Fig.1
C1 filter capacitor for control voltage (pin 10)
C2 filter capacitor for identification signal (pin 14)
Page 4
Philips Semiconductors Product specification
PAL decoder TDA4510
FUNCTIONAL DESCRIPTION
DIVIDER STAGES The divider stages provide(R-Y) and(B-Y) reference signals with the correct 90 degrees relation for the demodulators. PHASE COMPARATOR The phase comparator compares the (R-Y) reference signal with the burst pulse and controls the frequency and phase
of the reference oscillator. IDENTIFICATION DEMODULATOR The identification demodulator delivers a positive going identification signal for PAL-signals at pin 14, also used for the
automatic colour-killer. SERVICE SWITCH The service switch has two functions. The first position (V
14-3
< 1 V) allows the adjustment of the reference oscillator.
Therefore the colour is switched on and the burst for the oscillator PLL is switched off. The second position (V
14-3
> 5V)
switches the colour on and the output signals can be observed. SANDCASTLE PULSE DETECTOR Sandcastle pulse detector for burst-gate, line and blanking (horizontal and vertical) pulse detection. The vertical part of
the sandcastle pulse is needed for the internal colour-on and colour-off delay. PULSE PROCESSING PART Pulse processing part which shall prevent a premature switching on of the colour. The colour-on delay, two or three field
periods after identification of the PAL signal, is achieved by a counter. The colour is switched off immediately or at the latest one field period after disappearance of the identification voltage.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage range V
P
= V
7-3
10,8 to 13,2 V
Currents
at pins 1 and 2 I
1,2
max. 5 mA
at pin 6 I
6
max. 15 mA
at pin 16 I
16
max. 5 mA
Total power dissipation P
tot
max. 800 mW
Storage temperature T
stg
25 to + 150 °C
Operating ambient temperature T
amb
0 to + 70 °C
Page 5
Philips Semiconductors Product specification
PAL decoder TDA4510
CHARACTERISTICS
V
P
= 12 V; T
amb
= 25 °C; measured in Fig.2 unless otherwise specified
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply current I
7
50 mA
Chrominance part
Input voltage range (peak-to-peak value) V
9-3(p-p)
10 400 mV
Nominal input voltage (peak-to-peak value)
with 75% colour bar signal V
9-3(p-p)
100 mV
Input impedance Z
9-3
3,3 k
Input capacitance C
9-3
4 pF
Colour ON
Chrominance output voltage (peak-to-peak) with 75% colour bar signal V
6-3(p-p)
1,6 V
d.c. voltage at chrominance output V
6-3
8,2 V
Oscillator and control voltage part
Oscillator frequency f
o
8,8 MHz
Input resistance R
13-3
350 −Ω
Catching range
(depending on RC-network at pin 12) f ±400 −−Hz
Control voltage
without burst signal V
14-3
6,0 V
colour on switching threshold V
14-3
6,6 V
hysteresis of colour switching V
14-3
150 mV
flip-flop correction (FFC) voltage V
14-3
5,5 V
hysteresis of FFC V
14-3
170 mV
Colour-on delay 2 3 f.p.
(1)
Colour-off delay 0 1 f.p.
(1)
First service position (PLL is inactive
for oscillator adjustment, colour on) V
11-3
0 1V
second service position (colour on) V
11-3
5 −−V
Colour switching output (open npn emitter)
output current I
16
−−5mA
colour-on voltage V
16-3
6 V
colour-off voltage V
16-3
0 V
Page 6
Philips Semiconductors Product specification
PAL decoder TDA4510
Note
1. f.p. is shortening for field periods in this case.
Demodulator part
Delayed chrominance input signal
(peak-to-peak value) with 75% colour bar signal V
4-3(p-p)
200 mV
Colour difference output signals
(peak-to-peak value)
(R-Y) signal V
1-3(p-p)
0,84 1,05 1,32 V
(B-Y) signal V
2-3(p-p)
1,06 1,33 1,67 V
Ratio of colour difference output signals
(R-Y)/(B-Y) V
1-3/V2-3
0,71 0,79 0,87 V
D.C. voltage
at colour difference outputs V
1; 2-3
7,7 V
Residual carrier voltage
at colour difference outputs 1 × subcarrier frequency (4,4 MHz) V
1,2-3(p-p)
−−20 mV
2 × subcarrier frequency (8,8 MHz) V
1,2-3(p-p)
−−20 mV
Sandcastle pulse detector
Thresholds: Field- and line-pulse separation
pulse ON V
15-3
1,3 1,6 1,9 V
Required pulse amplitude V
15-3
2,0 2,5 3,0 V
Line pulse separation; pulse ON V
15-3
3,3 3,6 3,9 V
Required pulse amplitude V
15-3
4,1 4,5 4,9 V
Burst pulse separation; pulse ON V
15-3
6,6 7,1 7,6 V
Required pulse amplitude V
15-3
7,7 −−V
Input voltage during horizontal scanning V
15-3
−−1,1 V
Input current I
15
−−100 µA
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Page 7
Philips Semiconductors Product specification
PAL decoder TDA4510
Fig.2 Application information and test circuit.
C4 = 5 to 27 pF, X = 8,8 MHz; nominal frequency 8,867 238 MHz; resonance resistance 60 , load capacitance 20 pF, dynamic capacitance 22 fF and static capacitance 5,5 pF.
Page 8
Philips Semiconductors Product specification
PAL decoder TDA4510
PACKAGE OUTLINE
UNIT
A
max.
1 2
b
1
cEe M
H
L
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1
92-10-02 95-01-19
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.055
0.045
0.53
0.38
0.32
0.23
21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15
0.021
0.015
0.013
0.009
0.010.100.0200.19
050G09 MO-001AE
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D
(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
Page 9
Philips Semiconductors Product specification
PAL decoder TDA4510
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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