Datasheet TDA3608TH, TDA3608Q Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3608Q; TDA3608TH

Multiple voltage regulators with
switch

Product specification
Supersedes data of 2000 Oct 13
File under Integrated Circuits, IC01

2001 Jun 29

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

FEATURES
General

• Two VP-state controlled regulators (regulator 1 and
regulator 3) and a power switch

• Regulator 2 and reset circuit operate during load dump
and thermal shutdown

• Separate control pins for switching regulator 1,
regulator 3 and power switch

• Supply voltage range from −18 to +50 V

• Low reverse current of regulator 2

• Low quiescent current (when regulator 1, regulator 3

and power switch are switched off)

• Hold output circuit for regulator 1 (only valid when
regulator 3 output voltage >1.3 V)

• Reset and hold outputs (open-collector outputs)

• Adjustable reset delay time

• High ripple rejection

• Backup capacitor connection to supply regulator 2 and

reset circuit up to 25 V.

Protections

• Reverse polarity safe (down to −18 V without high
reverse current)

• Able to withstand voltages up to 18 V at the outputs
(supply line may be short circuited)

• ESD protection on all pins

• Thermal protection

• Load dump protection

• Foldback current limit protection for regulator 1,

regulator 2 and regulator 3

• Delayed foldback current limit protection for power
switch (at short-circuit); delay time fixed by reset delay
capacitor

• All regulator outputs and power switch are
DC short-circuited safe to ground and VP.

GENERAL DESCRIPTION

The TDA3608 isamultiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. It contains:

• Two fixed output voltage regulators with a foldback
current protection (regulator 1 and regulator 3) and one
fixed output voltage regulator (regulator 2) intended to
supply a microcontroller, which also operates during
load dump and thermal shutdown

• A power switch with protections, operated by an enable
input

• Reset and hold outputs that can be used to interface
with the microcontroller; the reset output can be used to
call up the microcontroller and the hold output indicates
thattheregulator 1 output voltage is available and within
the range

• A supply pin which can withstand load dump pulses and
negative supply voltages

• Regulator 2 which is switched on at a backup voltage
higher than 6.5 V and switched off when the regulator 2
output drops below 1.9 V

• A provision for the use of a reserve (backup) supply
capacitor that will hold enough energy for regulator 2
(5 Vcontinuous) to allow a microcontrollertoprepare for
loss of voltage.

ORDERING INFORMATION

TYPE

NUMBER

TDA3608Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
TDA3608TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2

2001 Jun 29 2

NAME DESCRIPTION VERSION

PACKAGE

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q

T

j

Voltage regulators

V

REG1

V

REG2

V

REG3

Power switch

V

drop

I

M

supply voltage operating 9.5 14.4 18 V

regulator 2 on 2.4 14.4 18 V
reverse polarity; non-operating −−−18 V
jump start for t ≤ 10 minutes −−30 V
load dump protection for t ≤ 50 ms

and t

≥ 2.5 ms

r

−−50 V

quiescent supply current standby mode; VP= 12.4 V − 500 600 µA
junction temperature −40 − +150 °C

output voltage of regulator 1 1 mA ≤ I
output voltage of regulator 2 0.5 mA ≤ I
output voltage of regulator 3 1 mA ≤ I

≤ 600 mA 8.15 8.5 8.85 V

REG1

≤ 150 mA 4.75 5.0 5.25 V

REG2

≤ 400 mA 4.75 5.0 5.25 V

REG3

dropout voltage ISW=1A − 0.45 0.7 V

I

= 1.8 A − 1.0 1.8 V

SW

peak current 2 −−A

2001 Jun 29 3

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

BLOCK DIAGRAM

handbook, full pagewidth

(14.4 V)

V

1 (3)

P

POWER SWITCH

(17) 13

SW

(14.2 V/1.8 A)

ENSW

EN3

EN1

7 (10)

4 (6)

6 (9)

&

BACKUP SWITCH

BACKUP CONTROL

&

&

TEMPERATURE

AND LOAD DUMP

PROTECTION

REGULATOR 2

REGULATOR 3

REGULATOR 1

(16) 12

(15) 11

(5) 3

(4) 2

(11) 8

BU

REG2

REG3

REG1

HOLD

(14.2 V/100 mA)

(5 V/150 mA)

(5 V/400 mA)

(8.5 V/600 mA)

TDA3608Q

hold enable

(TDA3608TH)

C

9 (12)

RES

(1, 2, 7, 13, 18, 19, 20)

n.c.

Numbers in parenthesis refer to type number TDA3608TH.

Fig.1 Block diagram.

2001 Jun 29 4

10 (14)
GND

(8) 5

MGK602

RES

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

PINNING

SYMBOL

DESCRIPTION

TDA3608Q TDA3608TH

PIN

V

P

1 3 supply voltage
REG1 2 4 regulator 1 output
REG3 3 5 regulator 3 output
EN3 4 6 regulator 3 enable input
RES 5 8 reset output
EN1 6 9 regulator 1 enable input
ENSW 7 10 power switch enable input
HOLD 8 11 hold output
C

RES

9 12 reset delay capacitor connection
GND 10 14 ground
REG2 11 15 regulator 2 output
BU 12 16 backup capacitor connection
SW 13 17 power switch output
n.c. − 1, 2, 7, 13, 18,

not connected

19 and 20

handbook, halfpage

Fig.2 Pin configuration of TDA3608Q.

V

REG1
REG3

EN3

RES

EN1
ENSW
HOLD
C

RES

GND

REG2

BU

SW

P

1
2
3
4
5
6

TDA3608Q

7
8

9
10
11
12
13

MGK601

handbook, halfpage

Fig.3 Pin configuration of TDA3608TH.

n.c.
n.c.
n.c.
SW

BU

REG2

GND

n.c.

C

RES

HOLD

20
19
18
17
16

TDA3608TH

15
14
13
12
11

MGT566

10

1
2
3
4
5
6
7
8
9

n.c.
n.c.

V

P

REG1
REG3
EN3
n.c.
RES
EN1
ENSW

2001 Jun 29 5

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

FUNCTIONAL DESCRIPTION

The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. Because of low-voltage operation of the
car radio, low-voltage drop regulators are used in the
TDA3608.

Backup supply

The charge of the backup capacitor connected to pin BU
can be used to supply regulator 2 for a short period when
the supply voltage VP drops to 0 V (the time depends on
the value of the capacitor).

Regulator 1

When the output voltage of regulator 2 and the supply
voltage (VP> 4.5 V) are both available, regulator 1 can be
operated by means of enable pin EN1 (see Fig.4).

Regulator 2

Regulator 2 switches on (see Fig.5) when the backup
voltage exceeds 6.5 V for the first time and switches off
when the output voltage of regulator 2 drops below 1.9 V
(this is far below an engine start).

The hold output is only activated when V

REG3

> 1.3 V.
When pin HOLD is connected via a pull-up resistor to the
output of regulator 3 spikes will be minimized to 1.3 V
(maximum value) because the hold output is only disabled
when V

REG3

< 1.3 V.

Pin HOLD will be forced LOW when the load dump
protection is activated and also in the standby mode.

Power switch

The power switch can be controlled by means of enable
pin ENSW (see Fig.6).

Protections

All output pins are fully protected.
The regulators are protected against load dump

(regulator 1 and regulator 3 switch off at VP> 18 V) and
short-circuit (foldback current protection).

The power switch contains a foldback current protection,
but this protection is delayed at a short-circuit condition by
the reset delay capacitor. During this time the output
current is limited to at least 2 A (peak value) and

1.8 A (continuous value) at VP≤ 18 V. During the foldback
mode the current is limited to 0.5 A (typical value).

Regulator 3

When the output voltage of regulator 2 and the supply
voltage (VP> 4.5 V) are both available, regulator 3 can be
operated by means of enable pin EN3 (see Fig.4).

Reset

When regulator 2 is switched on and the output voltage of
this regulator is within its voltage range, the reset output
(see Fig.5) will be enabled (pin RES goes HIGH through
an external pull-up resistor) to generate a reset to the
microcontroller.

The reset cycles can be extended by means of anexternal
capacitor connected to pin C

. This start-up feature is

RES

included to secure asmooth start-up ofthe microcontroller
at first connection, without uncontrolled switching of
regulator 2 during the start-up sequence.

Hold

Regulator 1 has an open-collector hold output (see Fig.4)
indicating that the output voltage is settled at 8.5 V.
Pin HOLD is held HIGH by an external pull-up resistor.
When the supply voltage VPdrops or during high load, the
output voltage drops out-of-regulationand pin HOLD goes
LOW.

The timing diagram is shown in Fig.7.
The foldback protection is activated when VSW<4V.

When regulator 2 is out-of-regulation and generates a
reset, the power switch is in the foldback mode
immediately when VSW<4V.

In the standby mode the voltage on the reset delay
capacitor is about 4 V and the voltage on the power switch
output is VP− 0.45 V (typical value) at ISW= 1 A. During
an overload condition or short-circuit the reset delay
capacitor will be charged to a higher voltage. The power
switch is in the high current mode while the capacitor is
charged, after this the switch is in the foldback mode
(VSW< 4 V).Whilethe reset delay capacitor is charged the
power switch output can reach its correct output voltage.
Now the voltage on the reset delay capacitor is decreased
rapidlyto 4 V. The resetoutput voltage is not influencedby
this change of voltages. The time of the high current mode
depends on the value of the reset delay capacitor.

At VP> 18 V the power switch is clamped at maximum

17.2 V (to avoid that external connected circuitry is being
damaged by an overvoltage) and the power switch will
switch off at load dump.

2001 Jun 29 6

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

handbook, full pagewidth

V

P

enable

regulator 1

regulator 1

enable

regulator 3

regulator 3

hold output

18.0 V

9.5 V

4.5 V

4.0 V

≥2.2 V
≤2.0 V

8.5 V

0 V

≥2.2 V
≤2.0 V

5.0 V

0 V

load dump

MGT568

Fig.4 Timing diagram of regulator 1, regulator 3 and hold output.

handbook, full pagewidth

V

P

backup

regulator 2

reset
delay

capacitor

reset

output

18.0 V

4.0 V

6.5 V

5.4 V

5.0 V

1.9 V
0 V

5.0 V

3.0 V
0 V

5.0 V

t

d(res)

load dump

Fig.5 Timing diagram of backup, regulator 2 and reset output.

2001 Jun 29 7

MGT567

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

handbook, full pagewidth

V

P

enable

power
switch

power
switch
output

handbook, full pagewidth

regulator 2

reset
delay

voltage

reset

output

enable

power
switch

power
switch

voltage

power
switch

current

18.0 V

4.5 V

4.0 V

≥2.2 V
≤2.0 V

16.2 V

0 V

5 V

6.4 V

4 V
3 V

0 V

5 V

0 V

>

2.2 V

<

2.0 V
14 V

4 V
0 V

2 A

0.5 A

0 A

current limit mode

load dump

Fig.6 Timing diagram of power switch output.

t

d(sw)

foldback mode foldback mode

t

d(res)

MGT569

MGT570

Fig.7 Timing diagram of current protection of power switch.

2001 Jun 29 8

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

P

tot

T

stg

T

amb

T

j

THERMAL CHARACTERISTICS

supply voltage operating − 18 V

reverse polarity; non-operating −−18 V
jump start for t ≤ 10 minutes − 30 V
load dump protection for t ≤ 50 ms and

t

≥ 2.5 ms

r

− 50 V

total power dissipation − 62 W
storage temperature non-operating −55 +150 °C
ambient temperature operating −40 +85 °C
junction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-c)

thermal resistance from junction to case

TDA3608Q 2 K/W
TDA3608TH 3.5 K/W

R

th(j-a)

thermal resistance from junction to ambient in free air 50 K/W

CHARACTERISTICS

V

= 14.4 V; T

P

=25°C; measured in test circuit of Fig.12; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage operating 9.5 14.4 18 V

regulator 2 on; note 1 2.4 14.4 18 V
jump start for t ≤ 10 minutes −− 30 V
load dump protection for

t ≤ 50 ms and t

I

q

quiescent supply
current

standby mode; note 2

= 12.4 V − 500 600 µA

V

P

V

= 14.4 V − 520 −µA

P

≥ 2.5 ms

r

−− 50 V

Schmitt trigger supply voltage for regulator 1, regulator 3 and power switch

V

thr

V

thf

V

hys

rising threshold voltage 4.0 4.5 5.0 V
falling threshold voltage 3.5 4.0 4.5 V
hysteresis voltage − 0.5 − V

Schmitt trigger supply voltage for regulator 2

V

thr

V

thf

V

hys

rising threshold voltage 6.0 6.5 7.1 V
falling threshold voltage 1.7 1.9 2.2 V
hysteresis voltage − 4.6 − V

2001 Jun 29 9

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Schmitt trigger voltage for enable input (regulator 1, regulator 3 and power switch)

V

thr

V

thf

V

hys

I

LI

Schmitt trigger voltage for reset

V

thr

V

thf

V

hys

Schmitt trigger voltage for hold

V

thr

V

thf

V

hys

Reset and hold output

I

sinkL

I

LO

t

r

t

f

Reset delay capacitor circuit

I

ch

I

dch

V

thr(res)

V

thr(sw)

t

d(res)

Regulator 1; I

V

REG1(off)

V

REG1

∆V

line

∆V

load

I

q

SVRR supply voltage ripple

rising threshold voltage 1.7 2.2 2.7 V
falling threshold voltage 1.5 2.0 2.5 V
hysteresis voltage I

REG=ISW

= 1 mA 0.1 0.2 0.5 V

input leakage current VEN=5V 1 5 10 µA

rising threshold voltage

VPrising; I

= 50 mA; note 3 − V

REG2

REG2

− 0.15 V

REG2

− 0.075 V

of regulator 2
fallingthresholdvoltage

VPfalling; I

= 50 mA; note 3 4.3 V

REG2

− 0.35 − V

REG2

of regulator 2
hysteresis voltage 0.1 0.2 0.3 V

rising threshold voltage

VPrising; note 3 − V

REG1

− 0.15 V

REG1

− 0.075 V

of regulator 1
fallingthresholdvoltage

VPfalling; note 3 7.7 V

− 0.35 − V

REG1

of regulator 1
hysteresis voltage 0.1 0.2 0.3 V

LOW-level sink current Vo≤ 0.8 V 2 −− mA
output leakage current Vo=5V; VP= 14.4 V −− 2 µA
rise time note 4 − 750µs
fall time note4 − 150µs

charge current 2 3 4 µA
discharge current 500 800 −µA
rising threshold voltage

2.8 3.0 3.2 V

for delayed reset pulse
rising threshold voltage

note 5 − 6.4 − V
for delayed power
switch foldback mode

reset delay time C7 = 47 nF; note 6 32 47 70 ms

= 5 mA; unless otherwise specified

REG1

output voltage with

− 1 400 mV

regulator off
output voltage 1 mA ≤ I

9.5 V ≤ V

≤ 600 mA 8.15 8.5 8.85 V

REG1

≤ 18 V 8.15 8.5 8.85 V

P

line regulation 9.5 V ≤ VP≤ 18 V − 275mV
load regulation 1 mA ≤ I
quiescent current I

= 600 mA − 25 60 mA

REG1

= 3 kHz; Vi= 2 V (p-p) 60 70 − dB

f

i

≤ 600 mA − 20 50 mV

REG1

rejection

2001 Jun 29 10

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

drop

I

m

I

sc

Regulator 2; I

V

REG2

∆V

line

∆V

load

SVRR supply voltage ripple

V

drop

I

m

I

sc

Regulator 3; I

V

REG3(off)

V

REG3

∆V

line

∆V

load

I

q

SVRR supply voltage ripple

V

drop

I

m

I

sc

dropout voltage VP= 8.5 V; I

REG1

= 550 mA;

− 0.4 0.7 V

note 7
current limit V

> 7.5 V; see Fig.8; note 8 0.65 1.2 − A

REG1

short-circuit current RL≤ 0.5 Ω; see Fig.8; note 9 250 800 − mA

= 5 mA; unless otherwise specified

REG2

output voltage 0.5 mA ≤ I

= 300 mA; note 10 4.75 5.0 5.25 V

I

REG2

7V≤V

P

18 V ≤ V

I

≤ 150 mA

REG2

≤ 150 mA 4.75 5.0 5.25 V

REG2

≤18 V 4.75 5.0 5.25 V

≤ 50 V;

P

4.75 5.0 5.25 V

line regulation 6 V ≤ VP≤ 18 V − 250mV

18 V ≤ V
load regulation 1 mA ≤ I

1mA≤I

f

= 3 kHz; Vi= 2 V (p-p) 60 70 − dB

i

≤ 50 V − 15 75 mV

P

≤ 150 mA − 20 50 mV

REG2

≤ 300 mA −− 100 mV

REG2

rejection
dropout voltage normal supply; note 7

V

= 4.75 V; I

P

V

= 5.75 V; I

P

= 100 mA − 0.4 0.6 V

REG2

= 200 mA − 0.8 1.2 V

REG2

backup supply; note 11

V

current limit V

= 4.75 V; I

BU

V

= 5.75 V; I

BU

> 4.5 V; see Fig.9; note 8 0.32 0.37 − A

REG2

= 100 mA − 0.2 0.5 V

REG2

= 200 mA − 0.8 1.0 V

REG2

short-circuit current RL≤ 0.5 Ω; see Fig.9; note 9 20 100 − mA

= 5 mA; unless otherwise specified

REG3

output voltage with

− 1 400 mV

regulator off
output voltage 1 mA ≤ I

7V≤V

≤ 400 mA 4.75 5.0 5.25 V

REG3

≤18 V 4.75 5.0 5.25 V

P

line regulation 7 V ≤ VP≤ 18 V − 250mV
load regulation 1 mA ≤ I
quiescent current I

= 400 mA − 15 40 mA

REG3

f

= 3 kHz; Vi= 2 V (p-p) 60 70 − dB

i

≤ 400 mA − 20 50 mV

REG3

rejection
dropout voltage VP= 5.75 V; I

REG3

= 400 mA;

− 1 1.5 V

note 7
current limit V

> 4.5 V; see Fig.10;

REG3

0.45 0.70 − A

note 8
short-circuit current RL≤ 0.5 Ω; see Fig.10; note 9 100 400 − mA

2001 Jun 29 11

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Power switch

V

drop

V

cl

V

fb

I

dc

I

M

I

sc

Backup switch

I

dc

V

cl

I

r

Notes

1. The minimum value is the minimum operating voltage, only if VP has exceeded 6.5 V.

2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulator 1, regulator 3 and
the power switch are grounded and R

3. The voltage of the regulator drops as a result of a VPdrop.

4. The rise and fall time is measured with a 10 kΩ pull-up resistor and CL=50pF.

5. Thisis the threshold voltage for thedelaytimeof the power switch. The voltageonthe reset delay capacitor increases
only at low output voltage of the power switch (for example at short circuit). When the voltage on this capacitor
exceeds this threshold voltage, the power switch is set to the foldback mode. The power switch is also protected by
the temperature protection.

6. Delay time calculation:

dropout voltage ISW= 1 A; note 12 − 0.45 0.7 V

I

= 1.8 A; note 12 − 1.0 1.8 V

SW

clamping voltage VP≥ 18 V 15 16.2 17.2 V
flyback voltage

ISW= −100 mA − VP+ 3 22 V

behaviour
continuous current VP=16V; VSW= 13.5 V 1.8 2.0 − A
peak current VP= 17 V; see Fig.11; note 13 2 −− A
short-circuit current VP= 14.4 V; VSW< 3.5 V;

− 0.5 − A

see Fig.11; note 14

continuous current 0.3 0.35 − A
clamping voltage VP≥ 16.7 V −− 16 V
reverse current VP= 0; VBU= 12.4 V; note 15 −− 900 mA

L(REG2)

= ∞.

d(sw)

C

V

× C 1000 103××== sec[]

------

C (th1)

I

ch

C

× C 500× 103×== sec[]

V

------

C (th2)

I

ch

and pins REG1, REG2

P

a) Reset pulse delay: The delay time is 47 ms for C = 47 nF.

b) Power switch delay: The delay time is 23.5 ms for C = 47 nF.

t

d(res)

t

7. The dropout voltage of regulator 1, regulator 2 and regulator 3 is measured between pin V
or REG3 respectively.

8. During current limit, current Im is held constant.

9. The foldback current protection limits the dissipated power at short-circuit.

10. The peak current of 300 mA can only be applied for short periods (t < 100 ms).

11. The dropout voltage is measured between pins BU and REG2.

12. The dropout voltage of the power switch is measured between pins VP and SW.

13. The maximum output current of the power switch is limited to 1.8 A when VP>18V.

2001 Jun 29 12

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

14. During short-circuit, current Iscof the power switch is held constant to a lower value than the continuous current after
a delay of at least 10 ms. Furthermore, a foldback function is activated after the delay. When VSW< 3.5 V, the
short-circuit current is reduced to 0.5 A (typical value). The short-circuit protection of the power switch functions best
when C1 = 220 µF and C2 = 10 µF.

15. The reverse current of the backup switch is the current which is flowing out of pin VP at VP=0V.

handbook, halfpage

8.5

V

REG1

(V)

2

I

sc

I

REG1

≥300

(mA)

Fig.8 Foldback current protection of regulator 1.

handbook, halfpage

V

REG3

(V)

5.0

MGT571

MGT573

handbook, halfpage

(mA)

MGT572

I

m

V

REG2

(V)

5.0

1

I

m

I

≥50

sc

I

REG2

Fig.9 Foldback current protection of regulator 2.

handbook, halfpage

14.2

V

SW

(V)

MGT574

1

I

sc

≥200

I

REG3

(mA)

I

m

Fig.10 Foldback current protection of regulator 3.

2001 Jun 29 13

0.5

(1)

ISW (A)

3

(1) Delayed; time depends on value of capacitor C7.

Fig.11 Current protection of power switch.

2

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

TEST AND APPLICATION INFORMATION
Test information

handbook, full pagewidth

V

V

ENSW

V

EN1

V

EN3

V

bu

V

P

ENSW

EN1

EN3

C

RES

BU

C8
220 nF

1

7

6

TDA3608Q

4

9

12

10

GND

(1)

P

C1

220 nF

C7
47 nF

R1

1 kΩ

SW

13

REG2

11

REG1

2

REG3

3

RES

5

HOLD

8

C9

>

10 µF

C6
50 pF

(2)

R4

2.2 Ω
C2

220 nF

C3
10 µF

C4
10 µF

C5
10 µF

R2
10 kΩ

C10
50 pF

14.2 V

8.5 V

R3
10 kΩ

MGK605

5 V

5 V

R

L(SW)

1 kΩ

R

L(REG2)

1 kΩ

R

L(REG1)

1 kΩ

R

L(REG3)

1 kΩ

(1) Capacitor not required for stability.
(2) Value depends on application.

Fig.12 Test circuit.

2001 Jun 29 14

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

Application information

NOISE
The noise on the supply line depends on the value of the

supply capacitor and is caused by a current noise (the
output noise of the regulators is translated into a current
noise by means of the output capacitors). Table 1 shows
thenoisefigurewiththecorrespondingoutputcapacitor C
for each regulator. The noise is minimal when a high
frequency capacitor of 220 nF in parallel with an
electrolytic capacitor of 100 µF is connected directly to
pins VP and GND.

Table 1 Noise figure; note 1

NOISE FIGURE (µV)

REGULATOR

Co=10µFCo=47µFCo= 100 µF

1 225 150 135
2 225 150 135
3 255 200 180

Note

1. Measured at a bandwidth of 200 kHz.

S

TABILITY

Solution

Use a tantalum capacitor of 10 µF or a larger electrolytic
capacitor.Theuseoftantalumcapacitorsisrecommended
to avoid problems with stability at low temperatures.

o

handbook, halfpage

R

(Ω)

4

3

2

1

minimum ESR

0

110

maximum ESR

stable region

C (µF)

MBK100

100

Fig.13 Curves for selecting value of output

capacitor for regulator 1 and regulator 3.

The regulators are made stable with the externally
connectedoutputcapacitors.Theoutputcapacitorscanbe
selected using the graphs of Figs 13 and 14. When an
electrolyticcapacitorisused, the temperature behaviour of
this output capacitor can cause oscillations at low
temperature. The next two examples show how an output
capacitor value is selected.

Example 1

The regulator 1 is made stable with an electrolytic output
capacitor of 220 µF with ESR = 0.15 Ω. At T

amb

= −30 °C
the capacitor value is decreased to 73 µF and the ESR is
increased to 1.1 Ω. The regulator remains stable at
T

= −30 °C (see Fig.13).

amb

Example 2

The regulator 2 is made stable with an electrolytic
capacitor of 10 µF with ESR = 3 Ω. At T

= −30 °C the

amb

capacitor value is decreased to 3 µF and the ESR is
increased to 23.1 Ω. The regulator will be instable at
T

= −30 °C (see Fig.14).

amb

handbook, halfpage

(Ω)

14
12

R

10

8
6
4
2
0

0.22

maximum ESR

stable region

minimum ESR

110

Fig.14 Curves for selecting value of output

capacitor for regulator 2.

C (µF)

MBK099

100

2001 Jun 29 15

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

PACKAGE OUTLINES

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

SOT141-6

non-concave

x

D

E

h

view B: mounting base side

d

B

j

L

A

2

L

3

Q

D

h

E

A

113

e

Z

DIMENSIONS (mm are the original dimensions)

UNIT A e

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT141-6

A2bpcD

17.0

4.6

4.4

0.75

0.60

15.5

1

e

(1)

0.48

24.0

23.6

20.0

19.6

0.38

IEC JEDEC EIAJ

w M

b

p

0 5 10 mm

(1)

deD

E

h

12.2

10 3.4

11.8

REFERENCES

scale

1

1.7

2001 Jun 29 16

e

5.08

c

m

E

2

h

6

LL3m

3.4

12.4

3.1

11.0

e

2

2.4

4.3

1.6

EUROPEAN

PROJECTION

Qj

2.1

1.8

v M

0.8

v

x

0.25w0.03

ISSUE DATE

97-12-16
99-12-17

(1)

Z

2.00

1.45

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height

D

c

y

D

1

1

pin 1 index

10

D

2

E

1

x

A

2

A

4

E

E

2

H

E

SOT418-2

A

X

v M

A

Q

A

(A3)

20

Z

DIMENSIONS (mm are the original dimensions)

A

UNIT

mm

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

3.5

3.5 0.35

3.2

OUTLINE
VERSION

SOT418-2

2

e

(1)

bpc

A

A

4

3

+0.12

0.53

−0.02

0.40

IEC JEDEC EIAJ

0.32

0.23

D

16.0

15.8

(2)

13.0

12.6

11

w M

b

p

0 5 10 mm

scale

(2)

D

D

2

1

1.1

0.9

REFERENCES

E

11.1

10.9

E

6.2

5.8

1

E

2.9

2.5

L

p

detail X

H

L

Q

e

E

14.5

13.9

p

1.1

0.8

2

1.27

v

1.7

0.25w0.25

1.5

EUROPEAN

PROJECTION

x

0.03

θ

yZ

2.5

0.07

2.0

ISSUE DATE

98-02-25
99-11-12

θ

8°
0°

2001 Jun 29 17

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

SOLDERING
Introduction

Thistextgives a very brief insight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. Wave solderingcan still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screenprinting,stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

stg(max)

). If the

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, thepackage must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.

2001 Jun 29 18

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

WAVE REFLOW

(2)

− suitable

(1)

DIPPING

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

(3)

suitable −

HTSSOP, SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable −

(4)(5)

suitable −

(6)

suitable −

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 Jun 29 19

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

(1)

STATUS

(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limitingvalues given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditions abovethosegivenin the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswill be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected toresult in personalinjury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofany of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products,and makes no representations or warrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2001 Jun 29 20

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

NOTES

2001 Jun 29 21

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

NOTES

2001 Jun 29 22

Philips Semiconductors Product specification

Multiple voltage regulators with switch TDA3608Q; TDA3608TH

NOTES

2001 Jun 29 23

Philips Semiconductors – a w orldwide compan y

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For all other countries apply to: Philips Semiconductors,
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© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2001

Internet: http://www.semiconductors.philips.com

72

Printed in The Netherlands 753503/03/pp24 Date of release: 2001 Jun 29 Document order number: 9397 750 08405