3supply voltage
REG14regulator 1 output
REG35regulator 3 output
REG26regulator 2 output
DEC7decoupling capacitor
GND8ground
V
en2
9enable input regulator 2
1997 May 053
handbook, halfpage
1
V
en3
2
V
en1
3
V
P
4
REG1
5
REG3
REG2
DEC
GND
V
en2
TDA3607
6
7
8
9
MBG717
Fig.2 Pin configuration.
Page 4
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
FUNCTIONAL DESCRIPTION
The TDA3607 is a multiple output voltage regulator with
three independent switchable regulators. When the supply
voltage (VP> 4.5 V) is available, regulators 1, 2 and 3 can
be operated by means of 3 independent enable inputs.
Schmitt-trigger functions are included to switch-off the
regulators at low battery voltage (VP< 4 V). A hysteresis is
included to avoid random switching.
handbook, full pagewidth
V
enable
regulator 1
regulator 1
enable
regulator 2
regulator 2
enable
regulator 3
regulator 3
18.0 V
9.4 V
P
4.5 V
4.0 V
≥2.2 V
≤2.0 V
9.0 V
0 V
≥2.2 V
≤2.0 V
5.0 V
0 V
≥2.2 V
≤2.0 V
5.0 V
0 V
load dump
All output pins are fully protected. The regulators are
protected against load dump (regulators will switch-off at
supply voltages higher than 20 V) and short-circuit
(foldback current protection).
The total timing of a semi on/off logic set is shown in Fig.3.
reverse battery voltagenon-operating−−18V
total power dissipation−62W
storage temperature rangenon-operating−55+150°C
ambient temperature rangeoperating−40+85°C
junction temperatureoperating−150°C
thermal resistance from junction to caseregulator and switch-on2K/W
thermal resistance from junction to ambient in free air50K/W
QUALITY SPECIFICATION
In accordance with
Handbook”
. The handbook can be ordered using the code 9397 750 00192.
“SNW-FQ-611-E”
. The number of the quality specification can be found in the
“Quality Reference
CHARACTERISTICS
= 14.4 V; T
V
P
=25°C; measured in test circuit of Fig.5; unless otherwise specified.
line regulation7 V ≤ VP≤ 18 V−−50mV
load regulation1 mA ≤ I
quiescent currentI
= 0.4 A−1040mA
REG3
f= 3 kHz; V
≤ 400 mA−2050mV
REG3
=2V6070−dB
i(p-p)
rejection
V
REGd3
drop-out voltageI
= 400 mA; VP=9V;
REG3
−0.451.5V
note 3
I
REGm3
I
REGsc3
α
ct
current limitV
short circuit currentRL≤ 0.5 Ω; note 5100300−mA
cross talk noisenote 6−25100µV
> 4 V; note 40.450.9−A
REG3
Notes
1. Minimum operating voltage, only if VP has exceeded 4.5 V.
2. The quiescent current is measured in the standby mode. So, the enable inputs of regulator 1, 2 and 3 are LOW
(Ven< 1 V).
3. The drop-out voltage of regulators 1, 2 and 3 is measured between VP and V
4. At current limit, I
is held constant (see Fig.4 for behaviour of I
REGmn
REGmn
).
REGn
.
5. The foldback current protection limits the dissipated power at short-circuit (see Fig.4).
6. Perform the load regulation test with sine wave load of 10 kHz on the regulator output under test. Measure the RMS
ripple voltage on each of the remaining regulator outputs, using a 80 kHz low-pass filter.
1997 May 057
Page 8
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
handbook, halfpage
9 V
V
REG1
2 V
MGB755
handbook, halfpage
V
REG2
5.0 V
1 V
I
REG1
I
REGm1
I
REGsc2
≥50 mA
I
REGsc1
≥300 mA
a. Regulator 1.b. Regulator 2.
handbook, halfpage
V
REG3
5.0 V
1 V
I
REGsc3
≥200 mA
I
REG3
MGB757
I
REGm3
c. Regulator 3.
I
REG2
MGB756
I
REGm2
Fig.4 Foldback current protection for regulators 1, 2 and 3.
1997 May 058
Page 9
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
TEST AND APPLICATION INFORMATION
Test information
handbook, full pagewidth
(1)
V
P
V
en2
V
en3
V
en1
(1) Capacitor not required for stability.
C1
220 nF
enable input regulator 2
enable input regulator 3
enable input regulator 1
Application information
N
OISE
Table 1 Noise figures
NOISE FIGURE (µV)
REGULATOR
at OUTPUT CAPACITOR (µF)
1047100
1−150−
2−150−
3−200−
Note
1. Measured at a bandwidth of 200 kHz.
V
P
3
9
1
2
TDA3607
8
GND
regulator 2
6
regulator 3
5
regulator 1
4
MBG719
C2
47 µF
C3
47 µF
C4
47 µF
5 V
5 V
9 V
R
L(REG2)
1 kΩ
R
L(REG3)
1 kΩ
R
L(REG1)
1 kΩ
Fig.5 Test circuit.
When a high frequency capacitor of 220 nF in parallel with
an electrolytic capacitor of 100 µF is connected directly to
pins 3 and 8 (supply and ground) the noise is minimal.
TABILITY
(1)
S
The regulators are made stable with the externally
connected output capacitors. The value of the output
capacitors can be selected by referring to the graphs
illustrated in Figs 6 and 7.
When an electrolytic capacitor is used the temperature
behaviour of this output capacitor can cause oscillations at
cold temperature.
The following two examples explain how an output
capacitor value is selected.
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (output
noise of the regulators is translated into a current noise by
means of the output capacitors).
1997 May 059
Page 10
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
Example 1
Regulator 1 is made stable with an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω), at −30 °C the capacitor
value is decreased to 22 µF and the ESR is increased to
3.5 Ω. The regulator will remain stable at −30 °C.
Example 2
Regulator 2 is made stable with a 10 µF electrolytic
capacitor (ESR = 3.3 Ω), at −30 °C the capacitor value is
decreased to 3 µF and the ESR is increased to 23.1 Ω.
The regulator will be unstable at −30 °C (see Fig.7).
handbook, halfpage
(Ω)
5
R
4
3
maximum ESR
Solution
Use a tantalum capacitor of 10 µF or a large electrolytic
capacitor. The use tantalum capacitors is recommended to
avoid problems with stability at cold temperatures.
handbook, halfpage
(Ω)
5
R
4
3
maximum ESR
2
1
0.22
stable region
minimum ESR
110
C (µF)
100
MGL138
Fig.6Curve for selecting the value of output
capacitor for regulator 1.
2
1
0.22
stable region
minimum ESR
110
C (µF)
100
MGL139
Fig.7Curve for selecting the value of output
capacitor for regulators 2 and 3.
1997 May 0510
Page 11
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
PACKAGE OUTLINE
SIL9P: plastic single in-line power package; 9 leads
D
d
seating plane
b
SOT131-2
non-concave
x
E
h
view B: mounting base side
A
B
j
A
1
D
h
2
E
19
Z
DIMENSIONS (mm are the original dimensions)
A
UNITA
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1
max.
2.0
OUTLINE
VERSION
SOT131-2
4.6
4.2
e
b
b
cD
max.
1.1
p2
0.75
0.48
0.60
0.38
IEC JEDEC EIAJ
b
p
(1)
24.0
23.6
REFERENCES
w M
0510 mm
scale
deD
h
20.0
102.54
19.6
1997 May 0511
E
12.2
11.8
L
c
Q
(1)
E
h
6
3.4
3.1
Lj
Q
17.2
2.1
16.5
1.8
EUROPEAN
PROJECTION
0.25w0.03
ISSUE DATE
92-11-17
95-03-11
(1)
Z
x
2.00
1.45
Page 12
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 May 0512
Page 13
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
NOTES
1997 May 0513
Page 14
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
NOTES
1997 May 0514
Page 15
Philips SemiconductorsPreliminary specification
Multiple voltage regulator with switchTDA3607
NOTES
1997 May 0515
Page 16
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands547027/1200/01/pp16 Date of release: 1997 May 05Document order number: 9397 750 02272
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