Product specification
Supersedes data of 1997 Jul 15
File under Integrated Circuits, IC01
1998 Jun 16
Page 2
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
detection
FEATURES
• One VP-state controlled regulator
• Regulator and reset outputs operate during load dump
• Supply voltage range of −18 to +50 V
• Low quiescent current (battery detection switched off)
• High ripple rejection
• Dual reset output.
PROTECTIONS
• Reverse polarity safe (down to −18 V without high
reverse current)
• Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
• ESD protected on all pins
• Load dump protection
• Foldback current limit protection for regulator
• DC short-circuit safe to ground and V
output.
of regulator
P
TDA3606
GENERAL DESCRIPTION
The TDA3606 is a low power voltage regulator. It contains:
1. One fixed voltage regulator with a foldback current
protection, intended to supply a microprocessor that
also operates during load dump
2. A reset-signal can be used to interface with the
microprocessor
3. Supply pin can withstand load dump pulses and
negative supply voltages
4. Defined start-up behaviour; regulator will be switched
on at a supply voltage higher than 7.6 V and off when
the output voltage of the regulator drops below 2.4 V.
The TDA3606 is a voltage regulator intended to supply a
microprocessor (e.g. in car radio applications). Because of
low voltage operation of the application, a low-voltage drop
regulator is used in the TDA3606.
This regulator will switch on when the supply voltage
exceeds 7.5 V for the first time and will switch off again
when the output voltage of the regulator drops below
2.4 V. When the regulator is switched on, the RES1 and
RES2 outputs (RES2 can only be HIGH when RES1 is
HIGH) will go HIGH after a fixed delay time (fixed by an
external delay capacitor) to generate a reset to the
microprocessor.
handbook, full pagewidth
TDA3606
RES1 will go HIGH by an internal pull-up resistor of 4.7 kΩ,
and is used to initialize the microprocessor. RES2 is used
to indicate that the regulator output voltage is within its
voltage range. This start-up feature is built-in to secure a
smooth start-up of the microprocessor at first connection,
without uncontrolled switching of the regulator during the
start-up sequence.
All output pins are fully protected. The regulator is
protected against load dump and short-circuit (foldback
current protection).
Interfacing with the microprocessor can be accomplished
by means of a battery Schmitt-trigger and output buffer
(simple full/semi on/off logic applications). The battery
output will go HIGH when the battery input voltage
exceeds the HIGH threshold level.
50 V
V
regulator
reset 1
reset 2
reset delay
capacitor
on/off switch
battery input
battery output
P
4.35 V4.35 V
2 V2 V
Fig.3 Timing diagrams.
2.4 V
2.1 V
2 V
MGB857
1998 Jun 164
Page 5
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
TDA3606
detection
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
reverse battery voltagenon-operating−−18V
positive pulse voltage at battery inputVP= 14.4 V; RI=5kΩ−50V
negative pulse voltage at battery inputVP= 14.4 V; RI=5kΩ−−100V
total power dissipationT
1. Minimum operating voltage, only if VP has exceeded 7.6 V.
2. The quiescent current is measured in stand-by mode. So, the battery input is connected to a low voltage source and
RL= ∞.
3. The voltage of regulator sinks as a result of a supply voltage drop.
= 5 mA)
REG
output voltage0.5 mA ≤ I
7V≤V
P
18 V ≤ V
I
=30mA
REG
≤ 50 mA4.85.05.2V
REG
≤18 V4.855.05.15V
≤ 50 V; load dump;
P
4.755.05.25V
output currentload dump; VP>25V−−45mA
line regulation7 V ≤ VP≤ 18 V−350mV
load regulation0.5 mA ≤ I
= 200 Hz; V
i
≤ 30 mA−−50mV
REG
i(p-p)
=2V;
5560−dB
Io=5mA
drop-out voltageI
current limitV
= 50 mA; VP= 5 V; note 6−0.270.4V
REG
> 4.5 V; note 70.10.270.6A
REG
short-circuit currentRL≤ 0.5 Ω; note 81560−mA
4. The delay time can be calculated with the following formula:
C
d
t
d
dV
------ -
∫
I
ch
thr
CdV
×
----------------------I
ch
5. Battery output voltage will be equal or less than the output voltage of regulator.
6. The drop-out voltage of regulator is measured between VP and V
7. At current limit, I
is held constant (behaviour according to dashed line in Fig.4).
clr
REG
.
8. The foldback current protection limits the dissipated power at short-circuit (see Fig.4).
handbook, halfpage
5.0 V
V
REG
1 V
I
scr
≥50 mA
I
REG
MGB853
I
clr
thr
(ms)==
Fig.4 Foldback current protection.
1998 Jun 167
Page 8
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
detection
TEST AND APPLICATION INFORMATION
Test information
handbook, full pagewidth
V
P
8
V
C
3
TDA3606
1
V
V
I(bat)
(1)
P
10 µF
battery input voltage
10 µF
4
GND
regulator output
7
reset 1 output
6
reset 2 output
5
battery output voltage
2
10 µF
MGB808
TDA3606
R
L(REG)
1 kΩ .. 0.5 Ω
R
L(RES1)
1 kΩ
R
L(RES2)
1 kΩ
R
L(bat)
1 kΩ
(1) Capacitor not required for stability.
Fig.5 Test circuit.
Application information
N
OISE
The noise at the output of the regulator depends on the
bandwidth of the regulator, which can be adjusted by
means of the output capacitor. In Table 1 the noise figures
are given.
Table 1 Noise figures
OUTPUT
CURRENT
(mA)
I
O
NOISE FIGURE (µV)
AT OUTPUT CAPACITOR CL(µF)
1047100
(1)
0.5585045
50250200180
Note
1. Measured at a bandwidth of 10 Hz to 100 kHz.
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (output
noise of the regulator is translated into a current noise by
means of the output capacitor). When a high frequency
capacitor of 220 nF in parallel with an electrolytic capacitor
of 100 µF is connected directly to pins 8 and 4 (supply and
ground) the noise is minimized.
S
TABILITY
The regulator is stabilized by means of the output
capacitor. The value of the output capacitor can be
selected using the diagram shown in Fig.6. The following
two examples show the effects of the stabilization circuit
using different values for the output capacitor.
Example 1
The regulator is stabilized using an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω). At −40 °C the capacitor
value is decreased to 22 µF and the ESR is increased to
3.5 Ω. The regulator will remain stable at a temperature of
−40 °C.
Example 2
The regulator is stabilized using an electrolytic output
capacitor of 10 µF (ESR = 3.3 Ω). At −40 °C the capacitor
value is decreased to 3 µF and the ESR is increased to
23.1 Ω. The regulator will be instable at a temperature of
−40 °C. This can be solved using a tantalum capacitor of
10 µF.
1998 Jun 168
Page 9
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
detection
handbook, full pagewidth
ESR
(Ω)
8
6
4
2
0
0.68
1
(1)
(2)
stable region
10
TDA3606
MBK118
1001000
output capacitor (µF)
(1) Maximum ESR.
(2) Minimum ESR.
Fig.6 Curve for selecting the value of the output capacitor.
APPLICATION CIRCUITS
In Fig.7 the quiescent current equals Iq+I
Rdivider
.
The specified quiescent current equals Iq. When the
supply voltage is connected, the regulator will switch on
when the supply voltage exceeds 7.6 V. With the aid of a
timing capacitor at pin 3 the reset can be delayed (the
timer starts at the same moment as the regulator is
switched on).
Forced reset can be accomplished by short-circuiting the
timer capacitor by using the push button switch. When the
push button is released again, the timer restarts (only
when the regulator is on) causing a second reset on both
RES1 and RES2.
The maximum output current of the regulator equals:
SO8: plastic small outline package; 8 leads; body width 3.9 mm
D
c
y
Z
8
5
TDA3606
SOT96-1
E
H
E
A
X
v M
A
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
1.75
0.069
A
1
0.25
0.10
0.010
0.004
A2A
1.45
1.25
0.057
0.049
0.25
0.01
b
3
p
0.49
0.25
0.36
0.19
0.019
0.0100
0.014
0.0075
4
w M
b
p
02.55 mm
scale
(1)E(2)
cD
5.0
4.8
0.20
0.19
eHELLpQZywv θ
4.0
1.27
3.8
0.16
0.050
0.15
2
A
6.2
5.8
0.244
0.228
Q
3
A
θ
0.250.10.25
0.010.010.0410.004
(1)
0.7
0.3
0.028
0.012
o
8
o
0
L
p
L
0.7
0.6
0.028
0.024
(A )
1
detail X
1.0
1.05
0.4
0.039
0.016
OUTLINE
VERSION
SOT96-1
IEC JEDEC EIAJ
076E03S MS-012AA
REFERENCES
1998 Jun 1611
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
Page 12
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
detection
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
TDA3606
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1998 Jun 1612
Page 13
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
TDA3606
detection
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Jun 1613
Page 14
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
detection
NOTES
TDA3606
1998 Jun 1614
Page 15
Philips SemiconductorsProduct specification
Multiple voltage regulator with battery
detection
NOTES
TDA3606
1998 Jun 1615
Page 16
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext.2501, Fax. +6221 7940080
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+38111 635777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands545102/1200/03/pp16 Date of release: 1998 Jun 16Document order number: 9397 750 03767
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