
Philips Semiconductors Product specification
Video control combination circuit TDA3504
FEATURES
• Capacitive coupling of the colour difference and
luminance input signals with black level clamping in the
input stages
• Linear saturation control acting on the colour difference
signals
• (G−Y) and RGB matrix
• Linear transmission of inserted signals
GENERAL DESCRIPTION
The TDA3504 is an integrated circuit which performs video
control functions in a PAL/SECAM decoder for negative
colour difference signals −(R−Y) and −(B−Y).
The required input signals are luminance and colour
difference and a 3-level sandcastle pulse for control
purposes. Linear RGB signals can be inserted from an
external source. RGB output signals are available for
driving the video output stages.
• Equal black levels for inserted and matrixed signals
• 3 identical channels for the RGB signals
• Linear contrast and brightness controls, operating on
both the inserted and matrixed RGB signals
• Clamping, horizontal and vertical blanking of the three
input signals controlled by a 3-level sandcastle pulse
• Emitter-follower outputs for driving the RGB output
stages.
QUICK REFERENCE DATA
All voltages referenced to pin 18 (ground).
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
P
I
P
V
11(p-p)
supply voltage (pin 2) − 12.0 − V
supply current (pin 2) − 95 − mA
video blanking sync (VBS) input signal
− 0.45 − V
(peak-to-peak value)
V
15(p-p)
−(B−Y) colour difference input signal
− 1.33 − V
(peak-to-peak value)
V
14(p-p)
−(R−Y) colour difference input signal
− 1.05 − V
(peak-to-peak value)
V
10, 9, 8(b-w)
V
6
inserted RGB signals (black-to-white value) − 1.0 − V
3-level sandcastle pulse
level 1 − 2.5 − V
level 2 − 4.5 − V
level 3 − 8.0 − V
V
17
V
16
V
12
T
amb
control voltage brightness 1.0 − 3.0 V
control voltage contrast 2.0 − 4.2 V
control voltage saturation 2.0 − 4.2 V
operating ambient temperature 0 − +70 °C
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
TDA3504 DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
1996 Jan 09 2

Philips Semiconductors Product specification
Video control combination circuit TDA3504
CHARACTERISTICS
V
= 12 V; V
P
8, 9,10(p-p)
Figs 3 and 4; nominal settings of brightness (V
referenced to ground (pin 18); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
I
P
Colour difference inputs (pins 14 and 15)
V
14(p-p)
V
15(p-p)
I
input current between clamping
14, 15
R
14, 15
V
14, 15
Saturation control (pin 12)
V
12
SAT minimum saturation V
I
I
(G−Y) matrix (see note 3)
=1V; V
11(p-p)
= 0.45 V; V
= 1.05 V; V
14(p-p)
= 2 V), contrast (V16= 3.6 V) and saturation (V12= 3.1 V); all voltages
17
15(p-p)
= 1.33 V; T
=25°C; measured in
amb
supply voltage (pin 2) 10.8 12.0 13.2 V
supply current (pin 2) note 1 65 95 125 mA
−(R−Y) input signal (pin 14)
(peak-to-peak value)
−(B−Y) input signal (pin 15)
(peak-to-peak value)
for saturated colour bar with
75% of maximum amplitude
for saturated colour bar with
75% of maximum amplitude
− 1.05 1.48 V
− 1.33 1.88 V
−− 0.2 µA
pulses
input resistance 1.0 −−MΩ
internal DC voltage due to clamping note 2 3.8 4.2 4.8 V
control voltages
(2)
maximum saturation 4.0 4.2 4.4 V
nominal saturation
2.9 3.1 3.3 V
6 dB below maximum
−26 dB saturation referenced
1.9 2.1 2.3 V
to maximum
= 1.8 V 46 50 − dB
12
input current −− 20 µA
Luminance input (pin 11)
V
11(p-p)
VBS input signal
note 4 − 450 630 mV
(peak-to-peak value)
I
input current between clamping
11
−− 0.4 µA
pulses
R
11
V
11
input resistance 1.0 −−MΩ
input DC voltage due to clamping note 2 2.5 2.9 3.3 V
m linearity nominal settings 0.85 −−
RGB channels
SIGNAL SWITCHING INPUT (PIN 7)
V
7
V
7
C
i
I
I
normal state voltage; no insertion 0 − 0.4 V
voltage level for insertion on 0.9 − 3.0 V
input capacitance −− 10 pF
input current V7=0to3V −100 − +430 µA
1996 Jan 09 5

Philips Semiconductors Product specification
Video control combination circuit TDA3504
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
SIGNAL INSERTION:RI(PIN 10); GI (PIN 9); BI (PIN 8)
V
8, 9, 10(b-w)
external RGB input signals
(black-to-white value)
I
input current between clamping
8, 9, 10
pulses
V
8, 9, 10
internal DC voltage due to clamping notes 2 and 5 4.0 4.5 5.0 V
Contrast control (pin 16)
V
16
control voltages
(2)
maximum contrast 4.0 4.2 4.4 V
nominal contrast
3 dB below maximum
−10 dB below maximum 2.6 2.8 3.0 V
CON minimum contrast referenced to maximum;
V
=2V
16
RGB
diff
difference between RGB channels contrast −10 dB below
maximum
− 1.0 1.4 V
−− 0.5 µA
3.4 3.6 3.8 V
17 21 29 dB
−− 0.6 dB
Peak drive limiting
V
th
I
16
threshold voltage note 2 8.5 8.8 9.1 V
input current at contrast control
V
1, 19, 20
≥ V
th
input
internal signal limiting referenced to nominal
output amplitude; note 6
Brightness control (pin 17)
V
17
control voltages
(2)
brightness control range 1.0 − 3.0 V
nominal brightness − 2.0 − V
I
I
input current no beam current limiting;
V17=1to3V
∆V
blk(b-w)
shift of black level in the control
∆V17=1V − 40 − %
range referenced to the luminance
signal (black-to-white value)
tracking 95 −−%
RGB outputs (emitter follower; pins 19, 20 and 1)
V
19, 20, 1
∆V
19, 20, 1
output voltage black-to-white positive 4.0 5.0 6.5 V
difference in black level between
RGB channels due to variation of
contrast control
I
internal current source 2.0 3.0 4.0 mA
19, 20, 1
Gain data (at nominal brightness, contrast, saturation and white point settings)
G
v19, 20, 1-11
voltage gain with respect to
luminance input (pin 11)
α
19, 20, 1-11
frequency response of luminance
f=0to5MHz −− 3dB
path
10 20 30 mA
110 −−%
−− −10 µA
−− 10 mV
22 24 26 dB
1996 Jan 09 6

Philips Semiconductors Product specification
Video control combination circuit TDA3504
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
;
G
v1-15
G
v19-14
α
; α
1-15
19-14
;
G
v19-10
G
; G
v20-9
α
; α
19-10
α
1-8
∆t
19, 20, 1
t
d
∆G
19, 20, 1
Sandcastle pulse detector (pin 6)
V
6
I
I
t
d
voltage gain with respect to colour
11 14 17 dB
difference inputs (pins 14 and 15)
frequency response of colour
f=0to2MHz −− 3dB
difference paths
voltage gain with respect to inserted
signals
v1-8
;
frequency response of inserted
20-9
f=0to10MHz −− 3dB
12 14 16 dB
signal paths
difference in transition times
− 015ns
between R, G and B channels
delay time between signal switching
−25 − +25 ns
and signal insertion
difference in gain between normal
−− 10 %
and signal insertion mode
the following amplitudes are
required for separating the various
pulses
horizontal and vertical
2.1 2.5 2.9 V
blanking; notes 7 and 8
horizontal; note 7 4.1 4.5 5.0 V
clamping; notes 7 and 9 7.6 8.0 12.0 V
no keying; note 7 −− 1.0 V
input current LOW −− −110 µA
delay of leading edge of clamping
− 0.5 −µs
pulse
Notes
1. Maximum value 110 mA after warm-up.
2. Values are proportional to the supply voltage.
3. Matrixed according to equation V
(G−Y)
= −0.51V
−(R−Y)
− 0.19V
−(B−Y)
.
4. Clipping due to internal signal limitation may occur when the Y input is greater than nominal and maximum contrast
and minimum brightness.
5. When V
< 0.4 V during clamping time, the black levels of the inserted RGB signals are clamped on the black
7-18
levels of the internal RGB signals.
When V
> 0.9 V during clamping time, the black levels of the inserted RGB signals are clamped on an internal
7-18
DC voltage (correct clamping of the external RGB signals is possible only when they are synchronous with the
sandcastle pulse).
6. Internal signal limitation is allowed to start at 5.5 V after warm-up time.
7. The sandcastle pulse is compared with three internal thresholds (proportional to VP) and the given levels separate
the various pulses.
8. Blanked to ultra-black (−25%).
9. Pulse duration ≥3.5 µs.
1996 Jan 09 7

Philips Semiconductors Product specification
Video control combination circuit TDA3504
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
(order code 9398 652 90011).
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jan 09 11

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SCDS47 © Philips Electronics N.V. 1996
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Printed in The Netherlands
533061/1100/02/pp12 Date of release: 1996 Jan09
Document order number: 9397 750 00556