Datasheet TDA2615-N1 Datasheet (Philips)

Page 1
DATA SH EET
Product specification Supersedes data of July 1994 File under Integrated Circuits, IC01
1995 May 08
INTEGRATED CIRCUITS
Philips Semiconductors
2 × 6 W hi-fi audio power amplifier
Page 2
1995 May 08 2
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
FEATURES
Requires very few external components
No switch-on/switch-off clicks
Input mute during switch-on and switch-off
Low offset voltage between output and ground
Excellent gain balance of both amplifiers
Hi-fi in accordance with
“IEC 268”
and
“DIN 45500”
Short-circuit proof and thermal protected
Mute possibility.
GENERAL DESCRIPTION
The TDA2615 is a dual power amplifier in a 9-lead plastic single-in-line (SIL9MPF) medium power package. It has been especially designed for mains fed applications, such as stereo radio and stereo TV.
QUICK REFERENCE DATA
Stereo application.
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
±V
P
supply voltage range 7.5 21 V
P
O
output power VS= ±12 V; THD = 0.5% 6 W
G
v
internal voltage gain 30 dB
G
v
channel unbalance 0.2 dB
α channel separation 70 dB
SVRR supply voltage ripple rejection 60 dB V
no
noise output voltage 70 −µV
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA2615 SIL9MPF
plastic single in-line medium power package with fin; 9 leads
SOT110-1
Page 3
1995 May 08 3
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
BLOCK DIAGRAM
Fig.1 Block diagram.
MLA711
5
voltage
comparator
4
4 k
10 k
P
– V
P
+ V
THERMAL
PROTECTION
5 k
1
CM
20 k
V
A
B
V
P
– V
680
20 k
10 k
V
A
B
V
P
+ V
ref1
V
ref3
V
ref2
+ V
ref2
– V
P
+ V
CM
20 k
V
A
B
V
P
– V
680
20 k
ref1
V
ref1
V
6
P
– V
8
9
3
2
TDA2615
INV1
MUTE
1/2 V / GND
OUT1
OUT2
INV1, 2
INV2
P
7
Page 4
1995 May 08 4
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
PINNING
SYMBOL PIN DESCRIPTION
INV1 1 non-inverting input 1 MUTE 2 mute input
1
⁄2VP/GND 31⁄2 supply voltage or ground
OUT1 4 output 1
V
P
5 supply voltage (negative) OUT2 6 output 2 +V
P
7 supply voltage (positive) INV1, 2 8 inverting input 1 and 2
INV2 9 non-inverting input 2
Fig.2 Pin configuration.
MLA708
1
2 3 4 5 6 7 8 9
P
+ V
OUT2
MUTE
INV2
TDA2615
/ GND
P
V
INV1
INV1, 2
OUT1
1/2 V
P
FUNCTIONAL DESCRIPTION
The TDA2615 is a hi-fi stereo amplifier designed for mains fed applications, such as stereo radio and stereo TV. The circuit is optimally designed for symmetrical power supplies, but is also well-suited to asymmetrical power supply systems.
An output power of 2 × 6W (THD = 0.5%) can be delivered into an 8 load with a symmetrical power supply of ±12 V. The gain is internally fixed at 30 dB, thus offering a low gain spread and a very good gain balance between the two amplifiers (0.2 dB).
A special feature is the input mute circuit. This circuit disconnects the non-inverting inputs when the supply voltage drops below±6 V, while the amplifier still retains its DC operating adjustment. The circuit features suppression of unwanted signals at the inputs, during switch-on and switch-off.
The mute circuit can also be activated via pin 2. When a current of 300 µA is present at pin 2, the circuit is in the mute condition.
The device is provided with two thermal protection circuits. One circuit measures the average temperature of the crystal and the other measures the momentary temperature of the power transistors. These control circuits attack at temperatures in excess of +150 °C, so a crystal operating temperature of max. +150 °C can be used without extra distortion.
With the derating value of 6 K/W, the heatsink can be calculated as follows:
at R
L
=8Ω and VS= ±12 V, the measured maximum
dissipation is 7.8 W. With a maximum ambient temperature of +60 °C, the
thermal resistance of the heatsink is:
The metal tab has the same potential as pin 5.
R
th
150 60
7.8
----------------------
6 5.5 K/W==
Page 5
1995 May 08 5
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
Note
1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to V
P
= 28 V and with an internal supply resistance of RS≥ 4 Ω, the maximum unloaded supply voltage is limited to 32 V
(with the load short-circuited). For symmetrical power supplies the circuit is short-circuit-proof up to VP=21V.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
±V
P
supply voltage 21 V
I
OSM
non-repetitive peak output current 4A
P
tot
total power dissipation see Fig.3 15 W
T
stg
storage temperature range 55 +150 °C
T
xtal
crystal temperature +150 °C
T
amb
ambient operating temperature range 25 +150 °C
t
sc
short-circuit time short-circuit to ground; note 1 1h
Fig.3 Power derating curve.
– 25 0 50 150
16
12
4
0
8
MCD368 - 2
100
T ( C)
o
amb
P
(W)
tot
infinite heatsink
R = 5.5 K/W
th-hs
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-c
thermal resistance from junction to case 6 K/W
Page 6
1995 May 08 6
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
±V
P
supply voltage range 12 21 V
I
ORM
repetitive peak output current 2.2 −−A Operating position; note 1 ±V
P
supply voltage range 7.5 12 21 V I
q(tot)
total quiescent current RL= 18 40 70 mA P
O
output power THD = 0.5% 5 6 W
THD = 10% 6.5 8 W THD total harmonic distortion PO=4W 0.15 0.2 % B power bandwidth THD = 0.5%; note 2 20 to 20000 Hz G
v
voltage gain 29 30 31 dB
G
v
gain unbalance 0.2 1 dB
V
no
noise output voltage note 3 70 140 µV
Z
i
input impedance 14 20 26 k
SVRR supply voltage ripple rejection note 4 40 60 dB
α
cs
channel separation RS= 0 46 70 dB
I
bias
input bias current 0.3 −µA
∆V
GND
DC output offset voltage 30 200 mV
∆V
46
DC output offset voltage between two channels 4 150 mV
MUTE POSITION (AT I
MUTE
300 µA)
V
O
output voltage VI= 600 mV 0.3 1.0 mV
Z
27
mute input impedance 9 k
I
q(tot)
total quiescent current RL= 18 40 70 mA
V
no
noise output voltage note 3 70 140 µV SVRR supply voltage ripple rejection note 4 40 55 dB ∆V
GND
DC output offset voltage 40 200 mV
∆V
off
offset voltage with respect to
operating position
4 150 mV
I
2
current if pin 2 is connected to pin 5 −− 6mA Mute position; note 5 ±V
P
supply voltage range 2 5.8 V I
P
total quiescent current RL= 930 40mA V
O
output voltage VI= 600 mV 0.3 1.0 mV V
no
noise output voltage note 3 70 140 µV SVRR supply voltage ripple rejection note 4 40 55 dB ∆V
GND
DC output offset voltage 40 200 mV
Page 7
1995 May 08 7
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
Notes
1. VP= ±12 V; RL=8Ω; T
amb
=25°C; fi= 1 kHz; symmetrical power supply I
MUTE
= < 30 µA (see Fig.4).
2. The power bandwidth is measured at a maximum output power (P
Omax
) of 3 dB.
3. The noise output voltage (RMS value) is measured at RS=2kΩ, unweighted (20 Hz to 20 kHz).
4. The ripple rejection is measured at RS= 0 and fi= 100 Hz to 20 kHz. The ripple voltage (200 mV) is applied in phase to the positive and the negative supply rails. With asymmetrical power supplies, the ripple rejection is measured at fi= 1 kHz.
5. ±VP= 4 V; RL=8Ω; T
amb
=25°C; fi= 1 kHz; symmetrical power supply (see Fig.4).
6. VP= 24 V; RL=8Ω; T
amb
=25°C; fi= 1 kHz; asymmetrical power supply I
MUTE
< 30 µA (see Fig.5).
7. The internal network at pin 2 is a resistor divider of typical 4 k and 5 k to the positive supply rail. At the connection of the 4 k and 5 k resistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread of the zener voltage is 6.1 to 7.1 V.
Operating position; note 6 I
q(tot)
total quiescent current 18 40 70 mA
P
O
output power THD = 0.5% 5 6 W
THD = 10% 6.5 8 W
THD total harmonic distortion P
O
=4W 0.13 0.2 % B power bandwidth THD = 0.5%; note 1 40 to 20000 Hz G
v
voltage gain 29 30 31 dB
G
v
gain unbalance 0.2 1 dB
V
no
noise output voltage note 3 70 140 µV
Z
i
input impedance 14 20 26 k
SVRR supply voltage ripple rejection 35 44 dB
α
cs
channel separation 45 dB
MUTE POSITION (I
MUTE
300 µA)
V
O
output voltage VI= 600 mV 0.3 1.0 mV
Z
27
mute input impedance note 7 6.7 9 11.3 k
I
q(tot)
total quiescent current 18 40 70 mA
V
no
noise output voltage note 3 70 140 µV SVRR supply voltage ripple rejection note 4 35 44 dB ∆V
off
offset voltage with respect to operating
position
4 150 mV
I
2
current if pin 2 is connected to pin 5 −− 6mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Page 8
1995 May 08 8
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
TEST AND APPLICATION INFORMATION
Fig.4 Test and application circuit with symmetrical power supply.
2200 µF
72
mute input
P
+ V
5
TDA2615
MLA710 - 2
100 nF
6
20 k
8
20 k680
220 nF
9
R = 8
L
22 nF
8.2
I
V
P
– V
3
R = 8
L
22 nF
8.2
4
20 k
220 nF
1
I
V
20 k680
2200 µF
Page 9
1995 May 08 9
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
Fig.5 Test and application circuit with asymmetrical power supply.
6
20 k
5
8
3
MLA709 - 1
20 k680
9
R = 8
L
22 nF
680 µF
8.2
100 nF
2200 µF
72
mute input
S
V
S
R
P
V
2
4
20 k
1
220 nF
100 µF
I
V
220 nF
I
V
20 k680
P
1/2 V
internal
R = 8
L
22 nF
680 µF
8.2
TDA2615
Page 10
1995 May 08 10
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
PACKAGE OUTLINE
UNIT
A
A
max.
2
A
3
b
1
D
1
b
2
bcD
(1)
E
(1)
Z
max.
(1)
eLPP
1
q1q
2
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
18.5
17.8
3.7
8.7
8.0
A
4
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
3.4
3.2
2.54
1.0
5.9
5.7
4.4
4.2
3.9
3.4
15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1
92-11-17 95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A
2
3
A
4
q
1
q
2
L
Q
w M
b
b
1
b
2
D
1
P
q
1
Z
e
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
Page 11
1995 May 08 11
Philips Semiconductors Product specification
2 × 6 W hi-fi audio power amplifier TDA2615
SOLDERING Plastic single in-line packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is 260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 12
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Philips Semiconductors
Printed in The Netherlands
513061/1500/03/pp12 Date of release: 1995 May 08 Document order number: 9397 750 00122
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