Output trailing edge currentI
Saturation voltage at horizontal scanV
Clamping circuit for vertical blanking pulse (pin 6) (note 3)
Output voltage at I6= 2,8 mAV
Minimum output current
at V
> 2,15 VI
6-5
Maximum output current
at V
< 3VI
6-5
TV-transmitter identification (pin 12) (note 4)
Output voltage
no TV transmitterV
TV transmitter identifiedV
∆t−2,6 ± 0,7−µs
∆I/∆t−30−µA/µs
6-5
p
t
ϕ6
6
6-5
6
6-5sat
6-5
6min
6max
12-5
12-5
1011−V
3,744,3µs
2,152,653,15µs
−2−mA
4,14,54,9V
−2−mA
−−0,5V
2,152,53V
−2,3−mA
−3,3−mA
−−1V
7−−V
March 19879
Page 10
Philips SemiconductorsProduct specification
Horizontal combinationTDA2595
PARAMETERSYMBOLMIN.TYP.MAX.UNIT
Mute output (pin 7)
Output voltage at I
no TV transmitterV
Output resistance at I
no TV transmitterR
Output leakage current
at V
12-5
> 3V
TV transmitter identifiedI
Protection circuit (beam-current/ EHT voltage protection) (pin 8)
No-load voltage for I8=0
(operative condition)V
Threshold at positive-going voltageV
Threshold at negative-going voltageV
Current limiting for V
Input resistance for V
Internal response delay of threshold switcht
Control output of line flyback pulse control (pin 1)
Saturation voltage at standard operation; I7=3mAV
Output leakage current in case of disturbance of line
flyback pulse
=3mA
7
=3mA
7
= 1 to 8,5 V± I
8-5
> 8,5 VR
8-5
7
d
I
1
7-5
7-5
8-5
8-5
8-5
8
8-5
1-5sat
−−0,5V
−−100Ω
−−5 µA
−6−V
−8 ± 0,8−V
−4 ± 0,4−V
−60−µA
−3−kΩ
−10−µs
−−0,5V
−−5 µA
Notes to the characteristics
1. Phase comparison between horizontal oscillator and the line flyback pulse. Generation of a phase modulated
( ϕ2 ) horizontal output pulse with constant duration.
2. tfp is the line flyback pulse duration.
3. Three-level sandcastle pulse.
4. If pin 12 is connected to Vp the vertical output is active independent of synchronization state.
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT102-1
12
min.
max.
IEC JEDEC EIAJ
b
1.40
1.14
0.055
0.044
b
1
0.53
0.38
0.021
0.015
b
cD E eM
2
0.32
1.40
0.23
1.14
0.013
0.055
0.009
0.044
REFERENCES
21.8
21.4
0.86
0.84
March 198711
9
(1)(1)
6.48
6.20
0.26
0.24
L
e
1
M
3.9
8.25
3.4
7.80
0.15
0.32
0.13
0.31
EUROPEAN
PROJECTION
E
0.37
0.33
H
9.5
8.3
w
max.
0.2542.547.62
ISSUE DATE
0.010.100.30
93-10-14
95-01-23
0.854.70.513.7
0.0330.190.0200.15
(1)
Z
Page 12
Philips SemiconductorsProduct specification
Horizontal combinationTDA2595
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 198712
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