Datasheet TDA2546A Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA2546A

Quasi-split-sound circuit
with 5,5 MHz demodulation

Product specification
File under Integrated Circuits, IC02

February 1985

Philips Semiconductors Product specification

Quasi-split-sound circuit

TDA2546A

with 5,5 MHz demodulation

GENERAL DESCRIPTION

The TDA2546A is a monolithic integrated circuit for quasi-split-sound processing, including 5,5 MHz demodulation, in
television receivers.

Features

1st i.f. (V.C.: vision carrier plus S.C.: sound carrier)

• 3-stage gain controlled i.f. amplifier

• A.G.C. circuit

• Reference amplifier and limiter amplifier for vision carrier (V.C.) processing

• Linear multiplier for quadrature demodulation

2nd i.f. (5,5 MHz signal)

• 8-stage limiter amplifier

• Quadrature demodulator

• A.F. amplifier with de-emphasis

• AV switch

QUICK REFERENCE DATA

Supply voltage (pin 15) V
Supply current (pin 15) I

P=I15

Minimum i.f. vision carrier input voltage (r.m.s. value) V
Output voltage; 5,5 MHz (r.m.s. value) V
Output voltage; 5,742 MHz (r.m.s. value) V
I.F. control range ∆G

P=V15-16

VC1-18 (rms)
14-16(rms)
14-16(rms)

v

typ. 12 V
typ. 57 mA
typ. 150 µV
typ. 100 mV
typ. 45 mV
typ. 64 dB

Signal-to-weighted-noise ratio (rel. to 1 kHz; 30 kHz deviation)

at 5,5 MHz S + W/W typ. 58 dB

for 2T/20T pulses with white bars

at 5,742 MHz S + W/W typ. 56 dB

A.F. output voltage (r.m.s. value) V

o6-16(rms)

typ. 0,6 V

PACKAGE OUTLINES

18-lead DIL; plastic (SOT 102); SOT102-1; 1996 November 19.

February 1985 2

Philips Semiconductors Product specification

Quasi-split-sound circuit
with 5,5 MHz demodulation

TDA2546A

February 1985 3

Fig.1 Block diagram.

(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.)

Philips Semiconductors Product specification

Quasi-split-sound circuit
with 5,5 MHz demodulation

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 15) V
Input current (pin 4) I
Storage temperature range T
Operating ambient temperature range T

P

4

stg
amb

= V

15-16

TDA2546A

max. 13,2 V
max. 7 mA

−25 to +150 °C
0 to +70 °C

February 1985 4

Philips Semiconductors Product specification

Quasi-split-sound circuit

TDA2546A

with 5,5 MHz demodulation

CHARACTERISTICS

V

P=V15-16

= 12 V; T
Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10%
residual carrier).
Vision carrier amplitude (r.m.s. value) is V
Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB.
Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f=±30 kHz.
For measuring circuit see Fig.2; unless otherwise specified.

Supply (pin 15)

Supply voltage V
Supply current I

I.F. amplifier

Input voltage for start of gain control

(intercarrier signals −3 dB) V

Input voltage for end of gain control

(intercarrier signals + 1 dB) V
I.F. gain control range ∆G
Control voltage range (see Fig.3) V
Input resistance R
Input capacitance C

Intercarrier generation

Output voltage; 5,5 MHz (r.m.s. value) V
Output voltage; 5,742 MHz (r.m.s. value) V
D.C. output voltage V
Allowable d.c. load resistance at the output R
Allowable output current −I

Frequency demodulator (measured at f = 5,5 MHz)
Input voltage vor start of limiting (r.m.s. value) V

Maximum input voltage (r.m.s. value) V
D.C. output voltage V
A.F. output voltage (r.m.s. value) V
D.C. output voltage v
Allowable d.c. load resistance at the output R
Allowable a.c. load impedance at the output Z
Total harmonic distortion THD −−1%
Internal de-emphasis resistance R
Switching voltage (pin 4)

for mute V

for a.f. on V

=25°C; measured at fVC= 38,9 MHz, f

amb

= 10 mV.

VC

= 33,4 MHz, f

SC1

= 33,158 MHz:

SC2

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

P=V15-16

P=I15

VC1-18(rms)

VC1-18 (rms)

v
3-16
1-18
1-18

14-16(rms)
14-16(rms)
14-16
14-16

14

12-16(rms)
12-16 (rms)
11,12,13-16
6-16(rms)

6-16

6-16
6-16

i5-16

4-16
4-16

10,8 12 13,2 V
40 57 75 mA

− 150 200 µV

100 250 − mV
60 64 − dB
4 − V

p

V

− 2,5 − kΩ

− 1,5 − pF

60 100 140 mV
27 45 63 mV

− 5,9 − V
7 −−V

−−1mA

−−100 µV

− 200 − mV

− 2,2 − V

450 600 810 mV

− 4 − V
27 −−kΩ
10 −−kΩ

− 1 − kΩ

9 −−V

−−2,5 V

February 1985 5

Philips Semiconductors Product specification

Quasi-split-sound circuit

TDA2546A

with 5,5 MHz demodulation

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Intercarrier signal-to-noise

(measured behind the FM demodulators)
Signal-to-weighted-noise ratio according to

CCIR 468-2, quasi-peak 2T/20T pulses with white
bars (see also Fig.4)

at 5,5 MHz S+W/W 53 58 − dB
at 5,742 MHz S+W/W 51 56 − dB

6 kHz sine wave

at 5,5 MHz S+W/W 50 53 − dB
at 5,742 MHz S+W/W 50 53 − dB

with black level (vision carrier modulated with sync
pulses only)

at 5,5 MHz S+W/W 60 65 − dB
at 5,742 MHz S+W/W 58 63 − dB

Notes to the characteristics

1. Incidential phase on the vision carrier, caused by TV-transmitter, has to be less than 0,5 degrees for black to white
transient.
(Equivalent to S+W/W = 56 dB for 6 kHz sine wave).

February 1985 6

Philips Semiconductors Product specification

Quasi-split-sound circuit
with 5,5 MHz demodulation

TDA2546A

(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.)

Fig.2 Measuring circuit for TDA2546A.

Fig.3 Control voltage at pin 3 as a function of the input voltage V

February 1985 7

VC1-18(rms).

Philips Semiconductors Product specification

Quasi-split-sound circuit
with 5,5 MHz demodulation

TDA2546A

Fig.4 Signal-to-weighted-noise ratio depending on video modulation.

February 1985 8

Philips Semiconductors Product specification

Quasi-split-sound circuit
with 5,5 MHz demodulation

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil)

D

seating plane

L

Z

18

e

b

TDA2546A

SOT102-1

M

E

A

2

A

A

1

w M

b

1

b

2

10

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT102-1

12

min.

max.

IEC JEDEC EIAJ

b

1.40

1.14

0.055

0.044

b

1

0.53

0.38

0.021

0.015

b

2

0.32

1.40

0.23

1.14

0.013

0.055

0.009

0.044

REFERENCES

(1) (1)

cD E e M

21.8

21.4

0.86

0.84

9

6.48

6.20

0.26

0.24

E

(1)

Z

L

e

1

M

3.9

8.25

3.4

7.80

0.15

0.32

0.13

0.31

EUROPEAN

PROJECTION

E

0.37

0.33

H

9.5

8.3

w

max.

0.2542.54 7.62

0.854.7 0.51 3.7

0.010.10 0.30

0.0330.19 0.020 0.15

ISSUE DATE

93-10-14
95-01-23

February 1985 9

Philips Semiconductors Product specification

Quasi-split-sound circuit

TDA2546A

with 5,5 MHz demodulation

SOLDERING
Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

February 1985 10