Signal-to-weighted-noise (rel. to 1 kHz; 30 kHz deviation)
at 5,5 MHz
at 5,742 MHzS + W/Wtyp.56dB
for 2T/20T pulses with white bars
S + W/Wtyp.58dB
PACKAGE OUTLINES
16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 19.
February 19852
Page 3
Philips SemiconductorsProduct specification
Quasi-split-sound circuitTDA2545A
(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.).
Fig.1 Block diagram.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 11)V
Storage temperature rangeT
Operating ambient temperature rangeT
= V
P
stg
amb
max.13,2V
11-13
−25to+ 150°C
0to+70°C
February 19853
Page 4
Philips SemiconductorsProduct specification
Quasi-split-sound circuitTDA2545A
CHARACTERISTICS
V
= V
P
Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10%
residual carrier).
Vision carrier amplitude (r.m.s. value) is V
Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB.
Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f= ±30 kHz.
For measuring circuit see Fig.2; unless otherwise specified.
Supply (pin 11)
Supply voltageV
Supply currentI
I.F. amplifier
Input voltage for start of gain control
(intercarrier signals −3 dB)V
Input voltage for end of gain control
(intercarrier signals + 1 dB)V
I.F. gain control range∆G
Control voltage range (see Fig.3)V
Input resistanceR
Input capacitanceC
Intercarrier signal-to-noise (see note 1)
(measured behind the FM demodulators)
weighted according to CCIR 468-2, quasi-peak
a. 2T/20T pulses with white bars (see also Fig.4)
at 5,5 MHzS+W/W5358−dB
at 5,742 MHzS+W/W5156−dB
b. 6 kHz sinewave
at 5,5 MHzS+W/W5053−dB
at 5,742 MHzS+W/W5053−dB
c. black level (sync pulses only)
at 5,5 MHzS+W/W6065−dB
at 5,742 MHzS+W/W5863−dB
11-13
= 12 V; T
= 25 °C; measured at fVC = 38,9 MHz, f
amb
= 10 mV.
VC
= 33,4 MHz, f
SC1
= 33,158 MHz:
SC2
PARAMETERSYMBOLMIN.TYP.MAX.UNIT
= V
P
11-13
= I
P
11
VC1-16(rms)
VC1-16(rms)
v
3-13
1-16
1-16
12-13(rms)
12-13(rms)
12-13
12-13
12
10,81213,2V
334555mA
−150200µV
100250−mV
6064−dB
4−V
p
−2,5−kΩ
−1,5−pF
60100140mV
274563mV
−5,9−V
7−−kΩ
−−1mA
V
Note
1. Incidental phase on the vision carrier, caused by TV transmitter, has to be less than 0,5 degrees for black to white
transient (equivalent to S+W/W = 56 dB for 6 kHz sinewave).
February 19854
Page 5
Philips SemiconductorsProduct specification
Quasi-split-sound circuitTDA2545A
Fig.2 Measuring circuit for TDA2545A.
Fig.3 Control voltage at pin 3 as a function of the input voltage V
February 19855
VC1-16(rms).
Page 6
Philips SemiconductorsProduct specification
Quasi-split-sound circuitTDA2545A
Fig.4 Signal-to-weighted-noise ratio depending on video modulation.
February 19856
Page 7
Philips SemiconductorsProduct specification
Quasi-split-sound circuitTDA2545A
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
1
w M
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
E
1
0510 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEeM
0.32
0.23
0.013
0.009
REFERENCES
(1)(1)
D
21.8
21.4
0.86
0.84
February 19857
8
6.48
6.20
0.26
0.24
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.547.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02
95-01-19
Z
max.
2.2
0.087
(1)
Page 8
Philips SemiconductorsProduct specification
Quasi-split-sound circuitTDA2545A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 19858
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