Datasheet TDA2545A Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA2545A

Quasi-split-sound circuit

Product specification
File under Integrated Circuits, IC02

February 1985

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

GENERAL DESCRIPTION

The TDA2545A is a monolithic integrated circuit for quasi-split-sound processing in television receivers.

Features

• 3-stage gain controlled i.f. amplifier

• A.G.C. circuit

• Reference amplifier and limiter amplifier for vision carrier (V.C.) processing

• Linear multiplier for quadrature demodulation

QUICK REFERENCE DATA

Supply voltage (pin 11) V
Supply current (pin 11) I
Minimum i.f. vision carrier input voltage (r.m.s. value) V
Output voltage; 5,5 MHz (r.m.s. value) V
Output voltage; 5,742 MHz (r.m.s. value) V
I.F. control range ∆G

= V

P

11-13

= I

P

11
VC1-16(rms)
12-13(rms)
12-13(rms)

v

typ. 12 V
typ. 45 mA
typ. 150 µV
typ. 100 mV
typ. 45 mV
typ. 64 dB

Signal-to-weighted-noise (rel. to 1 kHz; 30 kHz deviation)

at 5,5 MHz
at 5,742 MHz S + W/W typ. 56 dB

for 2T/20T pulses with white bars

S + W/W typ. 58 dB

PACKAGE OUTLINES

16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 19.

February 1985 2

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.).

Fig.1 Block diagram.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 11) V
Storage temperature range T
Operating ambient temperature range T

= V

P
stg
amb

max. 13,2 V

11-13

−25 to + 150 °C
0to+70 °C

February 1985 3

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

CHARACTERISTICS

V

= V

P

Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10%
residual carrier).
Vision carrier amplitude (r.m.s. value) is V
Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB.
Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f= ±30 kHz.
For measuring circuit see Fig.2; unless otherwise specified.

Supply (pin 11)

Supply voltage V
Supply current I

I.F. amplifier

Input voltage for start of gain control

(intercarrier signals −3 dB) V

Input voltage for end of gain control

(intercarrier signals + 1 dB) V
I.F. gain control range ∆G
Control voltage range (see Fig.3) V
Input resistance R
Input capacitance C

Intercarrier generation

Output voltage; 5,5 MHz (r.m.s. value) V
Output voltage; 5,742 MHz (r.m.s. value) V
D.C. output voltage V
Allowable d.c. load resistance at the output R
Allowable output current −I

Intercarrier signal-to-noise (see note 1)
(measured behind the FM demodulators)

weighted according to CCIR 468-2, quasi-peak
a. 2T/20T pulses with white bars (see also Fig.4)

at 5,5 MHz S+W/W 53 58 − dB

at 5,742 MHz S+W/W 51 56 − dB
b. 6 kHz sinewave

at 5,5 MHz S+W/W 50 53 − dB

at 5,742 MHz S+W/W 50 53 − dB
c. black level (sync pulses only)

at 5,5 MHz S+W/W 60 65 − dB

at 5,742 MHz S+W/W 58 63 − dB

11-13

= 12 V; T

= 25 °C; measured at fVC = 38,9 MHz, f

amb

= 10 mV.

VC

= 33,4 MHz, f

SC1

= 33,158 MHz:

SC2

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

= V

P

11-13

= I

P

11

VC1-16(rms)

VC1-16(rms)

v
3-13
1-16
1-16

12-13(rms)
12-13(rms)
12-13
12-13

12

10,8 12 13,2 V
33 45 55 mA

− 150 200 µV

100 250 − mV
60 64 − dB
4 − V

p

− 2,5 − kΩ

− 1,5 − pF

60 100 140 mV
27 45 63 mV

− 5,9 − V
7 −−kΩ

−−1mA

V

Note

1. Incidental phase on the vision carrier, caused by TV transmitter, has to be less than 0,5 degrees for black to white
transient (equivalent to S+W/W = 56 dB for 6 kHz sinewave).

February 1985 4

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

Fig.2 Measuring circuit for TDA2545A.

Fig.3 Control voltage at pin 3 as a function of the input voltage V

February 1985 5

VC1-16(rms).

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

Fig.4 Signal-to-weighted-noise ratio depending on video modulation.

February 1985 6

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

pin 1 index

e

b

b

1

9

A

1

w M

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

E

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

D

21.8

21.4

0.86

0.84

February 1985 7

8

6.48

6.20

0.26

0.24

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

w

92-10-02
95-01-19

Z

max.

2.2

0.087

(1)

Philips Semiconductors Product specification

Quasi-split-sound circuit TDA2545A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

February 1985 8