Page 1
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
.
DRIVES VERTICAL DEFLECTION WINDINGS DIRECTLY
.
HIGH EFFICIENCY
.
INTERNAL FLYBACK GENERATOR
.
THERMAL PROTE CT ION
.
ON-CHIP VOLTAGE REFERENCE
.
HIGH OUTPUT CURRENT (2.2 A peak )
.
16-LEAD POWERDIP PLASTIC PACKAGE
TDA2270
DIP16
(Plastic package)
ORDER CODE : TDA2270
PIN CONNECTIONS
DESCRIPTIO N
The TDA2270 is a high efficiency monolithic output
stage for vertical deflection circuits in TVs and
monitors. Driving the vertical windings direc tly, the
device contains a power amplifier, flyback generator, voltage reference and thermal protection circuit.
The TDA2270 is supplied in a 16-pin DIP with the
four center pins connected together and used for
heatsinking.
BLOCK DIAGRAM
15
16
REFERENCE
VOLTAGE
POWER
AMP.
SUPPLY VOLTAGE
FLYBACK
GENERATOR
OUTPUT
OUTPUT STAGE
SUPPLY
281
FLYBACK
GENERATOR
THERMAL
PROTECTION
GND
GND
7
NC
NC
1
2
3
4
5
6
7
8
+V
S
16
15
14
13
12
11
10
9
YOKE
NON-INVERTING
INPUT
INVERTING INPUT
NC
GND
GND
NC
GND
REFERENCE
VOLTAGE
2270-01.EPS
September 1992
9
12 13 10
4
5
2270-02.EPS
1/7
Page 2
TDA2270
ABSOL UTE MAX IM UM R ATING S
Symbol Parameter Value Unit
V
s
, V
V
7
V
2
V15, V
I
o
I
o
I
o
I
2
I
2
P
tot
, TjStorage and Junction Temperature – 40 to 150 °C
T
stg
THERMAL DATA
Symbol Parameter Value Unit
R
th j–case
R
th j–amb
* Obtained with the GND pins soldered to printed circuit with minimized copper area.
Supply Voltage (pin 1) 35 V
Flyback Peak Voltage 60 V
8
Voltage at Pin 2 + V
Amplifier Input Voltage + Vs, – 0.5 V
16
s
Output Peak Current (non repetitive, t = 2 ms) 2 A
Output Peak Current at f = 50 Hz, t ≤ 10 µs 2.2 A
Output Peak Current at f = 50 Hz, t > 10 µs 1.2 A
Pin 2 DC Current at V7 < V
1
Pin 2 Peak to Peak Flyback Current at f = 50 Hz, t
Total Power Dissipation at T
pins
T
amb
≤ 90 °C
= 70 °C
≤ 1.5 ms 2 A
fly
50 mA
4.3
1
Thermal Resistance Junction-case Max 14 °C/W
Thermal Resistance Junction–ambient Max 80 °C/W
W
W
2270-01.TBL
2270-02.TBL
ELECTRICAL CHARACT E RIS TICS
(refer to the test circuits, V
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
Pin 1 Quiescent Current I2 = o, I7 = 0, V16 = 3 V 8 16 mA 1a
I
1
Pin 8 Quiescent Current I2 = 0, I7 = 0, V16 = 3 V 16 36 mA 1a
I
8
I
I
V
V
V
V
V
∆V
∆V
R
Amplifier Input Bias Current V15 = 1 V – 0.1 – 1 µA1a
15
Amplifier Input Bias Current V16 = 1 V – 0.1 – 1 µA1a
16
Pin 2 Saturation Voltage to GND I2 = 20 mA 1 V 1c
2L
Quiescent Output Voltage Vs = 35 V, Ra = 39 kΩ
7
Output Saturation Voltage to GND I7 = 0.7 A 0.7 1 V 1c
7L
Output Saturation Voltage to Supply – I7 = 0.7 A 1.3 1.8 V 1b
7H
Reference Voltage I9 = 0 2.2 V 1a
9
Reference Voltage Drift versus Supply
9
Voltage
S
Reference Voltage Output Resistance 2.1 kΩ
9
Junction Temperature for Thermal Shut
T
j
Down
= 35 V, T
S
= 25oC unless otherwise specified)
amb
= 15 V, Ra = 13 kΩ
V
s
Vs = 15 to 30 V 1 2 mV/V 1a
18
7.5
140 °C
VV1d
1d
2270-03.TBL
2/7
Page 3
Figure 1 : DC Test Circuits
TDA2270
Figure 1a : Measurement of I1 ; I8 ; I15 ; I16 ; V9 ;
/∆VS ; R
∆V
9
S1 : (a) I15 ; (b) I16, I7 and I8.
S2 : (a) I7 and I8 ; (b) I16, (c) I15.
S3 : (a) I15, I16, I7, I8, I9 and V9 ; (b) R
Figure 1c : Measurement of V2L ; V
9
9
7L
Figure 1b : Measurement of V
2270-03.EPS
Figure 1d : Measurement of V
7H
2270-04.EPS
7
S1 : (a) V2L ; (b) V
2270-05.EPS
7L
2270-06.EPS
3/7
Page 4
TDA2270
Figure 2 : A pplicat io n Cir cuit
Figure 3 : PC Board and Component Layout (1 : 1 scale)
2270-07.EPS
4/7
2270-08.TIF
Page 5
COMPONE NT S LIS T FOR T YP ICAL APPLICATIONS (refer to the fig. 2 )
Component
B/W TV
10 Ω / 20 mH / 1 App
15 Ω / 30 mH / 0.82 App
RT1 10 10 kΩ
R1 10 12 kΩ
R2 5.6 5.6 kΩ
R3 15 18 kΩ
R4 6.8 5.6 kΩ
R5 1 1 Ω
R6 330 330 Ω
R7 1.5 1.5 Ω
D1 1N 4001 1N 4001 –
C1 0.1 0.1 µF
C2 el. 470/25 V 470/25 V µF
C3 el. 220/25 V 220/25 V µF
C4 0.22 0.22 µF
C5 el. 1000/25 V 1000/16 V µF
C6 el. 10/16 V 10/16 V µF
90° TVC
TDA2270
Unit
2270-04.TBL
TYPICAL PE RF O RMANCE
Parameter
V
– Supply Voltage 20 25 V
s
– Current 145 125 mA
I
s
– Flyback Time 0.75 0.7 ms
t
fly
– Power Dissipation 1.8 2.05 W
* P
tot
– Heatsink 14 12 °C/W
* R
th c–a
T
amb
T
j max
t
o
V
i
– Flyback Voltage 42 52 Vp
V
7
B/W TV
10 Ω / 20 mH / 1 App
60 60 °C
130 130 °C
20 20 ms
2.5 2.5 Vpp
90° TVC
15 Ω / 30 mH
Unit
2270-05.TBL
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Page 6
TDA2270
MOUNTING INSTRUCTIONS
The R
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 4) or to an ext ernal
heatsink (fig. 5).
The diagram of figure 6 shows the maximum dissipable power P
the side "l" of two eq ual square copper areas having
of the TDA 2270 can be reduced by
th j-amb
and the R
tot
as a function of
th j-amb
a thickness of 35 µ (1.4 mils).
During soldering the pins temperature must not
exceed 260 °C and the s oldering time m ust not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 4 : Example of P.C. Board Copper Area
which is Used as Heatsink
Figure 6 : Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
versus Side "l"
Figure 5 : External Heatsink Mounting Example
2270-09.EPS
Figure 7 : Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
2270-10.EPS
6/7
2270-11.EPS
2270-12.EPS
Page 7
PACKAGE MECHANICAL DATA
16 PINS - PLASTIC DIP
TDA2270
a1
Z
b
B
e
e3
I
L
b1
E
D
16
9
F
18
Dimensions
Min. Typ. Max. Min. Typ. Max.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
i 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
Millimeters Inches
PM-DIP16.EPS
DIP16.TBL
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwi se under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously suppli ed. SGS-THOMSON Microele ctronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
© 1994 SGS-THOMSON Microelectronics - All Rights Reserved
2
Purchase of I
2
C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
I
Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
2
C Standard Specifications as defined by Philips.
the I
SGS-THOMSON Microelectronics G ROUP OF COMPANIES
7/7
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