Product specification
File under Integrated Circuits, IC01
February 1985
Page 2
Philips SemiconductorsProduct specification
Integrated FM tuner for radio receiversTDA1574
GENERAL DESCRIPTION
The TDA1574 is a monolithic integrated FM tuner circuit designed for use in the r.f./i.f. section of car radios and
home-receivers. The circuit comprises a mixer, oscillator and a linear i.f. amplifier for signal processing, plus the following
additional features.
Features
• Keyed automatic gain control (a.g.c.)
• Regulated reference voltage
• Buffered oscillator output
• Electronic standby switch
• Internal buffered mixer driving.
QUICK REFERENCE DATA
Supply voltage range (pin 15)V
Mixer input bias voltage (pins 1 and 2)V
P
1, 2-4
7 to 16 V
typ.1 V
noise figureNFtyp.9 dB
Oscillator output voltage (pin 6)V
6-4
typ.2 V
output admittance at pin 6 for f = 108,7 MHzY22typ.1,5 + j2 mS
Oscillator output buffer
D.C. output voltage (pin 9)V
9-4
typ.6 V
Total harmonic distortionTHDtyp.−15 dBC
Linear i.f. amplifier output voltage (pin 10)V
noise figure at R
= 300 ΩNFtyp.6,5 dB
S
Keyed a.g.c. output voltage range (pin 18)V
10-4
18-4
typ.4,5 V
+ 0,5 to VP− 0,3 V
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 August 08.
The mixer circuit is a double balanced multiplier with a preamplifier (common base input) to obtain a large signal handling
range and a low oscillator radiation.
Oscillator
The oscillator circuit is an amplifier with a differential input. Voltage regulation is achieved by utilizing the symmetrical
tanh-transfer-function to obtain low order 2nd harmonics.
Linear IF amplifier
The IF amplifier is a one stage, differential input, wideband amplifier with an output buffer.
Keyed AGC
The AGC processor combines narrow- and wideband information via an RF level detector, a comparator and an ANDing
stage. The level dependent, current sinking output has an active load, which sets the AGC threshold.
The AGC function can either be controlled by a combination of wideband and narrowband information (keyed AGC), or
by a wideband information only, or by narrowband information only. If only narrow-band AGC is wanted pin 3 should be
connected to pin 5. If only wideband AGC is wanted pin 12 should be connected to pin 13.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 15)V
Mixer output voltage (pins 16 and 17)V
Standby switch input voltage (pin 11)V
Reference voltage (pin 5)V
Field strength input voltage (pin 12)V
Total power dissipationP
Storage temperature rangeT
Operating ambient temperature rangeT
= V
P
16, 17-4
11-4
5-4
12-4
tot
stg
amb
15-4
max.18 V
max.35 V
max.23 V
max.7 V
max.7 V
max.800 mW
−55 to + 150 °C
−40 to + 85 °C
THERMAL RESISTANCE
From junction to ambient (in free air)R
th j-amb
=80 K/W
Note
All pins are short-circuit protected to ground.
February 19854
Page 5
Philips SemiconductorsProduct specification
Integrated FM tuner for radio receiversTDA1574
CHARACTERISTICS
= V
V
P
Supply (pin 15)
Supply voltageV
Supply current (except mixer)I
Reference voltage (pin 5)V
Mixer
D.C. characteristics
Input bias voltage (pins 1 and 2)V
Output voltage (pins 16 and 17)V
Output current (pin 16 + pin 17)I
A.C. characteristics (fi= 98 MHz)
Noise figureNF−9−dB
Noise figure including transforming networkNF−11−dB
3rd order intercept pointEMF1
Conversion power gain
10
= 8,5 V; T
15-4
= 25 °C; measured in test circuit Fig.1; unless otherwise specified
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT102-1
12
min.
max.
IEC JEDEC EIAJ
b
1.40
1.14
0.055
0.044
b
1
0.53
0.38
0.021
0.015
b
cD E eM
2
0.32
1.40
0.23
1.14
0.013
0.055
0.009
0.044
REFERENCES
21.8
21.4
0.86
0.84
February 198510
9
(1)(1)
6.48
6.20
0.26
0.24
L
e
1
M
3.9
8.25
3.4
7.80
0.15
0.32
0.13
0.31
EUROPEAN
PROJECTION
E
0.37
0.33
H
9.5
8.3
w
max.
0.2542.547.62
0.854.70.513.7
0.010.100.30
0.0330.190.0200.15
ISSUE DATE
93-10-14
95-01-23
(1)
Z
Page 11
Philips SemiconductorsProduct specification
Integrated FM tuner for radio receiversTDA1574
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 198511
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