Datasheet TCF6000D, TCF6000 Datasheet (Motorola)

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The TCF6000 was designed to protect input/output lines of
microprocessor systems against voltage transients.
Optimized for HMOS System
Minimal Component Count
Low Board Space Requirement
No P.C.B. Track Crossovers Required
Applications Areas Include Automotive, Industrial,
Telecommunications and Consumer Goods
Figure 1. Representative Block Diagram and
Simplified Application
V
V
CC
V
Gnd
Ref
Generator
V
Ref
Pin
DD
PERIPHERAL CLAMPING
SEMICONDUCTOR
TECHNICAL DATA
D SUFFIX
PLASTIC PACKAGE
8
1
NO SUFFIX
PLASTIC PACKAGE
CASE 626
PIN CONNECTIONS
Gnd
1 2
Clamp
3
Clamp
45
Clamp
CASE 751
(SO–8)
V
8
CC
7
Clamp
6
Clamp Clamp
Gnd
Each Cell
Digital Inputs
Analog
Inputs
R
in
Gnd
MOTOROLA ANALOG IC DEVICE DATA
Micro
Computer
ORDERING INFORMATION
Operating
C
in
Device
TCF6000D TCF6000
Motorola, Inc. 1996 Rev 0
Temperature Range
TA = – 40° to +85°C
Package
SO–8
Plastic DIP
1
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TCF6000
MAXIMUM RATINGS
Supply Voltage V Supply Current I Clamping Current I Junction Temperature T Power Dissipation (TA = + 85°C) P Thermal Resistance (Junction–Ambient) θ Operating Ambient Temperature Range T Storage Temperature Range T
NOTE: 1. Values beyond which damage may occur .
ELECTRICAL CHARACTERISTICS (T
Positive Clamping Voltage (Note 2)
(IIK = 10 mA, –40°C TA + 85°C) Positive Peak Clamping Current I Negative Peak Clamping Voltage
(IIK = –10 mA, –40°C TA + 85°C) Negative Peak Clamping Current I Output Leakage Current
(0 V Vin VCC)
(0 V Vin VCC, –40°C TA + 85°C) Channel Crosstalk (ACT = 20 log IL/IIK) A Quiescent Current (Package) I
NOTE: 2. The device might not give 100% protection in CMOS applications.
(TA = 25°C, unless otherwise noted, Note 1.)
Rating
Characteristics
Symbol Value Unit
CC
i
IK
J
D
JA
A
stg
= 25°C, 4.5 VCC 5.5 V, unless otherwise noted.)
A
6.0 V 300 mA ±50 mA 150 °C 400 m/W 100 °C/W
–40 to +85 °C
–55 to + 150 °C
Symbol Min Max Unit
V
(IK)
IK(P)
V
(IK)
IK(P)
I
L
I
LT
CT
B
VCC + 1.0 V
20 mA
–0.3 V
–20 mA
– –
100 dB
2.0 mA
1.0
5.0
µA
CIRCUIT DESCRIPTION
To ensure the reliable operation of any integrated circuit based electronics system, care has been taken that voltage transients do not reach the device I/O pins. Most NMOS, HMOS and Bipolar integrated circuits are particularly sensitive to negative voltage peaks which can provoke latch–up or otherwise disturb the normal functioning of the circuit, and in extreme cases may destroy the device.
Generally the maximum rating for a negative voltage transients on integral circuits is –0.3 V over the whole temperature range. Classical protection units have consisted of diode/resistor networks as shown in Figures 2a and 2b.
The arrangement in Figure 2a does not, in general, meet the specification and is therefore inadequate.
The problem with the solution shown if Figure 2b lies mainly with the high current drain through the biassing devices R1 and D3. A second problem exists if the input line carries an analog signal. When Vin is close to the ground potential, currents arising from leakage and mismatch between D3 and D2 can be sourced into the input line, thus disturbing the reading.
Figure 2. Classical Protection Circuits
(a) (b)
VinR
V
CC
D1
in
C
in
µ
D2
Gnd Gnd
VinR
C
R1
in
C
in
V
CC
D1
µ
C
D2
D
3
Figure 3 shows the clamping characteristics which are common to each of the six cells in the Peripheral Clamping Array.
As with the classical protection circuits, positive voltage transients are clamped by means of a fast diode to the V
supply line.
CC
2
MOTOROLA ANALOG IC DEVICE DATA
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Figure 3. Clamping Characteristics
I
IK
+10 mA
–0.3 V
Low
Impedance
0 V
–10 mA
High Low
Impedance Impedance
TCF6000
APPLICATIONS INFORMATION
Figure 4 depicts a typical application in a microcomputer based automotive ignition system.
The TCF6000 is being used not only to protect the system’s normal inputs but also the (bidirectional) serial diagnostics port.
The value of the input resistors, Rin, is determined by the clamping current and the anticipated value of the spikes.
V
CC
0.75 V Typ
VCC+
V
in
Thus:
V
where:
So, taking,
gives,
Rin =
= Peak Volts (V)
V
= Clamping current (A)
I
IK
= 300 V typically (SAE J1211)
V
= 10 mA (recommended)
I
IK
= 30 k
R
in
I
IK
Resistors of this value will not usually cause any problems in MOS systems, but their presence needs to be taken into account by the designer. Their ef fect will normally need to be compensated for Bipolar systems.
V
bat
Gnd
V
bat
Pick Up
Temperature
Pressure
Gnd
Hall
Effect
Engine
Sensor
Battery
Volts
Figure 4. T ypical Automotive Application
V
CC
Gnd
R
Hall
6X
R
in
TCF6000
3X
C
in
Gnd
V
CC
INT1
D1
MC6805S2
D0
D2
V
SS
Gnd
Serial Diagnostics
B0
D6
B1
B2
Coil Drive
Coil Feedback
MOTOROLA ANALOG IC DEVICE DATA
Ignition ModuleCar
3
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TCF6000
The use of Cin is not mandatory , and is not recommended where the lines to be protected are used for output or for both input and output. For digital input lines, the use of a small capacitor in the range of 50 pF to 220 pF is recommended as this will reduce the rate of rise of voltage seen by the TCF6000 and hence the possibility of overshoot.
In the case of the analog inputs, such as that from the pressure sensor, the capacitor Cin is necessary for devices such as the MC6805S2 shown, which present a low impedance during the sampling period. The maximum value for Cin is determined by the accuracy required, the time taken to sample the input and the input impedance during that time, while the maximum value is determined by the required frequency response and the value of R
Thus for a resistive input A/D connector where:
= Sample time (seconds)
T
s
= Device input resistance ()
R
D
= Input voltage (V)
V
in
= Required accuracy (%)
k
= Charge on capacitor before sampling
Q
1
= Charge on capacitor after sampling
Q
2
= Device input current (A)
I
D
in.
kQ
Thus:
but, and,
so that, ID Ts =
and, Cin (min) =
so, Cin (min) =
even simpler:
k C
Cin (min) = For the MC6805S2 this comes out at: Cin (min) =
Q1–Q2 =
= Cin V
Q
1
= ID• T
Q1–Q
2
The calculation for a sample and hold type converter is
= Required accuracy (%) = Hold capacitor (Farad)
H
100 C
k
100.25 pF
0.25
1
100
in s
k Cin–V
ID• T Vin• k
100 T
k R
H
in
100
s
Farad
s
Farad
D
Farad
= 10 nF for 1/4% accuracy
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MOTOROLA ANALOG IC DEVICE DATA
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NOTE 2
–T–
SEATING PLANE
H
58
–B–
14
F
–A–
C
N
D
K
G
0.13 (0.005) B
M
T
TCF6000
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 626–05
ISSUE K
L
J
M
M
A
M
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC
M ––– 10 ––– 10
N 0.76 1.01 0.030 0.040
INCHESMILLIMETERS
__
–T–
–A–
58
4X P
–B–
14
G
C
SEATING PLANE
8X D
K
0.25 (0.010)MB
SS
A0.25 (0.010)MTB
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
ISSUE N
M
R
X 45
_
M
(SO–8)
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.196
F
J
B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC
J 0.18 0.25 0.007 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
INCHESMILLIMETERS
____
MOTOROLA ANALOG IC DEVICE DATA
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TCF6000
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MOTOROLA ANALOG IC DEVICE DATA
TCF6000/D
*TCF6000/D*
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