Datasheet T1635H Datasheet (ST)

Main features

Symbol Value Unit

T1635H Series

Snubberless™ high temperature 16 A Triacs

I

T(RMS)

V

DRM/VRRM

I

GT (Q1)

16 A

600 V

35 mA

Description

Specifically designed to operate at 150° C, the
new 16 A T1635H Triacs provide an enhanced
performance in terms of power loss and thermal
dissipation. This facilitates the optimization of
heatsink dimensioning, leading to improved space
and cost effectiveness when compared to electro­mechanical solutions.

Based on ST Snubberless™ technology, the
T1635H series offers high commutation switching
capabilities and high noise immunity levels on the
full range of T

The T1635H series facilitates the optimization of
the control of universal motors and inductive
loads found in appliances such as vacuum
cleaners, and washing machines.

The T1635H Triacs are also suitable for use in
high temperature environment found in hot
appliances such as cookers, ovens, hobs, electric
heaters, and coffee machines.

.

j

A2

G

A2

A1

2

PAK

D

T1635H-G

A2

TO-220AB Insulated

T1635H-I

G

A2

A1

TO-220AB

T1635H-T

Order code

Part number Marking

T1635H-600G T1635H-600G

T1635H-600G-TR T1635H-600G

T1635H-600TRG T1635H-600T

T1635H-600IRG T1635H-600I

A1

A1

A2

A2

G

G

TM: Snubberless is a trademark of STMicroelectronics

August 2006 Rev 1 1/10

www.st.com

Characteristics T1635H Series

1 Characteristics

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit

2

D

I

T(RMS)

I

TSM

RMS on-state current (full sine wave)

Non repetitive surge peak on-state current
(full cycle sine wave, Tj initial = 25° C)

PA K

TO-220AB

TO-220AB Ins T

F = 60 Hz t = 16.7 ms 170

F = 50 Hz t = 20 ms 160

= 130° C

T

c

= 110° C

c

16 A

I²t I²t Value for fusing tp = 10 ms 128 A

dI/dt

V

DSM/VRSM

I

GM

P

G(AV)

T

stg

T

j

Table 2. Electrical characteristics (Tj = 25° C, unless otherwise specified)

Critical rate of rise of on-state current
I

= 2xIGT, tr ≤ 100 ns

G

F = 120 Hz T

= 150° C 50 A/µs

j

Non repetitive surge peak off state voltage Tj = 25° C 700 V

Peak gate current tp = 20 µs Tj = 150° C 4 A

Average gate power dissipation Tj = 150° C 1 W

Storage junction temperature range
Operating junction temperature range

-40 to +150

-40 to +150

Symbol Test conditions Quadrant Value Unit

(1)

I

GT

V

V

IH

GT

GD

(2)

VD = 12 V, RL = 33 Ω

VD = V

, RL =3.3 kΩ II - III MIN 0.15

DRM

IT = 100 mA MAX 35

II - III MAX 35

II - III MAX 1.3

mA

V

V

mA

A

° C

2

s

I

L

dV/dt

(dI/dt)c

1. minimum IGT is guaranteed at 5% of IGT max

2. for both polarities of A2 referenced to A1

IG = 1.2 x I

(2)

VD = 67% V

(2)

Without snubber, Tj = 150° C MIN 7.1

GT

gate open, Tj = 150° C MIN 300

DRM,

2/10

I - III

MAX

II 80

50

mA

V/µs

A/ms

T1635H Series Characteristics

Table 3. Static electrical characteristics

Symbol Test conditions Value Unit

(1)

V

V

TM

TO

R

I

DRM

I

RRM

(1)

(1)

D

ITM= 22.5 A, tp = 380 µs Tj = 25° C MAX 1.5 V

Tj = 150° C MAX 0.80 V

Tj = 150° C MAX 23 mΩ

V

Tj = 25° C

= V

V

DRM

D/VR

RRM

Tj = 150° C 6.4

MAX

= 400 V (at peak mains voltage) Tj = 150° C 4.2

5µA

1. for both polarities of A2 referenced to A1

Table 4. Thermal resistance

Symbol Parameter Value Unit

2

PA K

R

th (j-c)

Junction to case (AC)

D
TO-220AB

1.2

TO-220AB Ins 2.1

= 1 cm² D2PA K 4 5

S

CU

R

th (j-a)

Junction to ambient

TO-220AB
TO-220AB Ins

60

mA

°C/W

Figure 1. Maximum power dissipation

vs RMS on-state current (full cycle)

P(W)

18

α=180 °

16

14

12

10

8

6

4

2

0

0246810121416

I

T(RMS)

(A)

180°

Figure 2. RMS on-state current vs case

temperature (full cycle)

I

(A)

T(RMS)

18

16

14

12

10

8

6

4

2

α=180 °

0

0 25 50 75 100 125 150

TC(°C)

TO-220AB

Insulated

TO-220AB/D²PAK

3/10

Characteristics T1635H Series

Figure 3. RMS on-state current vs ambient

temperature, PCB FR4, e

I

(A)

T(RMS)

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150

T

(°C)

amb

= 35 µm

CU

α=180 °

D²PAK

S

CU

=1 cm²

Figure 5. Relative variation of gate trigger

current, holding current and
latching current vs junction
temperature (typical values)

IGT,IH,IL[Tj]/IGT,IH,IL[Tj=25°C]

2.5

2.0

1.5

1.0

0.5

0.0

I

GT

IH& I

L

Tj(°C)

-40 -20 0 20 40 60 80 100 120 140 160

Figure 4. Relative variation of thermal

impedance vs pulse duration

K=[Zth/Rth]

1.E+00

Z

th(j-c)

1.E-01

1.E-02

1.E-03

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Z

th(j-a)

tP(s)

Figure 6. Surge peak on-state current vs

number of cycles

I

(A)

TSM

180

160

140

120

Non repetitive
T

initial=25 °C

j

100

80

60

Repetitive
T

=113 °C

c

40

20

0

Number of cycles

1 10 100 1000

t=20ms

One cycle

Figure 7. Non repetitive surge peak

on-state current (sinusoidal pulse
width tp<10 ms) and corresponding
value of I²t

I

(A), I²t (A²s)

TSM

10000

dI/dt limitation: 50 A/µs

1000

tP(ms)

100

0.01 0.10 1.00 10.00

4/10

Tj initial=25 °C

I

TSM

I²t

Figure 8. On-state characteristics (maximum

values)

ITM(A)

100

Tj=150 °C

Tj=25 °C

10

Tjmax. :

V

= 0.80 V

T0

R

= 23 mW

1

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

VTM(V)

D

T1635H Series Characteristics

Figure 9. Relative variation of critical rate

of decrease of main current (di/dt)c
versus junction temperature

(dI/dt)c[Tj]/(dI/dt)c[Tj=150°C]

8

7

6

5

4

3

2

1

0

25 50 75 100 125 150

Tj(°C)

Figure 11. Variation of thermal resistance,

junction to ambient versus copper
surface under tab (PCB FR4,
e

35 µm)

CU

R

(°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

SCU(cm²)

D²PAK

Figure 10. Relative variation of critical rate of

decrease of main current (di/dt)c vs
reapplied dV/dt (typical values)

(dI/dt)c[(dV/dt)c] / Specified (dI/dt)

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.1 1.0 10.0 100.0

c

dV/dt (V/µs)

Figure 12. Leakage current versus junction

temperature for different values of
blocking voltage (typical values)

I

(mA)

DRM/IRRM

1.E+01

V

=600 VV

=600 V

DRM=VRRM

1.E+00

1.E-01

1.E-02

1.E-03

1.E-04

V

DRM=VRRM

DRM=VRRM

50 75 100 125 150

=200 VV

=200 V

V

DRM=VRRM

DRM=VRRM

=400 VV

=400 V

DRM=VRRM

Tj(°C)

Figure 13. Acceptable repetitive peak

off-state voltage versus case­ambient thermal resistance

R

(°C/W)

th(c-a)

10

9

8

7

6

5

4

3

2

1

0

300 350 400 450 500 550 600

V

DRM/VRRM

(V)

R

th(j-c)

T

J

=1.2 °C/W

=150 °C

5/10

Ordering information scheme T1635H Series

2 Ordering information scheme

T 16 35 H - 600 I (-TR)

Triac series

Current

16 = 16 A

Sensitivity

35 = 35 mA

High temperature

Voltage

600 = 600 V

Package

2

G = D PAK
I = TO-220AB Ins
T = TO-220AB

Packing mode

Blank = Tube (D PAK)

-TR = Tape and reel (

2

D PAK)

RG = Tube (TO-220AB)

2

6/10

T1635H Series Package information

3 Package information

Table 5. TO-220AB and TO-220AB Insulated dimensions

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 15.20 15.90 0.598 0.625

a1 3.75 0.147

B

Ø I

L

A

I4

l3

a1

l2

a2

C

b2

a2 13.00 14.00 0.511 0.551

B 10.00 10.40 0.393 0.409

F

b1 0.61 0.88 0.024 0.034

b2 1.23 1.32 0.048 0.051

C 4.40 4.60 0.173 0.181

c2

c1 0.49 0.70 0.019 0.027

c2 2.40 2.72 0.094 0.107

e 2.40 2.70 0.094 0.106

M

b1

e

c1

F 6.20 6.60 0.244 0.259

ØI 3.75 3.85 0.147 0.151

I4 15.80 16.40 16.80 0.622 0.646 0.661

L 2.65 2.95 0.104 0.116

l2 1.14 1.70 0.044 0.066

l3 1.14 1.70 0.044 0.066

M 2.60 0.102

7/10

Package information T1635H Series

Table 6. D

L2

L

L3

2

PAK Mechanical data

E

B2

B

G

A1

2mm min.
FLAT ZONE

C2

C

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

D

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

A2

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

V2

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 14. D2PAK Footprint (dimensions in mm)

16.90

10.30

8.90

3.70

5.08

1.30

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

8/10

T1635H Series Ordering information

4 Ordering information

Part number Marking Package Weight Base Qty Packing mode

T1635H-600G T1635H-600G D

T1635H-600G-TR T1635H-600G D

2

PAK 1.5 g 50 Tube

2

PAK 1.5 g 1000 Tape and Reel

T1635H-600TRG T1635H-600T TO-220AB 2.3 g 50 Tube

T1635H-600IRG T1635H-600I TO-220AB Ins 2.3 g 50 Tube

5 Revision history

Date Revision Changes

31-Aug-2006 1 Initial release

9/10

T1635H Series

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