Datasheet SZA1010T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SZA1010

Digital Servo Driver 3 (DSD-3)

Preliminary specification
File under Integrated Circuits, IC01

1997 Apr 07

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

FEATURES
Servo functions

• 1-bit class-D focus actuator driver (4 Ω)

• 1-bit class-D radial actuator driver (4 Ω)

• 1-bit class-D sledge motor driver (2 Ω).

Other features

• Supply voltage 5 V only

• Small package (SOT163-1)

• Higher efficiency, compared with conventional drivers,

due to the class-D principle

• Built-in digital notch filters for higher efficiency

• Enable input for focus and radial driver

• Enable input for sledge driver

• 3-state input for radial driver

• Doubled clock frequency

• Differential outputs for all drivers

• Separate power supply pins for all drivers.

QUICK REFERENCE DATA

GENERAL DESCRIPTION

The SZA1010 or Digital Servo Driver 3 (DSD-3) consists of
1-bit class-D power drivers, which are specially designed
for digital servo applications. Three such amplifiers are
integrated in one chip, to drive the focus and radial
actuators and the sledge motor of a compact disc optical
system.

The main benefits of using this principle are its higher
efficiency grade compared to conventional analog power
amplifiers, its higher integration level, its differential output
and the fact that only a few external components are
needed. When using these digital power drivers in a digital
servo application, the statement ‘complete digital servo
loop’ becomes more realistic.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DDD

V

DDA(F)

V

DDA(R)

V

DDA(S)

I

DDDq

I

DDA(F)

I

DDA(R)

I

DDA(S)

f

i(clk)

P

tot

T

amb

digital supply voltage 4.5 − 5.5 V
analog supply voltage focus actuator 4.5 − 5.5 V
analog supply voltage radial actuator 4.5 − 5.5 V
analog supply voltage sledge actuator 4.5 − 5.5 V
quiescent digital supply current −−10 µA
analog supply current focus actuator − 126 250 mA
analog supply current radial actuator − 20 250 mA
analog supply current sledge actuator − 150 560 mA
input clock frequency − 8.4672 10 MHz
total power dissipation − tbf − mW
operating ambient temperature −40 − +85 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

SZA1010T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1997 Apr 07 2

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

BLOCK DIAGRAM

book, full pagewidth

RAC

FOC

SLC

CLI

EN1
EN2

4

3

2

7
8

9

SZA1010

CONTROL

V

V

V

DDA(R)

DDD

613141

DIGITAL

NOTCH FILTER

DIGITAL

NOTCH FILTER

DIGITAL

NOTCH FILTER

5101718

V

SSA(R)

SSD

V

3-STATE

DDA(F)

V

DDA(S)

END STAGE

H−BRIDGE

END STAGE

H−BRIDGE

END STAGE

H−BRIDGE

V

SSA(S)/VSSA(F)

11

RA+

12

RA−

15

FO+

16

FO−

19

SL+

20

SL−

MBK013

Fig.1 Block diagram.

1997 Apr 07 3

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

PINNING

SYMBOL PIN DESCRIPTION

V

DDA(S)

SLC 2 PDM input for sledge driver
FOC 3 PDM input for focus driver
RAC 4 PDM input for radial driver
V

SSD

V

DDD

CLI 7 clock input
EN1 8 enable input 1
EN2 9 enable input 2
V

SSA(R)

RA+ 11 radial driver (positive output)
RA− 12 radial driver (negative output)
V

DDA(R)

V

DDA(F)

FO+ 15 focus driver (positive output)
FO− 16 focus driver (negative output)
3-STATE 17 radial 3-state input

/

V

SSA(S)

V

SSA(F)

SL+ 19 sledge driver (positive output)
SL− 20 sledge driver (negative output)

analog supply voltage for sledge

1

motor driver

5 digital ground
6 digital supply voltage

10 analog ground for radial driver

analog supply voltage for radial

13

driver

14 analog supply voltage for focus

analog ground for sledge

18

driver/focus

handbook, halfpage

V

DDA(S)

V

SSA(R)

1
2

SLC

FOC

3

RAC

4

V

5

SSD

V

DDD

CLI
EN1
EN2 RA−

6
7
8
9

10

SZA1010

MBK012

Fig.2 Pin configuration.

20

SL−
SL+

19

V

18

SSA(S)/VSSA(F)

3-STATE

17
16

FO−

15

FO+
V

14

DDA(F)

V

13

DDA(R)

12
11

RA+

1997 Apr 07 4

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

FUNCTIONAL DESCRIPTION
Principle of a class-D digital power driver

Figure 3 shows the block diagram of one of the digital
drivers integrated in the DSD-3. It consists of a timing
block and four CMOS switches. The input signal is a 1-bit
Pulse Density Modulated (PDM) signal, the output of the
digital servo ICs.

The maximum operating clock frequency of the device is
10 MHz. In combination with most frequently used Philips
digital servo ICs, the operating frequency of the digital
drivers is 8.4672 MHz (192 × 44.1 kHz). The sampling
frequency of the 1-bit code however is 2.1168 MHz, so
internally in the DSD-3 the clock speed of the switches will
be 2.1168 MHz.
The higher input clock frequency is used to make
non-overlapping pulses to prevent short-circuits between
the supply voltages. For the control of the switches, two
states can be distinguished. If the 1-bit code contains a
logic 1, switches A and D are closed and current will flow
in the direction as shown in Fig.4.

If the 1-bit code contains a logic 0, switches B and C are
closed and current will flow in the opposite direction, as
shown in Fig.5.

This indicates that the difference between the mean
number of ones and zeros in the PDM signal determines
the direction in which the actuator or motor will rotate.

If the mean number of ones and zeros is equal (Idle mode)
the current through the motor or actuator is alternated
between the positive and negative direction at a speed of
half the sample frequency of 2.1168 MHz. This results in a
high dissipation and the motor does not move.

The amplitude transfer as a function of frequency is given
in Fig.7.

Figure 7 shows that the filter has a zero on
filtering out the Idle pattern (101010). The output of this
filter is a three-level code (1.5-bit). For the control of the
switches three states (1.5-bit) can be distinguished: the
two states as described earlier and a third one. This state
is used when an idling pattern is supplied.

Switches C and D are closed (see Fig.8). In this Idle mode,
no current will flow and thus the efficiency will be improved.
This mode is also used to short-circuit the inductive
actuator/motor. In this way, high induction voltages are
prevented because the current can commutate via the
filter and the short-circuit in the switches. All three drivers
(radial, focus and sledge) contain a digital notch filter as
described (see Fig.6). Each driver has its own power
supply pins to reduce crosstalk due to of the relative high
current flowing through the pins.

Compared to the DSD-2, the DSD-3 has a 3-state mode
for the radial output, which is useful when active damping
of the radial actuator is needed. When fast access times
are required, the sledge has to move with high
accelerations. To prevent the radial actuator from moving
too far from its centre position due to the acceleration,
active damping is applied. In order to measure the
displacement of the radial actuator, the voltage induced by
the actuator itself is measured, which is proportional to its
speed. The damping consists of a sequence of controlling,
waiting, measuring and controlling etc. To be able to
measure the induced voltage properly, the influence of the
DSD-3 is eliminated by switching it into 3-state mode.

1

⁄2fs, thereby

To improve the efficiency, a digital notch filter is added at
the input of the digital drivers. This filters the Idle mode
pattern (1010101010 etc.) see Fig.6.

1997 Apr 07 5

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

1-bit
code

TIMING

clock

MBG786

(1) Sledge motor; focus/radial motor.

Fig.3 One of the digital drivers.

V

DD

1-bit

code

(1)

M

V

SS

'1'

TIMING

clock

MBG787

(1) Sledge motor; focus/radial motor.

V

DD

I

pos

AB

(1)

M

CD

V

SS

Fig.4 1-bit code is logic 1.

V

DD

I

neg

1-bit

code

'0'

TIMING

clock

MBG788

(1) Sledge motor; focus/radial motor.

AB

(1)

M

CD

V

SS

Fig.5 1-bit code is logic 0.

1997 Apr 07 6

1-bit 1.5-bit

The filter consists of a simple delay element (flip-flop) and an adder.
The transfer from input-to-output is: H(z) =1 + z

1/Z

MBG789

−1

.

Fig.6 Notch filter at input of digital drivers.

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

|H|

MBG790

1/2f

s

Fig.7 Amplitude transfer.

Switches

The digital part of the power drivers consists of standard
cells. The power switches are specifically designed for CD
applications. The most important feature is their
on-resistance. In the applications, they have to drive very
low-ohmic actuators and/or motors. The switches are
designed to have an on-resistance of 2 Ω for the actuator
drivers and 1 Ω for the sledge motor driver. In any mode,
there are always two switches in series with the
actuator/motor. The total loss due to the switches is 4 Ω for
the actuators and 2 Ω for the sledge motor.

3-state input

When the 3-STATE input (pin 17) is made HIGH, the four
CMOS switches of the radial driver are opened.
Consequently, the radial output pins RA+ (pin 11) and RA−
(pin 12) switch into a high impedance state.

To set the circuit into 3-state mode, the clock signal (CLI)
is not required; the 3-STATE input is a direct,
asynchronous input. It has an internal pull-down resistor.

V

DD

1-bit
code

'idle'

TIMING

clock

MBG791

(1) Sledge motor; focus/radial motor.

AB

(1)

M

CD

I

idle

V

SS

Fig.8 Idling pattern.

Timing of input and output signals

All internal timing signals are derived from the externally
supplied CLI signal.

Sampling of the data inputs (SLC, FOC and RAC) occurs
at a frequency of1⁄4CL. For each channel, the clocking-in
occurs at a different positive edge of CLI. Because there
are only 3 channels, and the clock frequency CLI is
divided-by-4, only 3 out of 4 positive edges are effective for
sampling one of the inputs.

The switching of the outputs occurs in a similar way,
except that in this event the negative edge of CLI is used.
In this way, the input signals are immune to the noise
radiated by the switching of the outputs. It is possible that
an output transition will have a noticeable effect on the
power supply voltage or the ground voltage. To avoid
simultaneous transitions of all outputs, the outputs of each
bridge are also clocked at a different phase of CLI.
Consequently there are only 3 out of 4 negative edges
effective.

To reset the circuit, both the reset condition and the clock
should be present, because all flip-flops are reset
synchronously. The clock signal is also required to obtain
one of the possible modes of operation indicated in
Table 1.

1997 Apr 07 7

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

Table 1 Possible modes of operation

EN1 EN2 SLEDGE DRIVER

FOCUS/RADIAL

DRIVER

MODE

0 0 off off standby
0 1 off on partly operating
1 0 off off reset
1 1 on on operating

The timing diagram as shown in Fig.9 gives the relationship between the different clocks.
The negative edge of the signals called ncl0 to ncl2 is used to process the incoming data (see Table 2).
The negative edge of all signals called cl0s to cl2s is used to trigger the outputs (see Table 2).

Table 2 Signals ncl0 to ncl2 and cl0s to cl2s

SIGNAL DESCRIPTION

ncl0 sledge input sampling clock
ncl1 focus input sampling clock
ncl2 radial input sampling clock
cl0s sledge output trigger clock
cl1s focus output trigger clock
cl2s radial output trigger clock

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDD

V

DDA(x)

− V

V

SSD

P

tot

T

stg

T

amb

SSA(x)

digital supply voltage −0.5 +6.5 V
analog supply voltage −0.5 +6.5 V
ground supply voltage difference −5+5mV
total power dissipation − tbf mW
storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 75 K/W

1997 Apr 07 8

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

CHARACTERISTICS

V

DDD=VDDA(x)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

General

V

DDD

V

DDA(x)

I

DDDq

I

DDA(F)(max)

I

DDA(R)(max)

I

DDA(S)(max)

f

i(clk)

P

tot

T

amb

Digital inputs; SLC, FOC, RAC, CLI, 3-STATE, EN1 and EN2

V

IL

V

IH

I

LI

Clock input; CLI

f

clk

Analog outputs; FO+ and FO−

I

O

R

O

Analog outputs; RA+ and RA−

I

O

R

O

Analog outputs; SL+ and SL−

I

O

R

O

=5V; V

SSD=VSSA(x)

=0V; T

=25°C; unless otherwise specified.

amb

digital supply voltage 4.5 − 5.5 V
analog supply voltage 4.5 − 5.5 V
quiescent digital supply current −−tbf µA
maximum analog supply current

note 1 − 126 250 mA

focus actuator
maximum analog supply current

note 1 − 20 250 mA

radial actuator
maximum analog supply current

note 1 − 150 560 mA

sledge actuator
input clock frequency − 8.4672 10 MHz
total power dissipation − tbf − mW
operating ambient temperature −40 − +85 °C

LOW level input voltage T
HIGH level input voltage T

= −40 to +85 °C −−0.2V

amb

= −40 to +85 °C 0.8V

amb

−−V

DDD

DDD

V

input leakage current −−1µA

clock frequency − 8.4672 10 MHz

output current −−250 mA
output resistance note 2 − tbf 4 Ω

output current −−250 mA
output resistance note 2 − tbf 4 Ω

output current −−560 mA
output resistance note 2 − tbf 2 Ω

Notes

V

1. Maximum supply current depends on the value of R

:

I

L

max

DDA(x)(max)

=

-----------------------------­RORL+()

2. Output resistance is defined as the series resistance of the complete bridge.

1997 Apr 07 9

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

Timing diagram

RA−

RA+

FO−

FO+

SL−

SL+

cI2s

cI1s

cI0s

ncI2

ncI1

ncI0

RAC

FOC

SLC

CLI

MBG792

full pagewidth

inputs

outputs

Fig.9 Timing diagram.

Sampling of the incoming data is marked by a ‘∗’.

1997 Apr 07 10

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

APPLICATION INFORMATION

Figure 10 shows an application example.
An LC filter is connected to each output of the SZA1010 in

order to remove the PDM square wave signal at the clock
frequency. This is done to prevent the relatively long wires
to the actuators and motor from radiating and thereby
disturbing other circuitry. Therefore it is recommended to
place the coils as close as possible to the IC. The LC filter
bandwidth has been chosen as high as 20 kHz to ensure
that the filter’s poles are far enough outside the relevant
loop bandwidth, which in this application is approximately
1 kHz. In this way their influence on the closed loop
performance is kept to a minimum. Furthermore, the
corner frequency has not been chosen higher in order to
filter out noise and spurious products as much as possible,
because they enlarge the dissipation.

The various power supply and ground pins are all
connected together in the schematic, but if desired, the
focus, radial and sledge power pins can be connected to a
separate power supply.

The three ground pins are internally connected and
therefore should not be separated.

1997 Apr 07 11

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

MBK014

SERVO

(OQ8868)

CONTROLLER

33

32

SL

FO

31

RA

28

CLKO

(1)

5 V

+

100 nF

DDD

V

DDA(S)

V

DDA(R)

V

DDA(F)

V

SLC

2

FOC

3

RAC

4

3-STATE

CLI

17

EN1

EN2

7

8

9

from microcontroller

SSD

V

SSA(R)

V

SZA1010

18 10 5

14 13 1 6

19

20

SL−

SL+

15

16

FO−

FO+

11

RA−

RA+

SSA(F)

12

/V

SSA(S)

V

handbook, full pagewidth

Fig.10 Application diagram.

100 µH

100 µH

100 µH

100 µH

100 µH

100 µH

(2×)

1 µF

M

sledge motor

M

focus actuator

radial actuator

1997 Apr 07 12

(2×)

1 µF

(2×)

2.2 µF

M

(1) See Table 1.

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

PACKAGE OUTLINE

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

pin 1 index

1

e

11

A

2

10

w M

b

p

SOT163-1

E

H

E

Q

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT163-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E04 MS-013AC

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

13.0

7.6

7.4

0.30

0.29

1.27

0.050

12.6

0.51

0.49

REFERENCES

1997 Apr 07 13

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

92-11-17
95-01-24

o

8

o

0

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Apr 07 14

Philips Semiconductors Preliminary specification

Digital Servo Driver 3 (DSD-3) SZA1010

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Apr 07 15

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547027/00/01/pp16 Date of release: 1997 Apr 07 Document order number: 9397 750 01953