Datasheet SUD50NP04-77P Specification

Page 1
New Product
SUD50NP04-77P
Vishay Siliconix
Complementary N- and P-Channel 40-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) r
N-Channel 40
P-Channel - 40
S1 G1 S2 G
Ordering Information:
DS(on)
0.037 at V
0.046 at V
0.040 at V
0.050 at V
TO-252-4L
D-PAK
SUD50NP04-77P-T4-E3 (Lead (Pb)-free)
(Ω)
= 10 V
GS
= 4.5 V
GS
= - 10 V
GS
= - 4.5 V
GS
D
Top View Drain Connected to Tab
2
a
D
(A)
8
8
- 8
- 8
Qg (Typ.)
26
25.5
I
• TrenchFET® Power MOSFET
• 100 % UIS Tested
APPLICATIONS
• Backlight Inverter for LCD Display
• Full Bridge DC/DC Converter
D
G
1
S
1
N-Channel MOSFET
G
2
P-Channel MOSFET
RoHS
COMPLIANT
S
2
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol N-Channel P-Channel Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 150 °C)
J
Pulsed Drain Current (10 µs Pulse Width)
Source-Drain Current Diode Current
Pulsed Source-Drain Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
T
= 25 °C
C
= 70 °C
T
C
TA = 25 °C
TA = 70 °C
= 25 °C
T
C
TA = 25 °C
L = 0.1 mH
= 25 °C
T
C
= 70 °C
T
C
T
= 25 °C
A
TA = 70 °C
V
DS
V
GS
I
D
I
DM
I
S
I
SM
I
AS
E
AS
P
D
, T
T
J
stg
40 - 40
± 20
a, b, c
8
7
8
8
a
a
b, c
- 8
- 8
- 8
- 7.4
a
a
a, b, c
b, c
30 - 30
4.3
a
8
b, c
- 8
- 4.6
a
b, c
30 - 30
715
2.45 11.25 mJ
10.8 24
6.9 15.3
5.2
3.3
b, c
b, c
5.6
3.6
b, c
b, c
- 55 to 150 °C
V
A
W
THERMAL RESISTANCE RATINGS
N-Channel P-Channel
Parameter Symbol
Maximum Junction-to-Ambient
b, d
t 10 s
Maximum Junction-to-Case (Drain) Steady State
R
thJA
R
thJC
Notes: a. Package Limited. b. Surface Mounted on 1" x 1" FR4 Board. c. t = 10 s. d. Maximum under Steady State conditions is 60 °C/W (N-Channel) and 52 °C/W (P-Channel).
Document Number: 73989 S-80109-Rev. B, 21-Jan-08
Typ. Max. Typ. Max.
20 24 18 22
9.4 11.5 4.3 5.2
Unit
°C/W
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1
Page 2
New Product
SUD50NP04-77P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min.
Static
Drain-Source Breakdown Voltage
V
Temperature Coefficient ΔVDS/T
DS
V
Temperature Coefficient ΔV
GS(th)
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
a
b
b
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
V
DS
GS(th)/TJ
V
GS(th)
I
GSS
I
DSS
I
D(on)
r
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
VGS = 0 V, ID = 250 µA
V
= 0 V, ID = - 250 µA
GS
ID = 250 µA
J
= - 250 µA
I
D
ID = 250 µA
I
= - 250 µA
D
V
= VGS, ID = 250 µA
DS
V
= VGS, ID = - 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
= 40 V, V
DS
V
= - 40 V, V
DS
V
= 40 V, V
DS
V
= - 40 V, V
DS
V
V
GS
= 5 V, V
V
DS
= - 5 V, V
DS
V
= 10 V, ID = 5 A
GS
V
= - 10 V, ID = - 5 A
GS
V
= 4.5 V, ID = 4 A
GS
= - 4.5 V, ID = - 4 A
GS
= 0 V
GS
= 0 V
GS
= 0 V, TJ = 55 °C
= 0 V, TJ = 55 °C
GS
= 10 V
GS
= - 10 V
GS
VDS = 15 V, ID = 5 A
V
= - 15 V, ID = - 5 A
DS
N-Channel
V
= 20 V, V
DS
= 0 V, f = 1 MHz
GS
P-Channel
V
= - 20 V, V
DS
VDS = 20 V, V
V
= - 20 V, V
DS
= 0 V, f = 1 MHz
GS
= 10 V, ID = 5 A
GS
= - 10 V, ID = - 5 A
GS
N-Channel
V
= 20 V, V
DS
= 4.5 V, ID = 5 A
GS
P-Channel
V
= - 20 V, V
DS
= - 4.5 V, ID = - 5 A
GS
f = 1 MHz
N-Ch 40
P-Ch - 40
N-Ch 44
P-Ch - 41
N-Ch - 5.5
P-Ch 4.3
N-Ch 1.4 2.5
P-Ch - 1.4 - 2.7
N-Ch 100
P-Ch - 100
N-Ch 1
P-Ch - 1
N-Ch 10
P-Ch - 10
N-Ch 10
P-Ch - 10
N-Ch 0.0305 0.037
P-Ch 0.030 0.040
N-Ch 0.037 0.046
P-Ch 0.036 0.050
N-Ch 22
P-Ch 20
N-Ch 640
P-Ch 1555
N-Ch 73
P-Ch 176
N-Ch 41
P-Ch 142
N-Ch 11.7 20
P-Ch 38.5 60
N-Ch 5.3 9.0
P-Ch 17 27
N-Ch 1.9
P-Ch 4.2
N-Ch 1.7
P-Ch 7.0
N-Ch 2.2
P-Ch 3.0
Typ .
a
Max. Unit
V
mV/°C
V
nA
µA
A
Ω
S
pF
nC
Ω
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Document Number: 73989
S-80109-Rev. B, 21-Jan-08
Page 3
New Product
SUD50NP04-77P
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min.
Dynamic
Tu r n - O n D el a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
Tu r n - O n D el a y T i m e
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
Notes: a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
a
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
I
S
a
I
SM
V
SD
t
rr
I
D
I
- 5 A, V
D
5 A, V
I
D
I
- 5 A, V
D
N-Channel
V
= 20 V, RL = 4 Ω
DD
5 A, V
GEN
P-Channel
V
= - 20 V, RL = 4 Ω
DD
GEN
N-Channel
V
= 20 V, RL = 4 Ω
DD
GEN
P-Channel
V
= - 20 V, RL = 4 Ω
DD
GEN
TC = 25 °C
IS = 2 A
I
S
= 10 V, Rg = 1 Ω
= - 10 V, Rg = 1 Ω
= 4.5 V, Rg = 1 Ω
= - 4.5 V, Rg = 1 Ω
= - 2 A
N-Channel
Q
rr
t
a
t
b
I
= 2 A, di/dt = 100 A/µs, TJ = 25 °C
F
P-Channel
I
= - 2 A, di/dt = - 100 A/µs, TJ = 25 °C
F
N-Ch 9 18
P-Ch 10 20
N-Ch 11 20
P-Ch 14 25
N-Ch 14 25
P-Ch 36 60
N-Ch 8 16
P-Ch 10 20
N-Ch 18 30
P-Ch 47 80
N-Ch 14 25
P-Ch 60 110
N-Ch 14 25
P-Ch 35 60
N-Ch 10 20
P-Ch 13 25
N-Ch 8
P-Ch - 8
N-Ch 30
P-Ch - 30
N-Ch 0.805 1.2
P-Ch - 0.76 - 1.2
N-Ch 19 30
P-Ch 22 40
N-Ch 14 25
P-Ch 22 40
N-Ch 13
P-Ch 15
N-Ch 6
P-Ch 7
Vishay Siliconix
a
Typ .
Max. Unit
ns
A
V
ns
nC
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Document Number: 73989
www.vishay.com
S-80109-Rev. B, 21-Jan-08
3
Page 4
New Product
0
SUD50NP04-77P
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
24
18
12
- Drain Current (A)I
D
6
0
0.0 0.5 1.0 1.5 2.0 2.5
- Drain-to-Source Voltage (V)
V
DS
VGS=10thru 5 V
Output Characteristics
0.060
0.052
0.044
VGS=4.5V
0.036
- On-Resistance (Ω)r
DS(on)
0.028
VGS=10V
4 V
3 V
5
4
3
TC= 25 °C
2
- Drain Current (A)I
D
1
0
TC= 125 °C
TC= - 55 °C
012345
VGS- Gate-to-Source Voltage (V)
Transfer Characteristics
800
C
iss
640
480
320
C
C - Capacitance (pF)
160
oss
0.020
10
8
6
4
- Gate-to-Source Voltage (V)
2
GS
V
0
0.0 2.5 5.0 7.5 10.0 12.5
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0 6 12 18 24 30
ID- Drain Current (A)
On-Resistance vs. Drain Current
ID=5A
VDS=20V
Qg- Total Gate Charge (nC)
VDS=10V
VDS=30V
Gate Charge
C
rss
0
0 6 12 18 24 30
VDS- Drain-to-Source Voltage (V)
Capacitance
1.8
ID=5A
1.6
1.4
1.2
- On-Resistance (Normalized)
1.0
DS(on)
r
0.8
0.6
- 50 - 25 0 25 50 75 100 125 15
TJ- Junction Temperature (°C)
VGS=10V
On-Resistance vs. Junction Temperature
Document Number: 73989
S-80109-Rev. B, 21-Jan-08
VGS=4.5V
Page 5
New Product
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SUD50NP04-77P
Vishay Siliconix
- On-Resistance (Ω)r
DS(on)
0.20
ID=5A
0.16
0.12
0.08
TA= 125 °C
0.04
TA= 25 °C
0
02468 10
VGS- Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
100
80
60
Power (W)
40
100
TJ= 150 °C
10
1
0.1
- Source Current (A)I
S
0.01
0.001
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VSD- Source-to-Drain Voltage (V)
TJ= 25 °C
Source-Drain Diode Forward Voltage
0.4
0.2
ID=5mA
0.0
- 0.2
Variance (V)V
GS(th)
- 0.4
ID= 250 µA
- 0.6
- 0.8
- 50 - 25 0 25 50 75 100 125 150
TJ- Temperature (°C)
Threshold Voltage
100
80
60
Power (W)
40
20
0
0.01
Time (s)
Single Pulse Power, Junction-to-Case
20
0
0.0001 0.001 0.01 0.1 1 10
Time (s)
Single Pulse Power, Junction-to-Ambient
100
Limited byr
10
1
- Drain Current (A)I
D
0.1
0.01
10.10100.0 0.001
0.01
> minimum VGSat which r
* V
GS
*
DS(on)
TA= 25 °C
Single Pulse
0.1 1 10
- Drain-to-Source Voltage (V)
V
DS
DS(on)
is specified
100 µs
1ms
10 ms 100 ms
10 s
DC
100
Safe Operating Area, Junction-to-Ambient
Document Number: 73989 S-80109-Rev. B, 21-Jan-08
www.vishay.com
5
Page 6
New Product
SUD50NP04-77P
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
10
- Drain Current (A)
D
I
0.1
0.01
15
12
9
Limited byr
1
0.01
* V
> minimum VGSat which r
GS
*
DS(on)
TC= 25 °C
Single Pulse
0.1 1 10
V
- Drain-to-Source Voltage (V)
DS
DS(on)
Safe Operating Area, Junction-to-Case
Package Limited
is specified
100 µs
1ms 10 ms
100 ms, DC
100
7
5
4
3
- Drain Current (A)
D
I
1
0
0 25 50 75 100 125 150
TA- Ambient Temperature (°C)
Current Derating**, Junction-to-Ambient
2.5
2.0
1.5
6
- Drain Current (A)
D
I
3
0
0 25 50 75 100 125 150
TC- Case Temperature (°C)
Current Derating**, Junction-to-Case
15
12
9
Power (W)
6
3
0
0 25 50 75 100 125 150
TC- Case Temperature (°C)
Power Derating, Junction-to-Case
Power (W)
1.0
0.5
0.0 0 25 50 75 100 125 150
TA- Ambient Temperature (°C)
Power Derating, Junction-to-Ambient
** The power dissipation PD is based on T
= 150 °C, using
J(max)
junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
www.vishay.com 6
Document Number: 73989
S-80109-Rev. B, 21-Jan-08
Page 7
New Product
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Duty Cycle = 0.5
0.2
SUD50NP04-77P
Vishay Siliconix
Thermal Impedance
Normalized Effective Transient
Thermal Impedance
Normalized Effective Transient
0.1
0.01
10
1
0.1
0.1
0.05
0.02
Single Pulse
-4
Duty Cycle = 0.5
0.2
0.1
0.02
Single Pulse
0.05
-3
10
-2
10
-1
1
Square WavePulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Notes:
P
DM
1. Duty Cycle, D =
2. Per Unit Base = R
3. T
JM-TA=PDMZthJA
4. Surface Mounted
10
t
1
t
2
t
1
t
2
= 60 °C/W
thJA
(t)
100
100010
0.01
-4
10
Document Number: 73989 S-80109-Rev. B, 21-Jan-08
-3
10
-2
10
-1
Square WavePulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
01110
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7
Page 8
New Product
SUD50NP04-77P
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
VGS=10thru 4 V
24
18
12
- Drain Current (A)I
D
6
0
0.0 0.5 1.0 1.5 2.0 2.5
VDS- Drain-to-Source Voltage (V)
Output Characteristics
0.050
0.044
0.038
VGS=4.5V
3 V
5
4
3
TJ= 25 °C
2
- Drain Current (A)I
D
1
0
0.0 0.8 1.6 2.4 3.2 4.0
TJ= 125 °C
VGS- Gate-to-Source Voltage (V)
Transfer Characteristics
2500
2000
C
iss
1500
TJ= - 55 °C
0.032
- On-Resistance (Ω)r
DS(on)
0.026
0.020
VGS=10V
0 6 12 18 24 30
ID- Drain Current (A)
On-Resistance vs. Drain Current
10
ID=5A
8
6
4
- Gate-to-Source Voltage (V)
GS
2
V
0
0 8 16 24 32 40
VDS=20V
Qg- Total Gate Charge (nC)
VDS=10V
VDS=30V
Gate Charge
1000
C - Capacitance (pF)
- On-Resistance (Normalized)
DS(on)
r
C
500
C
rss
0
0 6 12 18 24 30
1.8
ID=5A
1.6
1.4
1.2
1.0
0.8
0.6
- 50 - 25 0 25 50 75 100 125 150
On-Resistance vs. Junction Temperature
oss
VDS- Drain-to-Source Voltage (V)
Capacitance
VGS=10V
VGS=4.5V
TJ- Junction Temperature (°C)
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Document Number: 73989
S-80109-Rev. B, 21-Jan-08
Page 9
New Product
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SUD50NP04-77P
Vishay Siliconix
- On-Resistance (Ω)r
DS(on)
0.12
0.09
0.06
TA= 125 °C
0.03
0
02468 10
VGS- Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
120
96
72
Power (W)
48
ID=5A
TA= 25 °C
100
10
- Source Current (A)I
S
1
0.0 0.3 0.6 0.9 1.2 1.5
TJ= 150 °C
- Source-to-Drain Voltage (V)
V
SD
TJ= 25 °C
Source-Drain Diode Forward Voltage
0.7
0.5
0.3
Variance (V)V
0.1
GS(th)
ID= 250 µA
ID=5mA
- 0.1
- 0.3
- 50 - 25 0 25 50 75 100 125 150
TJ- Temperature (°C)
Threshold Voltage
120
96
72
Power (W)
48
24
0
0.1
Time (s)
Single Pulse Power, Junction-to-Case
24
0
0.001 0.01 0.1 1 10 100
Time (s)
Single Pulse Power, Junction-to-Ambient
100
Limited byr
10
1
- Drain Current (A)I
D
0.1
0.01
011100.00.01
0.01
> minimum VGSat which r
* V
GS
*
DS(on)
TA= 25 °C
Single Pulse
0.1 1 10
V
- Drain-to-Source Voltage (V)
DS
DS(on)
1ms 10 ms 100 ms
1s
10 s
DC
100
is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 73989 S-80109-Rev. B, 21-Jan-08
www.vishay.com
9
Page 10
New Product
SUD50NP04-77P
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
10
- Drain Current (A)
D
I
0.1
0.01
22
18
13
Limited byr
1
0.01
* V
GS
*
DS(on)
TC= 25 °C
Single Pulse
0.1 1 10
V
- Drain-to-Source Voltage (V)
DS
> minimum VGSat which r
DS(on)
Safe Operating Area, Junction-to-Case
is specified
100 µs
1ms
10 ms 100 ms
DC
100
7
6
4
3
- Drain Current (A)
D
I
1
0
0 25 50 75 100 125 150
TA- Ambient Temperature (°C)
Current Derating**, Junction-to-Ambient
3.5
2.8
2.1
Package Limited
9
- Drain Current (A)
D
I
4
0
0 25 50 75 100 125 150
TC- Case Temperature (°C)
Current Derating**, Junction-to-Case
35
28
21
Power (W)
14
7
0
0 25 50 75 100 125 150 175
TC- Case Temperature (°C)
Power Derating, Junction-to-Case
Power (W)
1.4
0.7
0
0 25 50 75 100 125 150 175
TA- Ambient Temperature (°C)
Power Derating, Junction-to-Ambient
** The power dissipation PD is based on T
= 150 °C, using
J(max)
junction-to-case thermal resistance, and is more useful in settling the
upper dissipation limit for cases where additional heatsinking is
used. It is used to determine the current rating, when this rating falls
below the package limit.
www.vishay.com 10
Document Number: 73989
S-80109-Rev. B, 21-Jan-08
Page 11
New Product
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Duty Cycle = 0.5
SUD50NP04-77P
Vishay Siliconix
Thermal Impedance
Normalized Effective Transient
Thermal Impedance
Normalized Effective Transient
0.1
0.01
10
1
0.1
0.2
0.1
0.05
0.02
-4
Duty Cycle = 0.5
0.2
0.1
0.02
Single Pulse
Single Pulse
-3
10
0.05
Notes:
P
DM
1. Duty Cycle, D =
2. Per Unit Base = R
3. T
JM-TA=PDMZthJA
4. Surface Mounted
-2
10
-1
1
10
Square WavePulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
t
1
t
2
t
1
t
2
= 52 °C/W
thJA
(t)
100
100010
0.01
-4
10
-3
10
-2
10
-1
01110
Square WavePulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?73989.
Document Number: 73989 S-80109-Rev. B, 21-Jan-08
www.vishay.com
11
Page 12
TO252-4L CASE OUTLINE
A 0.254 C A B
E2
Package Information
Vishay Siliconix
E
A
C
C
C1
D1
L
F
G
E1
B2 B1
e (X4)
0.254 C A B
B
θ
B
L1
DETAIL “A”
b1(X4)
b(X5)
H
1, 18
L3
B
D
L2
C
SEATING PLANE
A1
DETAIL “A”
c3
SECTION B-B
(b)
H
c2
MILLIMETERS INCHES MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX.
A 2.22 2.38 0.087 0.094 E 6.40 6.60 0.252 0.260
A1 0.95 1.05 0.037 0.041 E1 4.90 5.00 0.193 0.197
B1 3.35 BSE 0.132 BSE E2 5.23 5.43 0.206 0.214
B2 1.74 BSE 0.069 BSE F 0.77 BSC 0.030 BSC
b 0.64 0.79 0.025 0.031 G 2.65 BSC 0.104 BSC
b1 0.8 0.86 0.031 0.034 H 9.60 10.20 0.378 0.402
C 0.49 0.53 0.019 0.021 L 1.1 REF 0.043 REF
C1 0.508 REF 0.020 REF L1 1.4 1.65 0.055 0.065
C2 0.495 0.53 0.0195 0.0209 L2 0.65 0.95 0.026 0.037
C3 0.509 0.564 0.020 0.0222 L3 0.01 0.127 0.0004 0.0050
D 6.00 6.20 0.236 0.244 e 1.27 BSC 0.050 BSC
D1 5.415 5.515 0.213 0.217 θ 8°0°
ECN: T09-0309-Rev. C, 11-May-09 DWG: 5956
Document Number: 74439 www.vishay.com 11-May-09 1
Page 13
Application Note 826
Vishay Siliconix
RECOMMENDED PAD FOR DPAK 4L
8.600
(0.339)
5.430
(0.214)
5.715
(0.225)
5.100
(0.034)
(0.201)
0.860
2.715
(0.107)
2.970
(0.117)
(0, 0)
0.615
(0.024)
1.700
(0.067)
1.270
(0.050)
12.200
(0.480)
Recommended Minimum PADs for TO-252-4L (DPAK)
Return to Index
APPLICATION NOTE
Dimensions in mm/(Inches)
Keep-out 8.6 (0.339) x 12.2 (0.480)
www.vishay.com Document Number: 69047 4 Revision: 04-Nov-08
Page 14
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 02-Oct-12
1
Document Number: 91000
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