ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter Symbol LimitUnit
Gate-Source Voltage
Continuous Drain Current (T
= 175 °C)
J
b
TC = 25 °C
T
= 100 °C
C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Avalanche Current
Single Avalanche Energy (Duty Cycle ≤ 1 %)L = 0.1 mH
= 25 °C
T
Maximum Power Dissipation
C
= 25 °C
T
A
Operating Junction and Storage Temperature Range
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
, T
T
J
stg
± 20V
23
16.5
50
23
20
20mJ
100
3
a
W
- 55 to 175°C
A
THERMAL RESISTANCE RATINGS
Parameter Symbol TypicalMaximumUnit
Maximum Junction-to-Ambient
a
t ≤ 10 sec
Steady State
Maximum Junction-to-Case
Notes:
a. Surface Mounted on 1" x 1" FR4 board, t ≤ 10 sec.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 72145
S-71660-Rev. C, 06-Aug-07
R
thJA
R
thJC
1822
4050
3.24
°C/W
www.vishay.com
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SUD23N06-31L
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
b
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
a
b
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Tur n -O n De l ay Ti m e
Rise Time
Turn-Off Delay Time
Fall Time
c
c
c
c
c
c
c
V
(BR)DSS
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
b
r
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Qgd
t
d(on)
t
r
t
d(off)
t
f
VGS = 0 V, ID = 250 µA
V
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
= 60 V, V
DS
V
= 60 V, V
DS
V
= 60 V, V
DS
= 5 V, V
DS
V
= 10 V, ID = 15 A
GS
V
= 10 V, ID = 15 A, TJ = 125 °C
GS
V
= 10 V, ID = 15 A, TJ = 175 °C
GS
V
= 4.5 V, ID = 10 A
GS
GS
= 0 V, TJ = 125 °C
GS
= 0 V, TJ = 175 °C
GS
= 10 V
GS
VDS = 15 V, ID = 15 A
VGS = 0 V, V
VDS = 30 V, V
V
DD
≅ 23 A, V
I
D
= 25 V, f = 1 MHz
DS
= 10 V, ID = 23 A
GS
= 30 V, RL = 1.3 Ω
= 10 V, Rg = 2.5 Ω
GEN
60
1.02.03.0
= 0 V
50A
Source-Drain Diode Ratings and Characteristics(TC = 25 °C)
Pulsed Current
Diode Forward Voltage
Reverse Recovery Time
I
SM
V
SD
t
rr
IF = 15 A, V
IF = 15 A, di/dt = 100 A/µs
GS
= 0 V
Notes:
a. For design aid only; not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?72145.
Document Number: 72145
S-71660-Rev. C, 06-Aug-07
www.vishay.com
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
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