Datasheet STW9NC70Z Datasheet (SGS Thomson Microelectronics)

Page 1
STW9NC70Z
N-CHANNEL 700V - 0.90 - 7.5A TO-247
Zener-Protected PowerMESH™III MOSFET
TYPE V
DSS
STW9NC70Z 700 V < 1.2
TYPICAL R
EXTREMELY HIGH dv /d t CAPABILITY GATE-
(on) = 0.9
DS
R
DS(on)
I
D
7.5A
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPAC ITANCES
GATE CHARGE MINIMIZED
DESCRIPTION
The third generation of MESH O VERLAY™ Power MOSFETs for very high voltage exhibits unsur­passed on-resistance per unit area while integrating back-to-back Zener diodes between gate and source. Such arrangement gives extra ESD capabil­ity with higher ruggedness performance as request­ed by a large variety of single-switch applications.
APPLICATIONS
SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
WELDING EQUIPMENT
TO-247
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
I
GS
V
ESD(G-S)
dv/dt (1) Peak Diode Recovery voltage slope 3 V/ns
T
stg
T
j
(•)Pu l se width limited by safe operati ng area
≤7.5A, di/ dt ≤100A/µs, VDD ≤ V
(1)I
SD
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ)
700 V 700 V
Gate- source Voltage ±25 V
Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C
()
Drain Current (pulsed) 30 A Total Dissipation at TC = 25°C
7.5 A
4.7 A
160 W Derating Factor 1.28 W/°C Gate-source Current (DC) ±50 mA Gate source ESD(HBM-C=100pF, R=15K
Ω)
3KV
Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
, Tj ≤ T
(BR)DSS
JMAX.
1/8March 2001
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STW9NC70Z
THERMA L D ATA
Rthj-case Thermal Resistance Junction-case Max 0.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 30 °C/W
Rthc-sink Thermal Resistance Case-sink Typ 0.1 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
BV
DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source
= 25 °C, ID = IAR, VDD = 50 V)
j
ID = 250 µA, VGS = 0 700 V
7.5 A
320 mJ
Breakdown Voltage
/∆TJBreakdown Voltage Temp.
ID = 1 mA, VGS = 0 0.8 V/°C
Coefficient Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
V
= Max Rating
DS
V
= Max Rating, TC = 125 °C
DS
V
= ±20V ±10 µA
GS
A
50 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage Static Drain-source On
Resistance On State Drain Current VDS > I
= VGS, ID = 250 µA
DS
= 10 V, ID = 3.75 A
V
GS
x R
D(on)
V
=10V
GS
DS(on)max,
345V
0.9 1.2
7.5 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS > I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 180 pF Reverse Transfer
Capacitance
I
D
V
DS
=3.75A
D(on)
x R
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
6S
2350 pF
22 pF
2/8
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STW9NC70Z
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON (RESISTIVE LOAD)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 10 ns Total Gate Charge
Gate-Source Charge 14 nC Gate-Drain Charge 21 nC
SWITCHING OFF (INDUCTIVE LOAD)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t t
f
c
Off-voltage Rise Time Fall Time 12 ns Cross-over Time 20 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Source-drain Current 7.5 A
(2)
Source-drain Current (pulsed) 30 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge 7.1 µC Reverse Recovery Current 21 A
= 350V, ID = 3.75A
DD
R
= 4.7Ω VGS = 10V
G
(see test circuit, Figure 3) V
= 560V, ID = 7.5 A,
DD
VGS = 10V
V
= 560V, ID = 7.5 A,
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
ISD = 7.5 A, VGS = 0 I
= 7.5 A, di/dt = 100A/µs,
SD
VDD = 100V, Tj = 150°C (see test circuit, Figure 5)
30 ns
55 77 nC
15 ns
1.6 V
680 ns
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain) 25 V
Voltage
α
T Voltage Thermal Coefficient T=25°C Note(3) 1.3
I
Rz Dynamic Resistance
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1. 5 %.
2. Pulse width li mited by safe operating area .
3. ∆
= αT (25°-T) BV
V
BV
GSO
(25°)
= 50 mA
GS
90
10
-4
/°C
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specif ically been designed to enhanc e not only t he dev ice’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to souce. In this respect the 25V Zener voltage is appropiate to achieve an efficient and cost-effective intervention to protect the device’s integrit y. These int egrated Zener diodes thus avoi d t he usage of external components.
3/8
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STW9NC70Z
Safe Operating Area
Output Characteristics
Ther m al Impe d ance
Transfer Characteristics
Transconductance Static Drain-source On Resistance
4/8
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STW9NC70Z
Capacitance VariationsGate Charge vs Gate-source Voltage
Normalized On Resistance vs Temperatur eNormalized Gate Threshold Volta ge vs Temp.
Source-drain Diode Forward Characteristics
5/8
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STW9NC70Z
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/8
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TO-247 MECHANICAL DATA
STW9NC70Z
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.7 5.3 0.185 0.209 D 2.2 2.6 0.087 0.102 E 0.4 0.8 0.016 0.031
F 1 1.4 0.039 0.055 F3 2 2.4 0.079 0.094 F4 3 3.4 0.118 0.134
G 10.9 0.429
H 15.3 15.9 0.602 0.626
L 19.7 20.3 0.776 0.779 L3 14.2 14.8 0.559 0.582 L4 34.6 1.362 L5 5.5 0.217
M 2 3 0.079 0.118
mm inch
P025P
7/8
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STW9NC70Z
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