The third generation of MESH O VERLAY™ Power
MOSFETs for very high voltage exhibits unsurpassed on-resistance per unit area while integrating
back-to-back Zener diodes between gate and
source. Such arrangement gives extra ESD capability with higher ruggedness performance as requested by a large variety of single-switch applications.
APPLICATIONS
■ SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
■ WELDING EQUIPMENT
TO-247
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
I
GS
V
ESD(G-S)
dv/dt (1)Peak Diode Recovery voltage slope3V/ns
T
stg
T
j
(•)Pu l se width limited by safe operati ng area
≤7.5A, di/ dt ≤100A/µs, VDD ≤ V
(1)I
SD
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
700V
700V
Gate- source Voltage±25V
Drain Current (continuos) at TC = 25°C
Drain Current (continuos) at TC = 100°C
(●)
Drain Current (pulsed)30A
Total Dissipation at TC = 25°C
7.5A
4.7A
160W
Derating Factor1.28W/°C
Gate-source Current (DC)±50mA
Gate source ESD(HBM-C=100pF, R=15K
Ω)
3KV
Storage Temperature–65 to 150°C
Max. Operating Junction Temperature150°C
VDD = 100V, Tj = 150°C
(see test circuit, Figure 5)
30ns
5577nC
15ns
1.6V
680ns
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain)25V
Voltage
α
TVoltage Thermal CoefficientT=25°C Note(3)1.3
I
RzDynamic Resistance
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1. 5 %.
2. Pulse width li mited by safe operating area .
3. ∆
= αT (25°-T) BV
V
BV
GSO
(25°)
= 50 mA
GS
90
10
-4
/°C
Ω
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specif ically been designed to enhanc e not only t he dev ice’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to souce. In this respect the 25V Zener voltage is appropiate to achieve an efficient and
cost-effective intervention to protect the device’s integrit y. These int egrated Zener diodes thus avoi d t he
usage of external components.
3/8
Page 4
STW9NC70Z
Safe Operating Area
Output Characteristics
Ther m al Impe d ance
Transfer Characteristics
TransconductanceStatic Drain-source On Resistance
4/8
Page 5
STW9NC70Z
Capacitance VariationsGate Charge vs Gate-source Voltage
Normalized On Resistance vs Temperatur eNormalized Gate Threshold Volta ge vs Temp.
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subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
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