automatic center frequency calibration:
– LOA: 850 to 1025 MHz
– LOB: 1025 to 1185 MHz
■ Embedded integer-N synthesizer
– Dual modulus programmable prescaler
(16/17 or 19/20)
– Programmable reference frequency divider
(10 bits)
– Adjustable charge pump current
– Digital lock detector
– Excellent integrated phase noise
– Fast lock time: 150 µs
■ Integrated DAC with dual current output
■ Supply: 3.3 V and 5 V analog,
3.3 V digital
■ Dual digital bus interface: SPI and I
mode) with 3 bit programmable address
(1101A
■ Process: 0.35 µm BICMOS SiGe
■ Operating temperature range -40 to +85
■ 44-lead exposed pad VFQFPN
2A1A0
)
package 7x7x1.0 mm
2
C bus (fast
o
C
STW82101B
Datasheet − production data
VFQFPN-44
Applications
■ Cellular infrastructure equipment:
– IF sampling receivers
– Digital PA linearization loops
■ Other wireless communication systems.
Table 1.Device summary
Part numberPackagePackaging
STW82101BVFQFPN-44Tray
STW82101BTRVFQFPN-44Tape and reel
Description
The STMicroelectronics STW82101B is an
integrated down converter providing 8.5 dB of
gain, 9.5 dB NF, and a very high input linearity by
means of its passive mixer.
Embedding two wide band auto calibrating VCOs
and an integer-N synthesizer, the STW82101B is
suitable for both Rx and Tx requirements for
Cellular infrastructure equipment.
The integrated RF balun and internal matching
permit direct 50 ohm single-ended interface to RF
port. The IF output is suitable for driving 200-ohm
impedance filters.
By embedding a DAC with dual current output to
drive an external PIN diode attenuator, the
STW82101B replaces several costly discrete
components and offers a significant footprint
reduction.
The STW82101B device is designed with
STMicroelectronics advanced 0.35 µm
SiGe process. Its performance is specified over a
-40 °C to +85 °C temperature range.
May 2012Doc ID 018503 Rev 31/68
This is information on a product in full production.
FLO = 950 MHz, TA = +25*C, RF power = 0 dBm, unless otherwise specified.
Table 6.Down converter mixer and IF amplifier electrical characteristics
)
(1)
SymbolParameterConditionsMinTypMaxUnit
F
RF
F
LO
F
IF
CGPower Conversion Gain
CG
ΔT
IP
1dB
IIP3
IIP3
ΔT
RF Frequency-695-960MHz
VCOA divided by 4850-1025 MHz
LO Frequency
VCOB divided by 41025-1185 MHz
IF Center Frequency
Power Conversion Gain over
Temperature
(3)
(2)
FIF = ABS(FLO-FRF)70-400MHz
Rin = 50 ohm, Rout = 200 ohm
RFin = 0 dBm
88.59dB
T= -40 to +85 °C-±0.6-dB
High current Mode-12-
Input P1dB
dBm
Low current Mode-7-
Third-order input intercept
(4)
point
IIP3 variation over
temperature
(3)
High current Mode2424.5-
dBm
Low current Mode1818.5-
T= -40 to +85 °C-±0.5-dB
2F
nFRF-nFLOSpurious rejection at IF
(3)
-2FLO F
RF
F
= 150 MHz
IF
-3FLO F
3F
RF
= 150 MHz
F
IF
RFin
RFin
= -5 dBm,
= -5 dBm,
-75-dBc
-75-dBc
High-current mode, MIX = 0011-9.510.2 dB
NF
SSB
Noise figure
Low-current mode, MIX = 0011-9.510.2 dB
1xLO--20-
-LO to IF Leakage
dBm
2xLO-30
-LO to RF Leakage---27-dBm
-RF to IF Isolation--55-dB
RF
IF
RL
RL
RF Return LossMatched to 50 ohm-20-dB
IF Return LossMatched to 200 ohm-22-dB
Maximum deviation from Fc over
±10 MHz. For any Fc within each TX
-
observation path
(5)
Gain Flatness for TX
observation path band.
Maximum deviation from F
over
c
±17.5 MHz. For any Fc within each
-0.05-+0.05 dB
-0.10-+0.10 dB
TX observation path band.
Doc ID 018503 Rev 315/68
Page 16
Electrical characteristicsSTW82101B
Table 6.Down converter mixer and IF amplifier electrical characteristics
(1)
(continued)
SymbolParameterConditionsMinTypMaxUnit
Maximum deviation from linear phase
at F
over ±10 MHz. For any Fc within
c
each TX observation path band.
-
Phase Flatness for TX
observation path
(5)
Maximum deviation from linear phase
at F
over ±17.5 MHz. For any Fc
c
within each TX observation path
band.
Maximum ripple over a 4 MHz band.
(5)
-Gain Flatness for RX path
-Phase Flatness for RX path
Mixer Driver Current
Consumption
ICC
MD
Mixer Driver Current
For any F
Maximum ripple over a 4 MHz band.
(5)
within each RX path band.
c
For any Fc within each RX path band.
3.3 V Supply (pin 41, 42)-35-mA
5 V Supply (pin 40)-35-mA
3.3 V Supply (pin 41, 42)-20-mA
Consumption (Low Current
Mode)
3.3 V Supply (pin 40)-20-mA
3.3 V Supply (pin 33)-10-mA
IFAMP Current Consumption
5 V Supply (pin 31, 32)-107-mA
ICC
IFAM
IFAMP Current Consumption
(Low Current Mode)
1. All linearity and NF performances are intended at maximum LO amplitude (LO_A[1:0]=[11]), tuning capacitors (CAP[2:0])
programmed according to the selected frequency, mixer bias (MIX[3:0]) set to maximize performance and the device
operated in high current mode. The performances of conversion gain, NF and linearity are intended at the SMA connectors
of a typical application board.
2. The IF frequency range supported by the IF Amplifier is from 70 to 400 MHz. The exact IF frequency range supported for a
specific RF frequency can be calculated as F
3. Guaranteed by design and characterization
4. RFin = 0 dBm/tone, RF tone spacing = 5 MHz
5. Guaranteed by design
3.3 V Supply (pin 33)-6-mA
3.3 V Supply (pin 31, 32)-55-mA
= ABS(FLO-FRF) where FLO is inside the specified LO frequency range.
1. The frequency step is related to the PFD input frequency as follows: F
2. See relationship between ICP and R
3. The level of spurs may change depending on PFD frequency, Charge Pump current, selected channel and PLL loop BW.
4. When setting a specified output frequency, the VCO calibration procedure must be run first in order to select the best subrange for the VCO covering the desired frequency. Once programmed at the initial temperature T
temperature range (-40 ° C to +85 ° C), the synthesizer is able to maintain the lock status if the temperature drift (in either
direction) is within the limit specified by ΔTLK, provided that the final temperature T1 is still inside the nominal range.
5. Frequency jump form 1150 to 1075 MHz; it includes the time required by the VCO calibration procedure (7 x F
=17.5 µs with F
=400 kHz))
PFD
in the Circuit Description section (Charge Pump)
EXT_CP
STEP=FPFD
/2)
inside the operating
0
cycles
PFD
Doc ID 018503 Rev 319/68
Page 20
Electrical characteristicsSTW82101B
Table 9.Phase noise performance
(1)
ParametersConditionsMin.Typ.Max.Unit
In band phase noise floor, closed loop
Normalized In Band Phase Noise
Floor (LO)
In Band Phase Noise Floor (LO)-236+20log(N)+10log(F
(2)
I
=4 mA, PLL BW = 50 kHz
CP
(including reference clock
contribution)
--236-
) dBc/Hz
PFD
dBc/Hz
PLL integrated phase noise
Integrated Phase Noise
(single sided)
100 Hz to 40 MHz
= 1.075 GHz, F
F
LO
STEP
=200 kHz,
ICP = 3 mA, PLL BW = 25 kHz
--53.4-dBc
-0.18-° rms
LOA (850 MHz to 1025 MHz) – open loop
Phase Noise @ 1 kHz---74-dBc/Hz
Phase Noise @ 10 kHz---100-dBc/Hz
Phase Noise @ 100 kHz---123-dBc/Hz
Phase Noise @ 1 MHz---143-dBc/Hz
Phase Noise @ 10 MHz---155-dBc/Hz
Phase Noise Floor @ 40 MHz---156-dBc/Hz
LOB (1025 MHz to 1185 MHz) – open loop
Phase Noise @ 1 kHz---67-dBc/Hz
Phase Noise @ 10 kHz---95-dBc/Hz
Phase Noise @ 100 kHz---118-dBc/Hz
Phase Noise @ 1 MHz---140-dBc/Hz
Phase Noise @ 10 MHz---154-dBc/Hz
Phase Noise Floor @ 40 MHz---156-dBc/Hz
1. Phase Noise SSB. VCO amplitude set to maximum value [11]. All the closed-loop performances are specified using a
Reference Clock signal at 76.8 MHz with phase noise of -144 dBc/Hz @1 kHz offset, -157 dBc/Hz @10 kHz offset and
-168 dBc/Hz of noise floor.
2. Normalized PN = Measured LO PN – 20log(N) – 10log(F
comparison frequency at the PFD input
) where N is the VCO divider ratio (N=B*P+A) and F
PFD
PFD
is the
20/68Doc ID 018503 Rev 3
Page 21
STW82101BTypical performance characteristics
7 Typical performance characteristics
Note:Vsupply digital = 3.3 V, Vsupply analog1 = 3.3 V, Vsupply analog2 = 5 V, F
T
= +25 °C, RF power = 0 dBm, unless otherwise specified.
A
Figure 3.Conversion gain against RF frequency
Conversion gain (dB)
RF frequency (MHz)
= 150 MHz,
IF
Figure 4.Noise figure against RF frequency
Noise figure (dB)
RF frequency (MHz)
Doc ID 018503 Rev 321/68
Page 22
Typical performance characteristicsSTW82101B
Figure 5.IIP3 against RF frequency
IIP3 (dBm)
RF frequency (MHz)
Figure 6.2RF-2LO response against RF frequency
2RF-2LO response (dB)
RF frequency (MHz)
22/68Doc ID 018503 Rev 3
Page 23
STW82101BTypical performance characteristics
Figure 7.LOA (VCOA div. by 4) closed-loop phase noise at 0.94 GHz (F
200 kHz, I
= 1.5 mA)
CP
STEP
=
Figure 8.LOB (VCOB div. by 4) closed-loop phase noise at 1.1 GHz (F
200 kHz, I
= 1.5 mA)
CP
STEP
=
Doc ID 018503 Rev 323/68
Page 24
General descriptionSTW82101B
8 General description
The STW82101B (see Figure 1: STW82101B block diagram on page 7) consists of a high
linearity passive CMOS mixer with integrated RF balun, an IF amplifier, a 10-bit current
steering DAC with dual output, and an integrated integer-N synthesizer.
The synthesizer embeds 2 internal low-noise VCOs with buffer blocks, a divider by 4, a low
noise PFD (Phase Frequency Detector), a precise charge pump, a 10-bit programmable
reference divider, two programmable counters and a dual-modulus prescaler. The A-counter
(5 bits) and B counter (12 bits) counters, in conjunction with the dual modulus prescaler
P/P+1 (16/17 or 19/20), implement an N integer divider, where N = B*P+A.
The device is controlled through a digital interface (I2C bus interface or SPI digital interface).
All internal devices operate with a power supply of 3.3 V except for the IF Amplifier output
stage and the mixer driver stage operating at 5 V power supply in order to maximize the
linearity performance. If the application requires a reduced linearity and noise figure
performance the device is programmed in a low-current mode by using the minimum LO
amplitude and the minimum biasing current in the IF amplifier. In low-current mode
operation the device can use only the 3.3 V power supply thus dissipating less power.
8.1 Circuit description
8.1.1 Reference input stage
The reference input stage is shown in Figure 9. The resistor network feeds a DC bias at the
F
input while the inverter used as the frequency reference buffer is AC coupled.
ref
Figure 9.Reference frequency input buffer
F
ref
VDD
Inverter
Buffer
Power Down
24/68Doc ID 018503 Rev 3
Page 25
STW82101BGeneral description
8.1.2 Reference divider
The 10-bit programmable reference counter allows the input reference frequency to be
divided to produce the input clock to the PFD. The division ratio is programmed through the
digital interface.
8.1.3 Prescaler
The dual-modulus prescaler P/P+1 takes the CML clock from the VCO buffer and divides it
down to a manageable frequency for the CMOS A and B counters. The modulus (P) is
programmable and can be set to 16 or 19. It is based on a synchronous 4/5 core which
division ratio depends on the state of the modulus input.
8.1.4 A and B counters
The A (5 bits) and B (12 bits) counters, in conjunction with the selected dual modulus (16/17
or 19/20) prescaler make it possible to generate output frequencies which are spaced only
by the reference frequency divided by the reference division ratio. Thus, the division ratio
and the VCO output frequency are given by the following formulae:
NBPA+×=
F
VCO
BPA+×()F
-----------------------------------------------=
×
ref
R
where:
F
: VCO output frequency.
VCO
P: modulus of dual modulus prescaler (16 or 19 selected through the digital interface).
B: division ratio of the main counter.
A: division ratio of the swallow counter.
F
: input reference frequency.
ref
R: division ratio of the reference counter.
N: division ratio of the PLL
The following points should be noted:
●For the VCO divider to work correctly, B must be higher than A.
●A can take any value from 0 to 31.
●Two PLL division ratio (N) ranges are possible, depending on the value of P:
–256 to 65551 (when P=16)
–361 to 77836 (when P=19).
Doc ID 018503 Rev 325/68
Page 26
General descriptionSTW82101B
Figure 10. VCO divider diagram
VCOBUF-
VCOBUF+
Prescaler
16/17 or 19/20
modulus
5-bit
A counter
8.1.5 Phase frequency detector (PFD)
The PFD takes inputs from the reference and the VCO dividers and produces an output
proportional to the phase error. The PFD includes a delay gate that controls the width of the
anti-backlash pulse. This pulse ensures that there is no dead zone in the PFD transfer
function.
Figure 11 is a simplified schematic of the PFD.
Figure 11. PFD diagram
VDD
F
ref_DIV
D
Q
R
To P F D
12-bit
B counter
Up
Delay
R
F
VCO_div
VDD
D
Q
ABL
26/68Doc ID 018503 Rev 3
Down
Page 27
STW82101BGeneral description
8.1.6 Lock detect
This signal indicates that the difference between rising edges of both UP and DOWN PFD
signals is found to be shorter than the fixed delay (roughly 5 ns). The Lock Detect signal is
high when the PLL is locked. The Lock Detector consumes current only during PLL
transients.
8.1.7 Mute until lock
This (software controlled) function shuts down the following elements until the PLL achieves
the lock status:
●RF output stage
●LO output buffer
●mixer
●IF amplifier circuitry
Under this setting there is no signal at the IF output stage or the LO output during a
frequency jump.
8.1.8 Charge pump
This block drives two matched current sources, Iup and Idown, which are controlled
respectively by the UP and DOWN PFD outputs. The nominal value of the output current is
controlled by an external resistor (to be connected to the REXT input pin) and the selection
of one of 8 possible values by a 3-bit word.
The minimum value of the output current is: IMIN = 2*VBG/REXT_CP (VBG~1.17 V)
Table 10.Current values for CPSEL[2:0] selection
CPSEL2CPSEL1CPSEL0CurrentValue for REXT=4.7 kΩ
000I
0012*I
0103*I
0114*I
1005*I
1016*I
1107*I
1118*I
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
0.5 mA
1.00 mA
1.50 mA
2.00 mA
2.50 mA
3.00 mA
3.50 mA
4.00 mA
Note:The current is output on pin ICP. During the VCO auto calibration, ICP and VCTRL pins are
forced to VDD/2.
Doc ID 018503 Rev 327/68
Page 28
General descriptionSTW82101B
Figure 12. Loop filter connection
VDD
Buffer
Buffer
8.1.9 Voltage controlled oscillators
VCO selection
Within the STW82101B two low-noise VCOs are integrated to cover a wide band from
850 MHz to 1025 MHz, and from 1025 MHz to 1185 MHz after the division by 4:
●VCO A frequency range is 3400 MHz to 4100 MHz
●VCO B frequency range is 4100 MHz to 4740 MHz
Charge
pump
Cal bit
VCTRL
ICP
C3
R3
R1
C2
C1
VCO frequency calibration
Both VCOs can operate on 32 frequency ranges that are selected by adding or subtracting
capacitors to the resonator. These frequency ranges are intended to cover the wide band of
operation and compensate for process variations on the VCO center frequency.
An automatic range selection is performed when the bit SERCAL rises from ‘0’ to ‘1’ . The
charge pump is inhibited and the pins ICP and VCTRL are set at a fixed calibration voltage
(VCAL). The frequency ranges are then tested to select the nearest one to the desired
output frequency (F
charge pump is once again enabled and the PLL performs a fine adjustment around VCAL
on the loop filter voltage to lock F
Two calibration algorithms are selectable by setting the CALTYPE bit.
Setting the CALTYPE bit to ‘1’ guarantees the PLL lock versus temperature variations. Once
programmed at the initial temperature, T
+85 °C), the synthesizer is able to maintain the lock status if the temperature drift (in either
direction) is within the limit specified by ΔT
still inside the nominal range.
Setting the CALTYPE bit to ‘0’ fixes VCAL to the mid point of the charge pump output
(VDD/2). Optimum PLL phase noise performance versus temperature variations with a
reduced ΔT
i
s guaranteed in this case.
LK
OUT
= N*F
/R) with VCAL input voltage applied. After this selection, the
ref
, thus enabling a fast settling time.
OUT
, within the operating temperature range (-40 °C to
0
, and provided that the final temperature, T
LK
1
, is
28/68Doc ID 018503 Rev 3
Page 29
STW82101BGeneral description
The ΔT
parameter, specific to each VCO and calibration type, in the STW82101B is
LK
specified in Table 8: Integer-N synthesizer electrical characteristics.
Figure 13. VCO typical sub-band characteristics
FREQ (Hz)
Calibrator lock
range
00000
00001
01111
11111
0.00
0.50
1.00
1.50
VCTRL (V)
2.00
2.50
3.00
3.50
The SERCAL bit should be set to ’1’ at each division ratio change. The calibration takes
approximately 7 periods of the Comparison Frequency and the SERCAL bit is automatically
reset to ’0’ at the end of each calibration.
The maximum allowed F
to perform the calibration process is 1 MHz. If a higher F
PFD
PFD
is
used the following procedure should be adopted:
1.Calibrate the VCO at the desired frequency with an F
2. Set the A, B and R dividers ratio for the desired F
PFD
lower than 1 MHz
PFD
For calibration details refer to Section 9.4.1: VCO calibration procedure (I2C interface) or
The VCO Calibration Auto-Restart feature, once activated, allows the calibration procedure
to be restarted when the Lock Detector reports that the PLL has moved to an unlock
condition (trigger on ‘1’ to ‘0’ transition of Lock Detector signal).
This situation could happen if the device experiences a significant temperature variation and
the CALTYPE bit is set for optimum PLL phase noise performance (CALTYPE [0]).
By enabling the VCO Calibration Auto-Restart feature (through the AUTO_CAL bit), the
device re-selects the proper VCO frequency sub-range, without any external user
command.
This feature can be enabled only when the F
is lower than 1 MHz.
PFD
VCO voltage amplitude control
The voltage swing of the VCOs can be adjusted over 4 levels by means of two dedicated
programming bits (PLL_A1 and PLL_A0). This setting trades current consumption with
phase noise performances of the VCO. Higher amplitudes provide best phase noise while
lower ones save power.
30/68Doc ID 018503 Rev 3
Page 31
STW82101BGeneral description
Ta bl e 1 1 and Ta bl e 1 2 give the current consumption and the phase noise at 1 MHz.
Table 11.VCOA performance against amplitude setting (frequency = 3.6 GHz)
PLL_A[1:0]
0023-127
0124-128
1032-131
1135-132
Table 12.VCOB performance against amplitude setting (frequency = 4.3 GHz)
PLL_A[1:0]
0016-124
0118-126
1027-128
1130-129
8.1.10 Output stage
The differential output signal of the synthesizer after the Divider by 4 is available on
pins 16 and 17.
The output stage is selected by programming the PD[4:0] bits.
Current
consumption (mA)
Current
consumption (mA)
PN @ 1 MHz
PN @ 1 MHz
The output stage is an open-collector structure which is able to meet different requirements
over the desired output frequency range by proper connections on the PCB. See Figure 27:
Diversity mode operation with same LO frequencies.
8.1.11 External VCO buffer
Although the STW82101B includes two wideband and low-noise VCOs, external VCO use
capability is also provided.
The external VCO buffer can be used to manage a signal coming from an external VCO in
order to build a local oscillator signal by using the STW82101B internal synthesizer as a
PLL. This is only possible when External VCO standard mode or External VCO diversity
master mode operation are selected. See Figure 29: External VCO standard mode
operation and Figure 30: External VCO diversity mode operation with same LO.
If the STW82101B is operated in Diversity slave mode, the external VCO buffer manage the
signal coming from the synthesizer output stage of another STW82101B device See
Figure 27: Diversity mode operation with same LO frequencies and Figure 30: External
VCO diversity mode operation with same LO.
The selection of the external VCO buffer is done by setting the PD[4:0] bits.
The external VCO signal can range from 850 MHz to 1185 MHz and its minimum power
level must be -10 dBm.
Doc ID 018503 Rev 331/68
Page 32
General descriptionSTW82101B
8.1.12 Mixer and IF amplifier
LO mixer driver
The LO signal is fed through a driver in order to achieve the high power level needed to drive
the passive mixer for maximum performance of linearity and NF.
The LO Mixer Driver is coupled to the mixer with an integrated LO balun. The LO signal level
is adjusted by means of an Automatic Level Control loop (ALC) controlled by the bits
LO_A[1:0].
In low current mode the configuration LO_A[1:0]=’00’ (minimum LO amplitude) should be
selected and the power supply on pin 40 can be set to 3.3 V.
The LO balun resonating frequency can be adjusted by means of the bits CAP[2:0] in order
to match the selected LO frequency.
Suggested CAP[2:0] values for LO Frequency range mixer
CAP[2:0]LO frequency range
0001120MHz ÷ 1185MHz
0011065MHz ÷ 1120MHz
0101020MHz ÷ 1065MHz
011975MHz ÷ 1020MHz
100940MHz ÷ 975MHz
101905MHz ÷ 940MHz
110875MHz ÷ 905MHz
111850MHz ÷ 875MHz
Mixer
A doubly balanced CMOS passive mixer is internally driven by the high level LO signal in
order to achieve high linearity and low noise performance.
The RF integrated balun permits the removal of external components and it is internally
matched to 50 ohms.
The gate bias of the CMOS devices in the mixer is programmable with 4 bits (MIX[3:0]) to
optimize the input matching and the gain of the signal chain.
Higher values of gate bias (higher decimal values of MIX[3:0]) are suggested to maximize
linearity and lower values to maximize the performance of Gain and NF.
32/68Doc ID 018503 Rev 3
Page 33
STW82101BGeneral description
IF amplifier
The integrated IF stage permits a 200-ohm load to be driven (typically a SAW filter) ensuring
high linearity.
It is an open collector stage (pin 31, 32) and should be biased to 5 V with choke inductors.
The typical output impedance is 200 ohms. The linearity performances are controlled by the
bits IFAMP[1:0]. In low current mode the configuration IFAMP[1:0]=’00’ (minimum linearity)
should be selected and the open collector stage can be biased to 3.3 V with choke
inductors.
Table 13.Linearity performance against IFAMP[1:0] configuration (typical
condition)
IFAMP[1:0]Linearity performance
0018.5 dB
0120.5 dB
1022.5dB
1124.5dB
8.1.13 Dual output current DAC
The STW82101B embeds a 10-bit Dual Output steering current DAC especially suited to
drive an external PIN diode attenuator. This provides power level calibration capability at the
RF input for the TX observation path applications.
The current sourced by the DAC is related to the R
following formulae (where VR
IDAC
LSB
IDAC
FS
With a 10 kΩ R
EXT_DAC
the FS current is approximately 2.8 mA.
EXT_DAC
1
-- -
2
1
-- -
2
is approximately 1.19 V):
3VR
×
EXT_DAC
----------------------------------------
R
EXT_DAC
3VR
×
EXT_DAC
----------------------------------------
R
EXT_DAC
××=LSB DAC current
1023
------------ -
××=Full scale current
EXT_DAC
1
------
64
64
resistor according to the
Doc ID 018503 Rev 333/68
Page 34
I2C bus interfaceSTW82101B
9 I2C bus interface
The I2C bus interface is selected by hardware connection of the pin 25 (DBUS_SEL) to 0 V.
Data transmission from a microprocessor to the STW82101B takes place through the 2
wires (SDA and SCL) I
2
The I
C-bus protocol defines any device that sends data on to the bus as a transmitter and
2
C-bus interface. The STW82101B is always a slave device.
any device that reads the data as receiver. The device that controls the data transfer is
known as the master and the others as slaves. The master always initiates the transfer and
provides the serial clock for synchronization.
The STW82101B I
2
C bus supports Fast Mode operation (clock frequency up to 1 MHz).
9.1 I2C general features
9.1.1 Data validity
Data changes on the SDA line must only occur when the SCL is LOW. SDA transitions while
the clock is HIGH identify START or STOP conditions.
Figure 14. Data validity waveform
SDA
SCL
Data line stable
data valid
Change
data allowed
34/68Doc ID 018503 Rev 3
Page 35
STW82101BI2C bus interface
9.1.2 START and STOP conditions
Figure 15. START and STOP condition waveform
SCL
SDA
START
START condition
A START condition is identified by a HIGH to LOW transition of the data bus SDA while the
clock signal SCL is stable in the HIGH state. A Start condition must precede any command
for data transfer.
STOP condition
A STOP condition is identified by a transition of the data bus SDA from LOW to HIGH while
the clock signal SCL is stable in the HIGH state.. A STOP condition terminates
communications between the STW82101B and the Bus Master.
9.1.3 Byte format and acknowledge
Every byte (8 bits long) transferred on the SDA line must contain bits. Each byte must be
followed by an acknowledge bit. The MSB is transferred first.
An acknowledge bit indicates a successful data transfer. The transmitter, either master or
slave, releases the SDA bus after sending 8 bits of data. During the 9th clock pulse the
receiver pulls the SDA low to acknowledge the receipt of 8 bits of data.
Figure 16. Byte format and acknowledge waveform
STOP
SCL
SDA
START
MSB
1
2
3
7
8
Acknowledgement
from receiver
STOP
9
Doc ID 018503 Rev 335/68
Page 36
I2C bus interfaceSTW82101B
9.1.4 Device addressing
To start the communication between the Master and the STW82101B, the master must
initiate with a START condition. Following this, the master sends onto the SDA line 8 bits
(MSB first) corresponding to the device select address and read or write mode.
The first 7 MSBs are the device address identifier, corresponding to the I
For the STW82101B the address is set as ’1101A
’, 3-bits programmable. The 8th bit
2A1A0
2
C-Bus definition.
(LSB) is the read or write operation bit (the RW bit is set to ‘1’ in read mode and to 0 in write
mode).
After a START condition the STW82101B identifies the device address on the bus and, if
matched, it acknowledge the identification on SDA bus during the 9th clock pulse.
9.1.5 Single-byte write mode
Following a START condition the master sends a device select code with the RW bit set to 0.
The STW82101B gives an acknowledge and waits for the internal sub-address (1 byte). This
byte provides access to any of the internal registers.
After reception of the internal byte sub-address the STW82101B again responds with an
acknowledge. A single-byte write to sub-address 0x00 would affect DATA_OUT[47:40], a
single-byte write with sub-address 0x04 would affect DATA_OUT[15:8] and so on.
S1101A2A1A
0
0ack
9.1.6 Multi-byte write mode
The multi-byte write mode can start from any internal address. The master sends the data
bytes and each one is acknowledged. The master terminates the transfer by generating a
STOP condition.
The sub-address determines the starting byte. For example, a multi-byte write with subaddress 0x01 and 4 DATA_IN bytes affects 4 bytes starting at address 0x01 (registers at
addresses 0x01, 0x02, 0x03 and 0x04 are modified).
S1101A2A1A00ack
sub-address
byte
9.1.7 Current byte address read
In the current byte address read mode, following a START condition, the master sends the
device address with the RW bit set to ‘1’ (No sub-address is needed as there is only 1 byte
read register). The STW82101B acknowledges this and outputs the data byte. The master
does not acknowledge the received byte, but terminates the transfer with a STOP condition.
S1101A2A1A
0
sub-address
byte
ackDATA INack..
1ackDATA OUTNo ackP
ackDATA INackP
DATA
IN
ackP
36/68Doc ID 018503 Rev 3
Page 37
STW82101BI2C bus interface
9.2 I2C timing specifications
9.2.1 Data and clock timing specification
Figure 17. I2C data and clock waveforms
SDA
SCL
t
cwl
Table 14.I
t
cs
2
C data and clock timing parameters
t
ch
t
cwh
SymbolParameterMinUnit
T
cs
T
ch
T
cwh
T
cwl
Data to clock set up time2
Data to clock hold time2
Clock pulse width high10
Clock pulse width low5.5
9.2.2 I2C START and STOP timing specification
Figure 18. I2C START and STOP timing waveforms
SDA
SCL
ns
t
t
start
stop
Doc ID 018503 Rev 337/68
Page 38
I2C bus interfaceSTW82101B
Table 15.I2C START and STOP timing parameters
SymbolParameterMinUnit
T
T
start
stop
Clock to data start time2
ns
Data to clock down stop time2
9.2.3 I2C acknowledge timing specification
Figure 19. I2C acknowledge timing waveforms
SDA
SCL
Table 16.I2C acknowledge timing parameters
8
t
d1
9
t
d2
SymbolParameterMax Unit
T
d1
T
d2
Ack begin delay2
Ack end delay2
ns
38/68Doc ID 018503 Rev 3
Page 39
STW82101BI2C bus interface
9.3 I2C registers
STW82101B has 9 write-only registers and 1 read-only register.
9.3.1 I2C register summary
The following table gives a short description of the write-only registers list.
Table 17.I2C register list
OffsetRegister nameDescriptionPage
0x00FUNCTIONAL_MODEFunctional mode register on page 40
0x01B_COUNTERB counter register on page 40
0x02A_COUNTERA counter register on page 41
0x03REF_DIVIDERReference clock divider ratio register on page 41
0x04CONTROLPLL control register on page 42
0x05MUTE_&_CALIBRATIONMute and calibration control register on page 43
0x06DAC_CONTROLDAC control register on page 43
0x07MIXER_CONTROLMixer control register on page 44
0x08IFAMP_LO_CONTROLIF amplifier LO control register on page 44
0x09READ_ONLY_REGISTERDevice ID and calibration status register on page 45
Doc ID 018503 Rev 339/68
Page 40
I2C bus interfaceSTW82101B
9.3.2 I2C register definitions
FUNCTIONAL_MODEFunctional mode register
76543210
ALC_PDPKD_ENPD[4:0]B11
WWWW
Address:0x00
Type:W
Reset:0x00
[7] ALC_PD: for test purpose only must be set to ’0’. (ALC ON)
[6] PKD_EN: for test purpose only must be set to ’0’. (Peak detector output on pin 36 OFF)
[5:1] PD[4:0]: bits used to select different functional modes for the STW82101B according to
the following table
00000: (0 decimal) Power down mode
00001: (1 decimal) Standard Mode VCOA (VCOA and RX chain ON)
00010: (2 decimal) Standard Mode VCOB (VCOB and RX chain ON)
00011: (3 decimal). Diversity Slave Mode (ExtVCO/LO input buffer and RX Chain ON;
internal synthesizer OFF)
00100: (4 decimal) Diversity Master Mode VCOA (VCOA, RX Chain and LO output
buffer ON)
00101: (5 decimal) Diversity Master Mode VCOB (VCOB, RX Chain and LO output
buffer ON)
00110: (6 decimal) External LO Standard Mode (RX Chain ON; PLL and ExtVCO/LO
[0] B11: B counter value (bits B[10:0] in the B_COUNTER and A_COUNTER registers)
B_COUNTERB counter register
76543210
B[10:3]
W
Address:0x01
Type:W
Reset:0x00
Description:Most significant bits of the B counter value
[7:0] B[10:3]: B counter value (bit B11 in the FUNCTIONAL_MODE register, bits B[2:0] in the
A_COUNTER register)
40/68Doc ID 018503 Rev 3
Page 41
STW82101BI2C bus interface
A_COUNTERA counter register
76543210
B[2:0]A[4:0]
WW
Address:0x02
Type:W
Reset:0x00
Description:Least significant bits of the B-counter value. A-counter value.
[7:5] B[2:0]: B Counter value (bit B11 in the FUNCTIONAL_MODE register, bits B[10:3] in
the B_COUNTER register).
[4:0] A[4:0]: A counter value
REF_DIVIDERReference clock divider ratio register
76543210
R[9:2]
W
Address:0x03
Type:W
Reset:0x00
Description:Most significant bits of the reference clock divider ratio value.
[7:0] R[9:2]: Reference clock divider ratio (bits R[1:0] in the CONTROL register)
Doc ID 018503 Rev 341/68
Page 42
I2C bus interfaceSTW82101B
CONTROLPLL control register
76543210
[R1:0]PLL_A[1:0]CPSEL[2:0]PSC_SEL
WWWW
Address:0x04
Type:W
Reset:0x00
Description:Least significant bits of the reference clock divider ratio value and PLL control bits.
[7:6] R[1:0]: Reference clock divider ratio (bits R[9:2] in the REF_DIVIDER register)
[5:4] PLL_A[1:0]:
[3:1] CPSEL[2:0]: Charge Pump output current
[0] PSC_SEL: Prescaler Modulus select (‘0’ for P=16, ‘1’ for P=19)
The LO output frequency is programmed by setting the proper value for A, B and R
according to the following formula
VCO amplitude
F
LO
:
F
ref
D
BPA+⋅()
⋅⋅=
R
--------- -
R
where DR equals 0.25 (VCOs output frequency divided by 4)
and P is the selected Prescaler Modulus
42/68Doc ID 018503 Rev 3
Page 43
STW82101BI2C bus interface
MUTE_&_CALIBRATIONMute and calibration control register
76543210
CALTYPE
WWWWWWWW
SERCAL
SELEXTCAL
MUTE_EN
MUTE_TYPE
MUTE_LOOUT_EN
MUTE_MIX_EN
Address:0x05
Type:W
Reset:0x00
Description:For test purposes only
[7]
CALTYPE:
0: standard calibration to optimize the phase noise versus temperature
1: enhanced calibration to maximize the ΔTLK range
[6] SERCAL:
1: starts the VCO auto-calibration (automatically reset to ’0’ at the end of calibration)
[5] SELEXTCAL: test purpose only; must be set to ‘0’
[4] MUTE_EN:
0: mute function disabled
1: mute function enabled
[3] MUTE_TYPE: must be set to '1' while the mute function is enabled (mute the IF output
on Unlock state)
[2] MUTE_LOOUT_EN:
To be set to ’1’ to mute the LO output buffer
[1] MUTE_MIX_EN:
To be set to ’1’ mute the Mixer circuitry
[0] MUTE_IFAMP_EN: To be set to '1' to mute the IF amplifier circuitry
MUTE_IFAMP_EN
DAC_CONTROLDAC control register
76543210
DAC[9:2]
W
Address:0x06
Type:W
Reset:0x00
Description:Most significant bits of the DAC control word
[7:0] DAC[9:2]: DAC input word for DAC current control (bits DAC[1:0] in the
MIXER_CONTROL register).
Doc ID 018503 Rev 343/68
Page 44
I2C bus interfaceSTW82101B
MIXER_CONTROLMixer control register
76543210
DAC[1:0]
WWWW
MIX[3:0]
PD_DAC
Address:0x07
Type:W
Reset:0x00
Description:Least significant bits of DAC control word and mixer control bit fields
[7:6] DAC[1:0]: DAC input word for DAC current control (bits DAC[9:2] in the DAC_CONTROL
register)
[5:2] MIX[3:0]: Mixer bias control value
[1] PD_DAC: DAC power down
[0] CAL_AUTOSTART_EN: VCO calibration auto-restart enable (’1’ active), permits to
automatically restart the VCO calibration procedure in case of PLL unlock
IFAMP_ LO_CONTROLIF amplifier LO control register
76543210
IFAMP[1:0]CAP[2:0]LO_A[1:0]LPMUX_EN
WWWW
CAL_AUTOSTART_EN
Address:0x08
Type:W
Reset:0x00
[7:6] IFAMP[1:0]: power consumption/linearity control
[5:3] CAP[2:0]: Tuning capacitors control
[2:1] LO_A[1:0]: LO amplitude control
[0] LPMUX_EN: for test purpose only (low power mode for MUX); must be set to ’0’
44/68Doc ID 018503 Rev 3
Page 45
STW82101BI2C bus interface
READ-ONLY REGISTERDevice ID and calibration status register
76543210
ID[1:0]LOCK_DETINTCAL[4:0]
RRR
Address:0x09
Type:R
Reset:0x00
Description:This register is automatically addressed in the ‘current byte address read mode’
[7:6] ID[1:0]: device identification ’01’ for STW82101B
[5] LOCK_DET: ’1’ when PLL is locked
[4:0] INTCAL[4:0]: internal value of the VCO calibration control word
Doc ID 018503 Rev 345/68
Page 46
I2C bus interfaceSTW82101B
9.4 Device calibration through the I2C interface
9.4.1 VCO calibration procedure (I2C interface)
The calibration of the VCO center frequency is activated by setting the SERCAL bit of the
MUTE & CALIBRATION register to ’1’.
To program the device ensuring a correct VCO calibration, the following procedure is
required before every channel change:
1.Program all the Registers using a multi-byte write sequence with the desired setting:
–Functional Mode
–B and A counters
–R counter
–VCO amplitude
–Charge Pump
–Prescaler Modulus
–DAC
–Mixer and LO Control
–all bits of the MUTE & CALIBRATION Register (0x05) set to ’0’.
2. Program the MUTE & CALIBRATION register using a single-byte write sequence (subaddress 0x05) with the SERCAL bit set to ’1’.
The maximum allowed PFD frequency (F
the desired F
is higher than 1 MHz the following steps are needed:
PFD
PFD
3. Perform all the step of the above calibration procedure programming the desired VCO
frequency with a proper setting of R, B and A counter so that F
1MHz.
4. Once calibration is completed, program all the Registers by using a multi-byte write
sequence (Functional Mode, B and A counters, R counter, VCO amplitude, Charge
Pump, Prescaler Modulus, DAC, Mixer and LO Control) with the proper settings for the
desired VCO and PFD frequencies.
9.4.2 Power ON sequence (I2C interface)
At power-on the device is configured in power-down mode.
In order to guarantee correct setting of the internal circuitry after the power on, the following
steps must be followed:
1.Power up the device
2. Provide the Reference clock
3. Implement the first programming sequence with a proper delay time between the STOP
condition of the multi-byte write sequence and that of the single-byte write sequence
(see Figure 20). The T
The VCO calibration auto-restart feature is enabled in two steps:
1.Set the desired frequency ensuring VCO calibration procedure as described above
(Section 9.4.1).
2. Program the MIXER_CONTROL register (sub-address 0x07) using a single-byte write
sequence with the CAL_AUTOSTART_EN bit set to '1' while keeping the others
unchanged.
ref
LSB
Doc ID 018503 Rev 347/68
Page 48
SPI digital interfaceSTW82101B
10 SPI digital interface
10.1 SPI general features
The SPI digital interface is selected by hardware connection of the pin 25 (DBUS_SEL) to
3.3 V.
The STW82101B IC is programmed by means of a high-speed serial-to-parallel interface
with write option only. The 3-wires bus can be clocked at a frequency as high as 100 MHz to
allow fast programming of the registers containing the data for RF IC configuration.
The programming of the chip is done through serial words with whole length of 26 bits. The
first 2 MSB represent the address of the registers. The others 24 LSB represent the value of
the registers.
Each data bit is stored in the internal shift register on the rising edge of the CLOCK signal.
On the rising edge of the LOAD signal the outputs of the selected register are sent to the
device.
The calibration of the VCO center frequency is activated by setting to ’1’ the SERCAL bit
(ST2 Register bit [6]).
In order to program properly the device while ensuring the VCO calibration, the following
procedure is required before every channel change:
1.Program the ST1 Register with the desired setting (DAC, Mixer, LO Control)
2. Program the ST3 Register with the desired setting (Functional mode, B and A counters)
3. Program the ST2 Register with the desired setting (R counter, VCO amplitude, Charge
Pump, Prescaler Modulus) and SERCAL bit set to ’1’
The maximum allowed PFD frequency (F
the desired F
is higher than 1 MHz the following steps are needed:
PFD
PFD
4. Perform all the steps of the above calibration procedure programming the desired VCO
frequency with a proper setting of R, B and A counter so that F
MHz.
5. Once calibration is completed program the device with the proper setting for the desired
VCO and PFD frequencies according to the following steps:
a) Program the ST3 Register with the desired setting (Functional mode, B and A
counters)
b) Program the ST2 Register with the desired setting (R counter, VCO amplitude,
Charge Pump, Prescaler Modulus) with the SERCAL bit set to ’0’.
10.4.2 Power ON sequence (SPI interface)
At power-on the device is configured in power-down mode.
In order to guarantee correct setting of the internal circuitry after the power on, the following
steps must be followed:
1.Power up the device
2. Provide the reference clock
3. Implement the first programming sequence with a proper delay time between the ST3
and ST2 load rising edges (see Figure 24). The T
condition:
Note:1or optimum performance a low-noise 3.3 V power supply must be used.
2The 3.3 V and 5 V power supplies are split in order to maximize the isolation between RF,
LO, IF and digital sections.
Doc ID 018503 Rev 357/68
Page 58
Application informationSTW82101B
11.2 Standard Mode Operation
The STW82101B can be used in Standard Mode for both RX path and TX observation path
(RX Chain ON and Synthesizer ON).
In such a case the 10-bit internal DAC can drive an external PIN diode attenuator in order to
calibrate the signal level at the input of the device.
Figure 26. Standard mode operation
RF_IN2
RF_IN
I_PINDRV1
I_PINDRV2
RF_IN
RF_VSS
RF_CT
5V
MIXDRV_CT
DAC
VCTRL
MIX
DRV
DIV4
VCO
BUFF
REXT_DAC
STW82101B
5V
4:1
IF_OUT
50 Ω
CAL_VCO
PLL
ICP
VCO
calibrator
CAL_VCO
PFD
IF AMP
DBUS
IF_OUTP
IF_OUTN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
BUF
UP
DN
REF_CLK
LOCK_DET
CHP
REXT_CP
58/68Doc ID 018503 Rev 3
Page 59
STW82101BApplication information
11.3 Diversity mode operation with same LO frequency
The STW82101B supports the Diversity mode with the same LO frequency by using one
STW82101B in Master Mode (RX Chain ON, Synthesizer ON and LO output buffer ON) and
the other in Slave Mode (RX Chain ON, Synthesizer OFF and EXT VCO/LO buffer ON). This
operation mode is suitable for antenna diversity.
Figure 27. Diversity mode operation with same LO frequencies
RF_IN_M
3.3V
50 Ω
RF_IN
RF_VSS
RF_CT
5V
MIXDRV_CT
50 Ω
OUTBUFP
OUTBUFN
LO
OUT
VCTRL
MIX
DRV
DIV4
VCO
BUFF
STW82101B Master
PLL
CAL_VCO
ICP
to DAC
VCO
calibrator
CAL_VCO
PFD
IF AMP
DBUS
5V
4:1
IF_OUTP
IF_OUTN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
BUF
UP
CHP
DN
REF_CLK
LOCK_DET
REXT_CP
IF_M
50 Ω
RF_IN_S
EXTVCO_INP
100 Ω
EXTVCO_INN
5V
MIXDRV_CT
RF_IN
RF_VSS
RF_CT
EXT
LO/VCO
BUF
MIX
DRV
STW82101B Slave
DBUS_SEL
DBUS
IF AMP
SDA/DATA
SCL/CLK
LOAD
IF_OUTP
IF_OUTN
5V
4:1
Doc ID 018503 Rev 359/68
IF_S
50 Ω
Page 60
Application informationSTW82101B
11.4 Diversity mode operation with different LO frequencies
The STW82101B is particularly suitable for Diversity schemes using different LO
frequencies such as the Interferer Diversity. In these schemes two STW82101Bs are used,
each one set in Standard Mode and with different LO frequencies.
Figure 28. Diversity mode operation with different LO frequencies
RF_IN1
RF_IN2
RF_IN
RF_VSS
RF_CT
5V
MIXDRV_CT
RF_IN
RF_VSS
RF_CT
5V
MIXDRV_CT
VCTRL
LO1
MIX
DRV
DIV4
VCO
BUFF
LO2
MIX
DRV
DIV4
VCO
BUFF
STW82101B Master
PLL
CAL_VCO
STW82101B Diversity
PLL
ICP
VCO
calibrator
VCO
calibrator
CAL_VCO
PFD
CAL_VCO
PFD
IF AMP
DBUS
IF AMP
DBUS
5V
4:1
IF_OUTP
IF_OUTN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
CHP
CHP
REF_CLK
LOCK_DET
REXT_CP
IF_OUTP
IF_OUTN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
REF_CLK
LOCK_DET
REXT_CP
5V
BUF
UP
DN
BUF
UP
DN
IF_OUT1
50 Ω
4:1
IF_OUT2
50 Ω
VCTRL
CAL_VCO
ICP
60/68Doc ID 018503 Rev 3
Page 61
STW82101BApplication information
11.5 External VCO standard mode operation
The STW82101B can be used in Ext VCO Mode for both RX path and TX observation path
(RX Chain ON, Synthesizer ON, EXT VCO/LO buffer ON and with an external VCO).
In such a case the 10-bit internal DAC can drive an external PIN diode attenuator in order to
calibrate the signal level at the input of the device.
Figure 29. External VCO standard mode operation
RF_IN2
RF_IN
I_PINDRV1
I_PINDRV2
RF_IN
RF_VSS
RF_CT
5V
MIXDRV_CT
EXTVCO_INP
EXTERNAL
VCO
DAC
LO/VCO
MIX
DRV
EXT
BUF
REXT_DAC
EXTVCO_INN
STW82101B
PLL
PFD
IF AMP
DBUS
5V
4:1
IF_OUTP
IF_OUTN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
BUF
UP
DN
REF_CLK
LOCK_DET
CHP
REXT_CP
ICP
IF_OUT
50 Ω
Doc ID 018503 Rev 361/68
Page 62
Application informationSTW82101B
11.6 External VCO diversity mode operation with same LO
The STW82101B can be used in Diversity mode using one STW82101B in Master Mode
(RX Chain ON, Synthesizer ON, EXT VCO/LO buffer ON, LO output buffer ON and with an
external VCO) and the other one in Slave Mode (RX Chain ON, Synthesizer OFF and EXT
VCO/LO buffer ON).
Figure 30. External VCO diversity mode operation with same LO
RF_IN_M
3.3V
50 Ω
EXTVCO_INP
100 Ω
EXTVCO_INN
RF_IN
RF_VSS
RF_CT
5V
MIXDRV_CT
50 Ω
OUTBUFP
OUTBUFN
LO/2xLO
OUT
EXTVCO_INP
EXTERNAL
VCO
EXT
LO/VCO
BUF
MIX
DRV
VCO
BUFF
EXTVCO_INN
STW82101B Master
to DAC
PLL
STW82101B Slave
PFD
IF AMP
DBUS
UP
DN
DBUS
BUF
CHP
ICP
IF_OUTP
IF_OUTN
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
REF_CLK
LOCK_DET
REXT_CP
DBUS_SEL
SDA/DATA
SCL/CLK
LOAD
5V
4:1
IF_M
50 Ω
MIX
DRV
5V
MIXDRV_CT
RF_IN_S
RF_IN
RF_VSS
RF_CT
62/68Doc ID 018503 Rev 3
IF AMP
IF_OUTP
IF_OUTN
5V
4:1
IF_S
50 Ω
Page 63
STW82101BEvaluation kit
12 Evaluation kit
An evaluation kit can be delivered upon request, including the following:
●Evaluation board
●GUI (graphical user interface) to program the device
●PLLSim software for PLL loop filter design and noise simulation
When ordering, please specify the following order code:
Table 22.Evaluation kit order code
Part numberDescription
STW82101B-EVBSTW82101B evaluation kit, 0.7 to 0.95 GHz RF frequency range
Doc ID 018503 Rev 363/68
Page 64
Package mechanical dataSTW82101B
13 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 31. VFQFPN-44 package outline
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
64/68Doc ID 018503 Rev 3
Page 65
STW82101BPackage mechanical data
Table 23.VFQFPN-44 package dimensions
Dimensions in mm
Symbol
MinTypMax
A0.800.901.00
A1-0.020.05
A2-0.651.00
A3-0.200-
b0.180.250.30
D6.857.007.15
D1-6.750-
D23.803.904.00
D3-4.90-
E6.857.007.15
E1-6.750-
E23.803.904.00
E3-4.90-
e-0.50-
L0.350.550.75
P--0.60
K (degree)--12
ddd--0.08
Note:1VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead.
Very thin: A=1.00 Max.
2Details of terminal 1 identifier are optional but must be located on the top surface of the
package by using either a mold or marked features.
Doc ID 018503 Rev 365/68
Page 66
Revision historySTW82101B
14 Revision history
Table 24.Document revision history
DateRevisionChanges
07-Mar-20111First release
Cover page:
– Noise figure NF changed to 9.5 dB
– Conversion gain CG changed to 8.5 dB
– Removed ‘Preliminary Data’ tags.
Table 3 moved to new Section 3: Absolute maximum ratings
Section 2.1 becomes Section 4: Operating conditions
Section 2.2 becomes Section 5: Test conditions
Section 2.3 becomes Section 6: Electrical characteristics
Table 4: Operating conditions updated current consumption:
. Updated typical values. Added maximum values.
CC3.3V
. Added maximum value for high-current mode at 5.5 V. Updated typical
CC5V
and added maximum value for low-current mode at 3.3 V.
RF-nFLO modified typical values
added maximum value for high-current mode, modified typical value
SSB
and added maximum value for low-current mode
and K
VCOA
split into ΔT
LK
typical values
VCOB
LK A
and ΔT
(for VCOA and VCOB). Specified as
LK B
maximum values.
typical value
DIV4
LOBUF and ILOBUF
lower frequency range typical value
VCOA
typical values
40 MHz
40 MHz
16-Jan-20122
–I
–I
Section 6: Electrical characteristics. Added note about Vsupply, RF frequency
range, ambient temperature and RF power conditions.
Table 6: Down converter mixer and IF amplifier electrical characteristics :
updated:
– CG nominal value 8, added minimum and max values.
– IIP3 added minimum values
–nF
–NF
Section 8.1.9: Voltage controlled oscillators. Modified sub-sections:
– VCO frequency calibration
– VCO calibration auto-restart feature
66/68Doc ID 018503 Rev 3
Page 67
STW82101BRevision history
Table 24.Document revision history (continued)
DateRevisionChanges
Section 9.3.2: I2C register definitions. Updated description of bitfield CALTYPE
and MUTE_TYPE in registers MUTE_&_CALIBRATION
Added Section 9.4.2: Power ON sequence (I2C interface)
Section 12: Evaluation kit:
– modified Figure 23: SPI timing waveforms
16-Jan-20122
11-May-20123
– modified Table 19: SPI timing parameters minimum values of t
t
clk_loadf.
clk_loadr
Section 10.3.2: SPI register definitions: updated
– description of bitfields CALTYPE and MUTE_TYPE in register ST2
– description of bitfield PD[4:0] in register ST3
Added Section 10.4.2: Power ON sequence (SPI interface)
Added Section 12: Evaluation kit.
Corrected titles of Figure 7 and Figure 8.
Replaced occurences of ‘STI register’ with ‘SPI register’ in section headers:
– Section 10.3: SPI registers
– Section 10.3.1: SPI register summary
– Section 10.3.2: SPI register definitions.
and
Doc ID 018503 Rev 367/68
Page 68
STW82101B
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.