Datasheet STW81102 Datasheet (ST)

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Multi-band RF frequency synthesizer with integrated VCOs
Features
■ Integer-N frequency synthesizer
■ Dual differential integrated VCOs with
automatic center frequency calibration: – 3000 - 3620 MHz (direct output) – 4000 - 4650 MHz (direct output) – 1500 - 1810 MHz (internal divider by 2) – 2000 - 2325 MHz (internal divider by 2) – 750 - 905 MHz (internal divider by 4) – 1000 - 1162.5 MHz (internal divider by 4)
■ Excellent integrated phase noise
■ Fast lock time: 150 µs
■ Dual modulus programmable prescaler (16/17
or 19/20)
■ 2 programmable counters to achieve a
feedback division ratio from 256 to 65551 (prescaler 16/17) and from 361 to 77836 (prescaler 19/20).
■ Programmable reference frequency divider (10
bits)
■ Phase frequency comparator and charge pump
■ Programmable charge pump current
■ Digital lock detector
■ Dual digital bus Interface: SPI and I
3 bit programmable address (1100A
■ 3.3V power supply
■ Power down mode (HW and SW)
■ Small size exposed pad VFQFPN28 package
5x5x1.0mm
■ Process: BICMOS 0.35 µm SiGe
2
C bus with
)
2A1A0
STW81102
Applications
■ 2.5G and 3G cellular infrastructure equipment
■ CATV equipment
■ Instrumentation and test equipment
■ Other wireless communication systems
Description
The STMicroelectronics STW81102 is an integrated RF synthesizer with voltage controlled oscillators (VCOs). Showing high performance, high integration, low power, and multi-band performances, the STW81102 is a low-cost one­chip alternative to discrete PLL and VCOs solutions.
The STW81102 includes an Integer-N frequency synthesizer and two fully integrated VCOs featuring low phase noise performance and a noise floor of -155 dBc/Hz.
The combination of wide frequency range VCOs (using center-frequency calibration over 32 sub­bands) and multiple output options (direct output, divided by 2 or divided by 4) allows coverage from 750 MHz to 905 MHz and 1000MHz to 1162.5 MHz, from 1500MHz to 1810 MHz and 2000 MHz to 2325MHz, from 3000 MHz to 3620 MHz and 4000MHz to 4650 MHz bands.
The STW81102 is designed with STMicroelectronics advanced 0.35µm SiGe process.
January 2008 Rev 5 1/53
www.st.com
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Contents STW81102
Contents
1 Block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Digital logic levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 Phase noise specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 Circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1 Reference input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.2 Reference divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.4 A and B counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.5 Phase frequency detector (PFD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.6 Lock detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.7 Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.8 Voltage controlled oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.8.1 VCO selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.8.2 VCO frequency calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.8.3 VCO voltage amplitude control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.9 Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.9.1 Output Buffer control mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.10 External VCO Buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6I
2/53
2
C bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1 General features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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STW81102 Contents
6.1.1 Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1.2 START and STOP conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1.3 Byte format and acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1.4 Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1.5 Single-byte write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.1.6 Multi-byte write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.1.7 Current byte address read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.2 Timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2
6.3 I
C registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.3.1 Write-only registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.3.2 Read-only register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.3.3 Default configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6.4 VCO calibration procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.4.1 VCO calibration auto-restart feature . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7 SPI digital interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.1 General features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7.2 Timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.3 Bit tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
7.3.1 Default configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.4 VCO calibration procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.4.1 VCO calibration auto-restart feature . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.1 Direct output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.2 Divided by 2 output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.3 Divided by 4 output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.4 Evaluation kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9 Application diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
11 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
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List of tables STW81102
List of tables
Table 1. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3. Operating conditions (refer to
Table 4. Digital logic levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 5. Electrical specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Phase noise specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Current value vs. selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 8. VCO A performances versus amplitude setting (freq=3.3GHz) . . . . . . . . . . . . . . . . . . . . . 24
Table 9. VCO B performances versus amplitude setting (freq=4.3GHz) . . . . . . . . . . . . . . . . . . . . . 25
Table 10. EXT_PD pin function setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 11. Single-byte write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 12. Multi-byte write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 13. Current byte address read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 14. Data and clock timing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 15. Start and stop timing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 16. Ack timing specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 17. Write-only registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 18. Functional modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 19. SPI data structure (MSB is sent first) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 20. Address decoder and outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 21. SPI timing specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 22. Bits at 00h and ST1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 23. Bits at 01h and ST2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 24. Order code of the evaluation kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 25. Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 26. Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 27. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 36: Typical application diagram
) . . . . . . . . . . . . . . . . 9
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STW81102 List of figures
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. VCO A (direct output) open loop phase noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 4. VCO B (direct output) open loop phase noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 5. VCO A (direct output) closed loop phase noise at 3.6GHz (F Figure 6. VCO B (direct output) closed loop phase noise at 4.3GHz (F Figure 7. VCO A (div. by 2 output) closed loop phase noise at 1.65GHz (F Figure 8. VCO B (div. by 2 output) closed loop phase noise at 2.15GHz (F Figure 9. VCO A (div. by 4 output) closed loop phase noise at 825MHz (F Figure 10. VCO B (div. by 4 output) closed loop phase noise at 1.075GHz (F Figure 11. PFD frequency spurs (direct output; F Figure 12. PFD frequency spurs (div. by 2 output; F Figure 13. PFD frequency spurs (div. by 4 output; F Figure 14. Settling time (final frequency=2.15 GHz; F
Figure 15. Reference frequency input buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 16. VCO divider diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 17. PFD diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 18. Loop filter connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 19. VCO sub-bands frequency characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 20. Data validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 21. START and STOP conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 22. Byte format and acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 23. Data and clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 24. Start and stop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 25. Ack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 26. SPI input and output bit order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 27. SPI timing specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 28. Differential/single-ended output network (MATCH_LC_LUMP_4G_DIFF.dsn) . . . . . . . . . 41
Figure 29. LC lumped balun and matching network (MATCH_LC_LUMP_4G.dsn) . . . . . . . . . . . . . . 42
Figure 30. Evaluation board (EVB4G) matching network (MATCH_EVB4G.dsn) . . . . . . . . . . . . . . . . 43
Figure 31. Differential/single-ended output network (MATCH_LC_LUMP_2G_DIFF.dsn) . . . . . . . . . 43
Figure 32. LC lumped balun for divided by 2 output (MATCH_LC_LUMP_2G.dsn) . . . . . . . . . . . . . . 44
Figure 33. Evaluation board (EVB2G) matching network (MATCH_EVB2G.dsn) . . . . . . . . . . . . . . . . 44
Figure 34. LC lumped balun for divided by 4 output (MATCH_LC_LUMP_1G.dsn) . . . . . . . . . . . . . . 45
Figure 35. Evaluation board (EVB1G) matching network (MATCH_EVB1G.dsn) . . . . . . . . . . . . . . . . 46
Figure 36. Typical application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 37. Ping-pong architecture diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 38. Application diagram with external VCO (LO output from STW81102) . . . . . . . . . . . . . . . . 49
Figure 39. Application diagram with external VCO (LO output from VCO) . . . . . . . . . . . . . . . . . . . . . 49
Figure 40. VFQFPN28 mechanical drawing (
=200kHz; F
STEP
=200kHz; F
STEP
=200kHz; F
STEP
=200kHz; F
STEP
=200kHz; F
STEP
=200kHz; F
STEP
=200kHz; ICP=3mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PFD
=200kHz; ICP=4mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PFD
=400kHz; ICP=2mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PFD
=400kHz; ICP=3mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PFD
=800kHz; ICP=1.5mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PFD
=800kHz; ICP=2.5mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PFD
Note 1
=200kHz). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PFD
=400kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PFD
=800kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PFD
=400kHz; ICP=3mA) . . . . . . . . . . . . . . . . . . 17
PFD
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
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Block diagram and pin configuration STW81102

1 Block diagram and pin configuration

1.1 Block diagram

Figure 1. Block diagram

VDD_OUTBUF
VSS_OUTBUF
DI V4
EXT VCO BUF
BUF
DIV4
VDD_DIV4 VSS_DIV4
VDD_DIV2 VSS_DIV2
VDD_BUFVCO VSS_BUFVCO
EXTVCO_INP
EXTVCO_INN
VDD_VCOA
VSS_VCOA
VDD_VCOB
VSS_VCOB
VDD_ESD
VSS_ESD
OUTB UFP
BUF
VCO
BUFF
VCTRL
OUTB UFN
REF_CLK
VDD_PLL
VSS_PLL
REXT
BUF
VCO
BUF
BUF
DIV 2
DIV2
REF
Divider
VCO
Divider
VSS_CP VDD_CP
P
UP
F D
C
ICP
P
DN
LOCK_DET
DBUS _SEL
SCL / CLK
DBUS
SDA / DATA
ADD0 / LOAD ADD1 ADD2
VCO
Calibrator
VDD_DBUS VSS_DBUS
TEST1
TEST2
EXT_PD
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STW81102 Block diagram and pin configuration

1.2 Pin configuration

Figure 2. Pin connection (top view)

ADD2
ADD1
ADD0/LOAD
SCL/CLK
SDA/DATA
EXT_PD
VDD_DBUS
VDD_VCOA
VDD_DIV2
VDD_OUTBUF
OUTBUFP
OUTBUFN
VDD_DIV4
VDD_VCOB
DBUS_SEL
VDD_BUFVCO
EXTVCO_INP
VFQFPN28
QFN 28
EXTVCO_INN
VDD_PLL
REF_CLK
TEST2
ICP
VCTRL
VDD_ESD
REXT
TEST1
VDD_CP
LOCK_DET
Table 1. Pin description
Pin No Name Description Observation
1 VDD_VCOA VCOA power supply
2 VDD_DIV2 Divider by 2 power supply
3 VDD_OUTBUF Output buffer power supply
4 OUTBUFP LO buffer positive output Open collector
5 OUTBUFN LO buffer negative output Open collector
6 VDD_DIV4 Divider by 4 power supply
7 VDD_VCOB VCOB power supply
8 VDD_ESD ESD positive rail power supply
9 VCTRL VCO control voltage
10 ICP PLL charge pump output
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Page 8
Block diagram and pin configuration STW81102
Table 1. Pin description (continued)
Pin No Name Description Observation
11 REXT
External resistance connection for PLL charge pump
12 VDD_CP Power supply for charge pump
For test purposes only;
13 TEST1 Test input 1
must be connected to GND
14 LOCK_DET Lock detector
CMOS output
= 4 mA)
(I
OUT
For test purposes only;
15 TEST2 Test input 2
must be connected to GND
16 REF_CLK Reference clock input
17 VDD_PLL PLL digital power supply
For test purposes only;
18 EXTVCO_INN External VCO negative input
must be connected to GND
For test purposes only;
19 EXTVCO_INP External VCO positive input
must be connected to GND
20 VDD_BUFVCO VCO buffer power supply
21 DBUS_SEL Digital bus interface select CMOS input
2
22 VDD_DBUS SPI and I
C bus power supply
23 EXT_PD
Power down hardware ‘0’ device ON; ‘1’ device OFF
24 SDA/DATA I2CBUS/SPI data line
25 SCL/CLK I2CBUS/SPI clock line
26 ADD0/LOAD
I2CBUS address select pin/ SPI load line
27 ADD1 I2CBUS address select pin
28 ADD2 I2CBUS address select pin
CMOS input
CMOS Bidir Schmitt triggered (I
OUT
=4 mA)
CMOS input Schmitt triggered
CMOS input
CMOS input; must be connected to GND in SPI mode
CMOS input; must be connected to GND in SPI mode
8/53
Page 9
STW81102 Electrical specifications

2 Electrical specifications

2.1 Absolute maximum ratings

Table 2. Absolute maximum ratings

Symbol Parameter Values Unit
AV
Analog supply voltage 0 to 4.6 V
CC
DVCC Digital supply voltage 0 to 4.6 V
T
stg
Storage temperature -65 to 150 °C
Electrical static discharge
(1)
ESD
- HBM
- CDM-JEDEC standard
- MM
1. The maximum rating of the ESD protection circuitry on pin 4 and pin 5 is 800V.
4
1.5
0.2

2.2 Operating conditions

Table 3. Operating conditions (refer to
Symbol Parameter Test conditions Min Typ Max Unit
AV
DD
DV
DD
I
VDD1
I
VDD2
T
amb
T
j
Figure 36: Typical application diagram
)
Analog supply voltage 3.0 3.3 3.6 V
Digital supply voltage 3.0 3.3 3.6 V
V
current consumption 90 mA
DD1
V
current consumption 12 mA
DD2
Operating ambient temperature
Maximum junction temperature
-40 85 °C
125 °C
kV
R
th j-amb
R
th j-b
R
th j-c
Junction to ambient package thermal resistance
Junction to board package thermal resistance
Junction to case package thermal resistance
Multilayer JEDEC board 35 °C/W
Multilayer JEDEC board 26.3 °C/W
Multilayer JEDEC board 6.3 °C/W
9/53
Page 10
Electrical specifications STW81102

2.3 Digital logic levels

Table 4. Digital logic levels

Symbol Parameter Test conditions Min Typ Max Unit
V
V
V
hyst
V
V
Low level input voltage 0.2*Vdd V
il
High level input voltage 0.8*Vdd V
ih
Schmitt trigger hysteresis 0.8 V
Low level output voltage 0.4 V
ol
High level output voltage 0.85*Vdd V
oh

2.4 Electrical specifications

All the electrical specifications are intended at 3.3V supply voltage.
Table 5. Electrical specifications
Symbol Parameter Test conditions Min Typ Max Unit
Output frequency range
F
OUTA
F
OUTB
Output frequency range with VCOA
Output frequency range with VCOB
Direct output 3000 3620 MHz
Divider by 2 1500 1810 MHz
Divider by 4 750 905 MHz
Direct output 4000 4650 MHz
Divider by 2 2000 2325 MHz
Divider by 4 1000 1162.5 MHz
VCO dividers
N VCO divider ratio
Prescaler 16/17 256 65551
Prescaler 19/20 361 77836
Reference clock and phase frequency detector
F
Reference input frequency 10 200 MHz
ref
Reference input sensitivity
(1)
0.35 1 1.5 Vpeak
R Reference divider ratio 2 1023
F
F
PFD
STEP
PFD input frequency 16 MHz
/
F
OUT
65551
F
OUT
77836
/
Frequency step
(2)
Prescaler 16/17
Prescaler 19/20
Charge pump
(3)
3bit programmable 5 mA
0.4 V
V
I
CP
OCP
ICP sink/source
Output voltage compliance range
10/53
F
/
OUT
256
F
/
OUT
361
-0.3 V
dd
Hz
Hz
Page 11
STW81102 Electrical specifications
Table 5. Electrical specifications (continued)
Symbol Parameter Test conditions Min Typ Max Unit
Spurious
VCOs
K
K
VCOA
VCOB
VCOA sensitivity
VCOB sensitivity
Maximum temperature
ΔΤ
variation for continuous
LK
lock
VCO A pushing
VCO B pushing
V
CTRL
VCO control voltage
LO harmonic spurious
I
VCOA
I
VCOB
I
VCOBUF
I
DIV2
I
DIV4
VCOA current consumption
VCOB current consumption
VCO buffer consumption 15 mA
Divider by 2 consumption 17 mA
Divider by 4 consumption 13 mA
LO output buffer
(5)(6)
(4)
(5)
(5)
(5)
(5)
Direct output (F
= 200 kHz)
PFD
Divider by 2 (F
= 400 kHz)
PFD
Divider by 4
= 800 kHz)
(F
PFD
-73 dBc
-83 dBc
-91 dBc
Lower frequency range 40 55 70 MHz/V
Intermediate frequency range 60 75 95 MHz/V
Higher frequency range 80 105 140 MHz/V
Lower frequency range 30 45 60 MHz/V
Intermediate frequency range 40 55 70 MHz/V
Higher frequency range 50 70 90 MHz/V
VCO A 115
° C
VCO B 95
47MHz/V
14 20 MHz/V
(5)
(5)
F
=3.3GHz; amplitude [11] 30 mA
VCO
F
=3.3GHz; amplitude [00] 16 mA
VCO
F
=4.3GHz; amplitude [11] 22 mA
VCO
F
=4.3GHz; amplitude [00] 11 mA
VCO
0.4 3 V
-20 dBc
P
LO
R
L
I
OUTBUF
Output level 0 dBm
Return loss
(5)
Matched to 50 ohms 15 dB
DIV4 buff 27 mA
Current consumption
DIV2 buff 23 mA
Direct output 39 mA
=4GHz) 43
OUT
62
67
dB
Output buffer isolation (power down state)
Direct output (F
Divider by 2 output
=2GHz)
(F
OUT
Divider by 4 output
=1GHz)
(F
OUT
11/53
Page 12
Electrical specifications STW81102
Table 5. Electrical specifications (continued)
Symbol Parameter Test conditions Min Typ Max Unit
External VCO
Frequency range 0.625 5 GHz
Input level -10 +6 dBm
Current consumption VCO internal buffer 28 mA
PLL miscellaneous
I
PLL
t
lock
1. In order to achieve best phase noise performance 1V peak level is suggested.
2. The frequency step is related to the PFD input frequency as follows:
- F
- F
- F
3. See relationship between ICP and REXT in
4. The level of the spurs may change depending on PFD frequency, charge pump current, selected channel and PLL loop BW.
5. Guaranteed by design and characterization.
6. When setting a specified output frequency, the VCO calibration procedure must be run in order to select the best sub-range for the VCO covering the desired frequency. Once programmed at the initial temperature T temperature range (-40 ° C to +85 ° C), the synthesizer is able to maintain the lock status only if the temperature drift (in either direction) is within the limit specified by If higher ΔT are required the ” calibration procedure automatically when the part loose the lock condition (trigger on lock detector signal)
7. Frequency jump from 2300 to 2150 MHz; it includes the time required by the VCO calibration procedure (7 F F
PFD
Current consumption
Lock up time
= F
STEP STEP STEP
=400kHz).
for direct output
PFD
= F
/2 for divided by 2 output
PFD
= F
/4 for divided by 4 output
PFD
(5), (7)
VCO calibration auto-restart
Input buffer, prescaler, digital dividers, misc.
25kHz PLL bandwidth; within 1 ppm of frequency error
Section 5.7: Charge pump
ΔT
, provided that the final temperature T1 is still inside the nominal range.
LK
“ feature can be enabled, thus allowing to re-start the VCO
.
12 mA
150 µs
inside the operating
0
cycles with
PFD
12/53
Page 13
STW81102 Electrical specifications

2.5 Phase noise specification

Table 6. Phase noise specification
Parameter Test conditions Min Typ Max Unit
Phase noise performance
Inband phase noise floor – closed loop
Normalized inband phase noise floor
(1)
(2)
ICP=4mA, PLL BW = 50kHz; including reference clock contribution
Inband phase noise floor direct output
Inband phase noise floor divider by 2
ICP=4mA, PLL BW = 50kHz; including reference clock
contribution
Inband phase noise floor divider by 4
PLL integrated phase noise – direct output
= 4.3 GHz,
F
Integrated phase noise 100 Hz to 40 MHz
OUT
F
= 200kHz, F
PFD
PLL BW = 15kHz, ICP=4mA
PLL integrated phase noise – divider by 2
= 2.15 GHz,
F
Integrated phase noise 100Hz to 40MHz
OUT
F
= 400kHz, F
PFD
PLL BW = 20kHz, ICP=3mA
STEP
STEP
=200 kHz,
=200 kHz,
-222 dBc/Hz
-222+20log(N)+10log(
-228+20log(N)+10log(F
-234+20log(N)+10log(F
-35 dBc
1.4 ° rms
-44 dBc
0.52 ° rms
F
)dBc/Hz
PFD
)dBc/Hz
PFD
)dBc/Hz
PFD
PLL integrated phase noise – divider by 4
F
= 1.075 GHz,
Integrated phase noise 100Hz to 40MHz
OUT
F
= 800kHz, F
PFD
PLL BW = 30kHz, ICP=2.5mA
VCO A direct (3000MHz-3620MHz) – open loop
(3)
STEP
=200 kHz,
-51 dBc
0.22 ° rms
Phase noise @ 1 kHz -57 dBc/Hz
Phase noise @ 10 kHz -84 dBc/Hz
Phase noise @ 100 kHz -107 dBc/Hz
Phase noise @ 1 MHz -129 dBc/Hz
Phase noise @ 10 MHz -149 dBc/Hz
Phase noise @ 40 MHz -159 dBc/Hz
VCO B direct (4000MHz-4650MHz) – open loop
(3)
Phase noise @ 1 kHz -55 dBc/Hz
Phase noise @ 10 kHz -83 dBc/Hz
Phase noise @ 100 kHz -106 dBc/Hz
Phase noise @ 1 MHz -128 dBc/Hz
Phase noise @ 10 MHz -148 dBc/Hz
Phase noise @ 40 MHz -158 dBc/Hz
13/53
Page 14
Electrical specifications STW81102
Table 6. Phase noise specification (continued)
Parameter Test conditions Min Typ Max Unit
VCO A with divider by 2 (1500MHz-1810MHz) – open loop
Phase noise @ 1 kHz -63 dBc/Hz
Phase noise @ 10 kHz -90 dBc/Hz
Phase noise @ 100 kHz -113 dBc/Hz
Phase noise @ 1 MHz -135 dBc/Hz
Phase noise @ 10 MHz -151.5 dBc/Hz
Phase noise floor @ 40 MHz -155 dBc/Hz
VCO B with divider by 2 (2000MHz-2325MHz) – open loop
Phase noise @ 1 kHz -61 dBc/Hz
Phase noise @ 10 kHz -89 dBc/Hz
Phase noise @ 100 kHz -112 dBc/Hz
Phase noise @ 1 MHz -134 dBc/Hz
Phase noise @ 10 MHz -151.5 dBc/Hz
Phase noise floor @ 40 MHz -155 dBc/Hz
VCO A with divider by 4 (750MHz-905MHz) – open loop
(3)
(3)
(3)
Phase noise @ 1 kHz -69 dBc/Hz
Phase noise @ 10 kHz -96 dBc/Hz
Phase noise @ 100 kHz -119 dBc/Hz
Phase noise @ 1 MHz -141 dBc/Hz
Phase noise @ 10 MHz -154 dBc/Hz
Phase noise floor @ 40 MHz -155 dBc/Hz
VCO B with divider by 4 (1000MHz-1162.5MHz) – open loop
(3)
Phase noise @ 1 kHz -67 dBc/Hz
Phase noise @ 10 kHz -95 dBc/Hz
Phase noise @ 100 kHz -118 dBc/Hz
Phase noise @ 1 MHz -140 dBc/Hz
Phase noise @ 10 MHz -154 dBc/Hz
Phase noise floor @ 40 MHz -155 dBc/Hz
1. Phase noise SSB. VCO amplitude setting to value [11]. All the closed-loop performances are specified using a reference clock signal at 76.8 MHz with phase noise of
-135dBc/Hz @1kHz offset, -145 dBc/Hz @10 kHz offset and -149.5dBc/Hz of noise floor.
2. Normalized PN = Measured PN – 20log(N) – 10log(F comparison frequency at the PFD input.
3. Typical phase noise at centre band frequency.
) where N is the VCO divider ratio (N=B*P+A) and F
PFD
PFD
is the
An evaluation kit is available upon request, including a powerful simulation tool (STWPLLSim) that allows a very accurate estimation of the device’s phase noise according to the desired project parameters (VCO frequency, selected output stage, reference clock, frequency step, and so on); refer to
Chapter 8: Application information
for more details.
14/53
Page 15
STW81102 Typical performance characteristics
s

3 Typical performance characteristics

Phase noise is measured with the Agilent E5052A Signal Source Analyzer. All closed-loop measurements are done with F
STEP
properly set. The loop filter configuration is depicted in
diagram
, and the reference clock signal is at 76.8 MHz with phase noise of -135 dBc/Hz at
1kHz offset, -145 dBc/Hz at10 kHz offset and -149.5 dBc/Hz of noise floor.
Figure 3. VCO A (direct output) open loop
phase noise
=200 kHz, with the F
Figure 4. VCO B (direct output) open loop
phase noise
and charge pump current
PFD
Figure 36: Typical application
Figure 5. VCO A (direct output) closed loop
phase noise at 3.6GHz (F I
1.2° rms
STEP
=3mA)
CP
=200kHz; F
=200kHz;
PFD
Figure 6. VCO B (direct output) closed loop
phase noise at 4.3GHz (F I
1.4° rm
STEP
=4mA)
CP
=200kHz; F
=200kHz;
PFD
15/53
Page 16
Typical performance characteristics STW81102
0.5
0.5
s
0
0
s
Figure 7. VCO A (div. by 2 output) closed
loop phase noise at 1.65GHz (F I
STEP
=2mA)
CP
° rms
=200kHz; F
=400kHz;
PFD
Figure 9. VCO A (div. by 4 output) closed
loop phase noise at 825MHz (F I
STEP
=1.5mA)
CP
=200kHz; F
=800kHz;
PFD
Figure 8. VCO B (div. by 2 output) closed
loop phase noise at 2.15GHz (F I
STEP
=3mA)
CP
7° rm
=200kHz; F
=400kHz;
PFD
Figure 10. VCO B (div. by 4 output) closed
loop phase noise at 1.075GHz (F I
STEP
=2.5mA)
CP
=200kHz; F
=800kHz;
PFD
.2° rms
16/53
.24° rm
Page 17
STW81102 Typical performance characteristics
Figure 11. PFD frequency spurs (direct
output; F
-73 dBc
@200KHz
=200kHz)
PFD
Figure 13. PFD frequency spurs (div. by 4
output; F
=800kHz)
PFD
Figure 12. PFD frequency spurs (div. by 2
output; F
-83 dBc
@400KHz
=400kHz)
PFD
Figure 14. Settling time (final frequency=2.15
GHz; F
=400kHz; ICP=3mA)
PFD
-91 dBc
@800KHz
17/53
Page 18
General description STW81102

4 General description

Figure 1: Block diagram
PLL frequency synthesizer.
The STW81102 consists of two internal low-noise VCOs with buffer blocks, a divider by 2, a divider by 4, a low-noise PFD (phase frequency detector), a precise charge pump, a 10-bit programmable reference divider, two programmable counters and a programmable dual­modulus prescaler. The 5-bit A-counter and 12-bit B-counter, in conjunction with the dual­modulus prescaler P/P+1 (16/17 or 19/20), implement an N integer divider, where N = B*P +A. The division ratio of both reference and VCO dividers is controlled through the selected digital interface (I
The digital interface type is selected by the proper hardware connection of the pin DBUS_SEL (0 V for I
All devices operate with a power supply of 3.3 V and can be powered down when not in use.
shows the separate blocks that, when integrated, form an Integer-N
2
C bus or SPI).
2
C bus, 3.3 V for SPI).
18/53
Page 19
STW81102 Circuit description

5 Circuit description

5.1 Reference input stage

The reference input stage is shown in F
input while the inverter used as the frequency reference buffer is AC coupled.
ref

Figure 15. Reference frequency input buffer

VDD
F
ref
Figure 15
. The resistor network feeds a DC bias at the
INV
Power Down
BUF

5.2 Reference divider

The 10-bit programmable reference counter allows division of the input reference frequency to produce the input clock to the PFD. The division ratio is programmed through the digital interface.

5.3 Prescaler

The dual-modulus prescaler P/P+1 takes the CML clock from the VCO buffer and divides it down to a manageable frequency for the CMOS A and B counters. The modulus P is programmable and can be set to 16 or 19. The prescaler is based on a synchronous 4/5 core whose division ratio depends on the state of the modulus input.
19/53
Page 20
Circuit description STW81102

5.4 A and B counters

The 5-bit A-counter and 12-bit B-counter, in conjunction with the selected dual modulus (16/17 or 19/20) prescaler, make it possible to generate output frequencies which are spaced only by the reference frequency divided by the reference division ratio. Thus, the division ratio and the VCO output frequency are given by these formulas:
NBPA+×=
F
VCO
BPA+×()F
----------- ------------- ------------- ---------- ----=
×
ref
R
where:
F
: output frequency of VCO
VCO
P: modulus of dual modulus prescaler (16 or 19 selected through the digital interface)
B: division ratio of the main counter
A: division ratio of the swallow counter
F
: input reference frequency
ref
R: division ratio of reference counter
N: division ratio of PLL
For a correct working of the VCO divider, B must be strictly higher than A. A can take any value ranging from 0 to 31. The range of N can vary from 256 to 65551 (P=16) or from 361 to 77836 (P=19).

Figure 16. VCO divider diagram

VCOBUF-
Prescaler
16/17 or 19/20
VCOBUF+
modulus
5-bit 12-bit
A-counter
20/53
To PFD
B-counter
Page 21
STW81102 Circuit description

5.5 Phase frequency detector (PFD)

The PFD takes inputs from the reference and the VCO dividers and produces an output proportional to the phase error. The PFD includes a delay gate that controls the width of the anti-backlash pulse. This pulse ensures that there is no dead zone in the PFD transfer function.
Figure 17
is a simplified schematic of the PFD.

Figure 17. PFD diagram

5.6 Lock detect

VDD
F
ref
F
ref
VDD
DFF
R
R
DFF
Up
Delay
Down
ABL
This signal indicates that the difference between rising edges of both UP and DOWN PFD signals is found to be shorter than the fixed delay (roughly 5 ns). The Lock Detect signal is high when the PLL is locked and low when the PLL is unlocked. Lock Detect consumes current only during PLL transients.

5.7 Charge pump

This block drives two matched current sources, IUP and I respectively by UP and DOWN PFD outputs. The nominal value of the output current is controlled by an external resistor (connected to the REXT input pin) and a 3-bit word that allows selection among 8 different values.
The minimum value of the output current is: I
, which are controlled
DOWN
= 2*VBG/REXT (VBG~1.17 V)
MIN
21/53
Page 22
Circuit description STW81102

Table 7. Current value vs. selection

CPSEL2 CPSEL1 CPSEL0 Current Value for REXT=4.7 KΩ
000I
0012*I
0103*I
0114*I
1005*I
1016*I
1107*I
1118*I
MIN
MIN
MIN
MIN
MIN
MIN
MIN
MIN
0.5 mA
1.0 mA
1.5 mA
2.0 mA
2.5 mA
3.0 mA
3.5 mA
4.0 mA
Note: The current is output on pin ICP. During VCO auto-calibration, the ICP and VCTRL pins are
forced to VDD/2

Figure 18. Loop filter connection

VDD
BUF
VCTRL
C3
R3
BUF
Charge
Pump
ICP
R1
C2
C1
Cal bit
22/53
Page 23
STW81102 Circuit description

5.8 Voltage controlled oscillators

5.8.1 VCO selection

The STW81102 integrates two low-noise VCOs to cover a wide band from:
● 3000 MHz to 3620 MHz and 4000 MHz to 4650 MHz (direct output)
● 1500 MHz to 1810 MHz and 2000 MHz to 2325 MHz (selecting divider by 2)
● 750 MHz to 905 MHz and 1000 MHz to 1162.5 MHz (selecting divider by 4)
The frequency range is 3000 MHz to 3620 MHz for VCO A and 4000 MHz to 4650 MHz for VCO B.

5.8.2 VCO frequency calibration

Both VCOs can operate on 32 frequency ranges that are selected by adding or subtracting capacitors from the resonator. These frequency ranges are intended to cover the wide band of operation and compensate for process variation on the VCO center frequency.
The range is automatically selected when the
SERCAL bit is set to 1. The charge pump is inhibited, and the ICP and VCTRL pins are at VDD/2 volts. The ranges are then tested with this VCO input voltage to select the one nearest to the desired output frequency (F N*F
/R).
ref
OUT
=
After this selection, the SERCAL bit is automatically reset to 0 and the charge pump is once again enabled. To enable a fast settle, t VDD/2 on the loop filter to reach F
he PLL needs only to perform fine adjustment around
.
OUT
Figure 19. VCO sub-bands frequency characteristics
23/53
Page 24
Circuit description STW81102
The SERCAL bit should be set to 1 at each division ratio change. VCO calibration procedure takes approximately 7 periods of the PFD frequency.
The maximum allowed F higher F
, follow the steps below:
PFD
to perform the calibration process is 1 MHz. When using a
PFD
1. Calibrate the VCO at the desired frequency with an F
2. Set the A, B and R divider ratios for the desired F
VCO calibration auto-restart feature
The VCO calibration auto-restart feature, once activated, allows to restart the calibration procedure when the Lock Detector reports that the PLL has moved to an unlock condition (trigger on ‘1’ to ‘0’ transition of Lock Detector signal).
This situation could happen if the device experiences a significant temperature variation. Once programmed at the initial temperature T (-40 °C to +85 °C), the synthesizer is able to maintain the lock status only if the temperature drift (in either direction) is within the limit specified by the ΔT final temperature T
is still inside the nominal range.
1
Each VCO featured by STW81102 has its specific ΔT is typically lower than the maximum allowable drift (ΔT vice versa).
By enabling the VCO Calibration Auto-Restart feature (through the CAL_AUTOSTART_EN bit), the part will be able to select again the proper VCO frequency sub-range if the temperature drift exceeds the ΔT
limit, without any external user command.
LK

5.8.3 VCO voltage amplitude control

less than 1 MHz.
PFD
.
PFD
inside the operating temperature range
0
parameter, provided that the
LK
parameter reported in Table 5, that
LK
=125; from -40 °C to +85 °C and
MAX
The voltage swing of the VCOs can be adjusted over four levels by means of two dedicated programming bits (PLL_A1 and PLL_A0). Higher amplitudes provide best phase noise, whereas lower amplitudes save power.
Ta bl e 8
gives the voltage swing level expected on the resonator nodes, the current
consumption, and the phase noise at 1 MHz.
Table 8. VCO A performances versus amplitude setting (freq=3.3GHz)
PLL_A[1:0]
00 1.1 16 -125
01 1.3 18 -126
10 1.9 27 -128.5
11 2.1 30 -129
Differential voltage swing
(Vp)
Current consumption
(mA)
PN @1MHz (dBc/Hz)
24/53
Page 25
STW81102 Circuit description
Table 9. VCO B performances versus amplitude setting (freq=4.3GHz)
PLL_A[1:0]
00 1.1 11 -124
01 1.3 14 -125
10 1.9 20 -127.5
11 2.1 22 -128
Differential voltage swing
(Vp)

5.9 Output stage

The differential output signal of the synthesizer can be selected by software among three different signal paths (Direct, Divider by 2 and Divider by 4) providing multi-band capability.
The selection of the output stage is done by programming properly the PD[4:0] bits.
The output stage is an open-collector structure which is able to meet different requirements over the desired output frequency range by proper connections on the PCB. Refer to
Chapter 8: Application information

5.9.1 Output Buffer control mode

This control mode allows to enable/disable the output stage by a hardware control pin (EXT_PD, pin#23) while the PLL stays locked at the desired frequency; in such a way a very fast switching time is achieved.
Current consumption
(mA)
for more details on PCB connections.
PN @1MHz (dBc/Hz)
This feature can be useful in designing a ping-pong architecture saving the cost of an external RF switch.
The function of pin#23 (EXT_PD) is set with the OUTBUF_CTRL_EN bit as shown in
Ta bl e 1 0.
Table 10. EXT_PD pin function setting
OUTBUF_CTRL_EN Function of the EXT_PD pin EXT_PD pin settings
0 Device hardware power down
1 Output Buffer control
EXT_PD = 0V Î Device ON
EXT_PD = 3.3V Î Device OFF
EXT_PD = 0V Î Output Stage ON
EXT_PD = 3.3V Î Output Stage OFF
25/53
Page 26
Circuit description STW81102

5.10 External VCO Buffer

Although the main benefits of the STW81102 are the two wideband and low-noise VCOs, the capability to use an external VCO is also provided.
The external VCO Buffer is able to manage a signal coming from an external VCO in order to build a synthesizer using the STW81102 only as PLL IC. The output signal of the synthesizer can also be taken from the output section of the STW81102 (direct, divided by 2 or divided by 4 by) by properly setting the PD[4:0] bits, thus providing additional flexibility.
The external VCO signal can range from 625 MHz up to 5 GHz and its minimum power level must be -10 dBm.
26/53
Page 27
STW81102 I2C bus interface

6 I2C bus interface

The I2C bus interface is selected by hardware connection of the pin #21 (DBUS_SEL) to 0 V.
Data is transmitted from microprocessor to the STW81102 through the 2-wire (SDA and
2
SCL) I
The I any device that reads the data as a receiver. The device controlling the data transfer is the master, and the others are slaves. The master always initiates the transfer and provides the serial clock for synchronization.

6.1 General features

6.1.1 Data validity

Data changes on the SDA line must only occur when the SCL is low. SDA transitions while the clock is high are used to identify a START or STOP condition.
Figure 20. Data validity
C bus interface. The STW81102 is always a slave device.
2
C bus protocol defines any device that sends data on the bus as a transmitter, and
SDA
SCL
Data line Change Stable data data Valid allowed

6.1.2 START and STOP conditions

START condition
A START condition is identified by a transition of the data bus SDA from high to low while the clock signal SCL is stable in the high state. A START condition must precede any data transfer command.
STOP condition
A STOP condition is identified by a transition of the data bus SDA from low to high while the clock signal SCL is stable in the high state. A STOP condition terminates communications between the STW81102 and the bus master.
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I2C bus interface STW81102
A L
/
/
Figure 21. START and STOP conditions
SCL
SDA
START

6.1.3 Byte format and acknowledge

Every byte put on the SDA line must be 8 bits long, and be followed by an acknowledge bit to indicate a successful data transfer. Data is transferred with the most significant bit (MSB) first. The transmitter releases the SDA line after sending 8 bits of data. During the 9th clock pulse, the receiver pulls the SDA line low to acknowledge the receipt of 8 bits of data.
Figure 22. Byte format and acknowledge
SC
SD
START
MSB

6.1.4 Device addressing

2 3 7
/
/
STOP
8 91
Acknowledgement
from receiver
The master must first initiate with a START condition to communicate with the STW81102, and then send 8 bits (MSB first) on the SDA line which correspond to the device select address and the read or write mode.
The first 7 MSBs are the device address identifier, which corresponds to the I2C bus definition. For the STW81102, the address is set at “1100A2A1A0”, 3 bits programmable. The 8th bit (LSB) is the read or write (RW) operation bit, which is set to 1 in read mode and to 0 in write mode.
Following a START condition, the STW81103 identifies the device address on the bus and, if matched, acknowledges the identification on the SDA bus during the 9th clock pulse.
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STW81102 I2C bus interface

6.1.5 Single-byte write mode

Following a START condition, the master sends a device select code with the RW bit set to
0. The STW81102 sends an acknowledge and waits for the 1-byte internal sub-address that provides access to the internal registers.
After receiving the sub-address internal byte, the STW81102 again responds with an acknowledge. A single-byte write to sub-address 00H changes the FUNCTIONAL_MODE register, a single-byte write with sub-address 04H changes the CONTROL register, and so on.
Table 11. Single-byte write mode
S 1100A
0 ack sub-address byte ack DATA IN ack P
2A1A0

6.1.6 Multi-byte write mode

The multi-byte write mode can start from any internal address. The master sends the data bytes, and each one is acknowledged. The master then terminates the transfer by generating a STOP condition.
The sub-address decides the starting byte. For example, a multi-byte with sub-address 01H and 2 DATA_IN bytes changes the B_COUNTER and A_COUNTER registers (01H,02H), and a multi-byte with sub-address 00H and 6 DATA_IN bytes changes all the STW81102 registers.
Table 12. Multi-byte write mode
S 1100A2A1A00 ack sub-address byte ack DATA IN ack .... DATA IN ack P

6.1.7 Current byte address read mode

In the current byte address read mode, following a START condition, the master sends the device address with the RW bit set to 1. Note that no sub-address is needed since there is only one read register. The STW81102 acknowledges this and outputs the data byte. The master does not acknowledge the received byte, and terminates the transfer with a STOP condition.
Table 13. Current byte address read mode
S 1100 A2 A1 A
0
1ack DATA OUT No ackP
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I2C bus interface STW81102

6.2 Timing specification

Figure 23. Data and clock

SDA
SCL
t
cwl
t
cs

Table 14. Data and clock timing specifications

t
ch
Symbol Parameter Minimum time Units
t
t
t
cs
t
ch
cwh
cwl
Data to clock setup time 2 ns
Data to clock hold time 2 ns
Clock pulse width high 10 ns
Clock pulse width low 5 ns

Figure 24. Start and stop

SDA
SCL
t
cwh
tt
start stop
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STW81102 I2C bus interface

Table 15. Start and stop timing specifications

Symbol Parameter Minimum time Units
t
start
t
stop

Figure 25. Ack

Clock to data start time 2 ns
Data to clock down stop time 2 ns
SDA
89
SCL
t
d1

Table 16. Ack timing specifications

t
d2
Symbol Parameter Minimum time Units
t
d1
t
d2
Ack begin delay 2 ns
Ack end delay 2 ns
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I2C bus interface STW81102

6.3 I2C registers

The STW81102 has 6 write-only registers and 1 read-only register.

6.3.1 Write-only registers

Ta bl e 1 7
Table 17. Write-only registers
gives a short description of the write-only registers.
HEX code DEC code Description
0x00 0 FUNCTIONAL_MODE
0x01 1 B_COUNTER
0x02 2 A_COUNTER
0x03 3 REF_DIVIDER
0x04 4 CONTROL
0x05 5 CALIBRATION
FUNCTIONAL_MODE
MSB LSB
b7 b6 b5 b4 b3 b2 b1 b0
OUTBUF_ CTRL_EN
CAL_AUT OSTART_
EN
PD4 PD3 PD2 PD1 PD0 B11
OUTBUF_CTRL_EN: Output Buffer control mode enable (0 = Off; 1 = ON)
CAL_AUTOSTART_EN: VCO calibration auto-restart enable (0 = Off; 1 = ON)
The bits PD[4:0] allow to select different functional modes for the STW81102 synthesizer according to the
Table 18. Functional modes
Decimal value Description
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Table 18
0 Power down mode
1 Enable VCO A, output frequency divided by 2
2 Enable VCO B, output frequency divided by 2
3 Enable external VCO, output frequency divided by 2
4 Enable VCO A, output frequency divided by 4
5 Enable VCO B, output frequency divided by 4
6 Enable external VCO, output frequency divided by 4
7 Enable VCO A, direct output
.
Page 33
STW81102 I2C bus interface
Table 18. Functional modes (continued)
Decimal value Description
8 Enable VCO B, direct output
9 Enable external VCO, direct output
B_COUNTER
MSB LSB
b7 b6 b5 b4 b3 b2 b1 b0
B10B9B8B7B6B5B4B3
B[10:3]. B counter value (bit B11 in the previous register, bits B[2:0] in the next register)
A_COUNTER
MSB LSB
b7 b6 b5 b4 b3 b2 b1 b0
B2 B1 B0 A4 A3 A2 A1 A0
Bits B[2:0] for B_COUNTER, A_COUNTER values.
REF_DIVIDER
MSB LSB
b7 b6 b5 b4 b3 b2 b1 b0
R9 R8 R7 R6 R5 R4 R3 R2
Reference clock divider ratio R[9:1] (bits R1, R0 in the next register).
CONTROL
MSB LSB
b7 b6 b5 b4 b3 b2 b1 b0
R1 R0 PLL_A1 PLL_A0 CPSEL2 CPSEL1 CPSEL0 PSC_SEL
The CONTROL register is used to set the charge pump current, the VCO output voltage amplitude and the prescaler modulus:
PLL_A[1:0]: VCO amplitude
CPSEL[2:0]: charge pump output current
PSC_SEL: prescaler modulus select ('0' for P=16, '1' for P=19)
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I2C bus interface STW81102
The LO output frequency is programmed by setting the proper values for A, B and R according to the following formula:
F
REF CLK–
F
OUTDR
BPA+×()×
------------ ----------------- --
×=
R
1 for direct output
where D
equals
R
and P is the selected prescaler modulus.
CALIBRATION
MSB LSB
b7 b6 b5 b4 b3 b2 b1 b0
INITCAL SERCAL SELEXTCAL CAL4 CAL3 CAL2 CAL1 CAL0
This register controls the VCO calibrator using the following values:
INITCAL: for test purposes only; must be set to 0.
SERCAL: at 1, starts the VCO auto-calibration (automatically reset to 0 at the end of calibration)
SELEXTCAL: for test purposes only; must be set to 0
CAL[4:0]: for test purposes only; must be set to 0

6.3.2 Read-only register

MSB LSB
0.5 for output divided by 2
{
0.25 for output divided by 4
b7 b6 b5 b4 b3 b2 b1 b0
DEV_ID1 DEV_ID0 LOCK_DET INTCAL4 INTCAL3 INTCAL2 INTCAL1 INTCAL0
This register is automatically addressed in the 'current byte address read mode', using the following values:
DEV_ID[1:0]: device identifier bits; returns 01
LOCK_DET: 1 when PLL is locked
INTCAL[4:0]: internal value of the VCO control word

6.3.3 Default configuration

At power on, all the bits are set to ‘0’. Consequently the part starts in power down mode.
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STW81102 I2C bus interface

6.4 VCO calibration procedure

Calibration of the VCO center frequency is activated when the SERCAL bit (CALIBRATION register bit[6]) is set to 1.
To program the device properly while ensuring VCO calibration, perform the following steps before every channel change:
1. Program all the registers using a multi-byte write sequence with the desired settings
(functional mode, B and A counters, R counter, VCO amplitude, charge pump, prescaler modulus), and all the bits of the CALIBRATION register (05H) set to 0.
2. Program the CALIBRATION register using a single-byte write sequence (subaddress
05H) with the SERCAL bit set to 1.
The maximum allowed PFD frequency (F
PFD
higher than 1 MHz, perform the following additional steps:
● Perform all the steps of the calibration procedure, making sure to program the desired
VCO frequency with proper settings for the R, B and A counters so that F
● Program the device with the desired VCO and PFD frequency settings according to
step 1) above.

6.4.1 VCO calibration auto-restart feature

The VCO calibration auto-restart feature can be enabled in two steps:
1. set the desired frequency ensuring VCO calibration as described above (section 6.4)
2. program the FUNCTIONAL_MODE register (sub-address 00H) using a single-byte
write sequence with the CAL_AUTOSTART_EN bit set to '1' while keeping unchanged the others.
) during calibration is 1 MHz; if you want a F
is ≤ 1 MHz.
PFD
PFD
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SPI digital interface STW81102

7 SPI digital interface

7.1 General features

The SPI digital interface is selected by hardware connection of the pin #21 (DBUS_SEL) to
3.3 V.
The STW81102 IC is programmed by means of a high-speed serial-to-parallel interface with write option only. The 3-wire bus can be clocked at a frequency as high as 100 MHz to allow fast programming of the registers containing the data for RF IC configuration.
The chip is programmed through serial words with a full length of 26 bits. The first 2 MSBs represent the address of the registers, and the 24 LSBs represent the value of the registers.
Each data bit is stored in the internal shift register on the rising edge of the CLOCK signal.
The outputs of the selected register are sent to the device on the rising edge of the LOAD signal.

Figure 26. SPI input and output bit order

Last bit sent (LSB)0
DATA
2
1
232425(MSB)
LOAD
Reg.#0
Reg.#1
Address
decoder
D23 (MSB)
D0 (LSB)
A1
LOAD #4
Reg.#4
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STW81102 SPI digital interface

Table 19. SPI data structure (MSB is sent first)

MSB LSB
Address Data for register (24 bits)
A1 A0 D23 D22 D21 D20 D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Table 20. Address decoder and outputs

Address Outputs
A1 A0
Data bits
D23-D0
00 24 0ST1
0 1 24 1 ST2 Functional modes, VCO dividers
10 24 2ST3Reserved
11 24 3ST4Reserved

7.2 Timing specification

Figure 27. SPI timing specification

tsetup
thold
Data
Clock
Load
MSBMSB-1 LSB
tdk
No Name Function
Reference divider, VCO amplitude, VCO calibration, charge pump current, prescaler modulus
t
clk_loadr tload
t
clk_loadf

Table 21. SPI timing specification

Parameter Description Min. Typ. Max. Units
t
setup
t
hold
t
clk
t
load
t
clk_loadr
t
clk_loadf
Data to clock setup time 0.8 ns
Data to clock hold time 0.2 ns
Clock cycle period 10 ns
Load pulse width 3 ns
Clock to load rising edge 2 ns
Clock to load falling edge 0.5 ns
37/53
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SPI digital interface STW81102

7.3 Bit tables

Table 22. Bits at 00h and ST1

Serial interface address = 00h Register name = ST1
Bit Name Description
[23] R9
[22] R8
[21] R7
[20] R6
[19] R5
Reference clock divider ratio
[18] R4
[17] R3
[16] R2
[15] R1
[14] R0
[13] PLL_A1
VCO amplitude control
[12] PLL_A0
[11] CPSEL2
Charge pump output current control[10] CPSEL1
[9] CPSEL0
[8] PSC_SEL Prescaler modulus select (0 for P=16, 1 for P=19)
[7] INITCAL For test purposes only; must be set to 0
[6] SERCAL Enable VCO calibration (see
Section 7.4
)
[5] SELEXTCAL For test purposes only; must be set to 0
[4] CAL4
[3] CAL3
[2] CAL2
For test purposes only; must be set to 0
[1] CAL1
[0] CAL0
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STW81102 SPI digital interface

Table 23. Bits at 01h and ST2

Serial interface address = 01h Register name = ST2
Bit Name Description
[23] OUTBUF_CTRL_EN Output buffer control mode enable (0 = Off, 1 = On)
[22] CAL_AUTOSTART_EN VCO calibration auto restart enable (0 = Off, 1 = On)
[21] PD4
[20] PD3
[19] PD2
[18] PD1
[17] PD0
[16] B11
[15] B10
[14] B9
[13] B8
[12] B7
[11] B6
[10] B5
[9] B4
[8] B3
Device functional modes:
0. Power down
1. Enable VCO A, output frequency divided by 2
2. Enable VCO B, output frequency divided by 2
3. Enable external VCO, output frequency divided by 2
4. Enable VCO A, output frequency divided by 4
5. Enable VCO B, output frequency divided by 4
6. Enable external VCO, output frequency divided by 4
7. Enable VCO A, direct output
8. Enable VCO B, direct output
9. Enable external VCO, direct output
B_COUNTER bits
[7] B2
[6] B1
[5] B0
[4] A4
[3] A3
[2] A2
[1] A1
[0] A0
A_COUNTER bits
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SPI digital interface STW81102
The LO output frequency is programmed by setting the proper values for A, B and R according to the following formula:
F
REF CLK–
F
OUT
D
BPA+×()×
R
------------ ----------------- ------
×=
R
1 for direct output
where D
and P is the selected prescaler modulus.
equals
R
0.5 for output divided by 2
{
0.25 for output divided by 4

7.3.1 Default configuration

At power on, all the bits are set to ‘0’. Consequently the part starts in power down mode.

7.4 VCO calibration procedure

Calibration of the VCO center frequency is activated when the SERCAL bit (ST1 register bit[6]) is set to 1.
To program the device properly while ensuring VCO calibration, perform the following steps before every channel change:
1. Program the ST2 register with the desired settings (functional mode, B and A
counters).
2. Program the ST1 register with the desired settings (R counter, VCO amplitude, charge
pump, prescaler modulus) and with the SERCAL bit set to 1.
The maximum allowed PFD frequency (F higher than 1 MHz, perform the following additional steps:
● Perform all the steps (step 1 and 2 above) of the calibration procedure, making sure to
program the desired VCO frequency with proper settings of the R, B and A counters so that F
● Program the device with the desired VCO and PFD frequency settings as per steps 1
and 2 above with SERCAL bit set to 0.
is ≤ 1 MHz.
PFD
) during calibration is 1 MHz; if you want a F
PFD
PFD

7.4.1 VCO calibration auto-restart feature

The VCO calibration auto-restart feature can be enabled in two steps:
1. set the desired frequency ensuring VCO calibration as described above (
2. program the ST2 register with the CAL_AUTOSTART_EN bit set to '1' while keeping
unchanged the others.
40/53
Section 7.4
)
Page 41
STW81102 Application information

8 Application information

The STW81102 features three different alternately selectable bands: direct output (3.0 to
3.62 GHz and 4.0 to 4.65 GHz), divided by 2 (1.5 to 1.81 GHz and 2.0 to 2.325 GHz) and divided by 4 (750 to 905 MHz and 1000 to 1162.5 MHz). To achieve a suitable power level, a good matching network is necessary to adapt the output stage to a 50 Ω load. Moreover, since most commercial RF components have single-ended input and output terminations, a differential to single-ended conversion may be required.
The different matching configurations shown below for each of the three bands are suggested as a guideline when designing your own application board.
Inside the evaluation kit is the ADS design for each matching configuration suggested in this chapter. The name of the corresponding ADS design is given in each figure.
The ADS designs provide only a first indication of the output stage matching, and should be reworked according to the choices of layout, board substrate, components and so on.
The ADS designs of the evaluation boards are provided with a complete electromagnetic modelling (board, components, and so on).

8.1 Direct output

If you do not need a differential to single conversion, you can match the output buffer of the STW81102 in the simple way shown in ended output network in the 3.0 - 4.65GHz range (MATCH_LC_LUMP_4G_DIFF.dsn).
Figure 28. Differential/single-ended output network
(MATCH_LC_LUMP_4G_DIFF.dsn)
RF
RF
OUTP
OUTN
100 ohm
100 ohm
Figure 28
Vcc
. This illustrates the differential to single-
5.5nH
10pF
10pF
5.5nH
50 ohm
50 ohm
Vcc
Since most discrete components for microwave applications are single-ended, you can easily use one of the two outputs and terminate the other one to 50 Ω with a 3 dB power loss.
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Application information STW81102
Alternatively, you can combine the two outputs in other ways. A first topology for the direct output (3 GHz to 4.65 GHz) is suggested in
Figure 29
. It basically consists of a simple LC balun and a matching network to adapt the output to a 50 Ω load. The two LC networks shift output signal phase of -90° and +90°, thus combining the two outputs. This topology, designed for a center frequency of 4 GHz, is intrinsically narrow-band since the LC balun is tuned at a single frequency. If the application requires a different sub-band, the LC combiner can be easily tuned to the frequency of interest.

Figure 29. LC lumped balun and matching network (MATCH_LC_LUMP_4G.dsn)

Vcc
0.8pF
0.8pF
1.9nH
0.8pF 2.5pF
1.9nH
0.8pF
50 ohm
RF
RF
50 ohm
OUTP
OUTN
50 ohm
1.9nH
1.9nH
Vcc
The 1.9 nH shunt inductor works as a DC feed for one of the open collector terminals as well as a matching element along with the other components. The 1.9 nH series inductors are used to resonate the parasitic capacitance of the chip.
For optimum output matching, it is recommended to use 0402 Murata or AVX capacitors and 0403 or 0604 HQ Coilcraft inductors. It is also advisable to use short interconnection paths to minimize losses and undesired impedance shift.
An alternative topology that permits a more broadband matching as well as balanced to unbalanced conversion, is shown in
42/53
Figure 30
.
Page 43
STW81102 Application information

Figure 30. Evaluation board (EVB4G) matching network (MATCH_EVB4G.dsn)

Vcc
RF
RF
50 ohm
OUTP
OUTN
50 ohm
5.5nH
12pF
12pF
5.5nH
Vcc
For differential to single conversion, the 50 to 100 Ω Johanson balun is recommended (3700BL15B100).

8.2 Divided by 2 output

If your application does not require a balanced to unbalanced conversion, the output matching reduces to the simple circuit shown below ( differential to single-ended output network in the 1.5 - 2.325 GHz range (MATCH_LC_LUMP_2G_DIFF.dsn). You can easily use this solution to provide one single­ended output that terminates the other output at 50 Ω with a 3 dB power loss.
2:1
4.7pF12pF
1pF 1pF 1.2pF 1.2pF
Figure 31
), which illustrates a
50 ohm
Figure 31. Differential/single-ended output network
(MATCH_LC_LUMP_2G_DIFF.dsn)
Vcc
RF
RF
50 ohm
OUTP
OUTN
50 ohm
22nH
10pF
10pF
22nH
Vcc
43/53
50 ohm
50 ohm
Page 44
Application information STW81102
A first solution to combine the differential outputs is the lumped LC type balun tuned in the 2 GHz band (
Figure 32
).

Figure 32. LC lumped balun for divided by 2 output (MATCH_LC_LUMP_2G.dsn)

Vcc
2pF
2pF
2.7nH
2pF 3pF
2.7nH
2pF
50 ohm
3nH
RF
RF
50 ohm
OUTP
OUTN
50 ohm
2.7nH
2.7nH
Vcc
The same recommendation for the SMD components also applies to the divided by 2 output.
Another topology suited to combining the two outputs for the divided by 2 frequencies is represented in
Figure 33
.

Figure 33. Evaluation board (EVB2G) matching network (MATCH_EVB2G.dsn)

Vcc
50 ohm
RF
OUTP
RF
OUTN
50 ohm
44/53
5.5nH
22pF
22pF
5.5nH
Vcc
2:1
22pF
1.9nH
1.2pF
50 ohm
Page 45
STW81102 Application information
For differential to single conversion, the 50 to 100 Ω Johanson balun (1600BL15B100) is recommended.

8.3 Divided by 4 output

The topology, components, values and considerations of
Figure 31
also apply to the divided
by 4 output (MATCH_LC_LUMP_1G_DIFF.dsn).
As for the previous sections, a solution to combine the differential outputs is the lumped LC type balun tuned in the 1 GHz band (
Figure 34
).

Figure 34. LC lumped balun for divided by 4 output (MATCH_LC_LUMP_1G.dsn)

Vcc
RF
RF
25 ohm
OUTP
OUTN
25 ohm
5.5nH
5.5nH
4pF
4pF
5.5nH
4pF 6pF
5.5nH
4pF
14nH
50 ohm
Vcc
If you prefer to use an RF balun, you can adapt the topology depicted in change the balun and the matching components (
Figure 35
). The suggested balun for the
0.75 - 1.17 GHz frequency range is the 1:1 Johanson 900BL15C050.
45/53
Figure 33
, and
Page 46
Application information STW81102

Figure 35. Evaluation board (EVB1G) matching network (MATCH_EVB1G.dsn)

Vcc
25 ohm
RF
OUTP
RF
OUTN
25 ohm

8.4 Evaluation kit

An evaluation kit can be delivered upon request, including the following:
● Evaluation board
● GUI (graphical user interface) to program the device
● Measured S parameters of the RF output
● ADS2005 schematics providing guidelines for application board design
● STWPLLSim software for PLL loop filter design and noise simulation
● Application program interface (API)
Vcc
18nH
8.2pF
8.2pF
18nH
1:1
22pF
2.1nH
0.5pF
50 ohm
Three different evaluation kits are available, each optimized for one of the following frequency ranges:
● 1 GHz
● 2 GHz
● 4 GHz
When ordering, please specify one of the following order codes:

Table 24. Order code of the evaluation kit

Part number Description
STW81102-EVB1G 1GHz frequency range - divider by 4 output optimized
STW81102-EVB2G 2GHz frequency range - divider by 2 output optimized
STW81102-EVB4G 4GHz frequency range - direct output optimized
The three evaluation kits differ only for the output stage network and can be adapted from one frequency band variant to a different one replacing properly the matching components and the balun.
46/53
Page 47
STW81102 Application diagrams

9 Application diagrams

Figure 36. Typical application diagram

From/to microcontroller
RF Out
VDD
VDD
1
10P22p1n
1
10P22p1n
VDD
VDD
VDD_VCOA DBUS_SEL
VDD_DIV 2
1
1
VDD_O UTBUF
OUTBUFP
OUTBUFN
VDD_DIV 4
VDD_VCOB
2.2K
270p 68p
ADD1
ADD2
STW81102
STW 81103
VCTRL
VDD_ESD
8.2K
2.7n
100
15p
100100
15p 15p
I2C
SDA/DATA
VDD_CP
EXT_PD
VDD_BUFV CO
EXTVCO_INP
EXTVCO_INN
TE ST1
VDD
VDD_PLL
REF_CLK
TEST2
LOCK_DET
1
10µ22p1n
SPI
1.8n
VDD
2
10P22p1n
ref clk
51
SCL/CLK
ADD0/LOAD
ICP
REXT
4.7K
VDD_DBUS
to microcontrollerloop filter
Note: 1 See Chapter 8: Application information for further information on output matching topology.
2
2 EXT_PD, ADD2, ADD1 (and ADD0 when the I
C bus is selected) can be hard wired directly
on the board.
3 Loop filter values are for F
4 For best performance VDD
= 200 kHz.
STEP
must be a low noise supply (20 μV
1
47/53
in 10 Hz-100 kHz BW).
RMS
Page 48
Application diagrams STW81102

Figure 37. Ping-pong architecture diagram

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PLFURFRQWUROOHU
9''
9''
9''
9''
B
Q S  M
QSM
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9''
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,&
+:&RQWURO
9''
,&
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Q S  M
7 (67
Q
9''
Q
UHIFON
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Note: 1 See Chapter 8: Application information for further information on output matching topology.
2
2 EXT_PD, ADD2, ADD1 (and ADD0 when the I
C bus is selected) can be hard wired directly
on the board.
3 Loop filter values are for F
4 For best performance VDD
STEP
1_1
= 200 kHz.
and VDD
must be low noise supplies (20 μV
1_2
RMS
in 10 Hz-
100 kHz BW).
48/53
Page 49
STW81102 Application diagrams

Figure 38. Application diagram with external VCO (LO output from STW81102)

)URPWR PLFURFRQWUROOHU
/22XW
9''
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9''
9''
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9''
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&
5
5
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WR PLF URFRQWUROOHU
ORRSILOWHU
Note: See Chapter 8: Application information for further information on output matching topology.

Figure 39. Application diagram with external VCO (LO output from VCO)

)URPWR PLFURFRQWUROOHU
Q S  M
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49/53
Page 50
Package mechanical data STW81102

10 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages, which have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: http://www.st.com.
Figure 40. VFQFPN28 mechanical drawing (
Note 1
)
Note: 1 VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead.
(Very thin: A=1.00 Max)
2 Details of the terminal 1 identifier are optional, but if given, must be located on the top
surface of the package by using either a mold or marked features.
50/53
Page 51
STW81102 Package mechanical data

Table 25. Package dimensions

Ref. Min. Typ. Max. Unit
A 0.800 0.900 1.000 mm
A1 0.020 0.050 mm
A2 0.650 1.000 mm
A3 0.200 mm
b 0.180 0.250 0.300 mm
D 4.850 5.000 5.150 mm
D1 4.750 mm
D2 2.950 3.100 3.250 mm
E 4.850 5.000 5.150 mm
E1 4.750 mm
E2 2.950 3.100 3.250 mm
e 0.500 mm
L 0.350 0.550 0.750 mm
P 0.600 mm
K 14 degrees
ddd 0.080 mm
51/53
Page 52
Ordering information STW81102

11 Ordering information

Table 26. Order codes

Part number Temp range, ° C Package Packing
STW81102AT -40 to 85 VFQFPN28 Tray
STW81102ATR -40 to 85 VFQFPN28 Tape and reel

12 Revision history

Table 27. Document revision history

Date Revision Changes
06-Mar-2006 1 Initial release.
Changed from preliminary data to maturity.
16-Jun-2006 2
20-Jul-2007 3
Updated
information
Added information usage of prescaler with modulus 16/17 for VCO higher than 3300MHz in
Section 5.3: Prescaler
Moved the ordering information to
Section 2: Electrical specifications; Section 8: Application
and
Section 9: Application diagrams
Section 2.4: Electrical specifications
and
Section 5.4: A and B counters
Chapter 11
.
,
.
.
14-Aug-2007 4
23-Jan-2008 5
Updated in
Updated Updated
application diagram) Phase noise specification
Updated Added Added Updated Updated Updated Updated Updated Added Updated Added Added the last bullet ‘Application program interface (API)’ in
Section 8.4
Added Added
Section 6.4: VCO calibration procedure
Ta b l e 1
.
Table 1: Pin description
.
Table 3: Operating conditions (refer to Figure 36: Typical
,
Table 5: Electrical specifications, Ta bl e 6 :
.
Section 5.8.2: VCO frequency calibration
Section 5.9: Output stage
.
Section 5.10: External VCO Buffer
FUNCTIONAL_MODE Table 22: Bits at 00h and ST1
and
CALIBRATION
.
Section 6.3.2: Read-only register Section 6.3.3: Default configuration Section 6.4: VCO calibration procedure
Section 6.4.1: VCO calibration auto-restart feature
Section 7.4: VCO calibration procedure
Section 7.4.1: VCO calibration auto-restart feature
.
Note 4 on page 47 Figure 37, Figure 38
.
and
Figure 39
, pin #23 description
.
.
registers.
.
.
.
.
.
.
.
52/53
Page 53
STW81102
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