EQUIPMENT AND UNINTERRUPTABLE
POWER SU PP LY (UP S)
3
2
1
TO-247
INTER NAL SCH E M ATI C DIAG RA M
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
I
DM
P
T
(•) Pulse width limited by safe operating area
January 1998
This is preliminary information on a new product now in development or undergoing evaluation.Details are subject to change without notice.
Drain-source Voltage (VGS = 0)600V
DS
Drain- gate Voltage (RGS = 20 kΩ)
DGR
Gate-source Voltage± 30V
GS
I
Drain Current (continuous) at Tc = 25 oC16A
D
I
Drain Current (continuous) at Tc = 100 oC10A
D
600V
(•)Drain Current (pulsed)64A
Total Dissipation at Tc = 25 oC250W
tot
Derating Factor2W/oC
Storage Temperature-65 to 150
stg
T
Max. Operating Junction Temperature150
j
o
C
o
C
1/5
Page 2
STW16NA60
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-si n k
T
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERI S TICS
SymbolParameterMax ValueUnit
I
AR
E
E
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
Repetitive Avalanche Energy
AR
= 25 oC, ID = IAR, V
j
(pulse width limited by T
ma x, δ < 1%)
j
DD
ma x, δ < 1%)
j
Avalanche Current, Repetitive or Not-Repetitive
= 100 oC, pulse width limited by Tj max, δ < 1%)
(T
c
= 25 V)
0.5
30
0.1
300
16A
1000mJ
80mJ
10A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
= 25 oC unless otherwise specified)
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
600V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating x 0.8 Tc = 100 oC
DS
V
= ± 30 V
GS
25
250
± 100nA
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
Gate Threshold
V
= VGS ID = 250 µA
DS
2.2533.75V
Voltage
R
DS(on)
I
D(on)
Static Drain-source On
Resistance
VGS = 10 V ID = 8 A
V
= 10 V ID = 8 A Tc = 100oC
GS
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
0.330.4
0.8
16A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
gfs (∗)Forward
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID = 8 A1015S
= 03700
GS
450
140
µA
µA
Ω
Ω
pF
pF
pF
2/5
Page 3
STW16NA60
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING O N
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
(di/dt)
Q
Q
Q
SWITCHING O F F
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
SOURCE DRAIN DIO DE
Turn-on Time
Rise Time
t
r
Turn-on Current Slope V
on
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
Off-voltage Rise Time
Fall Time
t
f
Cross-over Time
c
V
= 300 V ID = 8 A
DD
RG = 4.7 Ω VGS = 10 V
(see test circuit, figure 3)
= 480 V ID = 16 A
DD
= 47 Ω VGS = 10 V
R
G
(see test circuit, figure 5)
VDD = 480 V ID = 16 A V
V
= 480 V ID = 16 A
DD
= 4.7 Ω VGS = 10 V
R
G
= 10 V155
GS
(see test circuit, figure 5)
25
21
30
25
240A/µs
200nC
18
78
45
20
66
50
25
80
ns
ns
nC
nC
ns
ns
ns
SymbolParameterTest ConditionsMin.Typ.Max.Unit
16
64
I
SDM
I
SD
Source-drain Current
(•)
Source-drain Current
(pulsed)
V
(∗)Forward On VoltageISD = 16 A VGS = 01.6V
SD
t
Q
Reverse Recovery
rr
Time
Reverse Recovery
rr
I
= 16 A di/dt = 100 A/µs
SD
V
= 100 V Tj = 150 oC
DD
(see test circuit, figure 5)
770
17
Charge
I
RRM
Reverse Recovery
45
Current
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of pat e nts or ot her rights o f third partie s which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SG S-THOMSON Microelectroni cs. Specifications ment ioned
in this publication are subject to cha nge wi t hout n o tice. This p u bli ca t ion sup e rsed e s and r epla ces al l inf ormat i on pr ev io us ly supplied.
SGS-THOMSON Microelectronics products are not auth orized for use as critical components in life support devices or systems without express
written approval of SGS-THOM SO N M icroelecto nics.