This STripFET™ III Power MOSFET technology
is among the latest improvements, which have
been especially tailored to minimize on-state
resistance providing superior switching
performances.
Figure 6.Static drain-source on resistanceFigure 7.Normalized B
R
DS(on)
(mΩ)
1.40
V
T
GS≥
C
=25°C
10V
1.30
1.20
1.10
1.00
0
20
40
60
6/12 Doc ID 14089 Rev 6
80
AM01501v1
D
(A)
I
vs temperature
VDSS
Page 7
STV270N4F3Electrical characteristics
Figure 8.Gate charge vs gate-source voltage Figure 9.Capacitance variations
Figure 10. Normalized gate threshold voltage
vs temperature
Figure 12. Source-drain diode forward
V
characteristics
SD
(V)
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0
20
TJ=-50°C
60
40
80
TJ=25°C
100
120
J
=175°C
T
140
160
180
AM04229v1
I
SD
(A)
Figure 11. Normalized on resistance vs
temperature
Doc ID 14089 Rev 67/12
Page 8
Test circuitsSTV270N4F3
3 Test circuits
Figure 13. Switching times test circuit for
PW
resistive load
VD
VGS
RG
RL
D.U.T.
2200
µF
3.3µF
AM01468v1
V
DD
Figure 15. Test circuit for inductive load
G
25
Ω
switching and diode recovery times
A
D
D.U. T.
S
B
R
FAST
DIODE
G
A
A
L=100µH
B
B
D
G
S
3.3
µF
1000
µF
V
DD
Figure 14. Gate charge test circuit
V
i=20V=VGMAX
PW
2200
µF
1kΩ
12V
IG=CONST
2.7kΩ
47kΩ
47kΩ
100Ω
100nF
D.U.T.
AM01469v1
Figure 16. Unclamped inductive load test
circuit
L
VD
ID
Vi
D.U. T.
2200
µF
3.3µF
1kΩ
VDD
V
VDD
G
Pw
AM01470v1
Figure 17. Unclamped inductive waveformFigure 18. Switching time waveform
V(BR)DSS
VD
IDM
ID
VDD
VDD
AM01472v1
8/12 Doc ID 14089 Rev 6
0
0
10%
tdon
ton
90%
tr
10%
V
GS
VDS
tdoff
90%
AM01471v1
toff
tf
90%
10%
AM01473v1
Page 9
STV270N4F3Package mechanical data
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Doc ID 14089 Rev 69/12
Page 10
Package mechanical dataSTV270N4F3
0068039-C
PowerSO-10 MECHANICAL DATA
DIM.
MIN.TYP.MAX.MIN.TY P.MAX.
mminch
A3.353.650.1320.144
A10.000.100.0000.004
B0.400.600.0160.024
C0.350.550.0130.022
D9.409.600.3700.378
D17.407.600.2910.300
e1.270.050
E9.309.500.3660.374
E17.207.400.2830.291
E27.207.600.2830.300
E36.106.350.2400.250
E45.906.100.2320.240
F1.251.350.0490.053
h0.500.002
H13.8014.400.5430.567
L1.201.800.0470.071
q1.700.067
α0
= =
HE
A
F
A1
o
= =
h
o
8
B
B
A
Q
0.10
E1E3
= =
SEATING
PLANE
A
C
E4
= =
SEATING
PLANE
A1
= =
610
E2
= =
51
DETAIL "A"
B
e
M
0.25
D
= =
D1
= =
DETAIL "A"
10/12 Doc ID 14089 Rev 6
L
α
Page 11
STV270N4F3Revision history
5 Revision history
Table 8.Document revision history
DateRevisionChanges
25-Oct-20071Initial release
03-Apr-20082ID value has been updated.
01-Oct-20083Document status promoted from preliminary data to datasheet
09-Mar-20094R
05-May-20095
Changed: Description and Figure 12: Source-drain diode forward
characteristics
17-Jun-20096Corrected typing error on cover page
value has been changed in Table 3: Thermal data.
thj-pcb
Doc ID 14089 Rev 611/12
Page 12
STV270N4F3
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