High performance diode suited for high frequency
DC to DC converters. Packaged in PowerFLAT™
5x6, this device is intended for use in low voltage
high frequency inverters.
A(2)
A(1)
PowerFLAT 5x6
STTH8R03DJF
Table 1.Device summary
SymbolValue
I
F(AV)
V
RRM
T
j
V
(typ)0.8 V
F
(typ)27 ns
t
rr
A(2)
A(1)
8 A
300 V
175 °C
TM: PowerFLAT is a trademark of STMicroelectronics
March 2012Doc ID 022762 Rev 11/9
This is information on a product in full production.
www.st.com
9
Page 2
CharacteristicsSTTH8R03DJF
1 Characteristics
Table 2.Absolute ratings (limiting values with anode terminals short-circuited)
To evaluate the maximum conduction losses use the following equation:
P = 0.84 x I
2/9Doc ID 022762 Rev 1
F(AV)
+ 0.02 I
F2(RMS)
Page 3
STTH8R03DJFCharacteristics
Table 5.Recovery characteristics
SymbolParameter
Reverse recovery timeTj = 25 °C
t
rr
I
Reverse recovery current
RM
S
Table 6.Turn-on switching characteristics
Reverse recovery
factor
softness factor
Reverse recovery charges120nC
Q
rr
Tj = 125 °C
SymbolParameter
Test conditions
= 1 A
I
F
Vr = 30 V
/dt = 100 A/µs
dI
F
I
= 1 A
F
= 30 V
V
r
/dt = 50 A/µs
dI
F
I
= 8 A,
F
/dt = - 200 A/µs,
dI
F
= 200 V
V
CC
Test conditions
Min.TypMax.Unit
2735
ns
3850
6.08.0A
0.3-
Min.TypMax.Unit
t
Forward recovery time
fr
Tj = 25 °C
V
Forward recovery voltage2.13.2V
FP
IF = 8 A
dIF/dt = 100 A/µs
V
Figure 1.Average forward power dissipation
versus average forward current
P
(W)
F(AV)
12
δ
δ = 0.5
=tp/T
δ = 1
T
tp
10
8
6
4
2
0
012345678910
δ = 0.05
I
F(AV)
(A)
δ = 0.2
δ = 0.1
= 1.5 V
FR
Figure 2.Forward voltage drop versus
forward current
IFM(A)
100.0
Tj=125 °C
(Typical values)
10.0
1.0
0.1
Tj=125 °C
(Maximum values)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Tj=25 °C
(Maximum values)
150ns
VFM(V)
Doc ID 022762 Rev 13/9
Page 4
CharacteristicsSTTH8R03DJF
Figure 3.Relative variation of thermal
impedance junction to case versus
Figure 4.Peak reverse recovery current
versus dI
/dt (typical values)
F
pulse duration
Z
th(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-041.E-031.E-021.E-011.E+00
tP(S)
Figure 5.Reverse recovery time versus dI
(typical values)
TRR(ns)
100
90
80
70
60
50
40
30
20
10
0
050100 150 200250 300 350400 450 500
IF=I
F(AV)
VR=200 V
T
=125 °C
j
dIF/dt(A/µs)
/dt
F
IRM(A)
12
IF=I
F(AV)
VR=200 V
T
=125 °C
10
j
8
6
4
2
0
050100 150200 250300 350 400 450500
dIF/dt(A/µs)
Figure 6.Reverse recovery charges versus
dI
/dt (typical values)
F
QRR(nC)
180
IF=I
160
140
120
100
80
60
40
20
F(AV)
VR=200 V
T
=125 °C
j
dIF/dt(A/µs)
0
050100 150 200250 300350 400450 500
Figure 7.Softness factor versus dIF/dt
Figure 8.Relative variations of dynamic
(typical values)
S
FACTOR
0.6
IF=I
F(AV)
VR=200 V
T
=125 °C
j
0.5
0.4
0.3
0.2
0.1
0.0
050100150 200250 300 350400 450500
dIF/dt(A/µs)
4/9Doc ID 022762 Rev 1
2.75
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
255075100125
parameters versus junction
temperature
IF=I
S
FACTOR
I
RM
Q
RR
VR=200 V
Reference: T
F(AV)
=125 °C
j
Tj(°C)
Page 5
STTH8R03DJFCharacteristics
Figure 9.Transient peak forward voltage
versus dI
VFP(V)
5
IF=I
F(AV)
Tj=125 °C
4
3
2
1
0
050100150 200250300 350400450 500
/dt (typical values)
F
dIF/dt(A/µs)
Figure 11. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
V
OSC
F=1 MHz
=30 mV
Tj=25 °C
Figure 10. Forward recovery time versus dI
(typical values)
tFR(ns)
80
70
60
50
40
30
20
10
0
100150200250300350400450500
IF=I
VFR=1.5V
T
=125 °C
j
dIF/dt(A/µs)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab
R
(°C/W)
th(j-a)
250
RMS
200
PowerFLAT 5x6
/dt
F
F(AV)
100
10
1101001000
VR(V)
150
100
50
Scu(cm2)
0
012345678910
Doc ID 022762 Rev 15/9
Page 6
Package informationSTTH8R03DJF
2 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 7.PowerFLAT 5x6 dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
D2
E2
K
b
e
A
A1
D
L
A2
A0.801.000.0310.039
A10.020.050.0010.002
A20.250.010
b0.300.500.0120.020
D5.200.205
MillimetersInches
Min.Typ.Max.Min.Typ.Max.
D24.114.310.1620.170
e1.270.050
E
E6.150.242
E23.503.700.1380.146
L0.500.800.0200.031
K1.2751.5750.0500.062
Figure 13. Footprint (dimensions in mm)
5.35
4.41
1.27
6/9Doc ID 022762 Rev 1
0.98
0.62
3.86
0.95
4.33
6.29
Page 7
STTH8R03DJFPackage information
Figure 14. Tape and reel specifications
Dot identifying Pin A1 location
2.0
4.0
Ø 1.55
0.30
12.0
5.30
1.20
All dimensions are typical values in mm
0.20
6.30
8.0
User direction of unreeling
1.75
Ø 1.5
5.5
R 0.50
Doc ID 022762 Rev 17/9
Page 8
Ordering informationSTTH8R03DJF
3 Ordering information
Table 8.Other information
Order codeMarkingPackageWeightBase qtyDelivery mode
STTH8R03DJF-TRTH8R 03
4 Revision history
Table 9.Document revision history
DateRevisionChanges
16-May-20121First issue.
PowerFLAT
5x6
0.095 g3000Tape and Reel
8/9Doc ID 022762 Rev 1
Page 9
STTH8R03DJF
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